CN102107559A - Method for manufacturing thermosensitive printing head - Google Patents

Method for manufacturing thermosensitive printing head Download PDF

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Publication number
CN102107559A
CN102107559A CN2009103122391A CN200910312239A CN102107559A CN 102107559 A CN102107559 A CN 102107559A CN 2009103122391 A CN2009103122391 A CN 2009103122391A CN 200910312239 A CN200910312239 A CN 200910312239A CN 102107559 A CN102107559 A CN 102107559A
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CN
China
Prior art keywords
heating resistor
electrode
printing
printing head
spray printing
Prior art date
Application number
CN2009103122391A
Other languages
Chinese (zh)
Inventor
王吉刚
片桐让
于庆涛
Original Assignee
山东华菱电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 山东华菱电子有限公司 filed Critical 山东华菱电子有限公司
Priority to CN2009103122391A priority Critical patent/CN102107559A/en
Publication of CN102107559A publication Critical patent/CN102107559A/en

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Abstract

The invention relates to a thermosensitive printing head, in particular to a method for manufacturing a thermosensitive printing head. A ground coat layer is arranged on a substrate; the ground coat layer is provided with a heating resistor body and a common electrode and an individual electrode which are used for electrifying the heating resistor body; and wear-resisting protective layers are covered on the heating resistor body, the common electrode and the individual electrode. The method is characterized by comprising the following steps of: firstly, manufacturing a glass ground coat layer on the substrate made of an insulating material; secondly, manufacturing the common electrode and the individual electrode which are used for electrifying the heating resistor body on the ground coat layer, and leaving a spray printing area of the heating resistor body; thirdly, manufacturing the heating resistor body with adjacent separating structures in a heating resistor body area by a spray printing method; and finally, printing glass slurry on surfaces of the common electrode, the individual electrode and the heating resistor body, and sintering to form the wear-resisting protective layers. The method has the advantages of high machining accuracy and machining quality, long service life and the like, and the thermosensitive printing head manufactured by the method can realize high-speed and accurate printing.

