JP2018181849A - インターポーザアセンブリ及び方法 - Google Patents
インターポーザアセンブリ及び方法 Download PDFInfo
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- JP2018181849A JP2018181849A JP2018077201A JP2018077201A JP2018181849A JP 2018181849 A JP2018181849 A JP 2018181849A JP 2018077201 A JP2018077201 A JP 2018077201A JP 2018077201 A JP2018077201 A JP 2018077201A JP 2018181849 A JP2018181849 A JP 2018181849A
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- interposer assembly
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/20—Pins, blades, or sockets shaped, or provided with separate member, to retain co-operating parts together
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7082—Coupling device supported only by cooperation with PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/15—Pins, blades or sockets having separate spring member for producing or increasing contact pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/023—Stackable modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2428—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using meander springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2107/00—Four or more poles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connecting Device With Holders (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
Claims (7)
- 対向する基板(14、18)上のコンタクトパッド(12、16)間の電気的接続を形成するためのインターポーザアセンブリ(10)であって、前記インターポーザアセンブリは、絶縁本体(20)と、前記絶縁本体を通って延伸している複数の貫通通路(28)と、各々が前記複数の貫通通路のいずれか1つに配置されている複数のコンタクト(36)であって、各コンタクトは、一体型の金属であって、前記絶縁本体の上面及び底面(24、26)に位置する対向する端部を備える、複数のコンタクトとを備え、
各コンタクト(36)は、前記貫通通路に沿って延伸している非圧縮状態の長さと、前記非圧縮状態の長さより短い前記貫通通路に沿って延伸している圧縮状態の長さとを有する、少なくとも1つのコンタクトユニット(42)を含み、
前記複数のコンタクトが前記複数の貫通通路において圧縮されたとき、前記コンタクトユニット(42)はエネルギーを蓄積するように弾性的にねじられて弾性的に曲げられ、前記コンタクトが解放され、且つ、前記コンタクトユニットが前記非圧縮状態の長さまで長くなるとき、前記蓄積されたエネルギーは回収可能である、インターポーザアセンブリ。 - 各コンタクトは、コンタクト保持部材(64、66)を備え、各コンタクト保持部材は、前記貫通通路(28)における前記コンタクトの緩い保持のために前記貫通通路の壁(32)と係合している、請求項1に記載のインターポーザアセンブリ。
- 各コンタクト保持部材は、保持アーム(64)と摩擦突起部(66)とを備え、前記コンタクトが前記貫通通路(28)にあるとき、前記保持アームは弾性的に圧縮されて、前記摩擦突起部(66)は、前記貫通通路における前記コンタクトの移動を可能にする一方で、前記貫通通路において前記コンタクトを保持するように、前記壁(32)に対して把持されている、請求項2に記載のインターポーザアセンブリ。
- 各コンタクトユニット(42)は、U字型のばねアーム(72)を含む、請求項1に記載のインターポーザアセンブリ。
- 各貫通通路(28)は、長方形の輪郭を有し、前記ばねアーム(72)は、前記貫通通路において摺動嵌合している、請求項4に記載のインターポーザアセンブリ。
- 各貫通通路(28)は、2つの対向する壁(32)を含み、各コンタクトユニットは、離間された2つの支持ストリップ(70)と、前記2つの支持ストリップ(70)間に延伸している複数のばねアーム(72)とを含み、前記2つの支持ストリップ(70)は、一方の壁(32)に隣接して配置され、前記複数のばねアーム(72)は、他方の壁(32)に隣接して配置され、前記コンタクトユニットが圧縮されていないとき、前記複数のばねアーム(72)は概して前記貫通通路に沿って延伸し、それによって、前記貫通通路における前記コンタクトユニットの圧縮は、同時に、ねじりばねとして前記複数のばねアーム(72)を弾性的にねじり、且つ、カンチレバービームとして前記複数のばねアーム(72)を弾性的に曲げる、請求項1に記載のインターポーザアセンブリ。
- 前記複数のばねアーム(72)はそれぞれ、U字曲げ部(78)を含み、前記U字曲げ部が、前記貫通通路の前記他方の壁(32)に隣接している、請求項6に記載のインターポーザアセンブリ。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762486604P | 2017-04-18 | 2017-04-18 | |
US62/486,604 | 2017-04-18 | ||
US15/809,681 | 2017-11-10 | ||
US15/809,681 US10312613B2 (en) | 2017-04-18 | 2017-11-10 | Interposer assembly and method |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018181849A true JP2018181849A (ja) | 2018-11-15 |
JP6601984B2 JP6601984B2 (ja) | 2019-11-06 |
Family
ID=63790327
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018077201A Active JP6601984B2 (ja) | 2017-04-18 | 2018-04-12 | インターポーザアセンブリ |
