JP2018176549A - Thermal print head, manufacturing method of thermal print head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermal print head capable of suppressing time necessary for manufacture.SOLUTION: A thermal print head 101 includes: a glass substrate 1 having a principal plane 11 and a reverse face 12 facing opposite sides for each other and made of a glass plate having flexibility; a resistor layer 4 formed on a principal plane 11 side of the glass substrate 1; and an electrode layer 3 for energizing to the resistor layer 4.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a thermal print head and a method of manufacturing the thermal print head.

  FIG. 23 is an enlarged sectional view of an essential part showing an example of a conventional thermal print head (see, for example, Patent Document 1). In the thermal print head 100 shown in the figure, a heat storage layer 100c, a resistor layer 100d, an electrode layer 100e, and a protective layer 100f are formed on a silicon substrate 100a having a protrusion 100b having a trapezoidal cross section. The heat necessary for printing is generated by partially energizing the resistor layer 100d located on the protrusion 100b via the electrode layer 100e.

  The protrusion 100b of the silicon substrate 100a is formed by etching the surface of the silicon substrate 100a. Because the etching process takes time, the manufacturing of the thermal print head 100 requires a long time.

JP-A-5-147248

  The present invention is conceived under the above-described circumstances, and an object thereof is to provide a thermal print head capable of suppressing the time required for manufacturing.

  The thermal print head provided by the first aspect of the present invention has a main surface and a back surface facing each other, and is formed on a glass substrate made of a flexible glass plate and on the main surface side of the glass substrate. And the electrode layer for supplying a current to the resistor layer.

  In a preferred embodiment of the present invention, the glass substrate is fixed by curving the glass plate.

  In a preferred embodiment of the present invention, the glass plate has no unevenness on the main surface and the back surface.

  In a preferred embodiment of the present invention, the glass plate has a protrusion on the main surface.

  In a preferred embodiment of the present invention, the glass plate is made of heat resistant glass.

  In a preferred embodiment of the present invention, the thickness of the glass plate is 50 μm or less.

  In a preferred embodiment of the present invention, the glass plate is bendable to a radius of curvature of 50 mm.

  In a preferred embodiment of the present invention, the resistor layer is made of a conductive metal oxide.

  In a preferred embodiment of the present invention, the resistor layer is made of ITO (indium tin oxide).

  In a preferred embodiment of the present invention, the electrode layer contains Ag.

  In a preferred embodiment of the present invention, the device further comprises a protective layer covering at least a part of the resistor layer.

  In a preferred embodiment of the present invention, the resistor layer includes a plurality of heat generating portions arranged along the main scanning direction, and the electrode layers extend in the sub scanning direction and are separated from each other in the main scanning direction. A plurality of common electrode strip portions connected to any of the heat generating portions, and a common electrode having a connecting portion connected to the plurality of common electrode strip portions and extending in the main scanning direction; A plurality of individual electrodes connected to any one of the plurality of individual electrodes in the sub-scanning direction and extending in the opposite direction to the common electrode band, respectively, and arranged separately from each other in the main scanning direction; Is equipped.

  In a preferred embodiment of the present invention, the resistor layer includes a plurality of heat generating portions arranged along the main scanning direction, and the electrode layer is connected to a pair of heat generating portions adjacent to each other to form a sub electrode. A pair of relay electrode strip portions extending in the scanning direction and arranged to be separated from each other in the main scanning direction, and a connecting portion connected to the pair of relay electrode strip portions and extending in the main scanning direction, the main scanning A plurality of relay electrodes arranged along a direction, a plurality of common electrode strips connected to one of the pair of heat generating portions, and extending in the sub scanning direction opposite to the relay electrode strips; A common electrode connected to the plurality of common electrode strip portions and having a connecting portion extending in the main scanning direction and the other of the pair of heat generating portions is connected to the other of the pair of heat generating portions, and the side opposite to the relay electrode strip portion in the sub scanning direction Each have individual electrode strips extending , And a plurality of individual electrodes arranged apart from each other in the main scanning direction.

  In a preferred embodiment of the present invention, the electrode layer extends in the sub-scanning direction, and is connected to a plurality of common electrode strips and a plurality of common electrode strips which are spaced apart from each other in the main scanning direction. A common electrode having a connecting portion extending in the main scanning direction, and a plurality of individual electrodes each having an individual electrode strip extending in the sub-scanning direction and being separated from each other in the main scanning direction. The resistor layer is a strip extending in the main scanning direction, and the common electrode strips and the individual electrode strips are arranged to intersect the resistor layer alternately in the main scanning direction It is done.

  In a preferred embodiment of the present invention, it further comprises a support member having a support member main surface including a curved region and disposed on the back surface side of the glass substrate, wherein the glass substrate is the main support member. It is curved according to the surface shape of the surface and fixed to the main surface of the support member.

  In a preferred embodiment of the present invention, the main surface of the support member includes a protrusion.

  In a preferred embodiment of the present invention, the support member is in the form of a rectangular plate elongated in the main scanning direction, and the protrusion is a strip extending in the main scanning direction, and a cross section orthogonal to the main scanning direction has an arc shape. It is.

  In a preferred embodiment of the present invention, the projecting portion is provided with a strip extending in the main scanning direction, and a second projecting portion having an arc-shaped cross section orthogonal to the main scanning direction.

  In a preferred embodiment of the present invention, the support member is in the form of a rectangular plate elongated in the main scanning direction, and the projecting portion is in the shape of a strip extending in the main scanning direction and has a substantially triangular cross section.

  In a preferred embodiment of the present invention, the main surface of the support member is arc-shaped in cross section perpendicular to the main scanning direction.

  In a preferred embodiment of the present invention, the support member has a substantially rectangular parallelepiped shape elongated in the main scanning direction, and the main surface of the support member includes two adjacent surfaces extending in the main scanning direction.

  In a preferred embodiment of the present invention, the support member has two opposite surfaces facing each other, and a side surface connected to the two surfaces, and the main surface of the support member includes the two surfaces and Includes the side.

  In a preferred embodiment of the present invention, the back surface of the glass substrate is adhered to the main surface of the support member by an adhesive.

  In a preferred embodiment of the present invention, the support member is a heat dissipation member.

