CN107813615A - Bus electrode framework, thermal printing head and preparation method thereof - Google Patents

Bus electrode framework, thermal printing head and preparation method thereof Download PDF

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Publication number
CN107813615A
CN107813615A CN201711207890.3A CN201711207890A CN107813615A CN 107813615 A CN107813615 A CN 107813615A CN 201711207890 A CN201711207890 A CN 201711207890A CN 107813615 A CN107813615 A CN 107813615A
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bus electrode
heating resistor
layer
printed
substrate
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CN201711207890.3A
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CN107813615B (en
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杨潮平
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Individual
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/3351—Electrode layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/33515—Heater layers

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Abstract

The present invention proposes a kind of bus electrode framework, thermal printing head and preparation method thereof, and bus electrode framework includes：Substrate；Bus electrode, on the substrate；Heating resistor, together with the bus electrode it is transversely arranged on the substrate；Heating resistor protective layer, it is covered on the heating resistor；Bus electrode protective layer, it is covered on the bus electrode；Wherein, the thickness of the bus electrode is more than the thickness of the heating resistor; the upper surface of the bus electrode and the upper surface of the heating resistor are at grade; plane where the lower surface of the bus electrode is less than plane where the lower surface of the heating resistor; both bus electrode thickness had been increased and decreased; the position and structure of the bus electrode protective layer above bus electrode need not be changed again, therefore the increase of thermal printing head volume will not be caused；The abrasion resistance properties of bus electrode protective layer and heating resistor protective layer can also be improved, improve the life-span of bus electrode and heating resistor.

Description

Bus electrode framework, thermal printing head and preparation method thereof
Technical field
The present invention relates to thermal printer technical field, more particularly to a kind of bus electrode framework, thermal printing head and The preparation method of thermal printing head.
Background technology
In thermal printer, one of most important of which component is the thermal printing for being configured with linear heating resistor Head.During work, print media is pressed against heating resistor by pressure roller, and the heating resistor on thermal printing head can be according to whether logical Electricity and optionally generate heat, make the print media that contact with thermal printing head heating resistor that selective coloration occur and react, meanwhile, Cylinder pressure roller is pivoted, and realizes the conveying of print media.
One important feature of thermal printing head is bus electrode, and bus electrode is used to enter in the electric current for flowing through heating resistor Row interflow, it is therefore desirable for bus electrode portion has high current capacity, be currently by increase the cross-sectional area of bus electrode come Its current capacity is improved, increases the cross-sectional area of bus electrode particular by the width of increase bus electrode, but the electricity that confluxes The increase of pole width can cause the increase of thermal printing head volume, be unfavorable for the miniaturization of thermal printing head.
The content of the invention
Based on this, it is necessary to which the increase for bus electrode width can cause the increase of thermal printing head volume, be unfavorable for A kind of the problem of miniaturization of thermal printing head, there is provided the preparation of bus electrode framework, thermal printing head and thermal printing head Method.
A kind of bus electrode framework, including：
Substrate；
Bus electrode, on the substrate；
Heating resistor, together with the bus electrode it is transversely arranged on the substrate；
Heating resistor protective layer, it is covered on the heating resistor；
Bus electrode protective layer, it is covered on the bus electrode；
Wherein, the thickness of the bus electrode be more than the heating resistor thickness, the upper surface of the bus electrode with At grade, plane where the lower surface of the bus electrode is less than the heating resistor for the upper surface of the heating resistor Lower surface where plane.
In one embodiment, the thickness of the bus electrode protective layer is identical with the thickness of the heating resistor protective layer, The upper surface of the bus electrode protective layer and the upper surface of the heating resistor protective layer are at grade.
In one embodiment, the bus electrode includes upper bus electrode layer, middle bus electrode layer and lower bus electrode Layer；The lower bus electrode layer, middle bus electrode layer and upper bus electrode layer stack to form the bus electrode from bottom to top.
In one embodiment, the substrate opens up groove, and the bottom of the bus electrode is inserted in the groove.
In one embodiment, described bus electrode framework also includes：Glass glazings, on the substrate, the glass Glass glaze layer opens up groove, and the bus electrode and the heating resistor are horizontally arranged on the glass glazings；Wherein, the remittance The bottom of stream electrode is inserted in the groove.
In one embodiment, the bus electrode framework also includes：Glass glazings, positioned at the substrate and the heating electric Between resistance.
