CN204701284U - Thermal printing head and apply the thermal printer of this thermal printing head - Google Patents
Thermal printing head and apply the thermal printer of this thermal printing head Download PDFInfo
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- CN204701284U CN204701284U CN201520388340.6U CN201520388340U CN204701284U CN 204701284 U CN204701284 U CN 204701284U CN 201520388340 U CN201520388340 U CN 201520388340U CN 204701284 U CN204701284 U CN 204701284U
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- printing head
- thermal printing
- glaze layer
- diverging electrodes
- common bus
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Abstract
The utility model provides a kind of thermal printing head and applies the thermal printer of this thermal printing head.It comprises: substrate; Accumulation of heat glaze layer, it is formed on the substrate; Common bus and diverging electrodes, described common bus and described diverging electrodes are all formed on described accumulation of heat glaze layer, and one end of described diverging electrodes is connected to described common bus, described common bus and described diverging electrodes are that the precious metal film layer made by thick-film technique is formed; Protection glaze layer, it covers a part for described diverging electrodes, only exposes the end away from described common bus of described diverging electrodes, and described protection glaze layer also covers the part of the close described diverging electrodes of described common bus; And conducting wire, it to be formed on described accumulation of heat glaze layer and to be connected to the end of exposing of described diverging electrodes, and described conducting wire is formed by base metal.This thermal printing head significantly reduces the consumption of noble metal (such as gold, silver), reduces the cost of manufacture of thermal printing head.
Description
Technical field
The utility model relates to printer field, particularly, relates to a kind of thermal printing head and applies the thermal printer of this thermal printing head.
Background technology
The use of thermal printer is increasingly extensive.Thermal printing head (thermal print head, TPH) is the vitals of thermal printer.Thermal printing head is made up of row's heating element heater usually.These elements all have identical resistance, and these element arrangements are fine and close, from 200dpi to 600dpi not etc.These elements, by can very fast heat production during certain electric current, form high temperature.When heat-sensitive paper touches these heater elements, will there is chemical change in the thermo-responsive coating of paper surface, reveal color.
The slurry that the thin coat of metal on the substrate of traditional thick-film thermal print head generally adopts high temperature sintering to contain the noble metals such as gold, silver makes, and therefore material cost remains high, and the defect that thin metal film layer manufacturing process is formed is difficult to control.
Therefore, be necessary the thermal printer proposing a kind of thermal printing head and apply this thermal printing head, thus reduce costs and solve some problems existed in prior art.
Utility model content
According to an aspect of the present utility model, provide a kind of thermal printing head, it comprises:
Substrate;
Accumulation of heat glaze layer, it is formed on the substrate;
Common bus and diverging electrodes, described common bus and described diverging electrodes are all formed on described accumulation of heat glaze layer, and one end of described diverging electrodes is connected to described common bus, described common bus and described diverging electrodes are that the precious metal film layer made by thick-film technique is formed;
Protection glaze layer, it covers a part for described diverging electrodes, only exposes the end away from described common bus of described diverging electrodes, and described protection glaze layer also covers the part of the close described diverging electrodes of described common bus; And
Conducting wire, it to be formed on described accumulation of heat glaze layer and to be connected to the end of exposing described in described diverging electrodes, and described conducting wire is formed by base metal.
Preferably, described diverging electrodes is formed by gold, and described common bus is formed by silver.
Preferably, described thermal printing head also comprises: heating resistor, and it to be formed on described accumulation of heat glaze layer and across on described diverging electrodes, and is positioned under described protection glaze layer.
Preferably, described thermal printing head also comprises: dielectric layer, and it covers the region except presumptive area on described accumulation of heat glaze layer and covers described conducting wire, and described presumptive area comprises the contact of region and the external lead wire treating that nation is fixed.
Preferably, described conducting wire is the conducting wire that the base metal rete adopting vacuum coating, plated film or solutions method to be coated with is formed.
Preferably, the thickness of described base metal rete is 0.4 μm-4 μm.
Preferably, the thickness of described accumulation of heat glaze layer is 50 μm-100 μm, and the thickness of described precious metal film layer is 0.3 μm-3 μm.
Preferably, described thermal printing head also comprises control chip, and described control chip is connected to described conducting wire by nation's line.
