CN111391515A - MO heating resistor body thermal-sensitive printing head substrate and manufacturing method - Google Patents
MO heating resistor body thermal-sensitive printing head substrate and manufacturing method Download PDFInfo
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- CN111391515A CN111391515A CN202010299052.9A CN202010299052A CN111391515A CN 111391515 A CN111391515 A CN 111391515A CN 202010299052 A CN202010299052 A CN 202010299052A CN 111391515 A CN111391515 A CN 111391515A
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- heating resistor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/33535—Substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33555—Structure of thermal heads characterised by type
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Abstract
The invention provides a thermal printing head substrate adopting an MO heating resistor and a manufacturing method, which solve the technical problems of uneven resistance value and poor printing effect of the MO heating resistor used for the existing heating substrate, and the thermal printing head substrate is characterized in that after a ground coat layer is formed, a metal mask etching process is combined to form a resistor forming area with an expected width, the most even part of a resistor slurry film is configured in the area by adopting screen printing or tracing, then the metal mask is etched by adopting an acid-base etching mode, the resistor slurry film layer attached to the surface of the metal mask is removed, the resistor slurry on the surface of the ground coat area does not chemically react with etching liquid, the resistor film layer in the most even area is reserved, a resistor film is formed by adopting a sintering mode, and the MO heating resistor with uniform resistance value is realized; the invention can be widely applied to the field of thermal printing.
Description
Technical Field
The invention relates to the field of thermal printing, in particular to a thermal printing head substrate adopting an MO heating resistor body and a manufacturing method thereof.
Background
The heating substrate for the thermal printing head adopts an MO (organic metal compound) heating resistor body, has the characteristics of high resolution of a thin-film thermal printing head and low cost of a thick-film thermal printing head, and is particularly suitable for occasions with high printing quality.
In order to solve the above disadvantages, a common method is to make the width of the MO heating resistor wide, select a region with a relatively uniform resistance value to be disposed in the central region of the common electrode and the individual electrode pair to form a heating region.
Disclosure of Invention
The invention aims at the technical problems of uneven resistance value and poor printing effect of an MO heating resistor body for the existing heating substrate, and provides a heating substrate for a thermal printing head and a manufacturing method thereof, wherein the heating substrate adopts MO (organic metal compound) resistor materials to realize uniform distribution of resistance values, and the obtained thermal printing head has the advantages of balanced heating substrate temperature, concentrated printing energy and high printing quality and low cost.
Therefore, the invention provides a method for manufacturing an MO heating resistor thermal printing head substrate, which comprises the following steps:
step 1: printing an amorphous glass material on the surface of an insulating substrate, and sintering to form a ground coat layer;
step 2: forming a metal mask layer on the bottom glaze layer and a part of the insulating substrate by adopting a mode of sputtering and evaporating a metal target material or screen printing and sintering organic metal slurry to prepare a first metalized substrate;
and step 3: carrying out a patterning process on the first metalized substrate by adopting a photoetching technology to form a first pattern at least comprising two metal mask patterns and a ground glaze region which is expected to form a resistor body and is exposed between the two metal masks;
and 4, step 4: printing or drawing required organic metal heating resistor slurry on the first graph, wherein the width of the printed or drawn graph is larger than that of a ground glaze area between the two metal masks;
and 5: removing the metal mask layer on the first metalized substrate and the resistive film of the residual part of the metal mask layer through a wet etching process, and forming a required MO heating resistor slurry pattern on the ground coat layer;
step 6: sintering the resistor paste pattern substrate obtained in the step 5 to prepare the needed MO heating element;
and 7: printing and sintering organic metal slurry on the bottom glaze layer and the heating resistor body in the step 6 to form a metal film conductor layer to manufacture a second metalized substrate;
and 8: patterning the second metalized substrate by adopting a photoetching technology to form an expected common electrode, an expected individual electrode and a pad formed by extending the individual electrode;
and step 9: and printing the sintered glass slurry on the second metalized substrate except for the bonding pad to form a wear-resistant protective layer, thus preparing the heating substrate for the thermal printing head.
Preferably, in the step 4, the organometallic heating resistor slurry is prepared by at least one of organic compounds of noble metals ruthenium and iridium and at least one of organic compounds of base metals titanium and zirconium, wherein the molar ratio of ruthenium and iridium metal atoms to titanium and zirconium base metal atoms is 10: 2-10: 10, mixing, wherein the mass ratio of ruthenium to iridium metal in the slurry is 1-5%, the organic solvent is at least one of terpineol, butyl carbitol acetate, isoborneol acetate and turpentine, and 5-10% of rosin or other water-insoluble organic resins are added.
