CN102120386A - Thermal print head and manufacturing method thereof - Google Patents
Thermal print head and manufacturing method thereof Download PDFInfo
- Publication number
- CN102120386A CN102120386A CN2010105655548A CN201010565554A CN102120386A CN 102120386 A CN102120386 A CN 102120386A CN 2010105655548 A CN2010105655548 A CN 2010105655548A CN 201010565554 A CN201010565554 A CN 201010565554A CN 102120386 A CN102120386 A CN 102120386A
- Authority
- CN
- China
- Prior art keywords
- insulation layer
- layer
- heating resistor
- substrate
- thermal insulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention relates to the field of thermal printers, specifically relates to a method for manufacturing thermal print heads. The method is characterized in that a heat insulation layer is arranged between a baseplate and a bottom glaze layer, and the inside of the heat insulation layer is provided with hollow balls. The method comprises the following steps: mixing aluminium oxides with glaze slurry, then coating the obtained mixture on an insulating substrate so as to form the heat insulation layer on the insulating substrate; forming the bottom glaze layer on the heat insulation layer; forming an electrode lead and a heating resistor body on the bottom glaze layer and the heat insulation layer; and forming a protective layer on the heating resistor body and at least part of the electrode lead connected with the heating resistor body. In the invention, because the inside of the heat insulation layer is provided with inorganic hollow balls, the heat insulation effect of the heat insulation layer is good, and the coefficient of heat conduction of the heat insulation layer is less than that of the bottom glaze layer, thereby reducing the energy loss and achieving the effect of energy saving.
Description
Technical field
The present invention relates to the thermal printer field, at length say it is a kind of thermal printing head and production method thereof that can reduce thermal losses, save the printing energy.
Background technology
As everyone knows; generally speaking; the ceramic substrate of thermal printing head (thermal print head) uses the glaze slurry; adopt the method (to call thick film in the following text) of printing, sintering on insulated substrate, to form ground glaze layer; on ground glaze layer and substrate, adopt methods such as thick film or spraying plating to form electrode cable; adopt the protective layer of methods formation such as thick film or spraying plating on the heating resistor that on ground glaze layer, adopts modes such as thick film or spraying plating to form, heating resistor and at least a portion and electrode cable that heating resistor is connected.The heat that the thermal printing head resistance heater of this structure produces scatters and disappears in a large number by ground glaze layer, and this is the principal element of thermal printing head consume energy.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, the thermal loss that provides a kind of resistance heater to produce is few, the better thermal printing head of energy-saving effect and manufacture method thereof.
The technical solution used in the present invention is:
A kind of thermal printing head; comprise the substrate that insulating materials constitutes; substrate surface is formed with part or comprehensive ground glaze layer; the ground glaze layer surface is provided with the electrode cable that heating resistor and at least a portion are connected with heating resistor; power to heating resistor by electrode cable; be coated with protective layer on heating resistor and at least a portion and the electrode cable that heating resistor links to each other, it is characterized in that being provided with thermal insulation layer between substrate and the ground glaze layer, be provided with hollow ball in the thermal insulation layer.
The present invention can be provided with groove on substrate, thermal insulation layer is located in the groove, so that thermal printing head has lower heat transmission speed under the situation that does not increase thickness, reduces thermal losses, saves and print energy.
Production method of the present invention is:
1, on insulated substrate, form groove,
2, with hollow ball by weight accounting to be 1%～50% ratio pour in the substrate recess with filling out after the glaze slurry mixes, form thermal insulation layer behind the sintering, be furnished with hollow ball in the thermal insulation layer,
3, in thermal insulation layer and part basic unit, form ground glaze layer,
4, on ground glaze layer and insulated substrate, adopt modes such as thick film or spraying plating to form electrode cable and heating resistor,
5, the protective layer that on heating resistor and at least a portion and electrode cable that heating resistor is connected, adopts methods such as thick film or spraying plating to form.