  In a preferred embodiment of the present invention, the semiconductor device further comprises a drive IC for causing a current to flow through the electrode layer, and a wiring board on which the drive IC is mounted, the wiring board being fixed to the support member. .

  In a preferred embodiment of the present invention, a drive IC for passing a current through the electrode layer is further provided, and the drive IC is mounted on the main surface side of the glass substrate.

  In a preferred embodiment of the present invention, the drive IC is disposed at a position not in contact with the paper conveyed at the time of printing.

  According to a second aspect of the present invention, there is provided a method of manufacturing a thermal print head, comprising: forming a resistor layer on the main surface side of a glass substrate having a main surface and a back surface facing each other and made of a flexible glass plate Forming an electrode layer on the resistor layer, and fixing and fixing the back surface of the glass substrate along the main surface of the support member including the curved region of the support member. It is characterized by having.

  In a preferred embodiment of the present invention, the fixing step includes a step of applying an adhesive to the main surface of the support member, a step of disposing the glass substrate on the support member main surface side of the support member, and And a step of pressing a pressing member having a surface capable of substantially adhering to the main surface of the support member from the main surface side of the glass substrate against the glass substrate while maintaining the glass substrate in a predetermined temperature range.

  In a preferred embodiment of the present invention, the step of forming the electrode layer includes a step of applying a metal paste by screen printing, a step of forming a metal film by firing the metal paste, and a step of forming the metal film , Patterning with a laser.

  In a preferred embodiment of the present invention, in the step of forming the resistor layer, a conductive metal oxide is formed by spray-coating a raw material solution on a heated glass substrate in a normal temperature air atmosphere.

  According to the present invention, a flexible glass plate is used for the glass substrate. The glass substrate can be curved and fixed according to, for example, the surface shape of a support member such as a heat sink, so that it is not necessary to form a projection in advance. Since only fixing to the support member in which the protrusion part was formed, the time concerning manufacture can be suppressed.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

FIG. 1 is a plan view showing a thermal print head according to a first embodiment of the present invention. It is a principal part top view which shows the thermal print head of FIG. It is sectional drawing in alignment with the III-III line of FIG. It is a principal part expanded sectional view which shows the thermal print head of FIG. It is a principal part expanded sectional view which shows the process concerning the manufacturing method of the thermal print head of FIG. It is a principal part expanded sectional view which shows the process concerning the manufacturing method of the thermal print head of FIG. It is a principal part enlarged plan view which shows the process concerning the manufacturing method of the thermal print head of FIG. It is a principal part enlarged plan view which shows the process concerning the manufacturing method of the thermal print head of FIG. It is a principal part expanded sectional view which shows the process concerning the manufacturing method of the thermal print head of FIG. It is a principal part expanded sectional view which shows the process concerning the manufacturing method of the thermal print head of FIG. FIG. 5 is a cross-sectional view showing a thermal print head according to a second embodiment of the present invention. It is a principal part top view showing a thermal print head concerning a 3rd embodiment of the present invention. It is a principal part top view showing a thermal print head concerning a 4th embodiment of the present invention. It is a principal part expanded sectional view of the cross section which follows the XIV-XIV line of FIG. It is a principal part expanded sectional view showing a printed circuit board concerning a 5th embodiment of the present invention. It is a principal part expanded sectional view showing a thermal print head concerning a 5th embodiment of the present invention. It is a principal part expanded sectional view showing a thermal print head concerning a 6th embodiment of the present invention. It is a principal part expanded sectional view showing a thermal print head concerning a 7th embodiment of the present invention. It is a principal part expanded sectional view showing a thermal print head concerning an 8th embodiment of the present invention. It is a principal part expanded sectional view showing a thermal print head concerning a 9th embodiment of the present invention. It is a principal part expanded sectional view showing a thermal print head concerning a 10th embodiment of the present invention. It is sectional drawing which shows the thermal print head which concerns on 11th Embodiment of this invention. It is a principal part expanded sectional view showing an example of the conventional thermal print head.

  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

  1 to 4 show a thermal print head 101 according to a first embodiment of the present invention. The thermal print head 101 is, for example, incorporated in a printer that performs printing on thermal paper to create a bar code sheet or a receipt.

  FIG. 1 is a plan view showing the thermal print head 101. As shown in FIG. FIG. 2 is a plan view of relevant parts showing the thermal print head 101. As shown in FIG. FIG. 3 is a cross-sectional view taken along the line III-III in FIG. FIG. 4 is an enlarged sectional view of the main part showing the thermal print head 101. In these drawings, the longitudinal direction (main scanning direction) of the thermal print head 101 is referred to as x direction, the short direction (sub scanning direction) is referred to as y direction, and the thickness direction is referred to as z direction. The same applies to the following figures. For convenience of understanding, the protective layer 5 is omitted in FIGS. 1 and 2 (the same applies to FIGS. 12 and 13).

  The thermal print head 101 includes a print substrate 8, a wiring substrate 6, and a heat sink 9. The print substrate 8 includes a glass substrate 1, an electrode layer 3, a resistor layer 4, and a protective layer 5.

The glass substrate 1 is a base of the print substrate 8 and made of a glass material such as borosilicate glass (Na ₂ O / B ₂ O ₃ / SiO ₂ ). The glass substrate 1 is made of, for example, a flat, uneven glass plate having a thickness of about 20 to 50 μm. The glass substrate 1 may be formed of other glass materials such as soda lime glass (Na ₂ O / CaO / SiO ₂ ) or quartz glass (SiO ₂ ). However, those having heat resistance are desirable. Further, as described later, the print substrate 8 is attached and fixed to the main surface 91 of the heat sink 9. Therefore, the glass substrate 1 needs to have flexibility capable of being curved according to the shape of the main surface 91 of the heat sink 9. The thickness of the glass substrate 1 is not limited as long as the flexibility can be secured. It is desirable that the glass substrate 1 can be bent to a radius of curvature of, for example, 50 mm. As shown in FIG. 1, the glass substrate 1 is in the form of a long rectangle extending in the x direction. The glass substrate 1 has a main surface 11 and a back surface 12 which are opposite to each other in the z direction. Resistor layer 4, electrode layer 3 and protective layer 5 are formed on main surface 11. Further, back surface 12 of glass substrate 1 is adhered to main surface 91 of heat dissipation plate 9 with, for example, a silicone adhesive.