Preferably, the thickness of the metal mask layer in step 2 is 0.5-10 μm, and the metal mask layer material includes a thin film of nickel, copper, molybdenum, gold, silver, aluminum, chromium, or a composite thin film or alloy thereof.
Preferably, the first pattern formed in step 3 at least comprises two metal masks along the main printing direction and an under-glaze region exposed between the two metal mask sections with the width of 10-300 μm.
Preferably, in the first pattern formed in step 3, the cross section of the metal mask in the ground glaze exposed region is in a right-angle or trapezoid structure with a wide top and a narrow bottom.
Preferably, the heating resistor paste printed or drawn in step 4 has a uniform thickness in the intermediate region disposed in the ground coat region of the first pattern, and has a thickness of 1 μm to 10 μm.
Preferably, the pattern width of the heating resistor paste printed or drawn in the step 4 is greater than the pattern width of the ground coat and not greater than the width of the metal mask area.
Preferably, the slurry for the organic metal heating resistor in step 4 is composed of a composition in which the etching solution in step 5 does not dissolve or react physically or chemically.
Preferably, the organic metal conductor paste in step 7 includes one of organic gold, organic silver and organic platinum paste.
The invention also provides an MO heating resistor thermal printing head substrate manufactured by the method, which comprises an insulating substrate, wherein a ground glaze layer is formed on the surface of the insulating substrate by printing and sintering, an MO heating resistor is formed in the middle area with uniform surface film thickness of the ground glaze layer, a metal film conductor layer is formed on the surfaces of the ground glaze layer and the MO heating resistor, a common electrode, an individual electrode and a bonding pad formed by extending the individual electrode are arranged on the surface of the metal film conductor layer, and a wear-resistant protective layer is formed on the surfaces of the common electrode, the individual electrode and the MO heating resistor except the bonding pad.
The method for manufacturing the thermal printing head has the advantages that the heating resistor is formed in the most uniform area of the film quality of the printed or drawn belt-shaped resistor, the deviation of the resistance value is small, namely the resistance value of the MO heating resistor is uniform, the heating temperature of the manufactured thermal printing head heating substrate is balanced, the printing energy is concentrated, and the thermal printing head with high printing quality and low cost is realized.
Drawings
FIG. 1 is a schematic cross-sectional view of a first metallized substrate according to example 1 of the present invention;
FIG. 2 is a schematic cross-sectional view of a substrate after a first pattern is formed according to embodiment 1 of the present invention;
fig. 3 is a schematic cross-sectional view of a substrate after printing or drawing a heating resistor in example 1 of the present invention;
fig. 4 is a schematic plan view of a heat-generating substrate for a thermal printhead having a metallized pattern according to embodiment 1 of the present invention;
FIG. 5 is a schematic cross-sectional view of a substrate after a desired heating resistor is formed by removing a metal mask in example 1 of the present invention;
fig. 6 is a schematic cross-sectional view of a heat-generating substrate for a thermal head finally formed in embodiment 1 of the present invention;
fig. 7 is a schematic cross-sectional view of a heat-generating substrate for a thermal printhead finally formed in embodiment 2 of the present invention.
Description of the symbols in the drawings
1. An insulating substrate; 2. a ground coat layer; 3. a metal mask layer; 3a, 3b. metal mask pattern; 4a, 4c. a resistance paste film on the metal mask; 4b, a required heating resistor body; 5a. a common electrode; 5b. individual electrodes; 5c, a bonding pad; 6. and (5) a wear-resistant protective layer.
Detailed Description
The technical points of the invention are as follows:
MO (metal organic) is metal organic, MO slurry, gold, platinum, silver, palladium organic compound is adopted, other base metal organic is added, necessary film forming resin is added to prepare solution, namely organic Metal (MO) slurry, and conductor films with main metal components of gold, platinum, silver are respectively formed by printing and sintering;
MO (metal organic) resistance paste is prepared by adding other base metal organic compounds and necessary film forming resin into one or more than one of gold, platinum, iridium, rhodium, ruthenium and palladium organic compounds to prepare solution, namely organic Metal (MO) resistance paste, and respectively forming metal-base metal oxide resistance films (hereinafter referred to as MO resistors) by printing and sintering;
the following detailed description of embodiments of the invention refers to the accompanying drawings.