Description

A kind of manufacture method of thermal printing head
Technical field
The present invention relates to the manufacture method of a kind of thermal printing head, particularly a kind of thermal printing head.
Background technology
Fig. 8 is an example of existing thick film thermal printing head; this thermal printing head; the substrate 1 that it is made of insulating materials; substrate is provided with ground glaze layer 2; common electrode 3 and individual electrode 4 for the heating resistor energising; print the broach shape electrode that extends 3a and individual electrode 4a formation along pair at common electrode; along leading India side to forming continuous heating resistor 5; heating resistor 5 and common electrode 3; 3a and individual electrode 4; the last covering of 4a wear-resistant protective layer; as shown in Figure 9; wherein substrate 1; ground glaze layer 2; heating resistor 5; wear-resistant protective layer 6; carry out meticulous; during the high speed hot print; because heating resistor 5 adjoins each other, the pyroconductivity of heating resistor 5 is very high, heat along leading India side to transmission; cause adjoint point to print the influence that is subjected to the consecutive points heat; tail is taken off in generation, and print pixel point expansion etc. are bad, can not obtain high-quality; high-speed printing.
In order to overcome the deficiency of above-mentioned technology; people have invented the thermal printing head with isolating construction heating resistor; as shown in Figure 7; the substrate that it is made of insulating materials; substrate is provided with ground glaze layer; on the ground glaze layer surface along leading India side synform composition from heating resistor 5; be covered as the common electrode 3a and the individual electrode 4a of heating resistor 5 and common electrode 3, individual electrode 4 energisings at the two ends of heating resistor 5, heating resistor 5 and common electrode 3,3a and individual electrode 4, the last covering of 4a wear-resistant protective layer.Because to being separated from each other, consecutive points do not have influence when printing to resistive element 5 mutually at leading India side, thereby can realize high speed, meticulous printing.
Figure 10 is the production example with isolating construction heating resistor thermal printing head; the substrate 1 that this thermal printing head is made of insulating materials; substrate is provided with ground glaze layer 2; at lead electrode along leading India side synform composition from heating resistor 5; common electrode 3 for the heating resistor energising; 3a and individual electrode 4; 4a; cover heating resistor 5 and common electrode 3; 3a and individual electrode 4; the wear-resistant protective layer 6 of 4a; its production method is: make the glass ground glaze layer earlier on the substrate that insulating materials constitutes; on the glass ground glaze layer, print the organic gold material then; form gold on the ground glaze layer surface behind the sintering; adopt the method for photoetching to form the common electrode 3 that heating resistor is switched on again; 3a and individual electrode 4; 4a; adopt serigraphy to form along leading India side then to continuous heating resistor; heating resistor is crossed over the 4a of common electrode extension 3a and individual electrode respectively at secondary Print direction; and then carry out the separation of heating resistor, at last at heating resistor 5 and common electrode 3; 3a and individual electrode 4; the last covering of 4a wear-resistant protective layer.Wherein the separation of heating resistor 5 is to adopt blasting craft to realize, promptly use the mode of sandblast, continuous heating resistor 5 is cut open, form the heating resistor 5 of isolating construction, in the sandblast process, be easy to cause between the 3a, between the 4a and electrode pair produces damage at heating resistor 5 positions of secondary Print direction correspondence, also may cause heating resistor 5 to separate thoroughly phenomenon sometimes.In addition as shown in figure 11, form the heating resistor 5 that separates fully, the resistive element of adjacency is separated fully, be easy to damage accumulation of heat ground glaze layer 2, in sum, existing blasting craft is not suitable for the retrofit to thermal printing head, for high accuracy, high-resolution thermal printing head, its processing dimension is difficult to accurate control, also has deficiencies such as not easy to operate, that working (machining) efficiency is low in addition.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, a kind of meticulous high thermal printing method for making head with isolating construction heating resistor of processing is provided.
The present invention reaches by following measure:
A kind of manufacture method of thermal printing head is characterized in that processing step is:
The first step is equipped with earlier the glass ground glaze layer on the substrate of being made by insulating materials, on ground glaze layer, be made as the public electrode and the individual electrode of heating resistor energising then, and leave heating resistor spray printing district, the general glass glaze laminar surface that adopts serigraphy the organic gold material to be printed in substrate, by forming golden film behind the sintering, adopt the mode of photoetching to form public electrode then, public electrode is to secondary Print direction extension, individual electrode and along secondary Print direction to 4a portion that public electrode 3a direction is extended, electrode 3a is corresponding one by one with individual electrode 4a, constitute a electrode pair for the resistive element energising, corresponding zone is the heating resistor tagma between 3a and the 4a
Second step adopted jet printing method to make heating resistor in the heating resistor tagma, hydrojet adopts resistance slurry, and heating resistor is connected with public electrode and individual electrode, carries out sintering again, forms heating resistor.
The 3rd step was made wear-resistant protective layer, and the surface printing glass paste at public electrode, individual electrode and heating resistor forms wear-resistant protective layer behind sintering.
The preferred meticulous ink jet printing of the present invention is as the technology that forms heating resistor, specifically will be with resistance slurry with pressure or other mechanical force, resistance material is sprayed from nozzle, form heating resistor
The present invention adopts continuously uninterrupted spray printing mode, once forms the resistive element of the heating of an isolating construction like this in each heating resistor spray printing district; If the spray printing mode is the pointwise ejection, utilize the combination of a spray printing point or a plurality of spray printing points, form the heating resistor of an isolating construction in each heating resistor spray printing district.
The pointwise ejection that the present invention adopts is the resistance slurry that at every turn sprays fixed volume, and the general mode of the spray printing of exerting pressure that adopts is pushed ejection from container with the resistance lotion.
The spray printing technology is used solution shape fluid usually, the invention is not restricted to solution, comprises the medium that solution, paste, powder etc. can spray printings.
The resistance slurry that the present invention adopts adopts present known thermal printing head heater resistance slurry, can use by suitable adjustment viscosity, the also resistance slurry that can adopt organo-metallic compound solution to be mixed with, the various parameters of heating resistor, the sintering condition of resistance need not regulated especially, and be same as the prior art.
The present invention has advantages such as machining accuracy height, crudy are good, and the thermal printing head that adopts this method to produce is realized advantages such as high speed, meticulous printing.
Description of drawings
Fig. 1 is the graphics of an example of thermal printing head of the present invention
Fig. 2 is the plane of an example of thermal printing head of the present invention
Fig. 3 is the graphics of the examples of implementation of thermal printing head of the present invention
Fig. 4 is the sectional drawing of Fig. 3 along I-I.
Fig. 5 is the sectional drawing of Fig. 3 along II-II.
Fig. 6 is the plane of thermal printing head examples of implementation of the present invention