Above-mentioned bus electrode framework, adds the thickness of bus electrode, and is thickness of the increase in substrate-side bus electrode Degree, the upper surface of bus electrode upper surface and heating resistor had both improved the current capacity of bus electrode, and nothing in same plane The position and structure of the bus electrode protective layer above bus electrode need to be changed, therefore the increasing of thermal printing head volume will not be caused Greatly；Moreover, bus electrode upper surface and the upper surface of heating resistor are in same plane, therefore, the electricity that confluxes above bus electrode The thickness of pole protective layer can be consistent with heating resistor protective layer thickness, can improve bus electrode protective layer and heating electric The abrasion resistance properties of protective layer are hindered, improve the life-span of bus electrode and heating resistor.
A kind of thermal printing head, including bus electrode framework as described above.
Above-mentioned thermal printing head, adds the thickness of bus electrode, and is thickness of the increase in substrate-side bus electrode, Bus electrode upper surface and the upper surface of heating resistor had both improved the current capacity of bus electrode, again need not in same plane Change the position and structure of the bus electrode protective layer above bus electrode, therefore the increasing of thermal printing head volume will not be caused Greatly；Moreover, bus electrode upper surface and the upper surface of heating resistor are in same plane, therefore, the electricity that confluxes above bus electrode The thickness of pole protective layer can be consistent with heating resistor protective layer thickness, can improve bus electrode protective layer and heating electric The abrasion resistance properties of protective layer are hindered, improve the life-span of bus electrode and heating resistor.
A kind of preparation method of thermal printing head, comprises the following steps：
Heating resistor is printed in surface, forms heating resistor band；
Bus electrode is printed on the surface in the heating resistor transverse direction, from less than the heating resistor Starting printing surface starts to print the bus electrode, until the height of bus electrode reaches the height of the heating resistor；
Bus electrode protective layer is printed on the bus electrode, and heating resistor protection is printed on the heating resistor Layer, until the height of bus electrode protective layer reaches the height of heating resistor protective layer.
In one embodiment, described the step of bus electrode is printed on into the surface, includes：By lower bus electrode Layer is printed on substrate, then middle bus electrode layer is printed on the lower bus electrode layer, then by upper bus electrode layer It is printed on the middle bus electrode layer, until the upper surface of upper bus electrode is in same flat with the heating resistor upper surface Face.
In one embodiment, it is described surface print heating resistor before the step of include：Glass is printed on substrate Glass glaze layer, wherein, the glass glazings thickness of default bus electrode printing zone is less than the glass glazings thickness in remaining region；
Described is to print the hair on glass glazings on substrate the step of surface prints heating resistor Thermal resistance；
The step that lower bus electrode layer is printed on substrate be lower bus electrode layer is printed on it is described default On the glass glazings of bus electrode printing zone, until the glass glazings of the upper surface of the lower bus electrode layer and remaining region Upper surface it is in the same plane；
It is described after printed glass glaze layer on substrate the step of include：Conductive pattern layer is prepared on glass glazings, so Heat resistance layer is printed on glass glazings and conductive pattern layer afterwards, forms heating resistor band；Wherein, conductive pattern layer includes public affairs Common electrode and individual electrode；And public electrode, individual electrode and the printing middle bus electrode layer are prepared in same step Carry out.
The preparation method of above-mentioned thermal printing head, adds the thickness of bus electrode, and is that increase is confluxed in substrate-side The upper surface of the thickness of electrode, bus electrode upper surface and heating resistor had both improved the electric current of bus electrode in same plane Capacity, need not change the position and structure of the bus electrode protective layer above bus electrode again, therefore will not cause thermal printing The increase of head volume；Moreover, bus electrode upper surface and the upper surface of heating resistor be in same plane, therefore, on bus electrode The thickness of the bus electrode protective layer of side can be consistent with heating resistor protective layer thickness, can improve bus electrode protective layer And the abrasion resistance properties of heating resistor protective layer, improve life-span of bus electrode and heating resistor.
Brief description of the drawings
Fig. 1 faces cross-sectional view for the bus electrode framework in one embodiment；
Fig. 2 is the top view cross section structural representation of the bus electrode framework in one embodiment；
Fig. 3 faces cross-sectional view for the bus electrode framework in another embodiment；
Fig. 4 faces cross-sectional view for the bus electrode framework in further embodiment；
Fig. 5 is that the thermal printing head of the thermal printer in one embodiment and the cross-section structure of facing of pressure roller are illustrated Figure；
Fig. 6 is the schematic flow sheet of the preparation method of thermal printing head in one embodiment.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and It is not used in the restriction present invention.
