CN101412323A - Thermal print head and method for manufacturing the same - Google Patents
Thermal print head and method for manufacturing the same Download PDFInfo
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- CN101412323A CN101412323A CNA2008101592985A CN200810159298A CN101412323A CN 101412323 A CN101412323 A CN 101412323A CN A2008101592985 A CNA2008101592985 A CN A2008101592985A CN 200810159298 A CN200810159298 A CN 200810159298A CN 101412323 A CN101412323 A CN 101412323A
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- enamel layer
- glaze layer
- layer
- glaze
- enamel
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Abstract
The invention discloses a thermal printing head and a method for producing the same. The structural characteristics of the thermal printing head are that a base plate is provided with an enamel layer 20, and a strip enamel layer 10 extending along the main printing direction is arranged between the enamel layer 20 under heating resistors and the base plate. The method for producing the thermal printing head comprises the following steps: firstly, arranging the strip enamel layer 10 which is made from a crystalline enamel material along the main printing direction on the insulated base plate under the heating resistors; secondly, adopting a non-crystalline enamel material to form the enamel layer 20 on the enamel layer 10 and the base plate; thirdly, when the enamel layer 20 is produced, forming a plurality of the heating resistors which are arrayed along the enamel layer 10 on the enamel layer 20 above the enamel layer 10; fourthly, forming electrode conducting wires on the enamel layer 20; and finally, forming protective layers on the heating resistors and at least part of the electrode conducting wires. Because a bottom enamel layer formed by the enamel layer 10 made from the crystalline enamel material and the enamel layer 20 made from the non-crystalline enamel material, which is arranged under the heating resistors, the structure of the enamel layer 20 can not disappear due to the melt flow of the enamel layer 20 due to the existence of the enamel layer 10 with bad fluidity when the bottom enamel layer is sintered at a high temperature. The thermal printing head has the advantages of improved printing quality, difficult wire break and short circuit phenomenon of the electrode conducting wires, prolonged service life of the thermal printing head and the like.
Description
Technical field
The present invention relates to the printer technology field, at length say it is a kind ofly can improve printing effect, the thermal printing head that increases the service life and production method thereof.
Background technology
As everyone knows; generally speaking; the ceramic insulation substrate of thermal printing head (thermal print head) uses the glaze material; adopt printing; the method of sintering (to call thick film in the following text) forms the glaze layer on insulated substrate; on glaze layer and insulated substrate, adopt mode such as spraying plating to form electrode cable; on the glaze layer, adopt metallikon to form several usually along heating resistor arranged in a straight line; the protective layer that adopts thick film or metallikon to form on the electrode cable of heating resistor and at least a portion; the direction that heating resistor is arranged be called leading India side to; in the insulated substrate plane perpendicular to leading India side to direction be called secondary Print direction; for improving print speed or improving printing effect; prior art has glaze layer 1 at heating resistor; be called glaze layer 1; for making glaze layer 1 surface have smooth; even curface uses noncrystalline glaze material to form the glaze layer usually.
Yet, use noncrystalline glaze material to form the thermal printing head of above-mentioned glaze layer 1 structure, owing at high temperature being in molten condition, the glaze material has flowability, having the mobile glaze material that is in molten condition can be under capillary effect, make the secondary Print direction cutting section of glaze layer 1 present arc, has flowability because be in the glaze material of molten condition under the high temperature, secondary Print direction cross section is that the ratio of height and the width of the glaze layer 1 of arc is not easy control, and the cutting section of the secondary Print direction of glaze layer 1 also is difficult to form other shapes beyond the arc.
And, adopt thick film to form the thermal printing head of above-mentioned glaze layer 1 structure, because the insulated substrate surface beyond the glaze layer 1 is too coarse and defective such as pit arranged, broken string appears in electrode cable on the insulated substrate beyond the glaze layer 1 easily, bad phenomenon such as short circuit, for solving the broken string of insulated substrate top electrode lead, short circuit problem, can the part beyond the part glaze also form the glaze layer, be called glaze layer 2, if glaze layer 1 and glaze layer 2 are very close to each other or the gap is too small, the flowability that glaze layer 1 and glaze layer 2 occur in the time of will be owing to high temperature sintering combines glaze layer 1 and glaze layer 2 together, and the structure of glaze layer 1 is disappeared, if the excesssive gap that leaves between glaze layer 1 and the glaze layer 2, the position, gap is too coarse and defective such as pit is arranged, and still occurs the electrode cable broken string easily, bad phenomenon such as short circuit.