Fig. 7 is the plane of existing first example of film thermal printing.
Fig. 8 is the graphics of existing first example of thick film thermal printing.
Fig. 9 is the sectional drawing of Fig. 8 along III-III.
Figure 10 is the graphics of first the example of thick film thermal printing of existing discrete resistor body.
Figure 11 is the sectional drawing of Figure 10 along IV-IV.
The specific embodiment
Below in conjunction with accompanying drawing the present invention is further described:
A kind of manufacture method of thermal printing head is characterized in that processing step is:
The first step is made the glass ground glaze layer earlier on the substrate of being made by insulating materials, substrate generally adopts ceramic wafer, the method for coating of glass ground glaze layer, on ground glaze layer, be made as the public electrode and the individual electrode of heating resistor energising then, and leave heating resistor spray printing district, the general glass glaze laminar surface that adopts serigraphy the organic gold material to be printed in substrate, by forming golden film behind the sintering, adopt the mode of photoetching to form public electrode 3 then, public electrode 3 is to secondary Print direction extension 3a, individual electrode 4 and along secondary Print direction to 4a portion that public electrode 3a direction is extended, electrode 3a is corresponding one by one with individual electrode 4a, constitute a electrode pair for the resistive element energising, corresponding zone is the heating resistor tagma between 3a and the 4a, above-mentioned same as the prior art, this does not give unnecessary details.
Second step adopted jet printing method to make heating resistor in the heating resistor tagma, hydrojet adopts resistance slurry, and heating resistor is connected with public electrode and individual electrode, carries out sintering again, forms heating resistor.The resistance slurry that the present invention adopts adopts present known thermal printing head heater resistance slurry, can use by suitable adjustment viscosity, the also resistance slurry that can adopt organo-metallic compound solution to be mixed with, the various parameters of heating resistor, the sintering condition of resistance need not regulated especially, and be same as the prior art.
The 3rd step was made wear-resistant protective layer, and the surface printing glass paste at public electrode, individual electrode and heating resistor forms wear-resistant protective layer behind sintering, and the technology of making wear-resistant protective layer is same as the prior art, and this does not give unnecessary details.
The preferred meticulous spray printing of the present invention is as the technology that forms heating resistor, and spray printing is that usually said micro liquid is extruded, specifically be with resistance slurry with pressure or other mechanical force, from nozzle, spray, form heating resistor.If the spray printing mode adopts continuously uninterrupted ejection in a resistance spray printing district, once form the strip resistance body of a separation; If the spray printing mode is the pointwise ejection in a resistance spray printing district, utilize the combination of a spray printing point or a plurality of spray printing points, form the heating resistor of an isolating construction.Wherein the resistance slurry of each ejection fixed volume is adopted in the ejection of the pointwise among the present invention, adopts the mode of the spray printing of exerting pressure that the resistance lotion is sprayed from container.
Represent first embodiment of thermal printing head of the present invention as Fig. 1, Fig. 5, this thermal printing head A is made up of substrate 1, glass glaze layer 2, public electrode 3, absolute electrode 4, resistance heater 5, wear-resistant protective layer 6.
The formation of electrode: adopt serigraphy the organic gold material to be printed in glass glaze layer 2 surface of substrate 1 as Fig. 2, by forming golden film behind the sintering, the 3a that adopts the mode of photoetching to form public electrode 3, public electrode then to extend, individual electrode 4 to secondary Print direction and along secondary Print direction to 4a portion that public electrode 3a direction is extended, electrode 3a is corresponding one by one with individual electrode 4a, constitute an electrode pair for the resistive element energising, corresponding zone is heating resistor tagma 8 between 3a and the 4a.
Resistive element 5 forms: resistance slurry is contained in the closed container, by to exerting pressure in the container, slurry is sprayed from shower nozzle 7.Fig. 6 a, b represent container is applied constant compression force, and then slurry ejection is continuously equably moved by the control shower nozzle, and fine rule resistive band of corresponding clear area 8 formation is a resistive element 5 between electrode.By the track that the control shower nozzle moves, form the resistive element of rectangle.Represent that as Fig. 5 resistive element 5 is crossed between the 4a of public electrode extension 3a and individual electrode corresponding regional 8, resistive element one end is connected with the extension 3a of public electrode, and the other end of resistive element is connected with individual electrode 4a.After first resistive element 5 spray printings finish, carry out the spray printing of second resistive element 5 as Fig. 3, carry out spray printing successively and finish, carry out electrical resistance sintering again, finish the making of resistive element 5 until all resistive element 5 spray printings.
Fig. 4 is illustrated in the surface-coated protective layer material of resistive element 5 surfaces and public electrode 3, individual electrode 4, forms wearing layer 6 behind the sintering, promptly finishes thermal printing head A of the present invention.
This thermal printing head has adjacent resistor body separated structures, and adjacent print point is influence not, so can realize letter quality.
Utilize Fig. 2 that second embodiment of thermal printing head of the present invention is described once more, this thermal printing head is made up of substrate 1, glass glaze layer 2, public electrode 3, absolute electrode 4, resistance heater 5, wear-resistant protective layer 6.
At first adopt the mode identical with first embodiment, form the electrode that Fig. 2 represents, electrode comprises 3a that public electrode 3, public electrode extend to secondary Print direction, individual electrode 4 and along the 4a portion of secondary Print direction to the extension of public electrode 3a direction.
Represent to adopt as Fig. 6 c then and decide volume spray printing technology, equipment is carried the slurry of fixed volume during spray printing in jet-printing head, then slurry is sprayed from shower nozzle, and each spray printing point has identical size like this, utilize a plurality of spray printing points, the resistive element shape of overlapped formation design.Represent that as Fig. 5 resistive element crosses over corresponding zone between the 4a of public electrode extension 3a and individual electrode, resistive element one end is connected with the extension 3a of public electrode, the other end of resistive element is connected with individual electrode 4a, after first resistive element 5 spray printings finish, carry out the spray printing of second resistive element 5, carry out spray printing successively and finish, carry out resistance 5 sintering again, finish the making of resistive element 5 until all resistive element 5 spray printings.
On resistive element 5 surfaces and the surface-coated protective layer material of public electrode 3, individual electrode 4, form wearing layer 6 behind the sintering, promptly finish the second embodiment of the invention thermal printing head.
This thermal printing head has adjacent resistor body separated structures, and adjacent print point is influence not, so can realize high speed, letter quality.
The spray printing technology is used solution shape fluid usually, the invention is not restricted to solution, comprises the medium that solution, paste, powder etc. can spray printings.
If above-mentioned resistance slurry thick-film resistor paste, the then final thick film heating resistor that forms with isolating construction.
If above-mentioned resistance slurry organic metal resistance slurry, the then final film heating resistor that forms with isolating construction.