In one embodiment, referring to Fig. 1, the bus electrode framework in Fig. 1 includes：Substrate 10, bus electrode 11, heating Resistance 12, heating resistor protective layer 13 and bus electrode protective layer 14；Bus electrode 11 on the substrate 10, heating resistor 12 with Bus electrode 11 together it is transversely arranged on the substrate 10, heating resistor protective layer 13 is covered on heating resistor 12, bus electrode Protective layer 14 is covered on bus electrode 11；Wherein, the thickness of bus electrode 11 is more than the thickness of heating resistor 12, bus electrode With the upper surface of heating resistor 12 at grade, plane is less than heating where the lower surface of bus electrode 11 for 11 upper surface Plane where the lower surface of resistance 12.Fig. 2 is the top view cross section structural representation of bus electrode framework, denotes and confluxes in Fig. 2 The structure of electrode, other structures are not shown.
Specifically, heating resistor 12 forms heat resistance layer.Substrate 10 can be ceramic insulation substrate.Heating resistor is protected Layer 13 and bus electrode protective layer 14 are used to contact with the print media of thermal printer, and print media is pressed against by pressure roller On heating resistor protective layer 13 and bus electrode protective layer 14.
Therefore, the bus electrode framework in the present embodiment, adds the thickness of bus electrode, and is increased in substrate-side The upper surface of the thickness of bus electrode (bus electrode of lower section), bus electrode upper surface and heating resistor is in same plane, both The current capacity of bus electrode is improved, the position and structure of the bus electrode protective layer above bus electrode need not be changed again, Therefore the increase of thermal printing head volume will not be caused；Moreover, bus electrode upper surface and the upper surface of heating resistor are same Plane, it therefore, there is no need to change the thickness of bus electrode protective layer, will not be corresponding in the bus electrode portion of thermal printing head surface Region form convex portion, the abrasion resistance properties of bus electrode protective layer and heating resistor protective layer can be improved, raising is confluxed electricity Pole and the life-span of heating resistor.
In one embodiment, the thickness of bus electrode protective layer 14 is identical with the thickness of heating resistor protective layer 13, confluxes The upper surface of electrode protecting layer 14 and the upper surface of heating resistor protective layer 13 are at grade.Bus electrode protective layer 14 is For protecting bus electrode 11, heating resistor protective layer 13 is for protecting heating resistor 12, bus electrode protective layer 14 With the upper surface of heating resistor protective layer 13 at grade, convex portion region will not be formed, can reduce and be extruded by outside pressure roller When protective layer the rate of wear.
For bus electrode 11, specifically, referring to Fig. 1, bus electrode 11 may include bus electrode layer 11a, middle remittance Flow electrode layer 11b and lower bus electrode layer 11c；Lower bus electrode layer 11c, middle bus electrode layer 11b and upper bus electrode Layer 11a stacks to form bus electrode 11 from bottom to top.
In one embodiment, referring to Fig. 1, bus electrode framework also includes glass glazings 15, glass glazings 15 are located at base On plate, bus electrode and heating resistor are horizontally arranged on glass glazings 15, and glass glazings 15 open up groove, the He of bus electrode 11 Heating resistor 12 is horizontally arranged on glass glazings 15；Wherein, the bottom of bus electrode 11 is inserted in groove.By bus electrode 11 Corresponding glass glazings region opens up a groove, and the bottom of bus electrode 11 is inserted in groove, it is clear that the correspondence of bus electrode 11 The thickness of the glass glazings in region is less than the thickness of the corresponding glass glazings of heating resistor 12, so that the upper surface of substrate 10 is at one In plane.
Specifically, can be that lower bus electrode layer 11c is located on the groove of glass glazings 15, lower bus electrode layer 11c's Upper surface and the upper surface of the glass glazings below heat-generating units are in the same plane, i.e., glass glazings depth of groove can be with Bus electrode layer 11c thickness is equal, and Fig. 1 shows a case that both is highly equal.
Below bus electrode also can not printed glass glaze layer, such as Fig. 3, bus electrode 11 can contact directly with substrate 10. In another embodiment, glass glazings 15 are between heating resistor and substrate 10, without glass between bus electrode and substrate Glaze layer 15, glass glazings 15 and bus electrode 11 are transversely arranged on the substrate 10.
