JP2023160355A - Thermal print head, manufacturing method for thermal print head, and thermal printer - Google Patents

Abstract

To provide a thermal print head that can suppress noise when performing printing on a label paper, a manufacturing method for the same, and a thermal printer.SOLUTION: A thermal print head A1 is provided with: a heat generation substrate 1 having a first main surface 11 pointing to a first side z1 in a thickness direction z, which is constituted of a single crystal semiconductor; a resistor layer 4 including a plurality of heat generation parts 41 arranged along a main scanning direction x at the first side z1 in the thickness direction z of the heat generation substrate 1; and a glaze layer 17 arranged among the heat generation substrate 1 and the plurality of heat generation parts 41. The heat generation substrate 1 further comprises a recessed part 15 recessed in the thickness direction z from the first main surface 11. The recessed part 15 comprises a recessed part edge 151 extending in the main scanning direction x, which is a boundary between the first main surface 11 and the part. In a view in the thickness direction z, a glaze edge 171 of the glaze layer 17 matches with the recessed part edge 151.SELECTED DRAWING: Figure 5

Description

The present disclosure relates to a thermal print head, a method for manufacturing the same, and a thermal printer including the thermal print head.

Patent Document 1 discloses an example of a conventional thermal print head. The thermal print head disclosed in this document includes a head substrate having a main surface integrally formed with a convex portion extending in the main scanning direction. A plurality of heat generating parts are arranged on the convex part. Since the heat generating part is arranged on the convex part, the print medium is reliably pressed against the heat generating part via the platen roller. The head substrate is made of a single crystal semiconductor, and has protrusions formed by anisotropic etching. Therefore, the angle of inclination of the inclined outer surface of the convex portion with respect to the main surface is a constant angle of, for example, 50 to 60 degrees.

There are various types of print media on which the thermal print head prints, including, for example, label paper with a heat-sensitive paper sticker pasted on a mount. The label paper is sent to the thermal print head with the side with the sticker affixed facing downward. The seal protrudes downward from the mount by an amount corresponding to its thickness (for example, about 60 to 80 μm). In the case of the above-mentioned thermal print head, there is a problem in that when printing on label paper, the downwardly protruding seal portion collides with the inclined outer surface of the convex portion, causing noise.

JP 2021-11021 Publication

The present disclosure was conceived under the above circumstances, and an object of the present disclosure is to provide a thermal print head that can suppress noise when printing on label paper.

A thermal print head provided by a first aspect of the present disclosure includes a heat-generating substrate having a first main surface facing a first side in the thickness direction and made of a single crystal semiconductor; a resistor layer including a plurality of heat generating parts arranged along the main scanning direction on a first side in the horizontal direction; and a glaze layer disposed between the heat generating substrate and the plurality of heat generating parts. The heating substrate further includes a recess recessed from the first main surface in the thickness direction, and the recess includes an edge of the recess that is a boundary with the first main surface and extends in the main scanning direction. , when viewed in the thickness direction, a glaze edge of the glaze layer and an edge of the recess are aligned.

A method for manufacturing a thermal print head provided by a second aspect of the present disclosure includes preparing a base material that has a first main surface facing the first side in the thickness direction and is made of a single crystal semiconductor. a preparatory step; a first etching step of forming a concave portion recessed in the thickness direction from the first principal surface by a first etching; a second etching step of forming a second main surface located on a second side opposite to the first side from the first main surface; and a glaze layer on the first side of the base material in the thickness direction. A glaze layer forming step of forming a glaze layer.

The thermal print head according to the present disclosure can suppress noise when printing on label paper.

Other features and advantages of the present disclosure will become more apparent from the detailed description given below with reference to the accompanying drawings.

FIG. 1 is a plan view showing a thermal print head according to a first embodiment of the present disclosure. FIG. 2 is a plan view of essential parts of the thermal print head of FIG. 1. FIG. FIG. 3 is an enlarged plan view of essential parts of the thermal print head of FIG. 1. FIG. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. FIG. 5 is a sectional view of essential parts of the thermal print head of FIG. 1. FIG. FIG. 6 is a plan view showing the heat generating substrate of the thermal print head of FIG. 1. FIG. FIG. 7 is a flowchart showing an example of a method for manufacturing the thermal print head shown in FIG. FIG. 8 is a cross-sectional view of a main part showing one step of an example of a method for manufacturing the thermal print head of FIG. 1. FIG. FIG. 9 is a cross-sectional view of a main part showing one step of an example of a method for manufacturing the thermal print head of FIG. FIG. 10 is a cross-sectional view of a main part showing one step of an example of a method for manufacturing the thermal print head of FIG. 1. FIG. FIG. 11 is a cross-sectional view of a main part showing one step of an example of a method for manufacturing the thermal print head of FIG. FIG. 12 is a cross-sectional view of a main part showing one step of an example of a method for manufacturing the thermal print head of FIG. 1. As shown in FIG. FIG. 13 is a cross-sectional view of a main part showing one step of an example of a method for manufacturing the thermal print head of FIG. 1. FIG. 14 is a cross-sectional view of a main part showing one step of an example of a method for manufacturing the thermal print head of FIG. 1. FIG. FIG. 15 is a cross-sectional view of a main part showing one step of an example of a method for manufacturing the thermal print head of FIG. 1. As shown in FIG. FIG. 16 is a cross-sectional view of a main part showing one step of an example of a method for manufacturing the thermal print head of FIG. 1. FIG. 17 is a cross-sectional view of main parts showing a thermal print head according to a second embodiment of the present disclosure. FIG. 18 is a plan view showing a heat generating substrate of a thermal print head according to a third embodiment of the present disclosure. FIG. 19 is a sectional view taken along line XIX-XIX in FIG. 18. FIG. 20 is a cross-sectional view showing a heat generating substrate of a thermal print head according to a fourth embodiment of the present disclosure. FIG. 21 is a plan view showing a heat generating substrate of a thermal print head according to a fifth embodiment of the present disclosure.

Hereinafter, preferred embodiments of the present disclosure will be specifically described with reference to the drawings.

<First embodiment>
1 to 6 show a thermal print head A1 according to a first embodiment of the present disclosure. The thermal print head A1 of this embodiment includes a heat generating board 1, a protective layer 2, a conductive layer 3, a resistor layer 4, a glaze layer 17, an insulating layer 18, a first board 5, a driver IC 55, a second board 6, and a connector 69. , a third substrate 7, and a heat dissipation member 8. The thermal print head A1 is incorporated into a thermal printer B1 as shown in FIG. 4, and prints on a print medium 92 that is conveyed while being sandwiched between a platen roller 91. The platen roller 91 is arranged to face a heat generating section, which will be described later, and presses the print medium 92 against the heat generating section while conveying the print medium 92. Examples of such print media 92 include thermal paper for creating barcode sheets or date code sheets. The print medium 92 also includes a label paper with a heat-sensitive paper sticker attached to a mount.

