CN104859312A - Thermosensitive printing head and manufacturing method therefor - Google Patents
Thermosensitive printing head and manufacturing method therefor Download PDFInfo
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- CN104859312A CN104859312A CN201510308251.0A CN201510308251A CN104859312A CN 104859312 A CN104859312 A CN 104859312A CN 201510308251 A CN201510308251 A CN 201510308251A CN 104859312 A CN104859312 A CN 104859312A
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- glaze layer
- common bus
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Abstract
The invention discloses a thermosensitive printing head and a manufacturing method therefor. The method comprises the steps: providing a substrate, and forming a thermal storage enamel layer on the substrate; forming a common bus ad a forked electrode on the thermal storage enamel layer, wherein one end of the forked electrode is connected to a forked electrode of the common bus, and the forked electrode and the common bus are made of precious metal; forming a protection enamel layer which covers a part of the forked electrode, wherein only one end part, far from the common bus, of the forked electrode is exposed, and the protection enamel layer also covers a part, close to the forked electrode, of the common bus; forming a conductive line on the thermal storage enamel layer, wherein the conductive line is connected to the exposed end part of the forked electrode and is made of base metal. The method provided by the method greatly reduce the consumption of precious metal (such as gold and silver), and reduces the manufacture cost of the thermosensitive printing head.
Description
Technical field
The present invention relates to printer field, particularly, relate to a kind of thermal printing head and preparation method thereof.
Background technology
The use of thermal printer is increasingly extensive.Thermal printing head (thermal print head, TPH) is the vitals of thermal printer.Thermal printing head is made up of row's heating element heater usually.These elements all have identical resistance, and these element lines are fine and close, from 200dpi to 600dpi not etc.These elements, by can very fast heat production during certain electric current, form high temperature.When heat-sensitive paper touches the element of these heatings, will there is chemical change in the thermo-responsive coating of paper surface, reveal color.
The slurry that the thin coat of metal on the substrate of traditional thick-film thermal print head generally adopts high temperature sintering to contain the noble metals such as gold, silver makes, and material cost remains high, and the defect that thin metal film layer manufacturing process is formed is difficult to control.
Therefore, be necessary to propose a kind of thermal printing head and preparation method thereof, thus reduce costs and solve some problems existed in prior art.
Summary of the invention
According to an aspect of the present invention, provide a kind of preparation method of thermal printing head, it comprises:
Substrate is provided, forms accumulation of heat glaze layer on the substrate;
Described accumulation of heat glaze layer forms common bus and diverging electrodes, and one end of described diverging electrodes is connected to described common bus, and wherein said diverging electrodes and described common bus are formed by noble metal;
Form protection glaze layer, described protection glaze layer covers a part for described diverging electrodes, only exposes the end away from described common bus of described diverging electrodes, and described protection glaze layer also covers the part of the close described diverging electrodes of described common bus; And
Described accumulation of heat glaze layer forms conducting wire, and described conducting wire is connected to the end of exposing of described diverging electrodes, and described conducting wire is formed by base metal.
Preferably, the formation method of described diverging electrodes comprises: on the respective regions of described accumulation of heat glaze layer, printing is containing the slurry of gold; Sinter to form rete to the described slurry containing gold; Photoetching process is adopted to etch described rete, to form the diverging electrodes of gold system.
Preferably, the thickness of described rete is 0.3 μm-3 μm.
Preferably, be included on described accumulation of heat glaze layer and formed across the heating resistor on described diverging electrodes before the described protection glaze layer of formation.
Preferably, the formation method of described common bus and described heating resistor comprises: on the respective regions of described accumulation of heat glaze layer, printing contains the slurry of ruthenium and the slurry of argentiferous respectively; Sinter, to form the common bus of described heating resistor and silvery respectively containing the slurry of ruthenium and the slurry of described argentiferous described simultaneously.
Preferably, the formation method of described conducting wire comprises: adopt vacuum coating, plated film or solutions method to form base metal rete on described accumulation of heat glaze layer; And adopt photoetching process to etch described base metal rete, to form described conducting wire.
Preferably, the thickness of described base metal rete is 0.4 μm-4 μm.