In one of embodiment, the lower surface of glass glazings 15 and the lower surface of bus electrode may be at same plane On.Can be specifically that lower bus electrode layer 11c thickness is equal to the thickness of glass glazings, then upper bus electrode layer 11a is with Bus electrode layer 11b thickness sum is identical with the thickness of heating resistor, therefore upper bus electrode layer 11a upper surface and heating The upper surface of resistive layer is in same plane, and middle bus electrode layer 11b lower surface and heat resistance layer lower surface are in same Plane, lower bus electrode layer 11c upper surface, the lower surface of heating resistor 13, the upper surface of glass glazings 15 are in same flat Face.
In embodiment illustrated in fig. 3, because the lower section of bus electrode 11 does not have glass glazings 15, the thickness of bus electrode 11 increases Add, current capacity is bigger, and resistance is lower, and the caloric value of bus electrode during work is small, low in energy consumption.
The thickness of bus electrode can also further increase, in one embodiment, referring to Fig. 4, substrate 10 offer it is recessed Groove, the bottom of bus electrode 11 are inserted in the groove of substrate 10.Plane where the obvious lower surface of bus electrode 11 is less than glass glaze Plane where 15 lower surface of layer, the thickness of bus electrode 11 is thicker, and current capacity is bigger, and resistance is lower, the electricity that confluxes during work The caloric value of pole is smaller, and power consumption is lower.
The present invention also proposes a kind of thermal printing head.
In one embodiment, thermal printing head includes the bus electrode framework in as above any embodiment.Referring to Fig. 1, Fig. 3, Fig. 4, thermal printing head also includes glass glazings 15, between the substrate and the heating resistor.Thermal printing head Also include conductive pattern layer, conductive pattern layer includes public electrode 16 and individual electrode 17；Referring to Fig. 2, the He of public electrode 16 Individual electrode 17 is spaced on glass glazings 15 in the horizontal.Specifically, heating resistor, public electrode 16 and individual electrode 17 are arranged on glass glazings 15, and the heating resistor of public electrode 16 and the intermediate region of individual electrode 17 is heater element.
Referring to Fig. 1, also have glass glazings 15 between substrate 10 and bus electrode 11, glass glaze corresponding to bus electrode 11 Layer region opens up fluted, and the bottom of bus electrode is inserted in groove, it is clear that the thickness of the glass glazings of bus electrode corresponding region Degree is less than the thickness that heating resistor corresponds to glass glazings, so as to the upper surface of substrate 10 in one plane.
The present invention also proposes a kind of thermal printer.
In one embodiment, thermal printer includes the thermal printing head in as above any embodiment, and thermal printing head can For linear thermal printing head, referring to Fig. 5, the thermal printer also includes pressure roller 18, pressure roller 18 can be specifically cylinder Pressure roller, print media are pressed against on thermal printing head by pressure roller 18.
Specifically, print media is to be pressed against bus electrode protective layer 14 and heating resistor protective layer by pressure roller 18 On 13.
When thermal printer works, print media is pressed against on heating resistor (i.e. print media position by cylinder pressure roller Between pressure roller and thermal printing head), heating resistor on thermal printing head can make according to whether be powered and optionally generate heat Selective coloration reaction occurs for the print media contacted with thermal printing head heating resistor, meanwhile, cylinder pressure roller is pivoted, real The conveying of existing print media.
The present invention also proposes a kind of preparation method of thermal printing head.
Referring to Fig. 6, the preparation method of the thermal printing head in one embodiment, comprises the following steps：
S11：Heating resistor is printed in surface, forms heating resistor band.
Heat resistance layer specifically is printed in surface, forms heating resistor band.It is that first printing is public in one embodiment Then common electrode and individual electrode print heating resistor on substrate, it is covered public electrode and individual electrode and public The substrate in region between electrode and individual electrode, form heating resistor band.
S12：Bus electrode is printed on the surface in the heating resistor transverse direction, from less than the heating electric The starting printing surface of resistance starts to print the bus electrode, until the height of bus electrode reaches the height of the heating resistor.
S13：Bus electrode protective layer is printed on the bus electrode, and heating resistor is printed on the heating resistor Protective layer, until the height of bus electrode protective layer reaches the height of heating resistor protective layer.
Can the first printed glass glaze layer on substrate, the thickness of glass glazings be it is unequal, default bus electrode The glass glazings thickness of printing zone is less than the glass glazings thickness in remaining region, can be in the default glass that place bus electrode Glass glaze layer region opens up the groove of a predetermined depth, bus electrode than the thickness that heating resistor has more be equal to groove this is default Depth, bus electrode are to start printing in the groove of glass glazings.Bus electrode can also be directly printed on substrate, i.e., Bus electrode is with substrate directly without glass glazings.