FIG. 1 is a plan view showing the thermal print head A1. FIG. 2 is a plan view of the main parts of the thermal print head A1. FIG. 3 is an enlarged plan view of the main parts of the thermal print head A1. In FIGS. 1 to 3, the protective layer 2 is omitted for convenience of understanding. In FIG. 2, for convenience of understanding, a protective resin 57 and a wire 561, which will be described later, are omitted. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. FIG. 5 is a sectional view of a main part of the thermal print head A1. FIG. 6 is a plan view showing the heat generating substrate 1 of the thermal print head A1. In FIG. 6, for convenience of understanding, recesses 15, which will be described later, are dotted. Further, in these figures, description will be made assuming that the longitudinal direction of the heat generating substrate 1 is the main scanning direction x, the lateral direction is the sub-scanning direction y, and the thickness direction is the thickness direction z. Regarding the sub-scanning direction y, the lower side of FIGS. 1 to 3 (the right side of FIGS. 4 and 5) is the upstream side y1 where the print medium 92 is sent, and the upper side of FIGS. 1 to 3 (the right side of FIGS. and the left side of FIG. 5) is defined as the downstream side y2 where the print medium 92 is discharged. Further, regarding the thickness direction z, the upper side in FIGS. 4 and 5 is defined as a first side z1, and the lower side in FIGS. 4 and 5 is defined as a second side z2. Regarding the main scanning direction x, the left side in FIGS. 1 to 3 is a first side x1, and the right side in FIGS. 1 to 3 is a second side x2. The same applies to the following figures.

The heat generating substrate 1 is mounted on the heat dissipating member 8 and supports the conductive layer 3 and the resistor layer 4. The heat generating substrate 1 has an elongated rectangular shape whose longitudinal direction is in the main scanning direction x and whose width direction is in the sub-scanning direction y. Although the size of the heat generating substrate 1 is not particularly limited, as an example, the thickness of the heat generating substrate 1 is, for example, about 0.5 to 1 mm. Further, the dimension of the heat generating substrate 1 in the main scanning direction x is, for example, about 50 to 150 mm, and the dimension in the sub scanning direction y is, for example, about 1 to 5 mm.

In this embodiment, the heat generating substrate 1 is made of a single crystal semiconductor, for example, Si. Note that the constituent material of the heat generating substrate 1 is not limited. As shown in FIGS. 4 and 5, the heat generating substrate 1 has a first main surface 11 and a back surface 12. As shown in FIG. The first main surface 11 and the back surface 12 face oppositely to each other in the thickness direction z and are parallel to each other. The first main surface 11 is a surface facing the first side z1 in the thickness direction z. The first main surface 11 is located on the downstream side y2 of the heat generating substrate 1 in the sub-scanning direction y, and extends to the edge of the downstream side y2. Further, in this embodiment, the first main surface 11 is divided into two parts by a recess 15, which will be described later, as shown in FIGS. 5 and 6. Both of these two parts have an elongated rectangular shape that extends in the main scanning direction x. A conductive layer 3 and a resistor layer 4 are arranged on the first main surface 11 . The back surface 12 is a surface facing the second side z2 in the thickness direction z. The back surface 12 is bonded to the heat dissipation member 8 (first support surface 81 to be described later) via an adhesive member (not shown).

Further, as shown in FIGS. 5 and 6, the heat generating substrate 1 has a second main surface 13 and an inclined surface 14. The second main surface 13 faces a first side z1 (the same side as the first main surface 11) in the thickness direction z, and is oriented toward a second side z2 (back side 12 side) in the thickness direction z from the first main surface 11. To position. Further, the second main surface 13 is located on the upstream side y1 of the first main surface 11 in the sub-scanning direction y, and extends to the edge of the heat-generating substrate 1 on the upstream side y1 in the sub-scanning direction y. The second main surface 13 has an elongated rectangular shape that extends in the main scanning direction x. The inclined surface 14 is located between the first main surface 11 and the second main surface 13 in the sub-scanning direction y, and is connected to the first main surface 11 and the second main surface 13. The inclined surface 14 is inclined with respect to the first main surface 11 and the second main surface 13, and approaches the back surface 12 as it approaches the upstream side y1 in the sub-scanning direction y. The inclined surface 14 has an elongated rectangular shape that extends in the main scanning direction x. The heat generating substrate 1 is formed by forming a mask layer on the (100) plane of a single crystal semiconductor material such as a Si wafer, and performing anisotropic etching using wet etching. The portion covered by the mask layer and remaining without being etched becomes the first main surface 11. Therefore, the first principal surface 11 is the (100) plane. On the other hand, the surfaces exposed by etching become the second main surface 13 and the inclined surface 14. The second main surface 13 is parallel to the first main surface 11 and, like the first main surface 11, is a (100) plane. The inclination angle α of the inclined surface 14 with respect to the first principal surface 11 is a predetermined angle depending on the anisotropic etching. In this embodiment, the inclined surface 14 is a (111) plane, and the inclined angle α is, for example, 54.8°. Note that the inclination angle α is not limited.

Further, as shown in FIGS. 5 and 6, the heat generating substrate 1 has a recess 15. The recess 15 is a groove recessed from the first main surface 11 toward the second side z2 in the thickness direction z, and extends in the main scanning direction x. The recess 15 has an elongated rectangular shape that extends in the main scanning direction x when viewed in the thickness direction z. In this embodiment, the recess 15 extends to both ends of the heat generating substrate 1 in the main scanning direction x. The recess 15 is formed, for example, by dry etching. Note that the method of forming the recess 15 is not limited. As shown in FIG. 5, the first dimension (dimension in the thickness direction z) of the depth of the recess 15 D1 is the difference in position between the first principal surface 11 and the second principal surface 13 in the thickness direction z. It is smaller than the second dimension D2. The first dimension D1 is 0.5% or more and 5% or less of the second dimension D2, and the inclination angle β of the side surface 153 of the recess 15 with respect to the first main surface 11 is the inclination angle α (the first main surface 11 (the angle of inclination of the inclined surface 14 relative to the angle of inclination of the inclined surface 14). In this embodiment, the inclination angle β is approximately a right angle. The recess 15 includes two recess edges 151. Each recess edge 151 is a boundary between the recess 15 and the first main surface 11, and extends in the main scanning direction x.

Glaze layer 17 is made of a glass material such as amorphous glass, for example. Glaze layer 17 is formed, for example, by firing a glass paste. In this embodiment, the thermal expansion coefficient of the glaze layer 17 is approximately the same as that of Si, which is the material of the heat generating substrate 1. Note that the characteristics of the glass material of the glaze layer 17 are not limited. As shown in FIG. 5, the glaze layer 17 is arranged inside the recess 15. As shown in FIG. Glaze layer 17 is formed by placing glass paste in recess 15 and firing it. Although the glass paste is fluid, when placed in the recess 15, surface tension prevents it from exceeding the recess edge 151. Also, during firing, the glass paste is fluidized by heating, but surface tension prevents it from exceeding the edge 151 of the recess. In other words, since the recess 15 only needs to have the recess edge 151 for preventing the glass paste from flowing and spreading on the first main surface 11, the first dimension D1 is relatively large as described above. It can be as small as Further, it is desirable that the inclination angle β is relatively large as described above. When viewed in the thickness direction z, the glaze edge 171, which is the edge of the glaze layer 17, and the recess edge 151 of the recess 15 match. More specifically, the glaze edge 171 on the upstream side y1 in the sub-scanning direction y and the recess edge 151 on the upstream side y1 in the sub-scanning direction y coincide with the glaze edge 171 on the downstream side y2 in the sub-scanning direction y. The concave portion edge 151 on the downstream side y2 in the sub-scanning direction y coincides with the concave portion edge 151. The glaze layer 17 is formed with a formation region defined by the recesses 15 . Further, the cross-sectional shape of the glaze layer 17 perpendicular to the main scanning direction x is a convex shape formed by the surface tension of the glass paste material. Therefore, the glaze layer 17 has a smaller thickness (dimension in the thickness direction z) than a convex portion formed by performing anisotropic etching on a single crystal semiconductor, and has a gentle convex portion.