  The resistor layer 4 is formed on the main surface 11 of the glass substrate 1, and the portion where the current from the electrode layer 3 flows generates heat. By generating heat in this manner, print dots are formed. The resistor layer 4 is made of a material having a higher resistivity than the material forming the electrode layer 3. In the present embodiment, the resistor layer 4 is a thin film of ITO (Indium Tin Oxide). The resistor layer 4 is formed by spray coating the raw material solution on the heated glass substrate 1 in a normal temperature air atmosphere. The resistor layer 4 may be formed by another thin film formation technique such as sputtering. The material of the resistor layer 4 is not limited to ITO, and may be, for example, a conductive metal oxide such as FTO (fluorine-doped tin oxide), and for example, TaN, TaSiO2, boron doped It may be polysilicon or the like. The thickness of the resistor layer 4 is, for example, about 0.2 μm. Depending on the material of the resistor layer 4, it may be about 0.05 to 1 μm. The thickness of the resistor layer 4 is not limited as long as the resistor layer 4 is not damaged by curving and fixing the glass substrate 1 without interrupting the flexibility of the glass substrate 1. In the present embodiment, the resistor layer 4 is interposed between the electrode layer 3 and the glass substrate 1 (main surface 11). The resistor layer 4 may be interposed between the electrode layer 3 and the protective layer 5. In addition, it may be formed only on a part of the main surface 11 of the glass substrate 1. As shown in FIG. 2, the resistor layer 4 includes a plurality of heat generating portions 41. The plurality of heat generating portions 41 in FIG. 2 are hatched for the sake of understanding. The plurality of heat generating portions 41 are arranged along the x direction. As shown in FIG. 4, each heat generating portion 41 is disposed at a position where the protruding portion 92 of the heat sink 9 is provided. Each heat generating portion 41 is shaped so as to extend across portions of the electrode layer 3 which are separated from each other.

  The electrode layer 3 is for forming a path for energizing each of the heat generating portions 41 of the resistor layer 4, and is formed on the resistor layer 4 on the main surface 11 of the glass substrate 1. Electrode layer 3 is made of, for example, Ag. In the present embodiment, the electrode layer 3 is formed by screen printing and baking silver paste for laser processing and patterning with a laser. In the present embodiment, the resistor layer 4 interposed between the electrode layer 3 and the glass substrate 1 is also patterned together with the electrode layer 3. Note that only the electrode layer 3 may be patterned by adjusting the output of the laser. The patterning may be performed by screen printing without using a laser. Alternatively, the electrode layer 3 may be formed by a thin film formation technique such as sputtering. The electrode layer 3 is not limited to Ag, and may be a conductor such as Au or Cu. The thickness of the electrode layer 3 is, for example, about 0.1 to 10 μm. The thickness of the electrode layer 3 is not limited as long as the electrode layer 3 is not damaged by curving and fixing the glass substrate 1 without hindering the flexibility of the glass substrate 1. The electrode layer 3 may have a portion formed on a portion other than the major surface 11 of the glass substrate 1. The electrode layer 3 includes a common electrode 31 and a plurality of individual electrodes 35.

  The common electrode 31 includes a plurality of strip portions 32, a connecting portion 33, and a bypass portion 34. As shown in FIG. 2, the connecting portion 33 is disposed closer to the end portion of the glass substrate 1 on the downstream side in the y direction, and has a strip shape extending in the x direction. The strip portions 32 extend from the connecting portion 33 to the upstream side in the y direction, and a plurality of the strip portions 32 are arranged at equal pitches in the x direction. Each strip 32 is connected to one of the heat generating portions 41. The “strips 32” correspond to the “common electrode strip” in the present invention. The bypass portion 34 extends in the y direction from one end of the connecting portion 33 in the x direction.

  The individual electrode 35 is for individually energizing each of the heat generating portions 41 of the resistor layer 4 and is a portion having a reverse polarity to the common electrode 31. A plurality of individual electrodes 35 are arranged at equal pitches in the x direction, and each has a strip portion 36 and a bonding portion 37. The strip portion 36 is a strip portion extending in the y direction, and is located on the opposite side to the common electrode 31 across the heat generating portion 41 in the y direction. The strip portion 32 of each individual electrode 35 is connected to one of the heat generating portions 41. The "stripes 36" correspond to the "individual electrode strips" in the present invention. The bonding portion 37 is provided at the y-direction upstream end of the strip portion 36.

  The shapes of the common electrode 31 of the electrode layer 3 and the individual electrodes 35 are not limited to those described above. The common electrode 31 may be connected to each heat generating portion 41, and each individual electrode 35 may be connected to each different heat generating portion 41.

  The protective layer 5 is for protecting the resistor layer 4 and the electrode layer 3 and is made of, for example, amorphous glass. The softening point of this amorphous glass is, for example, about 700.degree. As shown in FIG. 3, the protective layer 5 is formed in a region extending from the downstream side edge of the glass substrate 1 to the front of the bonding portion 37 of the individual electrode 35 in the y direction, and covers at least a plurality of heat generating portions 41. In the present embodiment, most of the electrode layer 3 is covered. The protective layer 5 is formed by thick-film printing a glass paste and then firing it. The thickness of protective layer 5 is, for example, about 1.0 to 5.0 μm. The thickness of the protective layer 5 is not limited as long as the protective layer 5 is not damaged by curving and fixing the glass substrate 1 without hindering the flexibility of the glass substrate 1. Further, the material of the protective layer 5 is not limited to amorphous glass, and may be an insulating material. In addition, a second protective layer may be further formed on the outer side (z-direction downstream side) of the protective layer 5. The material of the second protective layer is, for example, SiC, SiN, TiN, DLC (diamond like carbon), ta-C (tetrahedral amorphous carbon) or the like.

  Since the glass substrate 1 is a flat plate, the printing substrate 8 is also a substantially flat plate (the surface on the downstream side in the z direction has fine irregularities because the resistor layer 4 and the electrode layer 3 are laminated). is there). However, since the print substrate 8 (glass substrate 1) has flexibility, it can be curved. The back surface (the back surface 12 of the glass substrate 1) of the print substrate 8 is adhered to the main surface 91 of the heat sink 9 with, for example, a silicone adhesive. Since the main surface 91 of the heat sink 9 is curved by the protruding portion 92, the print substrate 8 is fixed in a curved state in accordance with the surface shape of the main surface 91 (see FIG. 4).