Preferably, described preparation method also comprises after the described conducting wire of formation: hide the presumptive area on described accumulation of heat glaze layer, described presumptive area comprises the contact of region and the external lead wire treating that nation is fixed; And formation dielectric layer, described dielectric layer covers the region except described presumptive area on described accumulation of heat glaze layer and covers described conducting wire.
According to a further aspect in the invention, also provide a kind of thermal printing head, it comprises:
Substrate;
Accumulation of heat glaze layer, it is formed on the substrate;
Common bus and diverging electrodes, described common bus and described diverging electrodes are all formed on described accumulation of heat glaze layer, and one end of described diverging electrodes is connected to described common bus, and described common bus and described diverging electrodes are formed by noble metal;
Protection glaze layer, it covers a part for described diverging electrodes, only exposes the end away from described common bus of described diverging electrodes, and described protection glaze layer also covers the part of the close described diverging electrodes of described common bus; And
Conducting wire, it to be formed on described accumulation of heat glaze layer and to be connected to the end that described diverging electrodes exposes, and described conducting wire is formed by base metal.
Preferably, described diverging electrodes is formed by gold, and described common bus is formed by silver.
Preferably, described thermal printing head also comprises: heating resistor, and it to be formed on described accumulation of heat glaze layer and across on described diverging electrodes, and is positioned under described protection glaze layer; Dielectric layer, it covers the region except presumptive area on described accumulation of heat glaze layer and covers described conducting wire, and described presumptive area comprises the contact of region and the external lead wire treating that nation is fixed.
Thermal printing head provided by the invention and manufacture craft thereof, the layer of precious metal utilizing the resistant to elevated temperatures thick-film technique of energy to make makes diverging electrodes and common bus etc., and adopt base metal to make conducting wire, therefore significantly reduce the consumption of noble metal (such as gold, silver), reduce the cost of manufacture of thermal printing head.
In summary of the invention, introduce the concept of a series of reduced form, this will further describe in detailed description of the invention part.Content part of the present invention does not also mean that the key feature and essential features that will attempt to limit technical scheme required for protection, does not more mean that the protection domain attempting to determine technical scheme required for protection.
Below in conjunction with accompanying drawing, describe advantages and features of the invention in detail.
Accompanying drawing explanation
Following accompanying drawing of the present invention in this as a part of the present invention for understanding the present invention.Shown in the drawings of embodiments of the present invention and description thereof, be used for explaining principle of the present invention.In the accompanying drawings,
Fig. 1 is the removed schematic top plan view in local of thermal printing head according to an embodiment of the invention;
Fig. 2 is the Making programme figure of thermal printing head according to an embodiment of the invention; And
Fig. 3-8 for make thermal printing head according to one embodiment of the invention process in the partial cutaway schematic of product that obtains of each step.
Detailed description of the invention
In the following description, a large amount of details is provided the present invention can be understood up hill and dale.But those skilled in the art can understand, following description only relates to preferred embodiment of the present invention, and the present invention can be implemented without the need to one or more such details.In addition, in order to avoid obscuring with the present invention, technical characteristics more well known in the art are not described.
The invention provides a kind of thermal printing head.As shown in Figure 1, this thermal printing head comprises substrate (not shown), accumulation of heat glaze layer 110, diverging electrodes (comprising 120A and 120B), common bus 130, protection glaze layer 140 and conducting wire 160.
Substrate adopts the resistant to elevated temperatures insulating materials comprising pottery to make usually.Pottery comprises aluminium oxide ceramics etc.In FIG, because substrate covered by accumulation of heat glaze layer 110, therefore not shown.Accumulation of heat glaze layer 110 mainly adopts glass material to make, for improving the heat storage performance of thermal printing head.Accumulation of heat glaze layer 110 can be use thick-film technique or thin-film technique to be formed on substrate.For convenience of description, can by the Region dividing on accumulation of heat glaze layer 110 for mainly to comprise electrode zone M and wiring area N.Electrode zone M is mainly used in forming diverging electrodes.Wiring area N is mainly used in forming conducting wire 160.In addition, control chip 170 and nation's line 180 are also formed in wiring area N usually.Common bus 130 is arranged on accumulation of heat glaze layer 110 according to predetermined pattern.