Preferably, described heating resistor is for containing ruthenium resistance.
According to another aspect of the present utility model, also provide a kind of thermal printer, it comprises any one thermal printing head as above.
The thermal printing head that the utility model provides, the layer of precious metal utilizing the resistant to elevated temperatures thick-film technique of energy to make makes diverging electrodes and common bus etc., and adopt base metal to make conducting wire, therefore significantly reduce the consumption of noble metal (such as gold, silver), reduce the cost of manufacture of thermal printing head.
In utility model content, introduce the concept of a series of reduced form, this will further describe in detailed description of the invention part.The utility model content part does not also mean that the key feature and essential features that will attempt to limit technical scheme required for protection, does not more mean that the protection domain attempting to determine technical scheme required for protection.
Below in conjunction with accompanying drawing, describe advantage of the present utility model and feature in detail.
Accompanying drawing explanation
Following accompanying drawing of the present utility model in this as a part of the present utility model for understanding the utility model.Shown in the drawings of embodiment of the present utility model and description thereof, be used for explaining principle of the present utility model.In the accompanying drawings,
Fig. 1 is the removed schematic top plan view in local of the thermal printing head according to the utility model embodiment; And
Fig. 2 for along Fig. 1 center line A-A the partial cutaway schematic of thermal printing head of cutting.
Detailed description of the invention
In the following description, a large amount of details is provided the utility model can be understood up hill and dale.But those skilled in the art can understand, following description only relates to preferred embodiment of the present utility model, and the utility model can be implemented without the need to one or more such details.In addition, in order to avoid obscuring with the utility model, technical characteristics more well known in the art are not described.
The utility model provides a kind of thermal printing head.Fig. 1 is the removed schematic top plan view in local of the thermal printing head according to the utility model embodiment; Fig. 2 for along Fig. 1 center line A-A the partial cutaway schematic of thermal printing head of cutting.As shown in Figure 1-2, this thermal printing head comprises substrate 100, accumulation of heat glaze layer 110, diverging electrodes (comprising 120A and 120B), common bus 130, protection glaze layer 140 and conducting wire 160.
Substrate 100 adopts the resistant to elevated temperatures insulating materials comprising pottery to make usually.Pottery comprises aluminium oxide ceramics etc.In FIG, because substrate 100 covered by accumulation of heat glaze layer 110, therefore not shown.Accumulation of heat glaze layer 110 mainly adopts glass material to make, for improving the heat storage performance of thermal printing head.Accumulation of heat glaze layer 110 can be use thick-film technique or thin-film technique to be formed on substrate.Exemplarily, high-temperature glaze can be printed on the substrate 110 of pottery, then through high temperature sintering, to form accumulation of heat glaze layer 110.Typically, the thickness of accumulation of heat glaze layer 110 can be 50 μm-100 μm.Typically, sintering temperature can be 1000 DEG C-1400 DEG C.For convenience of description, can by the Region dividing on accumulation of heat glaze layer 110 for mainly to comprise electrode zone M and wiring area N.Electrode zone M is mainly used in forming diverging electrodes.Wiring area N is mainly used in forming conducting wire 160.In addition, control chip 170 and nation's line 180 are also formed in wiring area N usually.Common bus 130 is arranged on accumulation of heat glaze layer 110 according to predetermined pattern.
Diverging electrodes is formed on accumulation of heat glaze layer 110 and its one end is connected to common bus 130, and the other end is connected to conducting wire 160.Particularly, diverging electrodes comprises public electrode 120A and absolute electrode 120B.Public electrode 120A is that comb teeth-shaped extends from common bus 130, and is connected with common bus 130.Multiple absolute electrode 120B mutually insulated, and with public electrode 120A interlaced arrangement.The end 121 away from common bus 130 of absolute electrode 120B is electrically connected with conducting wire 160.Preferably, diverging electrodes and common bus 130 are all that the precious metal film layer made by thick-film technique is formed.Noble metal mainly refers to 8 kinds of metals such as gold, silver and platinum group metal (ruthenium, rhodium, palladium, osmium, iridium, platinum).Particularly, the formation method of diverging electrodes comprises: on the respective regions of accumulation of heat glaze layer, printing is containing the slurry of gold, to make resistant to elevated temperatures conductive film layer; Then, sinter to form precious metal film layer to the slurry containing gold, preferably, the thickness of the precious metal film layer fired can be 0.3 μm-3 μm; Finally, due to printing precision and the mobility of slurry, also need to adopt photoetching process to etch above-mentioned rete, to form the diverging electrodes of gold system.