  Wiring board 6 is, for example, a printed wiring board. Wiring board 6 is made of, for example, glass propoxy resin, and its thickness is, for example, about 0.6 to 1.0 mm. As shown in FIG. 1, the wiring board 6 is in the form of a long rectangle extending in the x direction. The wiring substrate 6 has a main surface 61 and a back surface 62 facing in opposite directions in the z direction. On the main surface 61, a wiring pattern 63 made of, for example, Cu is formed, and a drive IC 71 is mounted. In addition, the back surface 62 of the wiring substrate 6 is attached to the main surface 91 of the heat sink 9 with an adhesive.

  The drive IC 71 has a function of causing any one of the plurality of heat generating parts 41 to generate heat by selectively energizing the plurality of individual electrodes 35. As shown in FIGS. 1 to 3, in the present embodiment, a plurality of drive ICs 71 are mounted on the wiring board 6. As shown in FIG. 2, the drive IC 71 is formed with a plurality of pads 72. The plurality of pads 72 are connected to the bonding portion 37 of the plurality of individual electrodes 35 or the bonding portion of the wiring pattern 63 formed on the wiring substrate 6 through the plurality of wires 73. As shown in FIGS. 1 and 3, the drive IC 71 is covered with a sealing resin 74. The sealing resin 74 is made of, for example, a black insulating soft resin. The sealing resin 74 covers and protects the drive IC 71, the wire 73, the bonding portion 37, and the bonding portion of the wiring pattern 63. In FIG. 2, the sealing resin 74 is omitted for the sake of understanding.

  Further, as shown in FIG. 1, the wiring substrate 6 is provided with a connector 83. The connector 83 is connected to the connector on the printer side when the thermal print head 101 is incorporated into, for example, the printer.

  The heat sink 9 is for dissipating the heat generated from the print substrate 8 at the time of printing to the outside. The heat sink 9 is made of metal such as Al, for example, and has a long rectangular plate shape extending in the x direction. The heat sink 9 has a main surface 91 (a surface facing the downstream side in the z direction). The glass substrate 1 is fixed to the main surface 91. A protrusion 92 is provided on the main surface 91 of the heat sink 9. The protrusion 92 is a strip extending long in the x direction, and as shown in FIGS. 3 and 4, the cross-sectional shape of the yz plane including the y direction and the z direction is arc-shaped. In FIG. 2, the boundary of the formation region of the protrusion 92 is indicated by a broken line. The size of the protrusion 92 is, for example, about 700 μm in the y direction and about 18 to 50 μm in the z direction. The print substrate 8 is curved along the shape of the main surface 91 on which the protrusion 92 is formed, and is fixed to the main surface 91. Therefore, the surface shape of the main surface 11 of the glass substrate 1 is similar to the surface shape of the main surface 91 of the heat sink 9. As a result, also in the resistor layer 4 and the protective layer 5 stacked on the main surface 11 of the glass substrate 1, the portion where the protrusion 92 is located protrudes. That is, the protruding portion 92 is provided in order to cause the portion covering the heat generating portion 41 in the protective layer 5 to protrude to the downstream side in the z direction so as to appropriately contact the thermal paper or the like to be printed. In addition, the heat sink 9 has a second main surface 93 which is directed in the same direction as the main surface 91 and located on the upstream side of the main surface 91 in the z direction. The wiring substrate 6 is fixed to the second major surface 93. Alternatively, the second main surface 93 may be fixed to the main surface 91 of the wiring substrate 6 without providing the second main surface 93. The heat sink 9 corresponds to the “support member” and the “heat release member” in the present invention.

  Next, a method of manufacturing the thermal print head 101 will be described with reference to FIGS. 5 to 6 and FIGS. 9 to 10 are enlarged cross-sectional views of the main parts showing the steps of the method of manufacturing the thermal print head 101. 7 to 8 are enlarged plan views of the main parts showing steps of the method of manufacturing the thermal print head 101. FIG.

  First, as shown in FIG. 5, the resistor layer 4 is formed on the entire main surface 11 of the glass substrate 1. In fact, although it forms in the big glass substrate divided | segmented into several glass substrates 1, in FIG. 5, the one part is expanded and shown (it is the same also in FIG. 6-FIG. 9). In the present embodiment, the resistor layer 4 is a thin film of ITO. The raw material solution is spray coated on the principal surface 11 of the glass substrate 1 heated to, for example, 500 ° C. in a normal temperature atmosphere, and a thin film of ITO is formed as the resistor layer 4 by thermal decomposition.

  Next, as shown in FIGS. 6 and 7, an electrode layer 3 ′ is formed on the resistor layer 4. In the present embodiment, the electrode layer 3 ′ is Ag. Silver paste for laser processing is screen-printed, and then the silver paste is fired to form an electrode layer 3 ′. The electrode layer 3 ′ includes an electrode layer 31 ′ to be the common electrode 31 and an electrode layer 35 ′ to be the individual electrode 35. For convenience of understanding, the electrode layers 3 ′ in FIG. 7 are dotted (the same applies to FIG. 8).

  Next, as shown in FIG. 8, the electrode layer 3 is formed by trimming the checkered area X with an IR laser. In the electrode layer 31 ′ shown in FIG. 7, the checkered portion is trimmed to form a plurality of strip portions 32, a connecting portion 33 and a detour portion 34. Further, in the electrode layer 35 ′ shown in FIG. 7, the checkered area X is trimmed to form a plurality of individual electrodes 35 provided with the strip portion 36 and the bonding portion 37 (not shown). In the present embodiment, the resistor layer 4 as well as the electrode layer 3 ′ is trimmed by a laser. In the resistor layer 4 exposed from the electrode layer 3 ′ shown in FIG. 7, the check pattern area X is trimmed to form a plurality of heat generating portions 41.

  Next, as shown in FIG. 9, the protective layer 5 is formed on the electrode layer 3 and the resistor layer 4. In the present embodiment, the protective layer 5 is formed by thick-film printing the glass paste and then baking it. Thereafter, the printed board 8 is completed by cutting.