Example 1
The invention provides a method for manufacturing a thermal printing head substrate of an MO heating resistor body, which comprises the following steps:
step 1: an amorphous glass material was printed on the entire surface of an insulating substrate 1, and the substrate was sintered at 1300 ℃ for 1 hour to form an entire ground glaze layer 2 having a thickness of 50 μm, as shown in FIG. 1;
step 2: forming a metal mask layer 3 on the ground glaze layer 2 and a part of the insulating substrate 1 by adopting a mode of sputtering and evaporating a metal target material or screen printing and sintering organic metal slurry to manufacture a first metalized substrate, wherein the thickness of the metal mask layer is 0.5-10 mu m, the material of the metal mask layer 3 comprises a nickel, copper, molybdenum, gold, silver, aluminum and chromium film or a composite film or alloy thereof, and the metal mask layer in the embodiment adopts an aluminum film with the thickness of 1 mu m, as shown in figure 1;
and step 3: performing partial etching on the metal mask layer 3 on the first metalized substrate by using a photolithography technique to form a first pattern which comprises metal mask patterns 3a and 3b and an underlying glaze layer 2 with the exposed width being the same as the expected width of the resistor body, wherein the first pattern at least comprises two metal masks along a main printing direction and an underlying glaze region with the width of 10-300 μm exposed between the sections of the two metal masks, the section of the metal mask of the underlying glaze exposed region is of a right-angle or trapezoidal structure with a wide top and a narrow bottom, and the opening width of the metal mask of the underlying glaze region exposed by the first pattern is 100 μm as shown in fig. 2;
and 4, step 4: printing or drawing required organic metal heating resistor paste on the first pattern formed after the treatment of the step 3, wherein the width of the resistor pattern to be printed or drawn is larger than the part 4b of the ground coat and does not exceed the edges of the 3a and 3b, and forming resistance paste films 4a, 4b and 4c after drying, the middle area with the most uniform film thickness is arranged in the ground coat area of the first pattern, the film thickness is 1-10 μm, and the film thickness of the resistance paste in the embodiment is 5 μm, as shown in FIG. 3;
preferably, in the step 4, the organometallic heating resistor slurry is prepared by at least one of organic compounds of noble metals ruthenium and iridium and at least one of organic compounds of base metals titanium and zirconium, wherein the molar ratio of ruthenium and iridium metal atoms to titanium and zirconium base metal atoms is 10: 2-10: 10, mixing, wherein the mass ratio of ruthenium to iridium metal in the slurry is 1-5%, the organic solvent is at least one of terpineol, butyl carbitol acetate, isoborneol acetate and turpentine, and 5-10% of rosin or other water-insoluble organic resins are added;
and 5: removing the metal mask parts 3a and 3b and the resistor paste films 4a and 4c on the metal mask layer residues 3a and 3b on the substrate processed in the step 4 by a wet etching process, and leaving a required heating resistor paste film layer 4b on the ground glaze layer 2, as shown in fig. 4;
preferably, the organic metal heating resistor slurry in step 4 may be composed of a component in which the etching solution in step 5 does not dissolve or undergo physical or chemical reactions;
step 6: sintering the resistor slurry pattern substrate obtained in the step 5 to prepare an MO heating resistor with the thickness of 0.2 mu m;
and 7: printing and sintering organic metal conductor slurry on the ground glaze layer 2 and the heating resistor 4b in the step 6 to form a metal film conductor layer, and manufacturing a second metalized substrate, wherein the organic metal conductor slurry is one of organic gold, organic silver and organic platinum slurry, and the organic metal conductor slurry in the embodiment adopts organic gold slurry;
and 8: partially etching the second metallized substrate by using a photolithography technique to form a desired common electrode 5a, an intended individual electrode 5b, and a desired pad 5c formed by extending the individual electrode, as shown in fig. 5;
and step 9: on the second metallized substrate processed in step 8, an abrasion-resistant protective layer 6 is formed on the surfaces of the common electrode 5a, the individual electrode 5b and the heating resistor 4b except the pad 5c, that is, the heating substrate for the thermal print head made of the MO resistor has a deviation of the resistance value of the heating resistor of ± 3% and a dispersion σ of not more than 1%, the heating temperature of the thermal print head is balanced, the printing energy is concentrated, and the thermal print head with high printing quality and low cost is realized, as shown in fig. 6.