This thermal printing head also comprises heating resistor 140.Heating resistor 140 is formed on accumulation of heat glaze layer and across on diverging electrodes, therefore a part for heating resistor 140 is formed on diverging electrodes, and another part is formed on the heating glaze layer 110 between diverging electrodes.Thus, heating resistor 140 is separated into multiple small resistor side by side by diverging electrodes.Heating resistor 140 can be made by the resistance slurry (such as ruthenium-oxide etc.) of printing-sintering containing ruthenium.Heating resistor 140 can still use traditional thick-film technique to make.Namely, be produced on diverging electrodes through high-sintering process, sintering temperature is up to more than 800 DEG C.Therefore, preferably, the diverging electrodes be connected with heating resistor 140 adopts and resistant to elevated temperatures thick-film technique can make gold or silvering.Further preferably, diverging electrodes directly contacts with heating resistor 140, and therefore diverging electrodes is formed by gold, and common bus 130 is formed by silver.Heating resistor 140 to be made and common bus 130 is formed by silver by containing ruthenium resistance, and both can be made sinter together, to reduce energy resource consumption, saving process costs.Particularly, can print respectively containing the slurry of ruthenium and the slurry of argentiferous on the respective regions of accumulation of heat glaze layer 110; Then, sinter containing the slurry of ruthenium and the slurry of argentiferous, to form the common bus 130 of heating resistor 140 and silvery respectively, wherein sintering temperature can be 800-850 DEG C simultaneously.
Protection glaze layer 150 covers in a part for diverging electrodes and a part for common bus.Protection glaze layer can make by adopting traditional thick membrane process printing-sintering high-temperature glaze.Particularly; protection glaze layer 150 covers in the part except end 121 (namely away from the end of common bus 130) of diverging electrodes, and covers in the part (being the common bus on the left of diverging electrodes in Fig. 1) of close diverging electrodes of common bus 130.In addition, glaze layer 150 is protected also to cover on heating resistor 140.The end 121 that the protected glaze layer of diverging electrodes exposes is used for being connected with conducting wire 160.
Conducting wire 160 to be formed on accumulation of heat glaze layer 110 and to be connected to the end 121 (such as overlapping with end 121) away from common bus 130 of diverging electrodes.Conducting wire 160 is formed on the N of wiring area, and in order to significantly reduce the consumption of noble metal (such as gold, silver), conducting wire 160 is formed by base metal.Base metal comprises aluminium, copper, nickel, iron, steel, lead, zinc, tin, tungsten etc.Preferably, conducting wire 160 is that the base metal film adopting vacuum coating, plated film or solutions method to be coated with is formed.In the preferred embodiment, use the vacuum coating of base metal because most of conducting wire changes into, the mode of plated film or solutions makes, significantly can reduce the consumption of noble metal gold, silver on the one hand, also improve thickness, compactness, the uniformity of base metal rete on the other hand, and then reduce the probability that in base metal rete, defect produces.
In addition, this thermal printing head also comprises dielectric layer 190.This dielectric layer 190 covers the region except presumptive area on accumulation of heat glaze layer 110 and covers conducting wire 160.Wherein presumptive area comprises the contact of region (region of corresponding nation line 180) and the external lead wire treating that nation is fixed.Exemplarily, the production method of dielectric layer 190 can comprise printing-sintering low temperature glass or vacuum is coated with dielectric material to be formed.
In addition, this thermal printing head also comprises control chip 170, and control chip 170 is connected to conducting wire 160 by nation's line 180.The nation substantially identical with the manufacture craft of traditional thick-film thermal print head can be adopted to determine packaged chip technique, encapsulate control chip 170.For simplicity, will not describe in further detail it herein.
The utility model also provides a kind of thermal printer, and its application comprises any one thermal printing head as above.The miscellaneous part that this thermal printer comprises can be known from prior art, therefore will be not described in detail herein.