  Next, as shown in FIG. 10, the silicone adhesive 95 is applied to the main surface 91 of the heat sink 9 manufactured separately, and the back surface of the print substrate 8 (the back surface 12 of the glass substrate 1) Arrange towards the side. Then, while maintaining the print substrate 8 in a predetermined temperature range (for example, a temperature slightly lower than the softening point of the glass substrate 1), the pressing member 99 is the main surface (the main surface 11 side of the glass substrate 1) of the print substrate 8. ) Press from the side. The pressing member 99 is formed with a surface 99 a which can be substantially in close contact with the main surface 91 of the heat sink 9 so that the surface 99 a abuts on the main surface of the printing substrate 8. Press 8 against the heat sink 9.

  After the print substrate 8 is bonded to the heat dissipation plate 9, the wiring pattern 6 is formed, and the wiring substrate 6 on which the drive IC 71 and the connector 83 are mounted is fixed to the second main surface 93 of the heat dissipation plate 9. Then, after bonding the plurality of wires 73 to the drive IC 71 or the like, the plurality of wires 73 and the drive IC 71 are covered with the sealing resin 74. Through the above steps, the thermal print head 101 is completed.

  Next, the operation of the thermal print head 101 will be described.

  According to the present embodiment, by laminating the resistor layer 4, the electrode layer 3 and the protective layer 5 on the flat glass substrate 1 made of a glass plate without unevenness, the printing substrate 8 having a substantially flat plate shape and flexibility Create Then, the print substrate 8 is curved according to the surface shape of the main surface 91 such that the heat generating portion 41 is disposed on the main surface 91 of the heat sink 9 on which the protruding portion 92 is provided. Fix in place. As a result, the portion of the protective layer 5 covering the heat generating portion 41 is protruded to the downstream side in the z direction, so that the portion is appropriately brought into contact with the thermal paper or the like to be printed. It can be manufactured only by laminating the resistor layer 4, the electrode layer 3 and the protective layer 5 on the glass substrate 1 and fixing it to the heat dissipation plate 9, so there is no need to process the substrate to provide a protrusion. Therefore, the time taken for manufacture can be suppressed. In addition, since the manufacturing process can be simplified, the manufacturing cost can be reduced. In addition, since the print substrate 8 can be formed in various shapes according to the shape of the heat sink 9, it has versatility. Various thermal print heads can be realized by the shape of the heat sink 9 as in the fifth to eleventh embodiments described later.

  Further, according to the present embodiment, the resistor layer 4 is formed by spray coating. Therefore, the time required to form the resistor layer 4 is shorter than when sputtering is performed. Therefore, the time taken for manufacture can be suppressed. Moreover, since it can form in a normal temperature air | atmosphere atmosphere, a vacuum apparatus is not required for the process for forming the resistor layer 4. The resistor layer 4 is formed of ITO. ITO has high uniformity of film thickness and resistance value. Therefore, the thickness of the resistor layer 4 can be made uniform. Moreover, the difference in resistance value of each heat generating portion 41 can be reduced. In addition, since ITO is thermally and chemically stable, the resistance and durability of the resistor layer 4 can be increased.

  Furthermore, according to the present embodiment, the electrode layer 3 is formed by screen printing and patterning by a laser. Therefore, the time required to form the electrode layer 3 is shorter than when sputtering and etching are performed. Therefore, the time which concerns on manufacture can be suppressed. Moreover, since it can form in a normal temperature air | atmosphere atmosphere, a vacuum apparatus is not required for the process for forming the electrode layer 3. In addition, since patterning is performed by a laser, high-definition patterning is possible. The material of the electrode layer 3 is Ag. Ag has strong adhesion to ITO, which is a material of the resistor layer 4. Therefore, the adhesion between the electrode layer 3 and the resistor layer 4 becomes strong.

  11 to 22 show another embodiment of the present invention. In these figures, elements that are the same as or similar to the above embodiment are given the same reference numerals as the above embodiment.

  FIG. 11 is a cross-sectional view showing a thermal print head according to a second embodiment of the present invention. The thermal print head 102 shown in FIG. 11 does not include the wiring substrate 6 and the drive IC 71 is mounted on the print substrate 8, the thermal print head 101 according to the first embodiment (see FIGS. 1 to 4). It is different from

  The drive IC 71 according to the present embodiment is mounted on the main surface 11 of the glass substrate 1. Then, it is connected to the wiring pattern of the electrode layer 3 formed on the glass substrate 1 and covered with the sealing resin 74.

  Also in the present embodiment, the same effects as in the first embodiment can be obtained. In addition, since it is not necessary to form the wiring substrate 6, the time required for manufacturing can be further shortened, and the manufacturing process can be simplified.

  FIG. 12 is a plan view of relevant parts showing a thermal print head according to a third embodiment of the present invention. The thermal print head 102 shown in FIG. 12 differs from the thermal print head 101 (see FIGS. 1 to 4) according to the first embodiment in the shape of the electrode layer 3.

  The electrode layer 3 according to the present embodiment includes a common electrode 31, a plurality of individual electrodes 35, and a plurality of relay electrodes 38.

  The relay electrode 38 includes two strip portions 381 and a connection portion 382. The two strip portions 381 extend in the y direction, and are disposed apart from each other. Each band-shaped portion 381 is connected to the adjacent heat generating portion 41. The "stripes 381" correspond to the "relay electrode strip" in the present invention. The connecting portion 382 is connected to the end of each of the two strip portions 381 on the opposite side to the heat generating portion 41, and has a strip shape extending in the x direction. The relay electrodes 38 are formed in a U-shape in which the openings are directed to the upstream side in the y direction, and a plurality of relay electrodes 38 are arrayed on the downstream side of the heat generating portion 41 in the y direction at equal pitches in the x direction.

  The common electrode 31 includes a connecting portion 33, and a plurality of strip portions 32, a branch portion 311, and a straight portion 312, respectively. The connection portion 33 is disposed closer to the end portion on the upstream side of the glass substrate 1 in the y direction, and has a strip shape extending in the x direction. The straight portions 312 are in the shape of a strip extending from the connecting portion 33 to the downstream side in the y direction, and a plurality of straight portions 312 are arranged at equal pitches in the x direction. A branch portion 311 and two strip portions 32 are provided on the tip end side (downstream side in the y direction) of each straight portion 312. The two strip portions 32 are strip portions extending in the y direction, and are disposed apart from each other. Each strip portion 32 is connected to the adjacent heat generating portion 41. The branched portions 311 are respectively connected to the ends of the two strip portions 32 on the opposite side to the heat generating portion 41, and are connected to the tip of the straight portion 312. The “strips 32” correspond to the “common electrode strip” in the present invention.

