CN202319296U - Thermo-sensitive printing head - Google Patents
Thermo-sensitive printing head Download PDFInfo
- Publication number
- CN202319296U CN202319296U CN2011204907787U CN201120490778U CN202319296U CN 202319296 U CN202319296 U CN 202319296U CN 2011204907787 U CN2011204907787 U CN 2011204907787U CN 201120490778 U CN201120490778 U CN 201120490778U CN 202319296 U CN202319296 U CN 202319296U
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- pressure welding
- silver
- printing head
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Abstract
The utility model discloses a thermo-sensitive printing head, which comprises a substrate made from an insulating material. A ground coat layer is arranged on the substrate. Lead electrodes are arranged on the ground coat layer and the substrate, and are divided into independent electrodes and common electrodes. A heating resistor body is formed along a main printing direction on the lead electrodes. A glass layer is printed and sintered on the electrodes and the surface of the resistor body and serves as a wearable protective layer. One end of each independent electrode is connected with the resistor body, and a pressure welding pan connected with a control chip is arranged at the other end of each independent electrode. The thermo-sensitive printing head is characterized in that: each independent electrode consists of two parts which are connected, wherein one part is a gold electrode which is connected with the resistor body and made of gold, and the other part is a silver electrode which is connected with a corresponding pressure welding pan and made from silver; adjacent pressure welding pans are at the insulating interval of not less than 25 microns; and a silver thread forming each pressure welding pan adopts curve transition. The using amount of a gold material is decreased, the phenomenon of high electric field gradient caused by charge concentration at the tip part of each pressure welding pan is avoided, an electric field gradient between the welding pans can be uniformly distributed, and migration between the welding pans is avoided; and the thermo-sensitive printing head has the advantages of working stability, reliable performance, reduction in production cost and the like.
Description
Technical field
The utility model relates to thermal printer, specifically a kind of thermal printing head that adopts silver as conductor material.
Background technology
As everyone knows, thermal printing head comprises the substrate that is made up of the insulation heat proof material, and substrate is provided with ground glaze layer; Ground glaze layer and substrate surface are provided with lead electrode, and lead electrode is divided into absolute electrode and common electrode, and absolute electrode one end is connected with heating resistor along secondary Print direction; The other end is connected with control IC; Common electrode one end is connected with heating resistor, and the other end is connected with power supply, at electrode and resistive element surface coverage wear-resistant protective layer is arranged.
Existing thermal printing head manufacturing technique is: the ceramic material of one, choosing good insulating is a substrate; Two, in order to prevent the thermal losses of heating resistor; Adopt the method (to call thick film in the following text) of printing, sintering on insulated substrate, to form ground glaze layer; Three, on ground glaze layer and substrate, adopt thick-film methods to form electrode cable; Four, on ground glaze layer, adopt thick film to form heating resistor, five, on heating resistor and at least a portion and electrode cable that heating resistor is connected, adopt the protective layer of thick-film methods formation then.
Advantages such as in addition, thermal printing is owing to have a low price, and is non-maintaining, easy to use are used in recent years widely; Because gold is the main raw material(s) of thermal printing head, along with the price of gold is constantly high, the material cost that thermal printing head faces constantly rises; Be unfavorable for popularizing of thermal printing, Chinese patent number is the thermal printing head in 200920029019.3, utilizes silver to substitute gold; Can reduce the use amount of gold, but the chemical stability of silver is lower than gold, in the bigger environment of humidity; The electromigration of silver then possibly take place, influence the problem in the life-span of thermal printing head, above-mentioned patent is not considered electromigration is corresponding.
Summary of the invention
The purpose of the utility model is the deficiency that overcomes above-mentioned prior art, provides a kind of employing silver as conductor material, the silver migration do not occur, dependable performance, the thermal printing head that golden use amount reduces.
The utility model can reach through following measure:
A kind of thermal printing head comprises the substrate that is made up of insulating materials, and substrate is provided with ground glaze layer; Ground glaze layer and substrate are provided with lead electrode, and lead electrode is divided into absolute electrode and common electrode, the leading India side in the edge that on lead electrode, forms to heating resistor; Print the sintered glass layer as wear-resistant protective layer at electrode and resistive surface; Absolute electrode one end is connected with resistive element, and the other end is provided with the pressure welding pad that is connected with control chip, it is characterized in that absolute electrode is formed by connecting two parts; A part is the gold electrode that not is connected and does with gold with resistance; Another part is the silver electrode that is connected with the pressure welding pad and adopts silver to do, and the insulation spacing between the adjacent pressure welding pad is not less than 25 microns, and the silver-colored lines that constitute the pressure welding pad are with arc transition.