In one embodiment, described the step of bus electrode is printed on into the surface, includes：By lower bus electrode Layer is printed on substrate, then middle bus electrode layer is printed on the lower bus electrode layer, then by upper bus electrode layer It is printed on the middle bus electrode layer, until the upper surface of upper bus electrode is in same flat with the heating resistor upper surface Face.It is described surface print heating resistor before the step of include：The printed glass glaze layer on substrate, wherein, it is default The glass glazings thickness of bus electrode printing zone is less than the glass glazings thickness in remaining region.
For step S11, referring to Fig. 1, described is the institute on substrate surface prints heating resistor the step of State and the heating resistor is printed on glass glazings；The step that lower bus electrode layer is printed on substrate is the electricity that confluxes by under Pole layer is printed on the glass glazings of the default bus electrode printing zone, until the upper surface of the lower bus electrode layer It is in the same plane with the upper surface of the glass glazings in remaining region.
Lower bus electrode directly can be without glass glazings, referring to Fig. 3, i.e. lower bus electrode layer can directly print with substrate On substrate, until the upper surface of lower bus electrode layer upper surface and remaining glass glazings is in same plane.
Further, referring to Fig. 4, the thickness of lower bus electrode layer is also greater than the thickness of glass glazings, on substrate The default position that print bus electrode opens up a groove, bus electrode layer under being printed on groove, until lower bus electrode The upper surface of layer and the upper surface of glass glazings are in a plane.
In one embodiment, it is described after printed glass glaze layer on substrate the step of include：
Conductive pattern layer is prepared on glass glazings；Wherein, conductive pattern layer includes public electrode and individual electrode；In glass After preparing conductive pattern layer in glass glaze layer, heat resistance layer is printed on glass glazings and conductive pattern layer, forms heating electric Stopband；
When printing the step of heating resistor protective layer on heating resistor, heating resistor protective layer is covered into the conductive pattern Shape layer.
In one embodiment, conductive pattern layer may include public electrode, individual electrode and middle bus electrode layer, that is, prepare Public electrode, individual electrode and on lower bus electrode layer print in bus electrode layer be to be carried out in same step, in this way, can Simplify the processing step of thermal printing head.
The preparation method flow of the thermal printing head in a specific implementation is described below.In a specific embodiment, The printed glass glaze layer on substrate, the thickness of glass glazings is unequal, the glass glaze of default bus electrode printing zone Thickness degree is less than the glass glazings thickness in remaining region；Then under the default glass glazings printing that print bus electrode region Bus electrode layer, until the glass glazings upper surface of lower bus electrode layer upper surface and non-bus electrode printing zone is positioned at same Horizontal plane；Then bus electrode layer in being printed in lower bus electrode region, and the glass glazings in middle bus electrode layer transverse direction Upper printed conductive patterns shape layer (conductive pattern layer includes public electrode and individual electrode)；Then in conductive pattern layer and glass glazings Upper printing heat resistance layer, form heating resistor band；Then bus electrode layer is printed on middle bus electrode layer, until upper remittance It is in the same plane to flow upper surface and the heat resistance layer upper surface of electrode layer, now, under, in, upper bus electrode layer composition Bus electrode；Bus electrode protective layer is finally printed on upper bus electrode layer and heating resistor is printed on heat resistance layer and is protected Sheath.
The preparation method of thermal printing head in the present embodiment, adds the thickness of bus electrode, and is increased in base The upper surface of the thickness of plate side bus electrode (bus electrode of lower section), bus electrode upper surface and heating resistor is same flat Face, both improved the current capacity of bus electrode, need not change again bus electrode protective layer above bus electrode position and Structure, therefore the increase of thermal printing head volume will not be caused；Moreover, bus electrode upper surface and the upper surface of heating resistor exist Same plane, it therefore, there is no need to change the thickness of bus electrode protective layer, will not be in the bus electrode portion of thermal printing head surface Corresponding region forms convex portion, can improve the abrasion resistance properties of bus electrode protective layer and heating resistor protective layer, improves and converges Flow the life-span of electrode and heating resistor.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality Apply each technical characteristic in example be possible to combination be all described, as long as but lance is not present in the combination of these technical characteristics Shield, all should be the scope that this specification is recorded.
Embodiment described above only expresses several embodiments of the present invention, and its description is more specific and detailed, but not Therefore the limitation to the scope of the claims of the present invention can be interpreted as.It should be pointed out that come for one of ordinary skill in the art Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.