  The individual electrode 35 is a portion having a reverse polarity to the common electrode 31. A plurality of individual electrodes 35 are arrayed spaced apart in the x direction, and each has a strip portion 36 and a bonding portion 37. The strip portion 36 is a strip portion extending in the y direction, and is located on the upstream side of the heat generating portion 41 in the y direction. The strip portion 36 is connected to the heat generating portion 41 on the tip end side (downstream side in the y direction). The "stripes 36" correspond to the "individual electrode strips" in the present invention. The bonding portion 37 is provided at the y-direction upstream end of the strip portion 36.

  In the present embodiment, the strip 32 of the common electrode 31 is disposed so as to be sandwiched between the strips 36 of the two individual electrodes 35. The heat generating portion 41 connected to one of the strip portions 381 of one relay electrode 38 is connected to the common electrode 31, and the heat generating portion 41 connected to the other strip portion 381 is connected to any one of the individual electrodes 35 . Therefore, when the individual electrode 35 is energized, current flows through the heat generating portion 41 connected thereto and the heat generating portion 41 connected to the heat generating portion 41 via the relay electrode 38 to generate heat. That is, the two heat generating parts 41 generate heat simultaneously.

  Also in the present embodiment, the same effects as in the first embodiment can be obtained. Further, in the present embodiment, the common electrode 31 can be disposed on the same side as the individual electrode 35 with respect to the heat generating portion 41. The shapes of the common electrode 31 of the electrode layer 3, the relay electrodes 38, and the individual electrodes 35 are not limited to those described above.

  13 and 14 show a thermal print head according to a fourth embodiment of the present invention. 13 is a plan view of the main part, and FIG. 14 is an enlarged cross-sectional view of the main part of the cross section taken along the line XIV-XIV of FIG. The thermal print head 104 shown in FIGS. 13 and 14 differs from the thermal print head 101 according to the first embodiment (see FIGS. 1 to 4) in that it is a so-called thick film type.

  The electrode layer 3 according to the present embodiment is formed on the major surface 11 of the glass substrate 1. The strip portions 36 of the individual electrodes 35 are located between two adjacent strip portions 32 of the common electrode 31. That is, the strip portions 36 and the strip portions 32 are alternately arranged in the x direction.

  Resistor layer 4 according to the present embodiment is made of, for example, ruthenium oxide or the like having a resistivity larger than that of the material forming electrode layer 3, and formed in a strip extending in the x direction on main surface 11 of glass substrate 1. ing. The resistor layer 4 is formed by thick-film printing a paste of ruthenium oxide or the like and then firing the paste. The resistor layer 4 may be formed by a thin film formation technique such as sputtering. The thickness of the resistor layer 4 is not particularly limited, but is, for example, about 6 μm in the case of thick film printing and, for example, about 0.05 to 0.2 μm in the case of sputtering. The resistor layer 4 is formed above the plurality of strip portions 32 and the plurality of strip portions 36 so as to intersect the plurality of strip portions 32 and the plurality of strip portions 36, respectively. A portion of the resistor layer 4 sandwiched between the strip portions 32 and the strip portions 36 is a heat generating portion 41.

  Also in the present embodiment, the same effects as in the first embodiment can be obtained. In the case of this embodiment, the flexibility of the portion where the resistor layer 4 is disposed is reduced, but the resistor layer 4 is in the shape of a strip extending in the x direction, and is disposed along the extending direction of the protrusion 92 It does not matter so much.

  FIGS. 15 and 16 show a thermal print head according to a fifth embodiment of the present invention. FIG. 15 is an enlarged cross-sectional view of the main portion of the print substrate 8 ′ before fixing to the heat sink 9, and FIG. 16 is an enlarged cross-sectional view of the main portion after fixing the print substrate 8 ′ to the heat dissipating plate 9. The thermal print head 105 shown in FIGS. 15 and 16 is different from the thermal print head 101 (see FIGS. 1 to 4) according to the first embodiment in that the protrusion 13 is provided on the glass substrate 1.

  The protrusion 13 is provided on the main surface 11 of the glass substrate 1 according to the present embodiment. The protrusion 13 is a strip extending in the x direction, and the cross-sectional shape of the yz plane including the y direction and the z direction is trapezoidal. The projection 13 is formed by digging a flat glass substrate. The digging process is performed, for example, by wet etching with hydrofluoric acid or sand blasting. The resistor layer 4 and the protective layer 5 stacked on the main surface of the glass substrate 1 also have a projecting shape according to the shape of the projecting portion 13. Therefore, as shown in FIG. 15, the printed substrate 8 ′ is flat on the back surface (the back surface 12 of the glass substrate 1) and has a portion protruding on the surface (surface on the downstream side in the z direction) according to the shape of the protrusion 13. It will have. Thereby, as shown in FIG. 16, the thermal print head 105 having the print substrate 8 ′ fixed to the heat dissipation plate 9 is provided with a protruding portion according to the shape of the protruding portion 92 of the heat dissipation plate 9. It has a so-called double partial type shape in which a further protruding portion is formed at the center.

  Also in the present embodiment, the same effects as in the first embodiment can be obtained. In addition, since the portion of the protective layer 5 covering the heat generating portion 41 is further protruded to the downstream side in the z direction, it is possible to more appropriately contact the thermal paper or the like to be printed. As shown in the fifth embodiment, the glass substrate 1 is not limited to one having no unevenness. The glass substrate 1 may be flexible as long as it can be curved and fixed according to the shape of the heat sink 9. Further, on the back surface 12 of the glass substrate 1, a band-shaped recess extending in the x direction may be provided in accordance with the position of the protrusion 13.