The invention also provides an MO heating resistor thermal printing head substrate manufactured by the method, which comprises an insulating substrate 1, wherein the surface of the insulating substrate 1 is printed and sintered to form an under glaze layer 2, an MO heating resistor 4b is formed in the middle area with uniform surface film thickness of the under glaze layer 2, metal film conductor layers are formed on the surfaces of the under glaze layer 2 and the MO heating resistor 4b, a common electrode 5a, an individual electrode 5b and a bonding pad 5c formed by extending the individual electrode are arranged on the surfaces of the metal film conductor layers, and a wear-resistant protective layer 6 is formed on the surfaces of the common electrode 5a, the individual electrode 5b and the MO heating resistor 4b except the bonding pad 5c, thereby manufacturing the heating substrate for the thermal printing head.
Example 2
As shown in fig. 7, the same as example 1 except that the ground coat layer 2 formed on the insulating substrate 1 in step 1 is a partial glaze.
However, the above description is only exemplary of the present invention, and the scope of the present invention should not be limited thereby, and the replacement of the equivalent components or the equivalent changes and modifications made according to the protection scope of the present invention should be covered by the claims of the present invention.
Claims (10)
1. A method for manufacturing a thermal print head substrate of an MO heating resistor, comprising the steps of:
step 1: printing an amorphous glass material on the surface of an insulating substrate, and sintering to form a ground coat layer;
step 2: forming a metal mask layer on the bottom glaze layer and a part of the insulating substrate by adopting a mode of sputtering and evaporating a metal target material or screen printing and sintering organic metal slurry to prepare a first metalized substrate;
and step 3: carrying out a patterning process on the first metalized substrate by adopting a photoetching technology to form a first pattern at least comprising two metal mask patterns and a ground glaze region which is expected to form a resistor body and is exposed between the two metal masks;
and 4, step 4: printing or drawing required organic metal heating resistor slurry on the first graph, wherein the width of the printed or drawn graph is larger than that of a ground glaze area between the two metal masks;
and 5: removing the metal mask layer on the first metalized substrate and the resistive film of the residual part of the metal mask layer through a wet etching process, and forming a required MO heating resistor slurry pattern on the ground coat layer;
step 6: sintering the resistor paste pattern substrate obtained in the step 5 to prepare the needed MO heating element;
and 7: printing and sintering organic metal slurry on the bottom glaze layer and the heating resistor body in the step 6 to form a metal film conductor layer to manufacture a second metalized substrate;
and 8: patterning the second metalized substrate by adopting a photoetching technology to form an expected common electrode, an expected individual electrode and a pad formed by extending the individual electrode;
and step 9: and printing the sintered glass slurry on the second metalized substrate except for the bonding pad to form a wear-resistant protective layer, thus preparing the heating substrate for the thermal printing head.
2. The method for producing a MO heating resistor thermal print head substrate according to claim 1, wherein in the step 4, the organometallic heating resistor paste is prepared by mixing at least one of organic compounds of ruthenium and iridium noble metals with at least one of organic compounds of base metals titanium and zirconium in a molar ratio of ruthenium and iridium metal atoms to titanium and zirconium base metal atoms of 10: 2-10: 10, mixing, wherein the mass ratio of ruthenium to iridium metal in the slurry is 1-5%, the organic solvent is at least one of terpineol, butyl carbitol acetate, isoborneol acetate and turpentine, and 5-10% of rosin or other water-insoluble organic resins are added.
3. The method of claim 1, wherein the thickness of the metal mask layer in step 2 is 0.5-10 μm, and the metal mask layer material comprises a thin film of nickel, copper, molybdenum, gold, silver, aluminum, chromium, or a composite thin film or alloy thereof.
4. The method of claim 1, wherein the first pattern formed in step 3 includes at least two metal masks along the main printing direction and an under-glaze region exposed between the cross-sections of the two metal masks with a width of 10-300 μm.
5. The method of manufacturing a MO heating resistor thermal printhead substrate according to claim 1, wherein the first pattern formed in step 3 has a metal mask cross-section of a region where the ground glaze is exposed, which is a right angle or a trapezoidal structure with a wide top and a narrow bottom.