Summary of the invention
The objective of the invention is in order to solve above-mentioned technical deficiency, propose a kind of thermal printing head broken string, short circuit phenomenon, that increase the service life and production method thereof of not being prone to.
The present invention reaches by following measure:
A kind of thermal printing head; comprise the substrate that insulating materials constitutes; substrate is provided with electrode cable and several are along heating resistor arranged in a straight line; the protective layer that adopts thick film or metallikon to form on the electrode cable of heating resistor and at least a portion; the direction that heating resistor is arranged be called leading India side to; in the insulated substrate plane perpendicular to leading India side to direction be called secondary Print direction; it is characterized in that substrate is provided with glaze layer 20, be provided with between glaze layer 20 under the heating resistor and the substrate along leading India side to the glaze layer 10 that extends.
Production method of the present invention is:
1, the leading India side in insulated substrate upper edge under heating resistor is to adopting thick film to form Belt-like Glaze layer 10, and glaze layer 10 adopts crystalline glaze material to make,
2, adopt thick film to form glaze layer 20 on glaze layer 10 and substrate, glaze layer 20 adopts noncrystalline matter glaze material to make,
3, on the glaze layer 20 above the glaze layer 10, adopt metallikon to form the heating resistor that several are arranged along glaze layer 10,
4, on glaze layer 20, adopt metallikon to form electrode cable,
5, the protective layer that on the electrode cable of heating resistor and at least a portion, adopts thick film or metallikon to form,
Because mobile relatively poor when high temperature of the glaze material of crystalline, so the shape of glaze layer 10 before high temperature sintering do not have big variation with the shape of passing through behind the high temperature sintering.
Because down better mobile of noncrystalline matter glaze material at high temperature, thus the glaze layer 20 of glaze layer 10 top smooth, the even curface of formation easily, and not can because of glaze layer 20 at high temperature flowability and change the shape of glaze layer 10.
The present invention is owing to the glaze layers of being made glaze layer 10 and being formed jointly by the glaze layer 20 that noncrystalline matter glaze material is made by crystalline glaze material that are provided with below heater; on glaze layer 20, adopt metallikon to form electrode cable 40; on the glaze layer 20 above the glaze layer 10, adopt metallikon to form heating resistor 50, the protective layer 60 that on the electrode cable of heater and at least a portion, adopts thick film or metallikon to form.When high temperature sintering, because the existence of the glaze layer 10 that flowability is relatively poor, the structure of glaze layer 20 is disappeared, help improving print quality, electrode cable is not prone to the life-span of broken string, short circuit phenomenon, prolongation thermal printing head.
Description of drawings
Accompanying drawing is a structural representation of the present invention.
The specific embodiment
Below in conjunction with accompanying drawing the present invention is further described:
As shown in the figure: a kind of thermal printing head; comprise the substrate 30 that insulating materials constitutes; substrate 30 is provided with electrode cable 40 and several along heating resistor arranged in a straight line 50, the protective layer 60 that adopts thick film or metallikon to form on the electrode cable of heater and at least a portion.The direction that heating resistor 50 is arranged be called leading India side to, in insulated substrate 30 planes perpendicular to leading India side to direction be called secondary Print direction, the invention is characterized in that substrate 30 is provided with glaze layer 20,30 of glaze layer 20 under the heating resistor 50 and substrates are provided with along leading India side to the Belt-like Glaze layer 10 that extends.
Manufacture method of the present invention is:
One, the leading India side in 30 upper edges of the insulated substrate under heating resistor is to adopting thick film to form Belt-like Glaze layer 10, and glaze layer 10 adopts crystalline glaze slurry to make,
Two, adopt thick film to form glaze layer 20 on glaze layer 10 and substrate 30, glaze layer 20 adopts noncrystalline matter glaze slurry to make,
Three, on the glaze layer 20 above the glaze layer 10, adopt metallikon to form the heating resistor 50 that several are arranged along glaze layer 10,
Four, on glaze layer 20, adopt metallikon to form electrode cable 40.
Five, the protective layer 60 that on the electrode cable of heating resistor and at least a portion, adopts thick film or metallikon to form.
Because mobile relatively poor when high temperature of the glaze material of crystalline, so the shape of glaze layer 10 before high temperature sintering do not have big variation with the shape of passing through behind the high temperature sintering.