Claims (5)

1. the manufacture method of a thermal printing head is characterized in that processing step is:
The first step is made the glass ground glaze layer earlier on the substrate of being made by insulating materials, and on ground glaze layer, be made as the public electrode and the individual electrode of heating resistor energising then, and leave heating resistor spray printing district,
Second step adopted jet printing method to make the heating resistor with adjacent isolating construction in the heating resistor tagma, hydrojet adopts resistance slurry, and heating resistor is connected with public electrode and individual electrode, carries out sintering again, forms heating resistor,
The 3rd step was made wear-resistant protective layer, and the surface printing glass paste at public electrode, individual electrode and heating resistor forms wear-resistant protective layer behind sintering.
2. the manufacture method of a kind of thermal printing head according to claim 1, the spray printing mode that it is characterized in that for second step are to adopt continuous spray printing, utilize continuous spray printing lines combination, form the heating resistor of isolating construction.
3. the manufacture method of a kind of thermal printing head according to claim 1, the spray printing mode that it is characterized in that for second step are to adopt the pointwise ejection, utilize the combination of a spray printing point or a plurality of spray printing points, the heating resistor of formation isolating construction.
4. the manufacture method of a kind of thermal printing head according to claim 3 is characterized in that the each resistance slurry that sprays fixed volume of pointwise ejection employing.
5. the manufacture method of a kind of thermal printing head according to claim 1 is characterized in that adopting the exert pressure mode of spray printing that the resistance lotion is sprayed from container.
CN2009103122391A 2009-12-25 2009-12-25 Method for manufacturing thermosensitive printing head CN102107559A (en)