As shown in FIG. 5, the insulating layer 18 covers the first main surface 11, the second main surface 13, the inclined surface 14, and the glaze layer 17, and connects the heat generating substrate 1 to the resistor layer 4 and the conductive layer 3. This is to provide more reliable insulation against the The insulating layer 18 may be formed in the region of the heat generating substrate 1 where the resistor layer 4 or the conductive layer 3 is formed. The insulating layer 18 is made of an insulating material, such as SiO ₂ , SiN, or TEOS (tetraethyl orthosilicate). In this embodiment, insulating layer 18 is TEOS. Note that the constituent material of the insulating layer 18 is not limited. The thickness of the insulating layer 18 is not particularly limited, and is, for example, 5 μm to 15 μm, preferably 5 μm to 10 μm.

The resistor layer 4 is supported by the heat generating substrate 1 via the insulating layer 18. The resistor layer 4 is arranged on the first side z1 in the thickness direction z with respect to the heat generating substrate 1, and covers at least a portion of the first main surface 11, the second main surface 13, the inclined surface 14, and the glaze layer 17. covered. The resistor layer 4 has a plurality of heat generating parts 41. The plurality of heat generating units 41 locally heat the print medium 92 by selectively energizing each of them. In this embodiment, the heat generating part 41 is a region of the resistor layer 4 exposed from the conductive layer 3 and is arranged on the glaze layer 17 arranged in the recess 15 . That is, the glaze layer 17 is arranged between the heat generating substrate 1 and the plurality of heat generating parts 41. As shown in FIG. 4, in the thermal printer B1, the plurality of heat generating parts 41 are opposed to the platen roller 91. The plurality of heat generating parts 41 are arranged along the main scanning direction x, and are spaced apart from each other in the main scanning direction x. The shape of the heat generating part 41 is not particularly limited, and in this embodiment, it is a long rectangular shape whose longitudinal direction is the sub-scanning direction y when viewed from the thickness direction z. The resistor layer 4 is made of TaN, for example. Note that the constituent material of the resistor layer 4 is not limited. The thickness of the resistor layer 4 is not particularly limited, and is, for example, 0.02 μm to 0.1 μm, preferably about 0.08 μm.

The conductive layer 3 is for configuring an energization path for energizing the plurality of heat generating parts 41 . The conductive layer 3 is supported by the heat generating substrate 1, and in this embodiment is laminated on the resistor layer 4, as shown in FIG. The conductive layer 3 exposes the portion of the resistor layer 4 that is to become the heat generating portion 41 . The conductive layer 3 is made of a metal material having a lower resistance than the resistor layer 4, and is made of Cu, for example. The thickness of the conductive layer 3 is not particularly limited, and is, for example, 0.3 μm to 2.0 μm.

As shown in FIGS. 1 to 3 and 5, in this embodiment, the conductive layer 3 includes a plurality of individual electrodes 31, a common electrode 32, and a plurality of relay electrodes 33.

The plurality of individual electrodes 31 each have a band shape extending approximately in the sub-scanning direction y, and are arranged on the first main surface 11 , the second main surface 13 , the inclined surface 14 , and the glaze layer 17 . The plurality of individual electrodes 31 are arranged on the upstream side y1 in the sub-scanning direction y with respect to the plurality of heat generating parts 41. Each of the plurality of individual electrodes 31 is connected to a different heat generating section 41 . As shown in FIGS. 2 and 5, the individual electrodes 31 have individual pads 311. The individual pad 311 is a portion to which a wire 561 for electrical connection with the driver IC 55 is wire-bonded. A plating layer containing, for example, Au is formed on the individual pads 311 .

The common electrode 32 is disposed on the first main surface 11 , the second main surface 13 , the inclined surface 14 , and the glaze layer 17 , and includes a connecting portion 323 and a plurality of strips 324 . The plurality of strips 324 extend in the sub-scanning direction y. As shown in FIG. 3, one end (downstream y2 end in the sub-scanning direction y) of the plurality of strips 324 is branched into two parts, and each branch part is connected to two adjacent heat generating parts 41, respectively. Connected. As shown in FIG. 2, the connecting portion 323 is located on the other end side (upstream side y1 in the sub-scanning direction y) of the plurality of strips 324 and extends in the main scanning direction x. It is connected.

The relay electrode 33 is disposed on the first main surface 11 and the glaze layer 17, and has a U-shape with an opening facing upstream y1 in the sub-scanning direction y. A plurality of relay electrodes 33 are arranged at equal pitches in the main scanning direction x on the downstream side y2 of the heat generating part 41 in the sub scanning direction y. Each relay electrode 33 is connected to two adjacent heat generating parts 41.

As shown in FIG. 3, the strip portion 324 of the common electrode 32 is sandwiched between the two individual electrodes 31. One of the two heat generating parts 41 connected to one relay electrode 33 is connected to the common electrode 32, and the other is connected to one of the individual electrodes 31. Therefore, when the individual electrode 31 is energized, current flows through the heat generating part 41 connected to the individual electrode 31 and the heat generating part 41 connected to the heat generating part 41 via the relay electrode 33, thereby generating heat. In other words, the two heat generating parts 41 generate heat at the same time.

Note that the arrangement and shape of the conductive layer 3 are not limited. For example, the relay electrode 33 is not provided, the common electrode 32 is arranged on the downstream side y2 of the heat generating part 41 in the sub-scanning direction y, and each heat generating part 41 is connected to the strip part 324 of the common electrode 32 and the individual electrode 31, which are different from each other. may be connected to.

The protective layer 2 is formed so as to overlap the first main surface 11 , the second main surface 13 , and the inclined surface 14 of the heat generating substrate 1 and the glaze layer 17 , and covers the conductive layer 3 and the resistor layer 4 . . The protective layer 2 is made of an insulating material and protects the conductive layer 3 and the resistor layer 4. The protective layer 2 is made of, for example, SiO ₂ , SiN, SiC, AlN, etc., and is composed of a single layer or a plurality of layers thereof. The thickness of the protective layer 2 is not particularly limited, and is, for example, about 1.0 μm to 10 μm.

As shown in FIG. 5, in this embodiment, the protective layer 2 has a pad opening 21. As shown in FIG. The pad opening 21 penetrates the protective layer 2 in the thickness direction z. The pad opening 21 exposes the individual pad 311 of each individual electrode 31.