  FIG. 17 is an enlarged sectional view of an essential part showing a thermal print head according to a sixth embodiment of the present invention. The thermal print head 106 shown in FIG. 16 is obtained by fixing a print substrate 8 ′ according to the fifth embodiment to the main surface 91 of the heat dissipation plate 9 whose main surface 91 is flat. The thermal print head 106 has a protruding portion in accordance with the shape of the protruding portion 13 of the glass substrate 1. Also in the present embodiment, the same effects as in the first embodiment can be obtained. In addition, the main surface 91 of the heat sink 9 may not be flat. For example, it may be a convex shape that protrudes gently to the downstream side in the z direction, and conversely, it may be a concave shape that is gently recessed to the upstream side in the z direction.

  FIG. 18 is an enlarged sectional view of an essential part showing a thermal print head according to a seventh embodiment of the present invention. The thermal print head 107 shown in FIG. 18 is different from the thermal print head 101 according to the first embodiment (see FIGS. 1 to 4) in that a second projection 94 is further provided on the projection 92 of the heat sink 9. It is different.

  The second projecting portion 94 is provided at the center of the projecting portion 92 along the projecting portion 92, and has a strip shape extending in the x direction. The cross-sectional shape of the yz plane of the second protrusion 94 is arc-shaped. The print substrate 8 is curved along the shape of the main surface 91 on which the protrusion 92 and the second protrusion 94 are formed, and is fixed to the main surface 91. Therefore, the thermal print head 107 has a so-called double partial type shape in which a portion projecting in two steps is formed.

  Also in the present embodiment, the same effects as in the first embodiment can be obtained. In addition, since the portion of the protective layer 5 covering the heat generating portion 41 is further protruded to the downstream side in the z direction, it is possible to more appropriately contact the thermal paper or the like to be printed.

  FIG. 19 is an enlarged sectional view of an essential part showing a thermal print head according to an eighth embodiment of the present invention. The thermal print head 108 shown in FIG. 19 is different from the thermal print head 101 according to the first embodiment (see FIGS. 1 to 4) in the shape of the projecting portion 92 of the heat dissipation plate 9.

  The protrusion 92 according to the present embodiment is a strip extending in the x direction, and the cross-sectional shape of the yz plane is substantially triangular. The print substrate 8 is curved along the shape of the main surface 91 on which the protrusion 92 is formed, and is fixed to the main surface 91. Therefore, the thermal print head 108 has a so-called super fine type shape in which the tip angle of the protruding portion is sharpened.

  Also in the present embodiment, the same effects as in the first embodiment can be obtained. In addition, more accurate printing can be performed.

  FIG. 20 is an enlarged sectional view of an essential part showing a thermal print head according to a ninth embodiment of the present invention. The thermal print head 109 shown in FIG. 20 is different from the thermal print head 101 (see FIGS. 1 to 4) according to the first embodiment in the shape of the heat dissipation plate 9.

  The heat sink 9 according to the present embodiment has a substantially rectangular parallelepiped shape elongated in the x direction, and includes a main surface 91 including a surface 911 extending in the x direction and a surface 912 extending in the x direction and connected to the surface 911 There is. The print substrate 8 is curved along the shape of the main surface 91 and fixed to the main surface 91 such that the heat generating portion 41 is positioned at a corner portion where the surface 911 and the surface 912 are connected. Therefore, the thermal print head 109 has a so-called corner edge type shape. Also in the present embodiment, the same effects as in the first embodiment can be obtained.

  FIG. 21 is an enlarged sectional view of an essential part showing a thermal print head according to a tenth embodiment of the present invention. The thermal print head 110 shown in FIG. 21 is different from the thermal print head 101 according to the first embodiment (see FIGS. 1 to 4) in the shape of the heat dissipation plate 9.

  The heat dissipating plate 9 according to the present embodiment is in the form of a long plate in the x direction, and includes two surfaces 913 and 914 facing in opposite directions, and a side surface 915 connected to the surfaces 913 and 914 and extending in the x direction. And a main surface 91 including the The print substrate 8 is curved along the shape of the main surface 91 and fixed to the main surface 91 such that the heat generating portion 41 is positioned on the side surface 915. Therefore, the thermal print head 110 has a so-called real edge type shape. Also in the present embodiment, the same effects as in the first embodiment can be obtained.

  FIG. 22 is a cross-sectional view showing a thermal print head according to an eleventh embodiment of the present invention. The thermal print head 111 shown in FIG. 22 is different from the thermal print head 101 according to the first embodiment (see FIGS. 1 to 4) in the shape of the heat dissipation plate 9.

  The heat sink 9 which concerns on this embodiment is extended long to the x direction, and the cross-sectional shape of the yz plane of the main surface 91 is circular arc shape. The print substrate 8 is curved along the shape of the main surface 91 and fixed to the main surface 91. The wiring substrate 6 is also fixed to the main surface 91. Also in the present embodiment, the same effects as in the first embodiment can be obtained. Furthermore, according to the present embodiment, even when the thermal paper P to be printed is transported in the y direction during printing, the thermal paper P does not contact the drive IC 71 and the sealing resin 74 covering the same.

  Although the case where the printed circuit board 8 (8 ') is fixed to the heat sink 9 has been described in the first to eleventh embodiments, the present invention is not limited thereto. It may be fixed to a support member such as a substrate other than the heat dissipation plate 9.

  The thermal print head and the method of manufacturing the thermal print head according to the present invention are not limited to the embodiments described above. The specific configuration of each part of the thermal print head and the method of manufacturing the thermal print head according to the present invention can be varied in design in many ways.

101 to 111: thermal print heads 8 and 8 ': print substrate 1: glass substrate 11: main surface 12: back surface 13: protrusion portion 3: electrode layer 31: common electrode 32: strip portion 33: connection portion 34: bypass portion 311 A branch portion 312: a straight portion 35: an individual electrode 36: a band portion 37: a bonding portion 38: a relay electrode 381: a band portion 382: a connection portion 4: a resistor layer 41: a heat generating portion 5: a protective layer 6: a wiring substrate 61: Principal surface 62: Back surface 63: Wiring pattern 71: Drive IC
72: pad 73: wire 74: sealing resin 83: connector 9: heat sink 91: main surface 911 to 914: surface 915: side surface 92: protrusion 93: second main surface 94: second protrusion 95: silicone adhesive Agent 99: Pressing member 99a: Surface P: Thermal paper

Claims (31)