6. The method of manufacturing a MO heating resistor thermal print head substrate according to claim 1, wherein the heating resistor paste printed or drawn in step 4 has a uniform film thickness in the middle region disposed in the ground coat region of the first pattern, and the film thickness is 1 μm to 10 μm.
7. The method of manufacturing a MO heating resistor thermal printhead substrate according to claim 1, wherein the heating resistor paste pattern width printed or drawn in step 4 is larger than the under-glaze pattern width and not larger than the metal mask region width.
8. The method of claim 1, wherein the organic metal heating resistor slurry in step 4 is composed of a composition that the etching solution in step 5 does not dissolve or react physically or chemically.
9. The method of claim 1, wherein the organic metal conductor paste in step 7 comprises one of organic gold, organic silver and organic platinum paste.
10. The MO heating resistor thermal print head substrate manufactured by the method for manufacturing a MO heating resistor thermal print head substrate according to any one of claims 1 to 9, comprising an insulating substrate, wherein a surface of the insulating substrate is printed and sintered to form an enamel layer, the MO heating resistor is formed in an intermediate region where a surface thickness of the enamel layer is uniform, a metal film conductor layer is formed on the surface of the enamel layer and the MO heating resistor, a common electrode, an individual electrode, and a pad where the individual electrode is formed by extending are provided on a surface of the metal film conductor layer, and a wear-resistant protective layer is formed on a surface of the common electrode, the individual electrode, and the MO heating resistor other than the pad.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010299052.9A CN111391515B (en) | 2020-04-16 | 2020-04-16 | Organometallic compound resistor thermal print head substrate and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010299052.9A CN111391515B (en) | 2020-04-16 | 2020-04-16 | Organometallic compound resistor thermal print head substrate and manufacturing method thereof |
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| CN111391515A true CN111391515A (en) | 2020-07-10 |
| CN111391515B CN111391515B (en) | 2021-03-16 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114379240A (en) * | 2021-08-06 | 2022-04-22 | 山东华菱电子股份有限公司 | Thermal print head substrate with composite lead-free protective layer and manufacturing method thereof |
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| JPS5959474A (en) * | 1982-09-30 | 1984-04-05 | Toshiba Corp | Thin film thermal head |
| JPS5959473A (en) * | 1982-09-30 | 1984-04-05 | Toshiba Corp | Manufacture of thin film thermal head |
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| JPH035164A (en) * | 1989-06-02 | 1991-01-10 | Toshiba Corp | Thermal head |
| JPH03189170A (en) * | 1989-12-20 | 1991-08-19 | Hitachi Ltd | Thermal head and its manufacture |
| WO2006049095A1 (en) * | 2004-11-04 | 2006-05-11 | Rohm Co., Ltd. | Thermal print head and method for manufacturing same |
| CN104859312A (en) * | 2015-06-08 | 2015-08-26 | 武汉今域通半导体有限公司 | Thermosensitive printing head and manufacturing method therefor |
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2020
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| JPS5959474A (en) * | 1982-09-30 | 1984-04-05 | Toshiba Corp | Thin film thermal head |
| JPS5959473A (en) * | 1982-09-30 | 1984-04-05 | Toshiba Corp | Manufacture of thin film thermal head |
| JPH021338A (en) * | 1988-06-09 | 1990-01-05 | Matsushita Electric Ind Co Ltd | Thermal head |
| JPH035164A (en) * | 1989-06-02 | 1991-01-10 | Toshiba Corp | Thermal head |
| JPH03189170A (en) * | 1989-12-20 | 1991-08-19 | Hitachi Ltd | Thermal head and its manufacture |
| WO2006049095A1 (en) * | 2004-11-04 | 2006-05-11 | Rohm Co., Ltd. | Thermal print head and method for manufacturing same |
| CN104859312A (en) * | 2015-06-08 | 2015-08-26 | 武汉今域通半导体有限公司 | Thermosensitive printing head and manufacturing method therefor |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114379240A (en) * | 2021-08-06 | 2022-04-22 | 山东华菱电子股份有限公司 | Thermal print head substrate with composite lead-free protective layer and manufacturing method thereof |
| CN114379240B (en) * | 2021-08-06 | 2023-01-20 | 山东华菱电子股份有限公司 | Thermal print head substrate with composite lead-free protective layer and manufacturing method thereof |
| WO2023011228A1 (en) * | 2021-08-06 | 2023-02-09 | 山东华菱电子股份有限公司 | Thermal print head substrate having composite lead-free protective layer and method for manufacturing same |
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