Country Status (5)
Country | Link |
---|---|
US (1) | US10312613B2 (ja) |
JP (1) | JP6601984B2 (ja) |
KR (1) | KR102033242B1 (ja) |
CN (1) | CN108736210B (ja) |
TW (1) | TWI720277B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10959343B2 (en) * | 2017-08-25 | 2021-03-23 | Hewlett Packard Enterprise Development Lp | Integrated stand-offs for printed circuit boards |
US10770839B2 (en) * | 2018-08-22 | 2020-09-08 | Amphenol Corporation | Assembly method for a printed circuit board electrical connector |
KR20200053408A (ko) | 2018-11-08 | 2020-05-18 | 주식회사 아모센스 | 인터포저 |
KR102386969B1 (ko) | 2019-04-01 | 2022-04-18 | 주식회사 아모센스 | 다층구조의 인터포저 및 그 제조방법 |
KR102387826B1 (ko) | 2019-04-01 | 2022-04-18 | 주식회사 아모센스 | 인터포저 및 그 제조방법 |
JP2021056158A (ja) * | 2019-10-01 | 2021-04-08 | 株式会社日本マイクロニクス | 電気的接触子、電気的接続構造及び電気的接続装置 |
CN115298912A (zh) | 2020-01-27 | 2022-11-04 | 安费诺有限公司 | 具有高速安装接口的电连接器 |
CN115315855A (zh) * | 2020-01-27 | 2022-11-08 | 安费诺有限公司 | 具有高速安装接口的电连接器 |
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JP4036872B2 (ja) * | 2005-05-18 | 2008-01-23 | アルプス電気株式会社 | 半導体装置の製造方法 |
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US7775804B2 (en) * | 2008-04-15 | 2010-08-17 | Amphenol Corporation | Interposer assembly with flat contacts |
JP5401101B2 (ja) * | 2009-01-08 | 2014-01-29 | 富士通コンポーネント株式会社 | コンタクト部材、及び該コンタクト部材を含むコネクタ |
WO2011153298A1 (en) * | 2010-06-03 | 2011-12-08 | Hsio Technologies, Llc | Electrical connector insulator housing |
JP5402424B2 (ja) * | 2009-09-07 | 2014-01-29 | 富士通株式会社 | コネクタ及び該コネクタを使用したインターポーザ |
JP2011071435A (ja) | 2009-09-28 | 2011-04-07 | Fujitsu Ltd | インターポーザ |
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JP2013055035A (ja) * | 2011-08-09 | 2013-03-21 | Yokowo Co Ltd | コネクタ |
KR101330999B1 (ko) * | 2011-12-05 | 2013-11-20 | (주)아이윈 | 탐침부 연결형 포고핀 및 그 제조방법 |
JP2013205191A (ja) * | 2012-03-28 | 2013-10-07 | Nidai Seiko:Kk | スプリングプローブおよびスプリングプローブの製造方法 |
US9172161B2 (en) | 2012-12-12 | 2015-10-27 | Amphenol InterCon Systems, Inc. | Impedance controlled LGA interposer assembly |
JP2015026502A (ja) | 2013-07-25 | 2015-02-05 | 富士通株式会社 | 電気コネクタ及び基板ユニット |
JP6364509B2 (ja) * | 2014-09-22 | 2018-07-25 | アンフェノール インターコン システムズ、インコーポレイテッド | インターポーザ・アセンブリ及び方法 |
US10003145B1 (en) * | 2017-04-17 | 2018-06-19 | Te Connectivity Corporation | Electrical connector having a circuit board interposer with press-fit mounting contacts |
-
2017
- 2017-11-10 US US15/809,681 patent/US10312613B2/en active Active
- 2017-12-29 TW TW106146400A patent/TWI720277B/zh active
-
2018
- 2018-03-23 CN CN201810244171.7A patent/CN108736210B/zh active Active
- 2018-03-23 KR KR1020180033744A patent/KR102033242B1/ko active IP Right Grant
- 2018-04-12 JP JP2018077201A patent/JP6601984B2/ja active Active
Also Published As
Publication number | Publication date |
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TW201840067A (zh) | 2018-11-01 |
CN108736210A (zh) | 2018-11-02 |
JP6601984B2 (ja) | 2019-11-06 |
CN108736210B (zh) | 2020-06-30 |
US20180301835A1 (en) | 2018-10-18 |
US10312613B2 (en) | 2019-06-04 |
KR102033242B1 (ko) | 2019-10-16 |
KR20180117034A (ko) | 2018-10-26 |
TWI720277B (zh) | 2021-03-01 |
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