CN203093333U - Temperature-sensitive printing head - Google Patents
Temperature-sensitive printing head Download PDFInfo
- Publication number
- CN203093333U CN203093333U CN 201320045121 CN201320045121U CN203093333U CN 203093333 U CN203093333 U CN 203093333U CN 201320045121 CN201320045121 CN 201320045121 CN 201320045121 U CN201320045121 U CN 201320045121U CN 203093333 U CN203093333 U CN 203093333U
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- thermal conductivity
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- printing
- enamel
- glaze layer
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Abstract
The utility model discloses a temperature-sensitive printing head comprising a base plate formed by an insulating material, wherein a ground-coat enamel layer is formed on a surface of the insulating material base plate. The temperature-sensitive printing head is characterized in that the ground-coat enamel layer is formed by superposing and combining at least two enamel layers which are different in thermal conductivity, the thermal conductivity of a surface layer enamel layer is smaller than the thermal conductivity of the other enamel layers, the surface layer enamel layer covers the other enamel layers, the thermal conductivity of surface layer ground-coat enamel is low and therefore loss of heat generated by a heating resistor body is small in printing processes, that the temperature of the heating resistor body rises quickly in printing processes is guaranteed, and therefore a quick printing function can be fulfilled, enamel of other layers other than the surface layer is made of or contains an insulator or conductor or semi conducting material which is large in thermal conductivity, unneeded heat after the printing processes can be released quickly, the problem that following printing processes are affected due to accumulated heat can be prevented, and high printing quality and high printing speed can be realized. Due to good thermal conductivity, accumulated heat of the heating resistor body in work processes does not go so far as to rise to a damage temperature of the resistor body, electric power resistant effects of a product are improved by about more than 30%, and various performance requirements of high speed printing are satisfied.
Description
Technical field
The utility model relates to thermal printer, specifically a kind of thermal printing head that has by the different ground glaze layer structure of multilayer thermal conductivity.
Background technology
As everyone knows, thermal printing head comprises the substrate that is made of the insulation heat proof material, and substrate is provided with ground glaze layer, and ground glaze layer and substrate surface are provided with lead electrode, at electrode and resistive element surface coverage wear-resistant protective layer are arranged.
Existing thermal printing head ground-coat enamel manufacturing process is: choosing ceramic material heat-resisting, good insulating is substrate, adopt the method (to call thick film in the following text) of printing, sintering on insulated substrate, to form ground glaze layer, be used for the accumulation of heat of heating resistor, ground glaze layer generally has three kinds of basic structures: comprehensive ground glaze layer, its radiating rate is slow, can not realize the printing of high speed high-quality; If the heater bottom is not provided with ground glaze layer, then most of heat is dissipated by ceramic substrate, and printhead is print job normally; Local ground glaze layer, promptly the heater below is provided with the local glaze layer of certain width, and its volume is less, and accumulation of heat, heat dissipation characteristics can be realized printing speed.
The existing general local ground-coat enamel structure production thermal printing head that adopts, its local ground glaze layer adopts single glass glaze material, its rate of heat transfer is subjected to the limitation of glass material lower thermal conductivity, in the process of flying print, the heat of accumulating can not in time scatter and disappear, remaining heat makes nonprinting region generation lettering, causes print quality to descend; And too high temperature makes heating resistor that bad phenomenon such as heat damage take place, and causes product can not satisfy requirements such as high speed, high-quality printing, long-life.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, and a kind of high lettering quality, long-life high speed thermal printing head are provided.
The utility model can reach by following measure:
A kind of thermal printing head, comprise the substrate that insulating materials constitutes, insulating materials substrate surface forms ground glaze layer, it is characterized in that ground glaze layer compoundly is made of the different glaze of two-layer thermal conductivity stacked adding at least, ground glaze layer is made up of bottom glaze layer, middle glaze layer and top layer glaze layer, the thermal conductivity of top layer glaze layer is lower than the thermal conductivity of other glaze layer, top layer glaze layer covers other glaze layer, top layer ground-coat enamel thermal conductivity is low, heating resistor generation heat scatters and disappears few during printing, the heating resistor temperature rises rapidly when guaranteeing its printing, thereby realizes printing speed; Other layer glaze beyond the top layer, adopting the particle that adds high thermal conductivity material to make or contain bigger insulator of thermal conductivity or conductor or semi-conducting material makes, as contain metallic, semiconductor particle etc., in order to improve its heat dispersion, to print the unwanted heat in back and discharge fast, accumulate the follow-up printing of influence to avoid heat.
The present invention effectively improves the heating-cooling speed of heating resistor, thereby realize high-quality, flying print, because its good thermal conductivity, the heating resistor thermal accumlation is unlikely to rise to the fail temperature of resistive element in the work, the anti-electric power effect of product strengthens about more than 30%, satisfies every performance requirement of flying print.
Description of drawings
Fig. 1 is an example sectional drawing of the present utility model.
Fig. 2 is another example sectional drawing of the present utility model.
The specific embodiment
Below in conjunction with accompanying drawing the utility model is further described.