The present invention is owing to be provided with thermal insulation layer on substrate, be provided with the inorganic hollow ball in the thermal insulation layer, because the existence of inorganic hollow ball, make that the coefficient of heat conduction of thermal insulation layer good heat-insulation effect, thermal insulation layer is littler than ground glaze layer, the heat that has hindered the heating resistor generation conducts to substrate by ground-coat enamel, reduce the loss of energy, reached energy-conservation effect.
Description of drawings
Fig. 1 is a kind of structural representation of the present invention.
Mark among the figure: substrate 10, substrate recess 20, thermal insulation layer 30, ground glaze layer 40, electrode cable 50, heating resistor 60, protective layer 70, hollow ball 80.
The specific embodiment
Below in conjunction with Fig. 1 the present invention is described further:
A kind of thermal printing head; comprise the substrate that insulating materials constitutes; substrate surface is formed with part or comprehensive ground glaze layer; the ground glaze layer surface is provided with the electrode cable that heating resistor and at least a portion are connected with heating resistor; power to heating resistor by electrode cable; be coated with protective layer on heating resistor and at least a portion and the electrode cable that heating resistor links to each other; it is characterized in that being provided with thermal insulation layer between substrate and the ground glaze layer; be provided with hollow ball in the thermal insulation layer; thermal insulation layer generally is located in the groove; so that thermal printing head has lower heat transmission speed under the situation that does not increase thickness, reduce thermal losses; save and print energy
Production method of the present invention is: one; on insulated substrate, form groove; its processing method is same as the prior art; this does not give unnecessary details; its Working position is below heating resistor; two; with inorganic hollow balls such as alundum (Al hollow ball or silica by weight accounting to be 1%～50% ratio pour in the substrate recess with filling out after the glaze slurry mixes; form thermal insulation layer behind the sintering; be furnished with the inorganic hollow ball in the thermal insulation layer; its sintering method is identical with the sintering method of ground glaze layer; this does not give unnecessary details; three; in thermal insulation layer and part basic unit, form ground glaze layer; its processing method is same as the prior art; this does not give unnecessary details; five; on ground glaze layer and insulated substrate, adopt modes such as thick film or spraying plating to form electrode cable and heating resistor; its processing method is same as the prior art; this does not give unnecessary details; six; the protective layer that on heating resistor and at least a portion and electrode cable that heating resistor is connected, adopts methods such as thick film or spraying plating to form; its processing method is same as the prior art; this does not give unnecessary details; the present invention is owing to be provided with thermal insulation layer on substrate; be provided with the inorganic hollow ball in the thermal insulation layer; because depositing of hollow ball; make the thermal insulation layer good heat-insulation effect; the coefficient of heat conduction of thermal insulation layer is littler than ground glaze layer; the heat that has hindered the heating resistor generation conducts to substrate by ground-coat enamel; reduce the loss of energy, reached energy-conservation effect.
As shown in Figure 1: a kind of thermal printing head; comprise the substrate 10 that insulating materials constitutes; substrate 10 surfaces are formed with groove 20; be provided with thermal insulation layer 30 in the groove 20; thermal insulation layer 30 is provided with ground glaze layer 40; ground glaze layer 40 is provided with some electrode cables 50 and several heating resistors 60; electrode cable 50 is heating resistor 60 power supplies; the protective layer 70 that on the electrode cable 50 of heater resistive element 60 and at least a portion, adopts thick film or metallikon to form; the invention is characterized between substrate 10 and the ground glaze layer 40 and be provided with thermal insulation layer 30; the coefficient of heat conduction of thermal insulation layer 30 is less than the coefficient of heat conduction of ground glaze layer 40; be provided with alundum (Al hollow ball or hollow silica ball 80 in the thermal insulation layer; make the coefficient of heat conduction of thermal insulation layer littler than ground glaze layer; the heat that has hindered the heating resistor generation conducts to substrate by ground-coat enamel; reduce the loss of energy, reached energy-conservation effect.
