CN111361295B - Organometallic compound resistor thermal print head substrate and manufacturing method thereof - Google Patents
Organometallic compound resistor thermal print head substrate and manufacturing method thereof Download PDFInfo
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- CN111361295B CN111361295B CN202010299324.5A CN202010299324A CN111361295B CN 111361295 B CN111361295 B CN 111361295B CN 202010299324 A CN202010299324 A CN 202010299324A CN 111361295 B CN111361295 B CN 111361295B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/33535—Substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33555—Structure of thermal heads characterised by type
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Abstract
The invention provides a thermal printing head substrate using organic metal compound resistor and a manufacturing method thereof, which solves the technical problems of uneven resistance value and poor printing effect of the organic metal compound heating resistor for the existing heating substrate, and comprises the steps of forming a ground glaze layer, forming a resistor forming area and a mask pattern with expected width on the surface of the ground glaze by using a water-soluble and organic solvent insoluble photoresist mask etching process, configuring the most uniform part of the organic metal resistor slurry film which can be dissolved by organic solvent and is not dissolved by water in the area, selectively dissolving the photoresist mask by using water or alkaline aqueous solution, removing the photoresist mask and the resistor slurry film attached to the surface of the photoresist mask, reserving the resistor slurry film in the most uniform area, sintering the resistor slurry film to form the resistor, balancing the heating temperature of the substrate, the printing energy is concentrated, and the thermosensitive printing head with high printing quality and low cost is realized; the invention can be widely applied to the field of thermal printing.
Description
Technical Field
The present invention relates to the field of thermal printing, and more particularly, to a thermal print head substrate using an organometallic compound resistor and a method of manufacturing the same.
Background
The thermal printing head adopting the MO (organic metal compound) heating resistor has the characteristics of high resolution of a thin-film thermal printing head and low cost of a thick-film thermal printing head, and is particularly suitable for occasions with high printing quality; the traditional heating substrate heating resistor generally adopts a mode of printing or drawing a strip-shaped resistor paste, and after sintering, the strip-shaped heating resistor is connected with a common electrode and an individual electrode to form a heating area; due to the limitations of the current screen printing and drawing process level, the resistance values of different parts of the strip-shaped resistor body have about +/-20% deviation, and the strip-shaped heating resistor body is made of organic metal and is not suitable for a nondestructive resistance value adjusting process such as electric pulse, so that the heating temperature of each part is different due to the resistance value deviation of the heating resistor body, and the printing effect is influenced.
In order to solve the above disadvantages, a common method is to make the width of the MO heating resistor wide, select a region with a relatively uniform resistance value to be disposed in the central region of the common electrode and the individual electrode pair to form a heating region.
Disclosure of Invention
The invention provides a method for manufacturing a heating substrate for a thermal printing head, which aims at solving the technical problems of uneven resistance value and poor printing effect of an MO (organic metal compound) heating resistor body for the existing heating substrate, realizes uniform distribution of resistance values by adopting an MO resistor material, has balanced temperature of the heating substrate and concentrated printing energy, and realizes the thermal printing head with high printing quality and low cost.
Therefore, the invention provides a method for manufacturing an MO heating resistor thermal printing head substrate, which comprises the following steps:
step 1: printing an amorphous glass material on the surface of an insulating substrate, and sintering to form a ground coat layer;
step 2: coating a water-soluble photoresist on the ground coat layer and a part of the insulating substrate, and drying to form a water-soluble photoresist coating;
and step 3: patterning the water-soluble photoresist mask layer by adopting a photoetching mode to form a first pattern which at least comprises two photoresist patterns arranged along a main printing direction and an under glaze region with the width of an expected resistance forming region exposed between the two photoresist patterns;
and 4, step 4: printing or drawing a strip-shaped MO heating resistor body slurry on a first pattern substrate along a main printing direction by using the center of a ground coat pattern exposed between two water-soluble photoresist patterns, and drying;
and 5: dissolving the photoresist in the step 4 by using water or an alkaline aqueous solution, removing the organic metal resistance slurry film layer attached to the surface of the photoresist, and forming a second pattern of the required heating resistor slurry on the ground coat layer;
step 6: sintering the second graphic substrate obtained in the step 5 to prepare the needed MO heating resistor body;
and 7: printing and sintering organic metal conductor slurry on the ground glaze layer and the heating resistor body in the step 6 to form a metal film conductor layer to prepare a metalized substrate;
and 8: patterning the metalized substrate in the step 7 by adopting a photoetching technology to form a third patterned substrate comprising a prospective common electrode, an individual electrode, a COM electrode connected with the common electrode, a bonding pad formed by extending the individual electrode and a welding part electrode;
and step 9: and 8, printing the sintered glass slurry on the third patterned substrate except for the bonding pad and the welding part electrode to form a wear-resistant protective layer, thus obtaining the heating substrate for the thermal printing head.