The described pressure welding pad of the utility model is to be roughly square with the profile that silver constitutes, and the profile adjacent lines that constitutes the pressure welding pad is carried out transition with circular arc, causes charge concentration easily to avoid the most advanced and sophisticated position of pressure welding pad, causes the high defective of electric-force gradient; Electric-force gradient between the pad is evenly distributed, avoids moving between pad.
The utility model has reduced the consumption of gold copper-base alloy; Insulation spacing between the adjacent pressure welding pad is not less than 25 microns, and the silver-colored lines that constitute the pressure welding pad have avoided the most advanced and sophisticated position of pressure welding pad to cause charge concentration with arc transition; Cause the high phenomenon of electric-force gradient; Electric-force gradient between the pad is evenly distributed, avoids moving between pad, advantage such as have working stability, dependable performance, reduce production costs.
Description of drawings
Fig. 1 is a kind of planar structure sketch map of the utility model.
Fig. 2 is I-I sectional drawing of Fig. 1.
Fig. 3 is the enlarged drawing at Figure 1A place.
The specific embodiment
An example of the utility model is shown in Fig. 1, Fig. 2, and a kind of thermal printing head is made up of substrate 1, glass glaze layer 2, public electrode 3, absolute electrode 4, resistance heater 5 and wear-resistant protective layer 6 (Fig. 1 is expression not)., substrate 1 has heat-resisting, insulating properties, is generally aluminium oxide ceramic substrate; Glass glaze layer 2 mainly plays the accumulation of heat effect, and resistance heater 5 and substrate 1 are isolated and smooth surface, the effect of the defective of minimizing electrode 3,4 be provided; Glass glaze layer 2 adopts printing, sintering enamel slurry to process; Public electrode 3 has a plurality of broach shape electrodes 31 that extend to the thermal printing head sub scanning direction, and it is 41 that absolute electrode 4 one ends extend to 31, and the end of absolute electrode 4 forms pad 44; Be used for being connected with the output of drive IC; Public electrode 3 and extension 31 and absolute electrode 41 adopts the printings of resin acid gold paste material, sintering to form, and absolute electrode 43,44 adopt the slurry printing, sintering of argentiferous after etching form 41 and 43 overlapped formation 42.
Like Fig. 3, absolute electrode pressure welding welding disk 44 has 44a1,44b1,44c, 44a2,44b2, and the right angle that 44a1,44b1 are formed becomes circular arc 44d1 transition; The right angle that 44b, 44c are formed becomes circular arc 44e1 transition, and the right angle that 44a2,44b2 are formed becomes circular arc 44d2 transition, and the right angle that 44b2,44c are formed becomes circular arc 44e2 transition; Between the adjacent pressure welding welding disk 44; The blank insulating regions that does not have electrode, promptly the distance between the 44b2 of 44b1 and adjacent pad portion 44 is not less than 25 microns, resistive element perpendicular to 31, the 41 broach shape electrode prescriptions that constitute to; Adopt printing, draw the resistance slurry that ruthenium-oxide adds the glass dust formation; Form the band shape of certain width, form resistance behind the sintering, this resistive conductor strides across on the every line of 31, the 41 broach shape electrode groups that constitute.Protective layer 6 covers the part of common electrode 3, absolute electrode 4, the surface of heating resistor 5 at least, and it adopts the printing of glass glaze slurry, sintering to form.The electromigration factor of influence silver; Except that the humidity of environment, electric-force gradient, relevant with the shape of electrode, interelectrode insulation distance, the curvature of charge density and electrode is directly proportional; When the tip appears in electrode; Electric charge accumulates in this tip easily, thereby makes the electric field here very strong, and causes partial portion that electromigration takes place under wet environment easily.