Diverging electrodes is formed on accumulation of heat glaze layer 110 and one end is electrically connected to common bus 130, and the other end is electrically connected to conducting wire 160.Particularly, diverging electrodes comprises public electrode 120A and absolute electrode 120B.Public electrode 120A is that comb teeth-shaped extends from common bus 130, and is electrically connected with common bus 130.Multiple absolute electrode 120B mutually insulated, arranges alternately with public electrode 120A.The end 121 away from common bus 130 of absolute electrode 120B is electrically connected with conducting wire 160.Preferably, diverging electrodes and common bus 130 are formed by noble metal.Noble metal mainly refers to 8 kinds of metals such as gold, silver and platinum group metal (ruthenium, rhodium, palladium, osmium, iridium, platinum).
This thermal printing head also comprises heating resistor 140.Heating resistor 140 is formed on accumulation of heat glaze layer and across on diverging electrodes, therefore a part for heating resistor 140 is formed on diverging electrodes, and another part is formed on the heating glaze layer 110 between diverging electrodes.Thus, heating resistor 140 is separated into multiple small resistor side by side by diverging electrodes.Heating resistor 140 can be made by the resistance slurry (such as ruthenium-oxide etc.) of printing-sintering containing ruthenium.Heating resistor 140 can still use traditional thick-film technique to make.Namely, be produced on diverging electrodes through high-sintering process, sintering temperature is up to more than 800 DEG C.Therefore, preferably, the diverging electrodes be connected with heating resistor 140 adopts and resistant to elevated temperatures thick-film technique can make gold or silvering.Further preferably, diverging electrodes is owing to directly contacting with heating resistor 140, and therefore diverging electrodes is formed by gold, and common bus 130 is formed by silver.
Protection glaze layer (not shown) covers in a part for diverging electrodes and a part for common bus.Protection glaze layer can make by adopting traditional thick membrane process printing-sintering high-temperature glaze.Particularly; protection glaze layer covers in the part except end 121 (namely away from the end of common bus 130) of diverging electrodes, and covers in the part (being the common bus on the left of diverging electrodes in Fig. 1) of close diverging electrodes of common bus 130.In addition, glaze layer is protected also to cover on heating resistor 140.The end 121 that the protected glaze layer of diverging electrodes exposes is used for being connected with conducting wire 160.
Conducting wire 160 to be formed on accumulation of heat glaze layer 110 and to be connected to the end 121 (namely overlapping to be energized with end 121) away from common bus 130 of diverging electrodes.Conducting wire 160 is formed on the N of wiring area, and in order to significantly reduce the consumption of noble metal (such as gold, silver), conducting wire 160 is formed by base metal.Base metal comprises aluminium, copper, nickel, iron, steel, lead, zinc, tin, tungsten etc.
In addition, this thermal printing head also comprises dielectric layer.This dielectric layer covers the region except presumptive area on accumulation of heat glaze layer and covers conducting wire.Wherein presumptive area comprises the contact of region (region of corresponding nation line 180) and the external lead wire treating that nation is fixed.
According to a further aspect in the invention, a kind of preparation method of thermal printing head is also provided.Fig. 2 is the Making programme figure of thermal printing head according to an embodiment of the invention; And Fig. 3-8 for make thermal printing head according to one embodiment of the invention process in the partial cutaway schematic of product that obtains of each step, wherein for simplicity, Fig. 3-8 only carries out cutting acquisition along the line A-A in Fig. 1.Below in conjunction with Fig. 2-8, this preparation method is described in detail.
Perform step 201, see Fig. 3, provide substrate 110, substrate 110 is formed accumulation of heat glaze layer 110.Exemplarily, high-temperature glaze can be printed on the substrate 110 of pottery, then through high temperature sintering, to form accumulation of heat glaze layer 110.Typically, the thickness of accumulation of heat glaze layer 110 can be 50 μm-100 μm.Typically, sintering temperature can be 1000 DEG C-1400 DEG C.