As shown in FIGS. 1 and 4, the first substrate 5 is mounted on the heat radiating member 8 and is disposed on the upstream side y1 of the heat generating substrate 1 in the sub-scanning direction y. The first board 5 is, for example, a PCB board, and has a driver IC 55 mounted thereon. The shape of the first substrate 5 is not particularly limited, and in this embodiment, it is a long rectangular shape whose longitudinal direction is the main scanning direction x. The first substrate 5 has a main surface 51 and a back surface 52. The main surface 51 is a surface facing the same side as the first main surface 11 of the heat generating substrate 1, and the back surface 52 is a surface facing the same side as the back surface 12 of the heat generating board 1. A first wiring (not shown) is formed on the main surface 51 . In the first wiring, the driver IC 55 is die-bonded and the wire 562 is wire-bonded, so in this embodiment, a plating layer containing, for example, Au is formed on the wiring made of, for example, Cu. Note that the constituent material and formation method of the first wiring are not limited.

The driver IC 55 is mounted on the main surface 51 of the first substrate 5, and is used to individually energize the plurality of heat generating parts 41. In this embodiment, the driver IC 55 is conductively connected to the plurality of individual electrodes 31 by a plurality of wires 561. Power supply control of the driver IC 55 follows command signals input from outside the thermal print head A1 via the first board 5, the second board 6, the third board 7, and the connector 69. The driver IC 55 is electrically connected to the first wiring of the first substrate 5 by a plurality of wires 562. In this embodiment, a plurality of driver ICs 55 are provided according to the number of heat generating parts 41.

The driver IC 55, the plurality of wires 561, and the plurality of wires 562 are covered with a protective resin 57. The protective resin 57 is made of, for example, an insulating resin and is, for example, black in color. The protective resin 57 is formed so as to straddle the heat generating substrate 1 and the first substrate 5.

As shown in FIGS. 1 and 4, the second substrate 6 is disposed on the upstream side y1 of the first substrate 5 in the sub-scanning direction y. The second board 6 is, for example, a PCB board, and has other circuit elements (not shown) and a connector 69 mounted thereon. The shape of the second substrate 6 is not particularly limited, and in this embodiment, it is a long rectangular shape whose longitudinal direction is the main scanning direction x. The second substrate 6 has a main surface 61 and a back surface 62. The main surface 61 is a surface facing the same side as the first main surface 11 of the heat generating substrate 1, and the back surface 62 is a surface facing the same side as the back surface 12 of the heat generating board 1. However, in this embodiment, the second substrate 6 is arranged in an inclined state with respect to the heat generating substrate 1 and the first substrate 5. Second wiring (not shown) is formed on the main surface 61 and the back surface 62. Note that the constituent material and formation method of the second wiring are not limited.

Connector 69 is used to connect thermal print head A1 to thermal printer B1. The connector 69 is attached to the back surface 62 and connected to the second wiring.

The third substrate 7 is connected to the first substrate 5 and the second substrate 6 and has more flexibility than the first substrate 5 and the second substrate 6. The third board 7 is a flexible printed circuit board, and has a third wiring that conductively connects the first wiring of the first board 5 and the second wiring of the second board 6. Since the first substrate 5 and the second substrate 6 are connected by the flexible third substrate 7, the second substrate 6 can be placed in an inclined state with respect to the first substrate 5. The shape of the third substrate 7 is not particularly limited, and in this embodiment, it is a long rectangular shape whose longitudinal direction is the main scanning direction x.

The heat dissipating member 8 has the heat generating board 1 , the first board 5 , and the second board 6 mounted thereon, and is used to radiate part of the heat generated by the plurality of heat generating parts 41 to the outside via the heat generating board 1 . belongs to. The heat radiation member 8 is a block-shaped member made of metal such as aluminum, and is formed by extrusion molding, for example. Note that the constituent material and forming method of the heat dissipation member 8 are not limited. As shown in FIG. 4, the heat dissipation member 8 has a first support surface 81, a second support surface 82, and a bottom surface 83. The first support surface 81, the second support surface 82, and the bottom surface 83 face opposite sides to each other in the thickness direction z.

The first support surface 81 and the second support surface 82 are arranged side by side in the sub-scanning direction y, facing the first side z1 in the thickness direction z. As shown in FIG. 4, the second support surface 82 is disposed further away from the bottom surface 83 than the first support surface 81 (on the first side z1 in the thickness direction z). Further, the first support surface 81 is inclined with respect to the second support surface 82 and the bottom surface 83. Note that the first support surface 81 may be parallel to the second support surface 82 and the bottom surface 83. Further, the first support surface 81 and the second support surface 82 may be flush with each other. The back surface 12 of the heat generating substrate 1 and the back surface 52 of the first substrate 5 are adhered to the first support surface 81 . The back surface 62 of the second substrate 6 is adhered to the second support surface 82 . Note that the constituent material of the adhesive member that adheres the back surface 12, the back surface 52, and the back surface 62 to the heat dissipation member 8 is not limited.

The bottom surface 83 faces the second side z2 in the thickness direction z. The bottom surface 83 is a surface that serves as a reference when installing the thermal print head A1 into a printer. The second support surface 82 is parallel to the bottom surface 83. In this specification, the thickness direction of the heat generating substrate 1 is defined as the thickness direction z, so the first support surface 81 is perpendicular to the thickness direction z. On the other hand, the second support surface 82 is inclined with respect to the surface (first support surface 81) orthogonal to the thickness direction z, so it is not perpendicular to the thickness direction z. Similarly, the bottom surface 83 is also not perpendicular to the thickness direction z.

Next, an example of a method for manufacturing the thermal print head A1 will be described below with reference to FIGS. 7 to 16. FIG. 7 is a flowchart illustrating an example of a method for manufacturing the thermal print head A1. 8 to 16 are cross-sectional views showing one step of an example of a method for manufacturing the thermal print head A1, and correspond to the cross-sections shown in FIGS. 4 and 5. Note that the main scanning direction x, sub-scanning direction y, and thickness direction z shown in FIGS. 8 to 16 indicate the same directions as in FIGS. 1 to 6.

As shown in FIG. 7, the manufacturing method of the thermal print head A1 includes a base material preparation step S10, a first etching step S20, a second etching step S30, a glaze layer forming step S40, an insulating layer forming step S50, and a heat generating part forming step. S60, a protective layer forming step S70, a cutting step S80, and an assembling step S90.

The base material preparation step S10 is a step of preparing the base material 10A, which is the material of the heat generating substrate 1. In this step, as shown in FIG. 8, a base material 10A is prepared. The base material 10A is made of a single crystal semiconductor, and is, for example, a Si wafer. The base material 10A has a main surface 11A. The main surface 11A is substantially flat and faces the first side z1 in the thickness direction z. The principal surface 11A is a (100) plane.