As Fig. 1, shown in Fig. 2, a kind of thermal printing head, by substrate 1, ground glaze layer, electrode 3, resistance heater 4, and wear-resistant protective layer 5 is formed, substrate 1 has heat-resisting, insulating properties, be generally aluminium oxide ceramic substrate, ground glaze layer mainly plays accumulation of heat, thermolysis, and resistance heater 4 and substrate 1 isolated and smooth surface is provided, reduce the effect of the defective of electrode 3, ground glaze layer adopts printing, the enamel slurry that the sintering thermal conductivity is different is made, the structure of above-mentioned each part and the interconnected relationship between them are same as the prior art, this does not give unnecessary details, the ground glaze layer that is characterised in that of the present utility model compoundly is made of the different glaze of two-layer thermal conductivity stacked adding at least, the thermal conductivity of top layer glaze layer is lower than the thermal conductivity of other glaze layer, top layer glaze layer covers other glaze layer, top layer ground-coat enamel thermal conductivity is low, ground glaze layer is by bottom glaze layer, middle glaze layer and top layer glaze layer are formed, heating resistor generation heat scatters and disappears few during printing, the heating resistor temperature rises rapidly when guaranteeing its printing, thereby realizes printing speed; Other layer glaze beyond the top layer adds the high insulating materials particle of thermal conductivity, form the high structure of thermal conductivity, adopt or contain bigger insulator of thermal conductivity or conductor or semi-conducting material and make, as contain metallic, semiconductor particle etc., in order to improve its heat dispersion, to print the unwanted heat in back and discharge fast, accumulate the follow-up printing of influence to avoid heat.
As Fig. 1; to contain the wherein glaze slurry of one or more compositions such as aluminium oxide, silica, magnesia; form the high ground glaze layer 2A of relatively hot conductance behind the printing sintering; common ground-coat enamel slurry is printed in ground glaze layer 2A surface; form lower thermal conductivity top layer glaze layer 2C behind the sintering; as the accumulation of heat insulating barrier of heating resistor, make electrode 3, heating resistor 4 and wear-resistant protective layer 5 on top layer glaze layer 2C surface, promptly finish the thermal printing head of the embodiment of the invention 1.
The present invention is made of the different two-layer heat-insulation layer of thermal conductivity, and top layer glaze layer 2C thermal conductivity is less relatively, and the heat major part that heating resistor produces is used to make print media to change, and realizes printing function; Ground glaze layer 2A thermal conductivity is bigger, top layer glaze layer 2C is transmitted the heat that comes discharge rapidly, and the heat that minimizing is accumulated is to the influence of follow-up printing.The present invention improves the print quality grade under the high speed, has improved the anti-electric power of product, has prolonged the service life of product.
As Fig. 2, the conductor that thermal conductivity is high, semi-conducting material for example contain one or more the glaze slurry of composition in platinum powder, metal silicide, metal carbides, the metal boride etc., behind the printing sintering, form ground glaze layer 2A; To contain higher heat-conductivity glaze slurry, be printed in ground glaze layer 2A surface, glaze layer 2B in the middle of forming behind the sintering; Printing of ground-coat enamel slurry and 2B surface with common thermal conductivity; form the top layer glaze layer 2C of the accumulation of heat insulating barrier of heating resistor behind the sintering; make electrode 3, heating resistor 4 and wear-resistant protective layer 5 on top layer glaze layer 2C surface, promptly finish the thermal printing head of the embodiment of the invention 2.
The present invention generally is made of three layers of different glaze layer of thermal conductivity, middle glaze layer 2B thermal conductivity greater than the thermal conductivity of top layer glaze layer 2C, be lower than the thermal conductivity of ground glaze layer 2A, can suitably control the transmission of heat, both prevented top layer glaze layer 2C heat excessively lost, influence the programming rate of heating resistor, can during non-printing, top layer glaze layer 2C be transmitted the heat that comes again and be passed to ground glaze layer 2A rapidly.
Thermal printing head of the present invention, improve the print quality grade during flying print significantly, the anti-electric power of product improves, the life-span of thermal printing head is improved, also can adopt the different ground-coat enamel combination of thermal conductivity of more multi-layered number to finish the present invention, realize high print quality, long-life high speed thermal printing head.
Claims (2)
1. thermal printing head, comprise the substrate that insulating materials constitutes, insulating materials substrate surface forms ground glaze layer, it is characterized in that ground glaze layer compoundly is made of the different glaze of two-layer thermal conductivity stacked adding at least, the thermal conductivity of top layer glaze layer is lower than the thermal conductivity of other glaze layer, and top layer glaze layer covers other glaze layer.
2. a kind of thermal printing head according to claim 1 is characterized in that ground glaze layer is made up of bottom glaze layer, middle glaze layer and top layer glaze layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320045121 CN203093333U (en) | 2013-01-28 | 2013-01-28 | Temperature-sensitive printing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320045121 CN203093333U (en) | 2013-01-28 | 2013-01-28 | Temperature-sensitive printing head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203093333U true CN203093333U (en) | 2013-07-31 |
Family
ID=48844764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320045121 Expired - Lifetime CN203093333U (en) | 2013-01-28 | 2013-01-28 | Temperature-sensitive printing head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203093333U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111409376A (en) * | 2020-03-31 | 2020-07-14 | 湖南凯通电子有限公司 | Printing and manufacturing method for base glaze of heating substrate of thermal printing head |
-
2013
- 2013-01-28 CN CN 201320045121 patent/CN203093333U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111409376A (en) * | 2020-03-31 | 2020-07-14 | 湖南凯通电子有限公司 | Printing and manufacturing method for base glaze of heating substrate of thermal printing head |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 264209 fire road 159, hi tech District, Shandong, Weihai Patentee after: SHANDONG HUALING ELECTRONICS Co.,Ltd. Address before: 264209 fire road 159, hi tech District, Shandong, Weihai Patentee before: SHANDONG HUALING ELECTRONICS Co.,Ltd. |
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| CX01 | Expiry of patent term |
Granted publication date: 20130731 |
|
| CX01 | Expiry of patent term |