Production method of the present invention is:
One, on insulated substrate, form groove,
Two, pour in the substrate recess filling out after mixing in alundum (Al hollow ball or the silica inorganic hollow ball ratio by weight 1%～50% and the glaze slurry, the glaze slurry can adopt multiple different proportioning to form, for example by weight: silica 25%～50%, boron oxide 2%～4%, zirconia 1%～5%, calcium oxide 3%～15%, barium monoxide 2%～12%, alundum (Al 3%～10%, ethyl cellulose 1%～15%, terpinol 20%～40%, the glaze slurry is as the hollow ball binding agent behind the sintering, the filling part that has hollow ball in the substrate recess is as thermal insulation layer
Three, above thermal insulation layer, form ground glaze layer,
Four, on ground glaze layer and insulated substrate, adopt modes such as thick film or spraying plating to form electrode cable and heating resistor,
Five, the protective layer that on heating resistor and at least a portion and electrode cable that heating resistor is connected, adopts methods such as thick film or spraying plating to form.
The present invention is owing to be provided with thermal insulation layer below heating resistor, be provided with alundum (Al hollow ball or hollow silica ball in the thermal insulation layer, make the coefficient of heat conduction of thermal insulation layer littler than ground glaze layer, the heat that has hindered the heating resistor generation conducts to substrate by ground-coat enamel, reduce the loss of energy, reached energy-conservation effect.
Claims (5)
1. thermal printing head; comprise the substrate that insulating materials constitutes; substrate surface is provided with ground glaze layer; ground glaze layer and substrate surface are provided with heating resistor and electrode cable; power to heating resistor by electrode cable; heating resistor and the electrode cable at least a portion that links to each other with heating resistor are coated with protective layer, it is characterized in that being provided with thermal insulation layer between substrate and the ground glaze layer, are furnished with hollow ball in the thermal insulation layer.
2. a kind of thermal printing head according to claim 1 is characterized in that substrate is provided with groove, is provided with the thermal insulation layer that is furnished with hollow ball in the groove.
3. the production method of a thermal printing head is characterized in that processing step is:
(1) mix hollow ball in the glaze slurry, insert after mixing in the insulated substrate groove, form the thermal insulation layer that is furnished with hollow ball behind the sintering, it is 1%～50% that hollow ball accounts for the glaze slip weight ratio,
(2) above thermal insulation layer, form ground glaze layer,
(3) on ground glaze layer and insulated substrate, form electrode cable and heating resistor,
(4) protective layer that on heating resistor and at least a portion and electrode cable that heating resistor is connected, forms.
4. the preparation method of a kind of thermal printing head according to claim 3 is characterized in that thermal insulation layer is arranged in the groove that substrate is provided with.
5. the preparation method of a kind of thermal printing head according to claim 3 is characterized in that described hollow ball is the inorganic hollow ball.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105655548A CN102120386A (en) | 2010-11-30 | 2010-11-30 | Thermal print head and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105655548A CN102120386A (en) | 2010-11-30 | 2010-11-30 | Thermal print head and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102120386A true CN102120386A (en) | 2011-07-13 |
Family
ID=44249097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105655548A Pending CN102120386A (en) | 2010-11-30 | 2010-11-30 | Thermal print head and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102120386A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107962827A (en) * | 2017-11-02 | 2018-04-27 | 杨潮平 | Composite plate and preparation method thereof and printhead |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01288462A (en) * | 1988-05-16 | 1989-11-20 | Seiko Epson Corp | Recording head |