The first etching step S20 is a step of performing first etching on the base material 10A, and is a step of forming a recess 15 as shown in FIG. In this step, first, a predetermined mask layer 98 (indicated by a two-dot chain line in FIGS. 8 and 9) is formed on a part of the main surface 11A of the base material 10A. The mask layer 98 is formed, for example, by patterning a resist using a photolithography technique. The mask layer 98 has an opening 98a that penetrates the mask layer 98 in the thickness direction z and extends in the main scanning direction x. Then, by performing dry etching, as shown in FIG. 9, a recessed portion 15 is formed that is recessed from the main surface 11A in the thickness direction z and extends in the main scanning direction x. The shape of the recess 15 when viewed in the thickness direction z corresponds to the opening 98a of the mask layer 98. Thereafter, mask layer 98 is removed.

The second etching step S30 is a step of performing second etching on the base material 10A. In this step, first, as shown in FIG. 10, a predetermined mask layer 99 (indicated by a two-dot chain line in FIGS. 10 and 11) is formed on a part of the main surface 11A of the base material 10A. The mask layer 99 is formed, for example, by patterning a hard mask using a photolithography technique. The mask layer 99 extends in the main scanning direction x, and covers the entire recess 15 and a portion of the main surface 11A on the downstream side y2 in the sub-scanning direction y. Then, anisotropic etching is performed using, for example, an alkaline aqueous solution. Examples of this alkaline aqueous solution include KOH (potassium hydroxide) and TMAH (tetramethylammonium hydroxide). As a result, as shown in FIG. 11, a first main surface 11, a second main surface 13, and an inclined surface 14 are formed. The first main surface 11 is a portion of the main surface 11A that is covered by the mask layer 99 and remains unetched. The second main surface 13 and the inclined surface 14 are surfaces obtained by etching the main surface 11A. The first main surface 11 and the second main surface 13 are (100) planes like the main surface 11A. The inclined surface 14 is a (111) plane and is inclined with respect to the first main surface 11 and the second main surface 13. The inclination angle α of the inclined surface 14 with respect to the first main surface 11 is, for example, 54.8°. Thereafter, mask layer 99 is removed.

The glaze layer forming step S40 is a step of forming a glaze layer 17, as shown in FIG. In this step, first, glass paste is placed in the recess 15 using, for example, a dispenser. Although the placed glass paste is fluid, surface tension prevents it from exceeding the edge 151 of the recess. Note that the method of disposing the glass paste is not limited, and may be disposed by, for example, screen printing. Thereafter, by firing the glass paste, a glaze layer 17 is formed as shown in FIG. 12. Although the glass paste is fluidized by heating during firing, surface tension prevents it from exceeding the edge 151 of the recess. As a result, the glaze layer 17 is formed in a state where the glaze edge 171 and the recess edge 151 match when viewed in the thickness direction z.

The insulating layer forming step S50 is a step of forming an insulating layer 18 covering the first main surface 11, the second main surface 13, the inclined surface 14, and the glaze layer 17, as shown in FIG. In this step, for example, CVD is used to form a film using, for example, TEOS as a raw material gas. Note that the method for forming the insulating layer 18 is not limited.

The heat generating part forming step S60 is a step of forming the heat generating part 41 and the conductive layer 3 for supplying electricity to the heat generating part 41 on the insulating layer 18, as shown in FIG. First, a resistor film is formed on the insulating layer 18 (S61). The resistor film is formed by forming a TaN thin film on the insulating layer 18 by sputtering, for example. The resistor film covers the entire surface of the insulating layer 18. Next, a conductive film is formed (S62). The conductive film is formed by, for example, forming a layer made of Cu by plating or sputtering. The conductive film covers the entire surface of the resistor film. Note that in forming the conductive film, a structure may be adopted in which a Ti layer is formed on the resistor film and then a Cu layer is formed. Next, the conductive film and the resistor film are partially removed by selectively etching the conductive film and the resistor film (S63). As a result, a resistor layer 4 separated in the main scanning direction x, and a plurality of individual electrodes 31, a common electrode 32, and a relay electrode 33 that cover the resistor layer 4 while leaving a plurality of heat generating parts 41 are formed. .

The protective layer forming step S70 is a step of forming the protective layer 2. This step is performed by depositing, for example, SiN and SiC on each of the insulating layer 18, the conductive layer 3, and the resistor layer 4 using, for example, CVD. Thereafter, the protective layer 2 is partially removed by etching or the like in order to form the pad opening 21.

The cutting step S80 is a step of cutting the base material 10A. In this step, a plurality of heat generating substrates 1 are formed by cutting the base material 10A along the main scanning direction x and the sub scanning direction y and dividing it into individual pieces. Through the above steps, the heat generating substrate 1 on which each layer is formed is obtained.

Furthermore, apart from processing the heat generating substrate 1, a first substrate 5, a second substrate 6, and a third substrate 7 are prepared. The first substrate 5 is a PCB substrate on which first wiring is formed. The second board 6 is a PCB board on which second wiring is formed, and a connector 69 is mounted thereon. The third board 7 is a flexible printed board on which third wiring is formed.

The assembly step S90 is a step of assembling the thermal print head A1. In this step, first, as shown in FIG. 15, the heat generating substrate 1 and the first substrate 5 are assembled. First, the heat generating substrate 1 and the first substrate 5 are placed on the support tape 95 at a predetermined interval. Next, the driver IC 55 is mounted on the main surface 51 of the first substrate 5, and the plurality of wires 561 and 562 are bonded. Then, a protective resin 57 covering the driver IC 55 and the plurality of wires 561 and 562 is formed so as to straddle the heat generating substrate 1 and the first substrate 5. Further, the second substrate 6 and the third substrate 7 are assembled by bonding the third substrate 7 to the main surface 61 of the second substrate 6 with an adhesive or the like. Next, a portion of the third substrate 7 on the downstream side y2 in the sub-scanning direction y is attached to the upstream side y1 in the sub-scanning direction y of the main surface 51 of the first substrate 5 that has been peeled off from the support tape 95 using adhesive or the like. Glue. Next, a heat radiating member 8 having a first support surface 81, a second support surface 82, and a bottom surface 83 is prepared. The heat dissipation member 8 is formed by extrusion molding using a metal material such as aluminum. Next, an adhesive member is placed on the first support surface 81 and the second support surface 82 of the heat dissipation member 8 .

Next, as shown in FIG. 16, the integrated heat generating board 1, first board 5, and second board 6 are attached to the heat radiating member 8. The heat generating substrate 1 is disposed on the downstream side y2 of the first support surface 81 in the sub-scanning direction y, with the back surface 12 facing the first support surface 81. The first substrate 5 is arranged on the upstream side y1 of the first support surface 81 in the sub-scanning direction y, with the back surface 52 facing the first support surface 81. Further, the second substrate 6 is arranged so that the back surface 62 faces the second support surface 82 . Since the first substrate 5 is connected to the second substrate 6 by the third substrate 7 having flexibility, the inclined posture with respect to the second substrate 6 can be changed freely. Therefore, the first substrate 5 can be attached to the first support surface 81 that is inclined with respect to the second support surface 82 . Next, by applying heat, the adhesive member is solidified and the back surface 12 and the back surface 52 are bonded to the first support surface 81.