Perform step 202, simultaneously see Fig. 1 and Fig. 4, accumulation of heat glaze layer 110 forms common bus 130 and diverging electrodes (illustrate only diverging electrodes in Fig. 4 and only 120A or 120B can be shown because Fig. 4 is sectional view).One end of diverging electrodes is connected to common bus 130.Diverging electrodes comprises and is arranged on its end 121 away from common bus, and this end 121 is for being connected with the conducting wire formed subsequently.Particularly, in the embodiment shown in fig. 1, the end 121 away from common bus of diverging electrodes is the end away from common bus of absolute electrode 120B.Wherein, diverging electrodes and common bus are formed by noble metal.
According to a preferred embodiment of the present invention, the formation method of diverging electrodes comprises:
First, on the respective regions of accumulation of heat glaze layer, printing is containing the slurry of gold, to make resistant to elevated temperatures conductive film layer.Those skilled in the art will appreciate that mentioned respective regions corresponds to the region that will form diverging electrodes here.
Then, sinter to form rete to the slurry containing gold.Exemplarily, sintering temperature can be 700-900 DEG C.Sintering time can be 30-120min.The thickness of the rete fired can be 0.3 μm-3 μm.
Finally, due to printing precision and the mobility of slurry, also need to adopt photoetching process to etch above-mentioned rete, to form the diverging electrodes of gold system.Exemplarily, after above-mentioned steps completes gold plate, cleaning is done to coating.Coating is evenly coated with last layer positive photoresist, and photoresist thickness is 0.3 μm-5 μm.After being dried by photoresist, use Lithographic template to aim at exposure, then use aqueous slkali to carry out development treatment, then etch with Wagner's reagent or wang aqueous solution, to produce the diverging electrodes with predetermined pattern.Being appreciated that when selecting other noble metals to form diverging electrodes, need adjusting etching solution.
According to one embodiment of present invention, the respective regions that the preparation method of common bus is included in accumulation of heat glaze layer prints the slurry of argentiferous, those skilled in the art will appreciate that mentioned respective regions corresponds to the region that will form common bus here; Sinter the slurry of argentiferous, to form the common bus of silvery, wherein sintering temperature is 800-850 DEG C.It should be noted that, because the sintering temperature of diverging electrodes is higher, the therefore best making first completing diverging electrodes before making common bus.
Perform step 203, simultaneously see Fig. 1 and Fig. 5, accumulation of heat glaze layer 110 is formed across the heating resistor 140 on diverging electrodes 120A and 120B.In one embodiment of the invention, heating resistor 140 is also adopt the mode of printing-sintering to complete.Therefore, further preferably, suitably can select the raw material forming heating resistor 140 and common bus, make it sinter together with common bus, to reduce energy resource consumption, to save process costs.
In accordance with a preferred embodiment of the present invention, the formation method of common bus and heating resistor comprises:
First, on the respective regions of accumulation of heat glaze layer, printing contains the slurry of ruthenium and the slurry of argentiferous respectively.Here mentioned respective regions corresponds to the region for the formation of heating resistor 140 and common bus.Containing the slurry of ruthenium for the formation of heating resistor 140.The slurry of argentiferous is for the formation of common bus.
Then, sinter containing the slurry of ruthenium and the slurry of argentiferous, to form the common bus of heating resistor 140 and silvery respectively, wherein sintering temperature can be 800-850 DEG C simultaneously.Only just to complete heating resistor and common bus through a step sintering process in the preferred embodiment.
Perform step 204, simultaneously see Fig. 1 and Fig. 6, form protection glaze layer 150.Protection glaze layer 150 covers the part (being namely the common bus on the left of diverging electrodes in Fig. 1) of the part except end 121 of diverging electrodes 120A and 120B and the close diverging electrodes of common bus.Exemplarily, on the region needing formation protection glaze layer, printing can protect glaze, then sinter, to form protection glaze layer 150.Typically, sintering temperature can be 700 DEG C-900 DEG C.
Perform step 205, simultaneously see Fig. 1 and Fig. 7, accumulation of heat glaze layer 110 forms conducting wire 160, and this conducting wire 160 is connected to the end 121 of diverging electrodes.Conducting wire 160 is formed by base metal, significantly to reduce the consumption of noble metal.