Preferably, the water-soluble photoresist mask layer material in step 2 is composed of components that are soluble in water and insoluble in organic solvents such as alcohols, esters, ketones, ethers, and the like.
Preferably, the first pattern formed in step 3 at least includes two water-soluble photoresist masks along the main printing direction and an under-glaze region exposed between the two water-soluble photoresist masks and having a width of 10-300 μm.
Preferably, the tape-shaped MO heating resistor slurry in step 4 is prepared by mixing at least one of organic compounds of noble metals such as ruthenium and iridium with at least one of organic compounds of base metals titanium and zirconium in a molar ratio of ruthenium and iridium metal atoms to titanium and zirconium base metal atoms of 10: 2-10: 10, mixing, wherein the content of ruthenium and iridium in the slurry is 1-5%, the organic solvent is at least one of terpineol, butyl carbitol acetate, isobornyl acetate and turpentine, and rosin, nitrocellulose or other water-insoluble organic resins are added.
Preferably, the slurry for the strip-shaped MO heating resistor in step 4 is formed by a system that is insoluble in water or an alkali solution, or does not hydrolyze in water or an alkali solution.
Preferably, the heating resistor paste printed or drawn in step 4 has a uniform thickness in the intermediate region disposed in the ground coat region of the first pattern, and has a thickness of 1 μm to 10 μm.
Preferably, the pattern width of the heating resistor paste printed or drawn in the step 4 is larger than the pattern width of the ground glaze and not larger than the width of the water-soluble photoresist mask area.
Preferably, the drying temperature of the heating resistor paste pattern printed or drawn in step 4 is not higher than the glass transition temperature of the water-soluble photoresist material used for the first pattern substrate.
Preferably, the organic metal conductor paste in step 7 includes one of organic gold, organic silver and organic platinum paste.
The invention also provides an MO heating resistor thermal printing head substrate manufactured by the method, which comprises an insulating substrate, wherein a ground glaze layer is formed on the surface of the insulating substrate by printing and sintering, an MO heating resistor is formed in the middle area with uniform surface film thickness of the ground glaze layer, a metal film conductor layer is formed on the surfaces of the ground glaze layer and the MO heating resistor, a common electrode, an individual electrode and a bonding pad formed by extending the individual electrode are arranged on the surface of the metal film conductor layer, and a wear-resistant protective layer is formed on the surfaces of the common electrode, the individual electrode and the MO heating resistor except the bonding pad.
The manufacturing method of the thermal printing head has the advantages that the heating resistor is formed in the most uniform area of the film quality of the printed or drawn belt-shaped resistor by adopting the low-cost manufacturing method, the resistance value deviation is small, namely the resistance value of the MO heating resistor is uniform, the thermal printing head made of the MO heating resistor heating substrate realizes the balance of heating temperature and the concentration of printing energy, and has the advantages of high printing quality and low production cost.
Drawings
FIG. 1 is a schematic cross-sectional view of a patterned substrate with a water-soluble photoresist mask formed according to example 1 of the present invention;
fig. 2 is a schematic cross-sectional view of a substrate after printing or drawing of a heating resistor paste in example 1 of the present invention;
FIG. 3 is a schematic cross-sectional view of the substrate after removing the water-soluble photoresist mask to form a desired heating resistor pattern in example 1 of the present invention;
fig. 4 is a schematic plan view of a heat-generating substrate for a thermal printhead having a metallized pattern according to embodiment 1 of the present invention;
fig. 5 is a schematic cross-sectional view of a heat-generating substrate for a thermal printhead finally formed in embodiment 1 of the present invention;
fig. 6 is a schematic cross-sectional view of a heat-generating substrate for a thermal printhead finally formed in embodiment 2 of the present invention.