Through the above steps, the above-described thermal print head A1 is obtained. Note that the method for manufacturing the thermal print head A1 is not limited to the method described above. For example, the second etching step S30 may be performed before the first etching step S20. Further, the order of assembling the thermal print head A1 is not limited. Thermal print head A1 attaches the heat generating substrate 1 and the first substrate 5, which are integrated with the protective resin 57, to the heat dissipating member 8, then attaches the second substrate 6 to the heat dissipating member 8, and attaches the third substrate 7 to the first substrate. It may also be connected to the substrate 5.

Next, the operation of the thermal print head A1 will be explained.

According to this embodiment, in the heat generating substrate 1, the glaze layer 17 is formed on the first side z1 (the first main surface 11 side) in the thickness direction z. The plurality of heat generating parts 41 are arranged on the glaze layer 17. The glaze layer 17 has a smaller thickness (dimension in the thickness direction z) than a protrusion formed by performing anisotropic etching on a single crystal semiconductor, and is formed as a gentle protrusion. Therefore, the convex portion formed by the glaze layer 17 can suppress collision of the downwardly protruding seal portion of the label paper, compared to the convex portion formed by anisotropic etching. Thereby, the thermal print head A1 can suppress noise when printing on label paper.

Further, according to the present embodiment, the heat generating substrate 1 has a recess 15 that is recessed from the first main surface 11 on the second side z2 in the thickness direction z and extends in the main scanning direction x. The glaze layer 17 is formed by preventing fluid glass paste from exceeding the recess edge 151 of the recess 15 during the manufacturing process. Therefore, the glaze layer 17 is formed in the formation region defined by the recess 15 without spreading on the first main surface 11.

Further, according to the present embodiment, the heat generating substrate 1 has a second main surface 13 that is located on the second side z2 in the thickness direction z from the first main surface 11 and faces the same side as the first main surface 11. We are prepared. That is, the heat generating substrate 1 has a shape in which the dimension in the thickness direction z on the upstream side y1 in the sub-scanning direction y is smaller than the dimension in the thickness direction z on the downstream side y2 in the sub-scanning direction y. As a result, as shown in FIG. 4, the thermal print head A1 allows the print medium 92 to come into contact with the protective resin 57 formed on the heat generating substrate 1 while making the dimension of the heat generating substrate 1 in the sub-scanning direction y relatively small. can be restrained from doing so.

Further, according to this embodiment, the first substrate 5 and the second substrate 6 are connected by the third substrate 7 having flexibility. Therefore, the first substrate 5 and the second substrate 6 can be mounted on the heat dissipation member 8 in a mutually inclined state. Therefore, the degree of freedom in designing the thermal print head A1 is improved.

17-21 illustrate other embodiments of the present disclosure. In addition, in these figures, the same or similar elements as in the above embodiment are given the same reference numerals as in the above embodiment.

<Second embodiment>
FIG. 17 is a diagram for explaining a thermal print head A2 according to a second embodiment of the present disclosure. FIG. 17 is a sectional view of a main part of the thermal print head A2, and corresponds to FIG. 5. As shown in FIG. The thermal print head A2 of this embodiment differs from the above-described first embodiment in that the heat generating substrate 1 does not have the second main surface 13 and the inclined surface 14. The configuration and operation of other parts of this embodiment are similar to those of the first embodiment. In addition, each part of the said 1st Embodiment may be combined arbitrarily.

In this embodiment, the first main surface 11 extends to the edge of the heat generating substrate 1 on the upstream side y1 in the sub-scanning direction y. The heat generating substrate 1 does not have the second main surface 13 and the inclined surface 14.

Also in this embodiment, the heat generating substrate 1 has the glaze layer 17 formed on the first side z1 (the first main surface 11 side) in the thickness direction z, and the plurality of heat generating parts 41 are arranged on the glaze layer 17. . Therefore, the thermal print head A2 can suppress noise when printing on label paper. Furthermore, the thermal print head A2 has a configuration common to that of the thermal print head A1, thereby achieving the same effects as the thermal print head A1. Furthermore, according to the present embodiment, the step of forming the second main surface 13 and the inclined surface 14 on the heat generating substrate 1 (second etching step S30) is not necessary, so the manufacturing process can be simplified.

<Third embodiment>
18 and 19 are diagrams for explaining a thermal print head A3 according to a third embodiment of the present disclosure. FIG. 18 is a plan view showing the heat generating substrate 1 of the thermal print head A3, and corresponds to FIG. 6. In FIG. 18, the recess 15 is dotted for convenience of understanding. FIG. 19 is a sectional view taken along line XIX-XIX in FIG. 18. In FIG. 19, the glaze layer 17 is shown by an imaginary line (two-dot chain line). The thermal print head A3 of this embodiment differs from the above-described first embodiment in that the recess 15 consists of two grooves 152 aligned in the sub-scanning direction y. The configuration and operation of other parts of this embodiment are similar to those of the first embodiment. Note that each part of the first and second embodiments described above may be combined arbitrarily.

In this embodiment, the recess 15 is composed of two grooves 152 lined up in the sub-scanning direction y. Each groove 152 is a groove recessed from the first main surface 11 toward the second side z2 in the thickness direction z, and extends in the main scanning direction x. Each groove 152 has an elongated rectangular shape that extends in the main scanning direction x when viewed in the thickness direction z. In this embodiment, each groove 152 extends to both ends of the heat generating substrate 1 in the main scanning direction x. Each groove 152 is formed, for example, by dry etching. Note that the method of forming each groove 152 is not limited. Each groove 152 has two recess edges 151, respectively. Each recess edge 151 is a boundary between each groove 152 and the first main surface 11, and extends in the main scanning direction x. The two recess edges 151 include a recess edge 151a and a recess edge 151b. The recess edge 151a is an edge located on the opposite side to the other groove 152 in the sub-scanning direction y. The recess edge 151b is an edge located on the other groove 152 side in the sub-scanning direction y.

The first main surface 11 is divided into three parts by a recess 15 (two grooves 152). All three portions have an elongated rectangular shape that extends in the main scanning direction x. The first main surface 11 includes a groove portion 111 . The groove portion 111 is a portion between two grooves 152 among the three portions. In other words, the groove portion 111 is connected to the groove 152 via the recess edge 151b.

The glaze layer 17 is arranged on the groove portion 111 of the first main surface 11 and inside each groove 152, as shown in FIG. The glass paste that is the material of the glaze layer 17 has fluidity, but when placed on the heat generating substrate 1, surface tension prevents it from going over the edge 151a of the recess. Also, during firing, the glass paste is fluidized by heating, but surface tension prevents it from exceeding the edge 151a of the recess. When viewed in the thickness direction z, the glaze edge 171 and the recess edge 151a match. More specifically, the glaze edge 171 on the upstream side y1 in the sub-scanning direction y and the concave edge 151a of the groove 152 on the upstream side y1 in the sub-scanning direction y match, and the glaze edge 171 on the upstream side y1 in the sub-scanning direction y coincides with the glaze edge 151a on the downstream side y2 in the sub-scanning direction y. The edge 171 and the recess edge 151a of the groove 152 on the downstream side y2 in the sub-scanning direction y are aligned. The glaze layer 17 is formed with a formation area defined by the recess edge 151 a of each groove 152 of the recess 15 . Further, the cross-sectional shape of the glaze layer 17 perpendicular to the main scanning direction x is a convex shape formed by the surface tension of the glass paste material. Therefore, the glaze layer 17 has a smaller thickness (dimension in the thickness direction z) than a convex portion formed by performing anisotropic etching on a single crystal semiconductor, and has a gentle convex portion.