The thermal printing head that the utility model provides and manufacture craft thereof, the layer of precious metal utilizing the resistant to elevated temperatures thick-film technique of energy to make makes diverging electrodes and common bus etc., and adopt base metal to make conducting wire, therefore significantly reduce the consumption of noble metal (such as gold, silver), reduce the cost of manufacture of thermal printing head.
The utility model is illustrated by above-described embodiment, but should be understood that, above-described embodiment just for the object of illustrating and illustrate, and is not intended to the utility model to be limited in described scope of embodiments.In addition it will be understood by those skilled in the art that; the utility model is not limited to above-described embodiment; more kinds of amendments and upgrade version can also be made, within these amendments and upgrade version all drop on the utility model scope required for protection according to guidance of the present utility model.Protection domain of the present utility model defined by the appended claims and equivalent scope thereof.
Claims (10)
1. a thermal printing head, is characterized in that, it comprises:
Substrate;
Accumulation of heat glaze layer, it is formed on the substrate;
Common bus and diverging electrodes, described common bus and described diverging electrodes are all formed on described accumulation of heat glaze layer, and one end of described diverging electrodes is connected to described common bus, described common bus and described diverging electrodes are that the precious metal film layer made by thick-film technique is formed;
Protection glaze layer, it covers a part for described diverging electrodes, only exposes the end away from described common bus of described diverging electrodes, and described protection glaze layer also covers the part of the close described diverging electrodes of described common bus; And
Conducting wire, it to be formed on described accumulation of heat glaze layer and to be connected to the end that described diverging electrodes exposes, and described conducting wire is formed by base metal.
2. thermal printing head as claimed in claim 1, it is characterized in that, described diverging electrodes is formed by gold, and described common bus is formed by silver.
3. thermal printing head as claimed in claim 1, it is characterized in that, described thermal printing head also comprises:
Heating resistor, it is formed on described accumulation of heat glaze layer, and across on described diverging electrodes, and be positioned under described protection glaze layer.
4. thermal printing head as claimed in claim 3, is characterized in that, described heating resistor is for containing ruthenium resistance.
5. thermal printing head as claimed in claim 1, it is characterized in that, described thermal printing head also comprises:
Dielectric layer, it covers the region except presumptive area on described accumulation of heat glaze layer and covers described conducting wire, and described presumptive area comprises the contact of region and the external lead wire treating that nation is fixed.
6. thermal printing head as claimed in claim 1, is characterized in that, described conducting wire is the conducting wire that the base metal rete adopting vacuum coating, plated film or solutions method to be coated with is formed.
7. thermal printing head as claimed in claim 6, it is characterized in that, the thickness of described base metal rete is 0.4 μm-4 μm.
8. thermal printing head as claimed in claim 1, it is characterized in that, the thickness of described accumulation of heat glaze layer is 50 μm-100 μm, and the thickness of described precious metal film layer is 0.3 μm-3 μm.
9. thermal printing head as claimed in claim 1, it is characterized in that, described thermal printing head also comprises control chip, and described control chip is connected to described conducting wire by nation's line.
10. a thermal printer, is characterized in that, it comprises the thermal printing head according to any one of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520388340.6U CN204701284U (en) | 2015-06-08 | 2015-06-08 | Thermal printing head and apply the thermal printer of this thermal printing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520388340.6U CN204701284U (en) | 2015-06-08 | 2015-06-08 | Thermal printing head and apply the thermal printer of this thermal printing head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204701284U true CN204701284U (en) | 2015-10-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520388340.6U Expired - Fee Related CN204701284U (en) | 2015-06-08 | 2015-06-08 | Thermal printing head and apply the thermal printer of this thermal printing head |
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| CN (1) | CN204701284U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109263295A (en) * | 2018-08-31 | 2019-01-25 | 潮州三环（集团）股份有限公司 | Thermal printing head and preparation method thereof |
-
2015
- 2015-06-08 CN CN201520388340.6U patent/CN204701284U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109263295A (en) * | 2018-08-31 | 2019-01-25 | 潮州三环（集团）股份有限公司 | Thermal printing head and preparation method thereof |
| CN109263295B (en) * | 2018-08-31 | 2020-04-10 | 潮州三环（集团）股份有限公司 | Thermal printing head and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151014 Termination date: 20180608 |