The present invention is owing to the glaze layers of being made glaze layer 10 and being formed jointly by the glaze layer 20 that noncrystalline matter glaze material is made by crystalline glaze material that are provided with below heater; on glaze layer 20, form electrode cable 40; on the glaze layer 20 above the glaze layer 10, form heating resistor 50; the protective layer 60 that on the electrode cable of heater and at least a portion, adopts thick film or metallikon to form; when high temperature sintering; because the existence of the glaze layer 10 that flowability is relatively poor; the structure of glaze layer 20 is disappeared; help improving print quality, electrode cable is not prone to broken string; short circuit phenomenon; prolong the life-span of thermal printing head.
Claims (2)
1. thermal printing head; comprise the substrate that insulating materials constitutes; substrate is provided with electrode cable and several are along heating resistor arranged in a straight line; the electrode cable of heating resistor and at least a portion is provided with protective layer; the direction that heating resistor is arranged be called leading India side to; in the insulated substrate plane perpendicular to leading India side to direction be called secondary Print direction; it is characterized in that substrate is provided with glaze layer 20, be provided with between glaze layer 20 under the heating resistor and the substrate along leading India side to the glaze layer 10 that extends.
2, a kind of manufacture method of thermal printing head is:
(1) the leading India side in insulated substrate upper edge under heating resistor is to adopting thick film to form Belt-like Glaze layer 10, and glaze layer 10 adopts crystalline glaze material to make,
(2) adopt thick film to form glaze layer 20 on glaze layer 10 and substrate, glaze layer 20 adopts noncrystalline matter glaze material to make,
(3) on the glaze layer 20 above the glaze layer 10, adopt metallikon to form the heating resistor that several are arranged along glaze layer 10,
(4) on glaze layer 20, adopt metallikon to form electrode cable 40,
(5) protective layer that on the electrode cable of heating resistor and at least a portion, adopts thick film or metallikon to form,
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101592985A CN101412323A (en) | 2008-11-28 | 2008-11-28 | Thermal print head and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101592985A CN101412323A (en) | 2008-11-28 | 2008-11-28 | Thermal print head and method for manufacturing the same |
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| Publication Number | Publication Date |
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| CN101412323A true CN101412323A (en) | 2009-04-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNA2008101592985A Pending CN101412323A (en) | 2008-11-28 | 2008-11-28 | Thermal print head and method for manufacturing the same |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102120386A (en) * | 2010-11-30 | 2011-07-13 | 山东华菱电子有限公司 | Thermal print head and manufacturing method thereof |
| CN102303458A (en) * | 2011-07-29 | 2012-01-04 | 山东华菱电子有限公司 | Temperature-sensitive printing head and manufacturing method thereof |
| CN105058807A (en) * | 2015-09-01 | 2015-11-18 | 上海悦瑞电子科技有限公司 | Selective micro hot-melting shaping device with thick-film thermal print head |
| JP2018176549A (en) * | 2017-04-13 | 2018-11-15 | ローム株式会社 | Thermal print head, manufacturing method of thermal print head |
| US20220063292A1 (en) * | 2020-08-31 | 2022-03-03 | Rohm Co., Ltd. | Thermal print head, manufacturing method of thermal print head, and thermal printer |
-
2008
- 2008-11-28 CN CNA2008101592985A patent/CN101412323A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102120386A (en) * | 2010-11-30 | 2011-07-13 | 山东华菱电子有限公司 | Thermal print head and manufacturing method thereof |
| CN102303458A (en) * | 2011-07-29 | 2012-01-04 | 山东华菱电子有限公司 | Temperature-sensitive printing head and manufacturing method thereof |
| CN102303458B (en) * | 2011-07-29 | 2014-07-30 | 山东华菱电子有限公司 | Temperature-sensitive printing head and manufacturing method thereof |
| CN105058807A (en) * | 2015-09-01 | 2015-11-18 | 上海悦瑞电子科技有限公司 | Selective micro hot-melting shaping device with thick-film thermal print head |
| JP2018176549A (en) * | 2017-04-13 | 2018-11-15 | ローム株式会社 | Thermal print head, manufacturing method of thermal print head |
| US20220063292A1 (en) * | 2020-08-31 | 2022-03-03 | Rohm Co., Ltd. | Thermal print head, manufacturing method of thermal print head, and thermal printer |
| US11602935B2 (en) * | 2020-08-31 | 2023-03-14 | Rohm Co., Ltd. | Thermal print head, manufacturing method of thermal print head, and thermal printer |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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Application publication date: 20090422 |