Also in this embodiment, the heat generating substrate 1 has the glaze layer 17 formed on the first side z1 (the first main surface 11 side) in the thickness direction z, and the plurality of heat generating parts 41 are arranged on the glaze layer 17. . Therefore, the thermal print head A3 can suppress noise when printing on label paper. Further, according to the present embodiment, the heat generating substrate 1 has two grooves 152 that are recessed from the first main surface 11 on the second side z2 in the thickness direction z and extend in the main scanning direction x, and are lined up in the sub-scanning direction y. . The glaze layer 17 is formed by preventing fluid glass paste from exceeding the recessed edge 151a of each groove 152 during the manufacturing process. Therefore, the glaze layer 17 is formed in the formation region defined by the recess 15 (two grooves 152) without spreading on the first main surface 11. Further, the thermal print head A3 has a configuration common to that of the thermal print head A1, thereby achieving the same effects as the thermal print head A1. Furthermore, according to the present embodiment, the amount of material used to form the glaze layer 17 can be suppressed compared to the first embodiment.

<Fourth embodiment>
FIG. 20 is a diagram for explaining a thermal print head A4 according to a fourth embodiment of the present disclosure. FIG. 20 is a sectional view of a main part of the heat generating substrate 1 of the thermal print head A4, and corresponds to FIG. 19. In FIG. 20, the glaze layer 17 is shown by an imaginary line (two-dot chain line). The thermal print head A4 of this embodiment is different from the third embodiment described above in the formation area of the glaze layer 17. The configuration and operation of other parts of this embodiment are similar to those of the third embodiment. Note that each part of the first to third embodiments described above may be combined arbitrarily.

In this embodiment, similarly to the third embodiment, the recess 15 is composed of two grooves 152 lined up in the sub-scanning direction y. Each groove 152 includes a recess edge 151a and a recess edge 151b. The first main surface 11 includes an inter-groove portion 111 located between the two grooves 152 .

In this embodiment, the glaze layer 17 is arranged on the groove portion 111 of the first main surface 11, and is not arranged inside the two grooves 152, as shown in FIG. In other words, the two grooves 152 are exposed from the glaze layer 17. Although the glass paste that is the material of the glaze layer 17 has fluidity, when it is placed on the heat generating substrate 1, surface tension prevents it from exceeding the recessed edge 151b. Also, during firing, the glass paste is fluidized by heating, but surface tension prevents it from exceeding the edge 151b of the recess. When viewed in the thickness direction z, the glaze edge 171 and the recess edge 151b match. More specifically, the glaze edge 171 on the upstream side y1 in the sub-scanning direction y and the concave edge 151b of the groove 152 on the upstream side y1 in the sub-scanning direction y match, and the glaze edge on the downstream side y2 in the sub-scanning direction y matches. The edge 171 and the recess edge 151b of the groove 152 on the downstream side y2 in the sub-scanning direction y are aligned. The glaze layer 17 is formed with a formation area defined by the recess edge 151b of each groove 152 of the recess 15. Further, the cross-sectional shape of the glaze layer 17 perpendicular to the main scanning direction x is a convex shape formed by the surface tension of the glass paste material. Therefore, the glaze layer 17 has a smaller thickness (dimension in the thickness direction z) than a convex portion formed by performing anisotropic etching on a single crystal semiconductor, and has a gentle convex portion.

Also in this embodiment, the heat generating substrate 1 has the glaze layer 17 formed on the first side z1 (the first main surface 11 side) in the thickness direction z, and the plurality of heat generating parts 41 are arranged on the glaze layer 17. . Therefore, the thermal print head A4 can suppress noise when printing on label paper. Further, according to the present embodiment, the heat generating substrate 1 has two grooves 152 that are recessed from the first main surface 11 on the second side z2 in the thickness direction z and extend in the main scanning direction x, and are lined up in the sub-scanning direction y. . The glaze layer 17 is formed by preventing fluid glass paste from exceeding the recessed edge 151b of each groove 152 during the manufacturing process. Therefore, the glaze layer 17 is formed in the formation region defined by the recess 15 (two grooves 152) without spreading on the first main surface 11. Furthermore, the thermal print head A4 has a configuration common to that of the thermal print head A3, thereby achieving the same effects as the thermal print head A3. Furthermore, according to this embodiment, since the glaze layer 17 is not disposed in each groove 152, the amount of material used for forming the glaze layer 17 can be further suppressed compared to the third embodiment.

<Fifth embodiment>
FIG. 21 is a diagram for explaining a thermal print head A5 according to a fifth embodiment of the present disclosure. FIG. 21 is a plan view showing the heat generating substrate 1 of the thermal print head A5, and corresponds to FIG. 6. The thermal print head A5 of this embodiment differs from the above-described first embodiment in that the recesses 15 do not reach both ends of the heat generating substrate 1 in the main scanning direction x. The configuration and operation of other parts of this embodiment are similar to those of the first embodiment. Note that each part of the first to fourth embodiments described above may be combined arbitrarily.

In this embodiment, the recesses 15 do not reach both ends of the heat generating substrate 1 in the main scanning direction x, but are included in the first main surface 11 when viewed in the thickness direction z. Therefore, the recess 15 further includes two recess edges 151 extending in the sub-scanning direction y.

Also in this embodiment, the heat generating substrate 1 has the glaze layer 17 formed on the first side z1 (the first main surface 11 side) in the thickness direction z, and the plurality of heat generating parts 41 are arranged on the glaze layer 17. . Therefore, the thermal print head A5 can suppress noise when printing on label paper. Furthermore, the thermal print head A5 has a configuration common to that of the thermal print head A1, thereby achieving the same effects as the thermal print head A1. Furthermore, according to this embodiment, the amount of material used to form the glaze layer 17 can be further suppressed compared to the first embodiment.

The thermal print head and the manufacturing method thereof according to the present disclosure, and the thermal printer including the thermal print head are not limited to the embodiments described above. The specific configuration of each part of the thermal print head and thermal printer according to the present disclosure, and the specific processing of each step of the method for manufacturing a thermal print head according to the present disclosure can be variously changed in design.