Description of the symbols in the drawings
1. An insulating substrate; 2. a ground coat layer; 3a, 3b. a water-soluble photoresist pattern; 4a, 4c resistive film paste on a water soluble photoresist mask; 4b, a required heating resistor body; 5a. a common electrode; 5b. individual electrodes; 5c, a bonding pad; 6. and (5) a wear-resistant protective layer.
Detailed Description
The technical points of the invention are as follows:
MO (metal organic) is metal organic, MO slurry, gold, platinum, silver, palladium organic compound is adopted, other base metal organic is added, necessary film forming resin is added to prepare solution, namely organic Metal (MO) slurry, and conductor films with main metal components of gold, platinum, silver are respectively formed by printing and sintering;
MO (metal organic) resistance paste is prepared by adding other base metal organic compounds and necessary film forming resin into one or more than one of gold, platinum, iridium, rhodium, ruthenium and palladium organic compounds to prepare solution, namely organic Metal (MO) resistance paste, and respectively forming metal-base metal oxide resistance films (hereinafter referred to as MO resistors) by printing and sintering;
selective dissolution: the physicochemical properties of the material are utilized, and a specific solvent is adopted to preferentially dissolve a certain component of the composition species.
The photoresist adopted by the invention can be dissolved in water or alkaline aqueous solution, but the organic solvent adopted in the resistance paste is not dissolved; the organic metal resistance paste adopted by the invention does not dissolve or hydrolyze in water or alkaline aqueous solution, and the organic metal resistance paste coating is arranged on the water-soluble photoresist mask, so that the two can stably coexist without influencing each other, when the water or alkaline aqueous solution is used for selectively dissolving the photoresist mask, the water-soluble photoresist mask and the resistance paste film attached to the surface are removed, the resistance film on the surface of the ground coat is completely reserved, and the expected resistor is obtained.
The following detailed description of embodiments of the invention refers to the accompanying drawings.
Example 1
The invention provides a method for manufacturing a thermal printing head substrate of an MO heating resistor body, which comprises the following steps:
step 1: an amorphous glass material is printed on the entire surface of an insulating substrate 1, and an entire ground glaze layer 2 having a thickness of 100 μm is formed by sintering, as shown in FIG. 1;
step 2: coating a water-soluble photoresist on the ground coat layer 2 and a part of the insulating substrate 1, and drying to form a water-soluble photoresist mask layer, wherein the thickness of the dried water-soluble photoresist mask layer is 0.5-10 mu m, and the water-soluble photoresist mask layer material is composed of components which are soluble in water and insoluble in organic solvents such as alcohols, esters, ketones, ethers and the like;
and step 3: patterning the water-soluble photoresist mask layer by adopting a photoetching mode, and forming a first patterned substrate which at least comprises two water-soluble photoresist patterns 3a and 3b with the widths of 100 mu m and the film thickness of 5 mu m respectively and an under glaze region with the width of 100 mu m exposed between the two water-soluble photoresist patterns, as shown in figure 1;
and 4, step 4: on the first pattern, printing or drawing and drying organic metal heating resistor slurry along the main scanning direction at the center of the ground coat region exposed between the two water-soluble photoresist patterns in the step 3, wherein the width of the printed or drawn heating resistor slurry pattern is larger than that of the ground coat 4b pattern and is not larger than that of the water-soluble photoresist masks 3a and 3b regions, and strip-shaped MO heating resistor slurry patterns 4a, 4b and 4c with the width of 200 μm are formed and dried, as shown in FIG. 2; the banded MO heating resistor body slurry is composed of a system which is insoluble in water or alkali solution or does not hydrolyze in water or alkali solution, the printed or drawn heating resistor body slurry has a uniform film thickness, the middle area is arranged in the ground coat area of the first graph, the film thickness is 1-10 mu m, and the drying temperature is not higher than the vitrification temperature of a water-soluble photoresist material adopted on the first graph substrate;