| JPH08192526A (en) * | 1994-11-18 | 1996-07-30 | Fuji Photo Film Co Ltd | Thermal head and production thereof |
| JPH10193659A (en) * | 1997-01-10 | 1998-07-28 | Tdk Corp | High thermal efficiency thermal head |
| US20020075373A1 (en) * | 1997-10-02 | 2002-06-20 | Asahi Kogaku Kogyo Kabushiki Kaisha | Thermal head and ink transfer printer using same |
| CN101302396A (en) * | 2008-06-27 | 2008-11-12 | 中材高新材料股份有限公司 | High temperature-resistant flame-retardant insulating paint and preparation thereof |
| CN101412323A (en) * | 2008-11-28 | 2009-04-22 | 山东华菱电子有限公司 | Thermal print head and method for manufacturing the same |
| CN201573391U (en) * | 2010-01-06 | 2010-09-08 | 山东华菱电子有限公司 | Thermal sensitive printhead |
-
2010
- 2010-11-30 CN CN2010105655548A patent/CN102120386A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01288462A (en) * | 1988-05-16 | 1989-11-20 | Seiko Epson Corp | Recording head |
| JPH08192526A (en) * | 1994-11-18 | 1996-07-30 | Fuji Photo Film Co Ltd | Thermal head and production thereof |
| JPH10193659A (en) * | 1997-01-10 | 1998-07-28 | Tdk Corp | High thermal efficiency thermal head |
| US20020075373A1 (en) * | 1997-10-02 | 2002-06-20 | Asahi Kogaku Kogyo Kabushiki Kaisha | Thermal head and ink transfer printer using same |
| CN101302396A (en) * | 2008-06-27 | 2008-11-12 | 中材高新材料股份有限公司 | High temperature-resistant flame-retardant insulating paint and preparation thereof |
| CN101412323A (en) * | 2008-11-28 | 2009-04-22 | 山东华菱电子有限公司 | Thermal print head and method for manufacturing the same |
| CN201573391U (en) * | 2010-01-06 | 2010-09-08 | 山东华菱电子有限公司 | Thermal sensitive printhead |
Non-Patent Citations (1)
| Title |
|---|
| 吕乃康等: "《厚膜混合集成电路》", 30 June 1990, 西安交通大学出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107962827A (en) * | 2017-11-02 | 2018-04-27 | 杨潮平 | Composite plate and preparation method thereof and printhead |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101148939B (en) | Electric heating floor board | |
| CN111073413B (en) | Water-based electrothermal energy storage coating, preparation method and application | |
| CN107573731B (en) | High-temperature infrared radiation coating and preparation method and application thereof | |
| CN104150933B (en) | A kind of high temperature insulating refractory mortar | |
| CN102584314B (en) | Preparation method of high heat conductive and high temperature resistant corrugated ceramic-based heat exchanger chip | |
| CN101934637A (en) | Thermal print head and preparation method thereof | |
| CN102120386A (en) | Thermal print head and manufacturing method thereof | |
| EP4027093A1 (en) | Construction method for fiber lining surface of ethylene cracking furnace | |
| CN204977815U (en) | Thermosensitive printing head | |
| CN201442382U (en) | Thermosensitive printing head | |
| CN105622073B (en) | A kind of high radiation coating slurry and the ceramic heating body with the high radiation coating | |
| CN102636527A (en) | Inlaid plate-shaped oxygen sensor and preparation method thereof | |
| CN202019464U (en) | Positive temperature coefficient (PTC) insulating heater | |
| CN204085178U (en) | Ceramic fiber module pin-connected panel hot pressed sintering furnace body | |
| CN103396705A (en) | Anti-oxidation coating and preparation method thereof | |
| CN203895162U (en) | High-temperature-resistant permeable coating structure | |
| CN206638034U (en) | A kind of furnace of calcium carbide high-alumina brick | |
| CN102303458B (en) | Temperature-sensitive printing head and manufacturing method thereof | |
| CN209683190U (en) | Thermal printing head heating base plate with composite heating resistor layer | |
| CN208001383U (en) | A kind of high power density ceramic heating flake | |
| CN205408184U (en) | Silica gel heating plate | |
| CN210579295U (en) | Flat thick film heater | |
| CN206457947U (en) | Novel building exterior wall reflective thermal insulation heat-insulation system | |
| CN201976268U (en) | Graphite heating plate | |
| CN205897976U (en) | Carbon film bridge silk |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110713 |