[Appendix 1]
a heat generating substrate (1) having a first main surface (11) facing a first side (z1) in the thickness direction (z) and made of a single crystal semiconductor;
a resistor layer (4) including a plurality of heat generating parts (41) arranged along the main scanning direction (x) on the first side in the thickness direction of the heat generating substrate;
a glaze layer (17) disposed between the heat generating substrate and the plurality of heat generating parts;
It is equipped with
The heat generating substrate further includes a recess (15) recessed from the first main surface in the thickness direction,
The recess includes a recess edge (151) that is a boundary with the first main surface and extends in the main scanning direction,
When viewed in the thickness direction, a glaze edge (171) of the glaze layer and an edge of the recess are aligned;
Thermal print head (A1).
[Appendix 2]
The recess is a single groove extending in the main scanning direction,
the glaze layer is disposed inside the recess;
The thermal print head described in Appendix 1.
[Appendix 3]
The recess includes two grooves aligned in the sub-scanning direction.
The thermal print head described in Appendix 1.
[Additional Note 4, Third Embodiment, Figures 18 and 19]
The glaze layer is disposed in an inter-groove portion, which is a region between the two grooves on the first main surface, and inside the two grooves.
The thermal print head described in Appendix 3.
[Additional Note 5, Fourth Embodiment, Figure 20]
The glaze layer is arranged in an inter-groove portion that is a region between the two grooves on the first main surface,
the two grooves are exposed from the glaze layer;
The thermal print head described in Appendix 3.
[Appendix 6]
The recess extends to both ends of the heat generating substrate in the main scanning direction.
The thermal print head according to any one of appendices 2 to 5.
[Appendix 7]
The heat generating substrate has a second main surface (13) facing the first side in the thickness direction and located on a second side (z2) opposite to the first side from the first main surface. Furthermore,
The second main surface extends to an edge of the heat generating substrate in the sub-scanning direction.
The thermal print head according to any one of appendices 1 to 6.
[Appendix 8, Figure 5]
According to appendix 7, the first dimension (D1) of the recess in the thickness direction is smaller than the second dimension (D2), which is the difference in position between the first main surface and the second main surface in the thickness direction. Thermal print head listed.
[Appendix 9]
The first dimension is 0.5% or more and 5% or less of the second dimension,
The thermal print head described in Appendix 8.
[Appendix 10, Figure 5]
The heat generating substrate further includes an inclined surface (14) located between the first main surface and the second main surface and inclined with respect to the first main surface and the second main surface,
A first inclination angle (β) of the side surface (152) of the groove with respect to the first main surface is larger than a second inclination angle (α) of the inclined surface with respect to the first main surface.
The thermal print head according to any one of appendices 7 to 9.
[Appendix 11]
The single crystal semiconductor includes Si,
the first principal surface is a (100) plane;
The thermal print head according to any one of Supplementary Notes 1 to 10.
[Appendix 12]
The thermal print head according to any one of appendices 1 to 11,
a platen roller disposed facing the plurality of heat generating parts;
A thermal printer equipped with
[Appendix 13, Figure 7]
a base material preparation step (S10) of preparing a base material (10A) having a first main surface facing the first side in the thickness direction and made of a single crystal semiconductor;
a first etching step (S20) of forming a concave portion recessed in the thickness direction from the first main surface by first etching;
Second etching to form a second main surface facing the first side in the thickness direction and located on a second side opposite to the first side from the first main surface. Step (S30),
a glaze layer forming step (S40) of forming a glaze layer on the first side of the base material in the thickness direction;
It is equipped with
A method of manufacturing a thermal print head.
[Appendix 14]
The first etching is dry etching,
The second etching is wet etching.
The method for manufacturing a thermal print head according to appendix 13.
[Appendix 15]
the second etching is anisotropic etching,
The method for manufacturing a thermal print head according to appendix 13 or 14.

A1 to A5: Thermal print head 1: Heat generating substrate 11: First main surface 111: Between grooves 12: Back surface 13: Second main surface 14: Inclined surface 15: Recesses 151, 151a, 151b: Recess edge 152: Groove 153 : Side surface 17 : Glaze layer 171 : Glaze edge 18 : Insulating layer 2 : Protective layer 21 : Pad opening 3 : Conductive layer 31 : Individual electrode 311 : Individual pad 32 : Common electrode 323 : Connecting part 324 : Band-shaped part 33 : Relay electrode 4 : Resistor layer 41 : Heat generating part 5 : First substrate 51 : Main surface 52 : Back surface 55 : Driver IC
561, 562: wire 57: protective resin 6: second board 61: main surface 62: back surface 69: connector 7: third board 8: heat dissipation member 81: first support surface 82: second support surface 83: bottom surface 91: Platen roller 92: Print medium 95: Support tape 98: Mask layer 98a: Opening 99: Mask layer 10A: Base material 11A: Main surface B1: Thermal printer

Claims (15)

a heat generating substrate having a first main surface facing the first side in the thickness direction and made of a single crystal semiconductor;
a resistor layer including a plurality of heat generating parts arranged along the main scanning direction on the first side in the thickness direction of the heat generating substrate;
a glaze layer disposed between the heat generating substrate and the plurality of heat generating parts;
It is equipped with
The heat generating substrate further includes a recessed portion recessed from the first main surface in the thickness direction,
The recess includes a recess edge that is a boundary with the first main surface and extends in the main scanning direction,
When viewed in the thickness direction, a glaze edge of the glaze layer and an edge of the recess are aligned;
thermal print head. The recess is a single groove extending in the main scanning direction,
the glaze layer is disposed inside the recess;
The thermal print head according to claim 1. The recess includes two grooves aligned in the sub-scanning direction.
The thermal print head according to claim 1. The glaze layer is disposed in an inter-groove portion, which is a region between the two grooves on the first main surface, and inside the two grooves.
The thermal print head according to claim 3. The glaze layer is arranged in an inter-groove portion that is a region between the two grooves on the first main surface,
the two grooves are exposed from the glaze layer;
The thermal print head according to claim 3. The recess extends to both ends of the heat generating substrate in the main scanning direction.
The thermal print head according to claim 2. The heat generating substrate further includes a second main surface facing the first side in the thickness direction and located on a second side opposite to the first side from the first main surface,
The second main surface extends to an edge of the heat generating substrate in the sub-scanning direction.
The thermal print head according to claim 1. The thermal print head according to claim 7, wherein a first dimension of the recess in the thickness direction is smaller than a second dimension, which is a difference in position between the first main surface and the second main surface in the thickness direction. . The first dimension is 0.5% or more and 5% or less of the second dimension,
The thermal print head according to claim 8. The heat generating substrate further includes an inclined surface located between the first main surface and the second main surface and inclined with respect to the first main surface and the second main surface,
A first inclination angle of the side surface of the groove with respect to the first main surface is larger than a second inclination angle of the inclined surface with respect to the first main surface.
The thermal print head according to claim 7. The single crystal semiconductor includes Si,
the first principal surface is a (100) plane;
The thermal print head according to claim 1. The thermal print head according to any one of claims 1 to 11,
a platen roller disposed facing the plurality of heat generating parts;
A thermal printer equipped with a base material preparation step of preparing a base material that has a first main surface facing the first side in the thickness direction and is made of a single crystal semiconductor;
a first etching step of forming a concave portion recessed in the thickness direction from the first main surface by first etching;
Second etching to form a second main surface facing the first side in the thickness direction and located on a second side opposite to the first side from the first main surface. process and
a glaze layer forming step of forming a glaze layer on the first side of the base material in the thickness direction;
It is equipped with
A method of manufacturing a thermal print head. The first etching is dry etching,
The second etching is wet etching.
A method for manufacturing a thermal print head according to claim 13. the second etching is anisotropic etching,
A method for manufacturing a thermal print head according to claim 13 or 14.

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