A glass substrate comprising a flexible glass plate having a main surface and a back surface facing each other,
A resistor layer formed on the main surface side of the glass substrate;
An electrode layer for energizing the resistor layer;
Equipped with
Thermal print head characterized by The glass substrate is fixed by curving the glass plate.
The thermal print head according to claim 1. The glass plate has no unevenness on the main surface and the back surface.
The thermal print head according to claim 1. The glass plate has a protrusion on the main surface,
The thermal print head according to claim 1. The glass plate is made of heat resistant glass,
The thermal print head according to any one of claims 1 to 4. The thickness of the glass plate is 50 μm or less.
The thermal print head according to any one of claims 1 to 5. The glass plate can be bent to a radius of curvature of 50 mm.
The thermal print head according to any one of claims 1 to 6. The resistor layer is made of a conductive metal oxide,
The thermal print head according to any one of claims 1 to 7. The resistor layer is made of ITO (indium tin oxide),
The thermal print head according to any one of claims 1 to 8. The electrode layer contains Ag.
The thermal print head according to any one of claims 1 to 9. It further comprises a protective layer covering at least a part of the resistor layer,
The thermal print head according to any one of claims 1 to 10. The resistor layer includes a plurality of heat generating portions arranged along the main scanning direction,
The electrode layer is
A plurality of common electrode strips extending in the sub scanning direction, spaced apart from each other in the main scanning direction, and connected to any of the heat generating portions, and connected to a plurality of common electrode strips, the main scanning A common electrode having a connecting portion extending in the direction;
A plurality of individual electrode strip portions connected to any one of the heat generating portions and extending in the sub scanning direction opposite to the common electrode strip portion, respectively, and arranged separately from each other in the main scanning direction With individual electrodes,
Equipped with
A thermal print head according to any of the preceding claims. The resistor layer includes a plurality of heat generating portions arranged along the main scanning direction,
The electrode layer is
A pair of relay electrode strip portions connected to the pair of heat generating portions adjacent to each other and extending in the sub-scanning direction and separated from each other in the main scanning direction, and a pair of relay electrode strip portions A plurality of relay electrodes arranged in the main scanning direction and having a connecting portion extending in the main scanning direction;
A plurality of common electrode strips connected to one of the pair of heat generating parts and extending in the sub scanning direction opposite to the relay electrode strips, and a plurality of common electrode strips connected to the main scan A common electrode having a connecting portion extending in the direction;
A plurality of individual electrode strip portions connected to the other of the pair of heat generating portions and extending in the sub scanning direction opposite to the relay electrode strip portions, respectively, and arranged separately from each other in the main scanning direction Individual electrodes, and
Equipped with
A thermal print head according to any of the preceding claims. The electrode layer is
A plurality of common electrode strips extending in the sub-scanning direction and spaced apart from each other in the main scanning direction, and a common electrode connected to the plurality of common electrode strips and having a connecting portion extending in the main scanning direction ,
A plurality of individual electrodes each having an individual electrode strip extending in the sub scanning direction, the plurality of individual electrodes being spaced apart from each other in the main scanning direction;
Equipped with
The resistor layer is a strip extending in the main scanning direction,
The common electrode strip and the individual electrode strip are alternately arranged to cross the resistor layer in the main scanning direction.
A thermal print head according to any of the preceding claims. It further has a support member main surface including a curved region, and is disposed on the back side of the glass substrate,
The glass substrate is curved according to the surface shape of the main surface of the support member and fixed to the main surface of the support member.
The thermal print head according to any one of claims 1 to 14. The main surface of the support member includes a protrusion.
The thermal print head according to claim 15. The support member is in the form of a rectangular plate elongated in the main scanning direction,
The protrusion is a strip extending in the main scanning direction, and a cross section orthogonal to the main scanning direction is an arc.
The thermal print head according to claim 16. The projecting portion is provided with a strip extending in the main scanning direction, and a second projecting portion having an arc-shaped cross section perpendicular to the main scanning direction.
The thermal print head of claim 17. The support member is in the form of a rectangular plate elongated in the main scanning direction,
The protrusion is a strip extending in the main scanning direction, and has a substantially triangular cross section.
The thermal print head according to claim 16. The main surface of the support member has an arc-shaped cross section orthogonal to the main scanning direction.
The thermal print head according to claim 15. The support member has a substantially rectangular parallelepiped shape long in the main scanning direction,
The support member main surface includes two adjacent surfaces extending in the main scanning direction.
The thermal print head according to claim 15. The support member has two faces facing each other and side faces connected to the two faces,
The main surface of the support member includes the two surfaces and the side surfaces.
The thermal print head according to claim 15. The back surface of the glass substrate is adhered to the main surface of the support member by an adhesive.
A thermal print head according to any of claims 15-22. The support member is a heat dissipation member.
A thermal print head according to any of claims 15-23. A drive IC for causing a current to flow through the electrode layer;
A wiring board on which the drive IC is mounted;
And have
The wiring board is fixed to the support member.
25. A thermal print head according to any of claims 15-24. It further comprises a drive IC for causing current to flow in the electrode layer,
The drive IC is mounted on the main surface side of the glass substrate.
25. A thermal print head according to any of the preceding claims. The drive IC is disposed at a position not in contact with the paper conveyed at the time of printing.
27. A thermal print head according to claim 25 or 26. Forming a resistor layer on the main surface side of a glass substrate having a main surface and a back surface facing each other and made of a flexible glass plate;
Forming an electrode layer on the resistor layer;
Closely attaching and fixing the back surface of the glass substrate along the main surface of the support member including the curved region of the support member;
A method of manufacturing a thermal print head, comprising: The fixing step is
Applying an adhesive to the main surface of the support member;
Placing the glass substrate on the support member main surface side of the support member;
Pressing a pressing member having a surface capable of substantially adhering to the main surface of the support member against the glass substrate from the main surface side of the glass substrate while maintaining the glass substrate in a predetermined temperature range;
Equipped with
29. The method of claim 28. In the step of forming the electrode layer,
Applying a metal paste by screen printing;
Forming a metal film by firing the metal paste;
Patterning the metal film with a laser;
Equipped with
The method according to claim 28 or 29. In the step of forming the resistor layer,
A conductive metal oxide film is formed by spray-coating a raw material solution on a heated glass substrate in a normal temperature atmosphere.
A method according to any of claims 28 to 30.

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