Claims (10)

  1. A kind of 1. bus electrode framework, it is characterised in that including：
    Substrate；
    Bus electrode, on the substrate；
    Heating resistor, together with the bus electrode it is transversely arranged on the substrate；
    Heating resistor protective layer, it is covered on the heating resistor；
    Bus electrode protective layer, it is covered on the bus electrode；
    Wherein, the thickness of the bus electrode be more than the heating resistor thickness, the upper surface of the bus electrode with it is described At grade, plane is less than under the heating resistor where the lower surface of the bus electrode for the upper surface of heating resistor Plane where surface.
  2. 2. bus electrode framework according to claim 1, it is characterised in that the thickness of the bus electrode protective layer and institute State that the thickness of heating resistor protective layer is identical, the upper surface of the bus electrode protective layer is upper with the heating resistor protective layer Surface is at grade.
  3. 3. bus electrode framework according to claim 1, it is characterised in that the bus electrode includes upper bus electrode Layer, middle bus electrode layer and lower bus electrode layer；The lower bus electrode layer, middle bus electrode layer and upper bus electrode layer Stack from bottom to top and form the bus electrode.
  4. 4. according to the bus electrode framework described in claim any one of 1-3, it is characterised in that
    The substrate opens up groove, and the bottom of the bus electrode is inserted in the groove.
  5. 5. according to the bus electrode framework described in claim any one of 1-3, it is characterised in that also include：Glass glazings, it is located at On the substrate, the glass glazings open up groove, and the bus electrode and the heating resistor are horizontally arranged in the glass In glaze layer；Wherein, the bottom of the bus electrode is inserted in the groove.
  6. 6. according to the bus electrode framework described in claim any one of 1-3, it is characterised in that also include：Glass glazings, it is located at Between the substrate and the heating resistor.
  7. 7. a kind of thermal printing head, it is characterised in that including the bus electrode framework as described in claim any one of 1-6.
  8. 8. a kind of preparation method of thermal printing head, it is characterised in that comprise the following steps：
    Heating resistor is printed in surface, forms heating resistor band；
    Bus electrode is printed on the surface in the heating resistor transverse direction, from the starting less than the heating resistor Printing surface starts to print the bus electrode, until the height of bus electrode reaches the height of the heating resistor；
    Bus electrode protective layer is printed on the bus electrode, and heating resistor protective layer is printed on the heating resistor, Until the height of bus electrode protective layer reaches the height of heating resistor protective layer.
  9. 9. the preparation method of thermal printing head according to claim 8, it is characterised in that
    Described the step of bus electrode is printed on into the surface, includes：Lower bus electrode layer is printed on substrate, so Middle bus electrode layer is printed on the lower bus electrode layer afterwards, then by upper bus electrode layer be printed on it is described in conflux electricity On the layer of pole, until the upper surface of upper bus electrode is in same plane with the heating resistor upper surface.
  10. 10. the preparation method of thermal printing head according to claim 9, it is characterised in that described to be printed in surface The step of before heating resistor, includes：The printed glass glaze layer on substrate, wherein, the glass of default bus electrode printing zone Glazed thickness is less than the glass glazings thickness in remaining region；
    Described is to print the heating electric on glass glazings on substrate the step of surface prints heating resistor Resistance；
    The step that lower bus electrode layer is printed on substrate is that lower bus electrode layer is printed on into described default conflux On the glass glazings in electrode print region, until upper surface and the glass glazings in remaining region of the lower bus electrode layer is upper Surface is in the same plane；
    It is described after printed glass glaze layer on substrate the step of include：Conductive pattern layer, Ran Hou are prepared on glass glazings Heat resistance layer is printed on glass glazings and conductive pattern layer, forms heating resistor band；Wherein, conductive pattern layer includes common electrical Pole and individual electrode；And prepare public electrode, individual electrode and the printing middle bus electrode layer to carry out in same step.
CN201711207890.3A 2017-11-27 2017-11-27 Bus electrode framework, thermal printing head and preparation method thereof Active CN107813615B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109263295A (en) * 2018-08-31 2019-01-25 潮州三环（集团）股份有限公司 Thermal printing head and preparation method thereof
CN113386469A (en) * 2020-03-11 2021-09-14 深圳市博思得科技发展有限公司 Thermal print head and method of manufacturing the same

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CN109263295B (en) * 2018-08-31 2020-04-10 潮州三环（集团）股份有限公司 Thermal printing head and preparation method thereof
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CN113386469B (en) * 2020-03-11 2022-07-01 深圳市博思得科技发展有限公司 Thermal print head and method of manufacturing the same

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