In accordance with a preferred embodiment of the present invention, the formation method of conducting wire 160 comprises:
First, vacuum coating, plated film or solutions method is adopted to form base metal rete on accumulation of heat glaze layer 110.If necessary, when forming base metal rete, can hide not needing the region of film forming (such as treating the contact etc. of the region that nation is fixed and external lead wire).Exemplarily, the mode of covering is included in this region and coats organic coating covering or the covering of use fixture.Typically, the thickness of base metal rete can be 0.4 μm-4 μm.Certainly, also can not hide these regions, the base metal rete on these regions can be removed in the etching process of description below.
Then, photoetching process is adopted to etch this base metal rete, to form conducting wire 160.Conducting wire 160 is electrically connected with diverging electrodes, can not have short circuit and open circuit.Exemplarily, after above-mentioned steps completes base metal rete, cleaning is done to base metal rete.Then, base metal rete is evenly coated with last layer positive photoresist, and photoresist thickness is 0.3 μm-5 μm.After being dried by photoresist, Lithographic template is used to aim at exposure.Use aqueous slkali to do to develop, make of Wagner's reagent or wang aqueous solution and corrode, produce the conducting wire 160 with predetermined pattern.This conducting wire 160 needs to aim at photoetching with diverging electrodes, preferably, and deviation of the alignment < 15 μm.
In the preferred embodiment, due to the manufacture craft of thermal printing head that the present invention relates to, major part conducting wire changes into and uses the vacuum coating of base metal, the mode of plated film or solutions makes, significantly can reduce the consumption of noble metal gold, silver on the one hand, also improve thickness, compactness, the uniformity of base metal rete on the other hand, and then reduce the probability that in base metal rete, defect produces.
In addition, preparation method provided by the invention also comprises step 206 after formation conducting wire 160, and simultaneously see Fig. 1 and Fig. 8, form dielectric layer 190, dielectric layer 190 mainly plays encapsulating effect to conducting wire 160.Particularly, hide the presumptive area on accumulation of heat glaze layer 110, this presumptive area comprises the contact of region and the external lead wire treating that nation is fixed; Then, form dielectric layer 190, this dielectric layer 190 covers the region except presumptive area on accumulation of heat glaze layer 110 and covers conducting wire 160.Exemplarily, the production method of dielectric layer 190 can comprise printing-sintering low temperature glass or vacuum is coated with dielectric material to be formed.
Next, the nation substantially identical with the manufacture craft of traditional thick-film thermal print head can be adopted to determine packaged chip technique, encapsulate control chip 170.Control chip 170 is connected to conducting wire 160 by nation's line 180.For simplicity, will not describe in further detail it herein.
Thermal printing head provided by the invention and manufacture craft thereof, the layer of precious metal utilizing the resistant to elevated temperatures thick-film technique of energy to make makes diverging electrodes and common bus etc., and adopt base metal to make conducting wire, therefore significantly reduce the consumption of noble metal (such as gold, silver), reduce the cost of manufacture of thermal printing head.
The present invention is illustrated by above-described embodiment, but should be understood that, above-described embodiment just for the object of illustrating and illustrate, and is not intended to the present invention to be limited in described scope of embodiments.In addition it will be appreciated by persons skilled in the art that the present invention is not limited to above-described embodiment, more kinds of modification and upgrade version can also be made according to guidance of the present invention, within these amendments and upgrade version all drop on the present invention's scope required for protection.Protection scope of the present invention defined by the appended claims and equivalent scope thereof.
Claims (11)
1. a preparation method for thermal printing head, it comprises:
Substrate is provided, forms accumulation of heat glaze layer on the substrate;
Described accumulation of heat glaze layer forms common bus and diverging electrodes, and one end of described diverging electrodes is connected to described common bus, and wherein said diverging electrodes and described common bus are formed by noble metal;
Form protection glaze layer, described protection glaze layer covers a part for described diverging electrodes, only exposes the end away from described common bus of described diverging electrodes, and described protection glaze layer also covers the part of the close described diverging electrodes of described common bus; And
Described accumulation of heat glaze layer forms conducting wire, and described conducting wire is connected to the end of exposing of described diverging electrodes, and described conducting wire is formed by base metal.