The present invention increases the radius of curvature of electrode through the terminal pressure welding bond pad shapes of individual electrode is set, and the Electrode Field that radius of curvature is big is more evenly distributed.Like Fig. 3, the right angle is become arc transition, eliminate the positions such as tip, right angle that electric charge is assembled easily, reduce silver electrode electromigratory problem takes place under wet environment.
Electromigratory in addition generation is relevant with the electric-force gradient height; Under the identical condition of thermal printing head supply voltage; Clearance for insulation distance between the pad is big more, and electric-force gradient is low more, and the electromigration odds is also low more; The insulation distance that the present invention is provided with between adjacent pad is not less than 25 microns, reduces silver electrode electromigratory problem takes place under wet environment.
Claims (2)
1. a thermal printing head comprises the substrate that is made up of insulating materials, and substrate is provided with ground glaze layer; Ground glaze layer and substrate are provided with lead electrode, and lead electrode is divided into absolute electrode and common electrode, the leading India side in the edge that on lead electrode, forms to heating resistor; Print the sintered glass layer as wear-resistant protective layer at electrode and resistive surface; Absolute electrode one end is connected with resistive element, and the other end is provided with the pressure welding pad that is connected with control chip, it is characterized in that absolute electrode is formed by connecting two parts; A part is the gold electrode that not is connected and does with gold with resistance; Another part is the silver electrode that is connected with the pressure welding pad and adopts silver to do, and the insulation spacing between the adjacent pressure welding pad is not less than 25 microns, and the silver-colored lines that constitute the pressure welding pad are with arc transition.
2. thermal printing head according to claim 1 is characterized in that the pressure welding pad is to constitute with silver, and the adjacent lines that constitutes the profile of pressure welding pad is carried out transition with circular arc.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2011204907787U CN202319296U (en) | 2011-12-01 | 2011-12-01 | Thermo-sensitive printing head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2011204907787U CN202319296U (en) | 2011-12-01 | 2011-12-01 | Thermo-sensitive printing head |
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CN202319296U true CN202319296U (en) | 2012-07-11 |
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CN2011204907787U Expired - Lifetime CN202319296U (en) | 2011-12-01 | 2011-12-01 | Thermo-sensitive printing head |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107160862A (en) * | 2017-06-20 | 2017-09-15 | 山东华菱电子股份有限公司 | Thermal printing head heating base plate and its manufacture method |
CN107901613A (en) * | 2017-11-27 | 2018-04-13 | 山东华菱电子股份有限公司 | A kind of novel thermosensitive printhead heating base plate and its manufacture method |
CN109263295A (en) * | 2018-08-31 | 2019-01-25 | 潮州三环(集团)股份有限公司 | Thermal printing head and preparation method thereof |
CN112071819A (en) * | 2019-06-11 | 2020-12-11 | 群创光电股份有限公司 | Electronic device |
-
2011
- 2011-12-01 CN CN2011204907787U patent/CN202319296U/en not_active Expired - Lifetime
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107160862A (en) * | 2017-06-20 | 2017-09-15 | 山东华菱电子股份有限公司 | Thermal printing head heating base plate and its manufacture method |
CN107901613A (en) * | 2017-11-27 | 2018-04-13 | 山东华菱电子股份有限公司 | A kind of novel thermosensitive printhead heating base plate and its manufacture method |
CN109263295A (en) * | 2018-08-31 | 2019-01-25 | 潮州三环(集团)股份有限公司 | Thermal printing head and preparation method thereof |
CN109263295B (en) * | 2018-08-31 | 2020-04-10 | 潮州三环(集团)股份有限公司 | Thermal printing head and preparation method thereof |
CN112071819A (en) * | 2019-06-11 | 2020-12-11 | 群创光电股份有限公司 | Electronic device |
CN112071819B (en) * | 2019-06-11 | 2023-05-16 | 群创光电股份有限公司 | Electronic device |
US11705392B2 (en) | 2019-06-11 | 2023-07-18 | Innolux Corporation | Electronic device having integrated circuit chip connected to pads on substrate |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 264209 fire road 159, hi tech District, Shandong, Weihai Patentee after: SHANDONG HUALING ELECTRONICS CO., LTD. Address before: 264209 fire road 159, hi tech District, Shandong, Weihai Patentee before: Hualing Electronics Co., Ltd., Shandong |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20120711 |