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Application Number Priority Date Filing Date Title
CN2009103122391A CN102107559A (en) 2009-12-25 2009-12-25 Method for manufacturing thermosensitive printing head

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Application Number Priority Date Filing Date Title
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104859312A (en) * 2015-06-08 2015-08-26 武汉今域通半导体有限公司 Thermosensitive printing head and manufacturing method therefor
CN106004074A (en) * 2016-05-24 2016-10-12 山东华菱电子股份有限公司 Manufacturing method of heating substrate for heat-sensitive printing head
CN106274066A (en) * 2015-06-23 2017-01-04 富士通电子零件有限公司 Thermal printer head
WO2019031199A1 (en) * 2017-08-10 2019-02-14 ローム株式会社 Thermal print head and thermal print head manufacturing method
CN109484039A (en) * 2018-12-03 2019-03-19 山东华菱电子股份有限公司 A kind of manufacturing method of thermal printing head heating base plate
CN110027327A (en) * 2019-05-10 2019-07-19 深圳市博思得科技发展有限公司 A kind of new wide thermal printing head and preparation method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04234674A (en) * 1991-01-07 1992-08-24 Oki Electric Ind Co Ltd Manufacture of substrate for thermal head
JP2000118024A (en) * 1998-10-16 2000-04-25 Rohm Co Ltd Method for repairing disconnection of thermal print head
CN1849220A (en) * 2003-09-16 2006-10-18 罗姆股份有限公司 Thermal printhead and method for manufacturing same
CN1876244A (en) * 2006-06-30 2006-12-13 华中科技大学 Electronic device for direct slurry atomization and deposition
CN200950436Y (en) * 2006-07-31 2007-09-19 华中科技大学 Super-thin pencil for writing directly electronic/photoelectronic component
US20080185172A1 (en) * 2007-02-06 2008-08-07 Ibiden Co., Ltd. Printed wiring board and method of manufacturing the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04234674A (en) * 1991-01-07 1992-08-24 Oki Electric Ind Co Ltd Manufacture of substrate for thermal head
JP2000118024A (en) * 1998-10-16 2000-04-25 Rohm Co Ltd Method for repairing disconnection of thermal print head
CN1849220A (en) * 2003-09-16 2006-10-18 罗姆股份有限公司 Thermal printhead and method for manufacturing same
CN1876244A (en) * 2006-06-30 2006-12-13 华中科技大学 Electronic device for direct slurry atomization and deposition
CN200950436Y (en) * 2006-07-31 2007-09-19 华中科技大学 Super-thin pencil for writing directly electronic/photoelectronic component
US20080185172A1 (en) * 2007-02-06 2008-08-07 Ibiden Co., Ltd. Printed wiring board and method of manufacturing the same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104859312A (en) * 2015-06-08 2015-08-26 武汉今域通半导体有限公司 Thermosensitive printing head and manufacturing method therefor
CN106274066A (en) * 2015-06-23 2017-01-04 富士通电子零件有限公司 Thermal printer head
US10040296B2 (en) 2015-06-23 2018-08-07 Fujitsu Component Limited Thermal head
CN106004074A (en) * 2016-05-24 2016-10-12 山东华菱电子股份有限公司 Manufacturing method of heating substrate for heat-sensitive printing head
WO2019031199A1 (en) * 2017-08-10 2019-02-14 ローム株式会社 Thermal print head and thermal print head manufacturing method
CN111372786A (en) * 2017-08-10 2020-07-03 罗姆股份有限公司 Thermal print head and method of manufacturing thermal print head
CN109484039A (en) * 2018-12-03 2019-03-19 山东华菱电子股份有限公司 A kind of manufacturing method of thermal printing head heating base plate
CN110027327A (en) * 2019-05-10 2019-07-19 深圳市博思得科技发展有限公司 A kind of new wide thermal printing head and preparation method thereof

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