2. preparation method as claimed in claim 1, it is characterized in that, the formation method of described diverging electrodes comprises:
On the respective regions of described accumulation of heat glaze layer, printing is containing the slurry of gold;
Sinter to form rete to the described slurry containing gold;
Photoetching process is adopted to etch described rete, to form the diverging electrodes of gold system.
3. preparation method as claimed in claim 2, it is characterized in that, the thickness of described rete is 0.3 μm-3 μm.
4. preparation method as claimed in claim 1, is characterized in that, was included on described accumulation of heat glaze layer and was formed across the heating resistor on described diverging electrodes before the described protection glaze layer of formation.
5. preparation method as claimed in claim 4, it is characterized in that, the formation method of described common bus and described heating resistor comprises:
On the respective regions of described accumulation of heat glaze layer, printing contains the slurry of ruthenium and the slurry of argentiferous respectively;
Sinter, to form the common bus of described heating resistor and silvery respectively containing the slurry of ruthenium and the slurry of described argentiferous described simultaneously.
6. preparation method as claimed in claim 1, it is characterized in that, the formation method of described conducting wire comprises:
Vacuum coating, plated film or solutions method is adopted to form base metal rete on described accumulation of heat glaze layer; And
Photoetching process is adopted to etch described base metal rete, to form described conducting wire.
7. preparation method as claimed in claim 6, it is characterized in that, the thickness of described base metal rete is 0.4 μm-4 μm.
8. preparation method as claimed in claim 1, is characterized in that, described preparation method also comprises after the described conducting wire of formation:
Hide the presumptive area on described accumulation of heat glaze layer, described presumptive area comprises the contact of region and the external lead wire treating that nation is fixed; And
Form dielectric layer, described dielectric layer covers the region except described presumptive area on described accumulation of heat glaze layer and covers described conducting wire.
9. a thermal printing head, it comprises:
Substrate;
Accumulation of heat glaze layer, it is formed on the substrate;
Common bus and diverging electrodes, described common bus and described diverging electrodes are all formed on described accumulation of heat glaze layer, and one end of described diverging electrodes is connected to described common bus, and described common bus and described diverging electrodes are formed by noble metal;
Protection glaze layer, it covers a part for described diverging electrodes, only exposes the end away from described common bus of described diverging electrodes, and described protection glaze layer also covers the part of the close described diverging electrodes of described common bus; And
Conducting wire, it to be formed on described accumulation of heat glaze layer and to be connected to the end that described diverging electrodes exposes, and described conducting wire is formed by base metal.
10. thermal printing head as claimed in claim 9, it is characterized in that, described diverging electrodes is formed by gold, and described common bus is formed by silver.
11. thermal printing heads as claimed in claim 9, it is characterized in that, described thermal printing head also comprises:
Heating resistor, it to be formed on described accumulation of heat glaze layer and across on described diverging electrodes, and is positioned under described protection glaze layer;
Dielectric layer, it covers the region except presumptive area on described accumulation of heat glaze layer and covers described conducting wire, and described presumptive area comprises the contact of region and the external lead wire treating that nation is fixed.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510308251.0A CN104859312A (en) | 2015-06-08 | 2015-06-08 | Thermosensitive printing head and manufacturing method therefor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510308251.0A CN104859312A (en) | 2015-06-08 | 2015-06-08 | Thermosensitive printing head and manufacturing method therefor |
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| CN107160862A (en) * | 2017-06-20 | 2017-09-15 | 山东华菱电子股份有限公司 | Thermal printing head heating base plate and its manufacture method |
| CN108025558A (en) * | 2015-09-28 | 2018-05-11 | 京瓷株式会社 | Thermal head and thermal printer |
| CN109572231A (en) * | 2018-11-16 | 2019-04-05 | 潮州三环（集团）股份有限公司 | Thermal printing head and preparation method thereof |
| CN111391515A (en) * | 2020-04-16 | 2020-07-10 | 山东华菱电子股份有限公司 | MO heating resistor body thermal-sensitive printing head substrate and manufacturing method |
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