preferably, in the step 4, the organometallic heating resistor slurry is prepared by at least one of organic compounds of noble metals ruthenium and iridium and at least one of organic compounds of base metals titanium and zirconium, wherein the molar ratio of ruthenium and iridium metal atoms to titanium and zirconium base metal atoms is 10: 2-10: 10, mixing, wherein the mass ratio of ruthenium to iridium metal in the slurry is 1-5%, the organic solvent is at least one of terpineol, butyl carbitol acetate, isoborneol acetate and turpentine, and 5-10% of rosin or other water-insoluble organic resins are added;
and 5: dissolving the substrate in the step 4 by using water or an alkaline aqueous solution, so that the water-soluble photoresist patterns 3a and 3b are completely dissolved, the resistive film pastes 4a and 4c on the water-soluble photoresist mask attached to the surface of the substrate are also removed, and an MO heating resistor paste pattern 4b with the required width of 100 μm is formed on the ground coat layer 2, as shown in FIG. 3;
step 6: sintering the resistor slurry pattern substrate obtained in the step 5 to prepare an MO heating resistor with the thickness of 0.2 mu m;
and 7: printing and sintering organic metal conductor slurry on the ground glaze layer 2 and the heating resistor 4b in the step 6 to form a metal film conductor layer, and manufacturing a metalized substrate, wherein the organic metal conductor slurry is one of organic gold, organic silver and organic platinum slurry, and the organic metal conductor slurry in the embodiment adopts organic gold slurry;
and 8: patterning the metallized substrate in the step 7 by using a 300dpi reticle and a photolithography technique to form a desired common electrode 5a, an individual electrode 5b and a pad 5c formed by extending the individual electrode, wherein the strip-shaped MO resistor is arranged in the middle of the comb-teeth-shaped electrode formed by the common electrode 5a and the individual electrode 5b along the main scanning direction, as shown in fig. 4;
and step 9: on the metallized substrate patterned in step 8, a sintered glass paste was printed at a position other than the pad electrode to form a wear-resistant protective layer 6, and a heat-generating substrate for a MO heat-generating resistor thermal print head having a resolution of 300dpi was produced, and a heat-generating substrate for a thermal print head was produced, as shown in fig. 5.
According to the MO heating resistor substrate, the most uniform area of the resistance film is set as the heating resistor, the distribution range of the resistance values of all resistors is +/-3%, the temperature of the heating substrate is balanced, printing energy is concentrated, the thermosensitive printing head with high printing quality and low production cost is realized, and the MO heating resistor substrate can be used in the printing field of images and the like.
The invention also provides an MO heating resistor thermal print head substrate manufactured by the method, which comprises an insulating substrate 1, wherein the surface of the insulating substrate 1 is printed and sintered to form an under glaze layer 2, an MO heating resistor 4b is formed in the middle area with uniform surface film thickness of the under glaze layer 2, metal film conductor layers are formed on the surfaces of the under glaze layer 2 and the MO heating resistor 4b, a common electrode 5a, an individual electrode 5b and a pad 5c formed by extending the individual electrode are arranged on the surfaces of the metal film conductor layers, and an abrasion-resistant protection layer 6 is formed on the surfaces of the common electrode 5a, the individual electrode 5b and the MO heating resistor 4b except the pad 5c.
Example 2
As shown in fig. 6, the same as example 1 except that the ground coat layer 2 formed on the insulating substrate 1 in step 1 is a partial glaze.
However, the above description is only exemplary of the present invention, and the scope of the present invention should not be limited thereby, and the replacement of the equivalent components or the equivalent changes and modifications made according to the protection scope of the present invention should be covered by the claims of the present invention.
Claims (10)
1. A method for manufacturing an organometallic compound resistor thermal print head substrate, comprising the steps of:
step 1: printing an amorphous glass material on the surface of an insulating substrate, and sintering to form a ground coat layer;
step 2: coating a water-soluble photoresist on the ground coat layer and a part of the insulating substrate, and drying to form a water-soluble photoresist coating;
and step 3: patterning the water-soluble photoresist mask layer by adopting a photoetching mode to form a first pattern which at least comprises two photoresist patterns arranged along a main printing direction and an under glaze region with the width of an expected resistance forming region exposed between the two photoresist patterns;
and 4, step 4: printing or drawing band-shaped organic metal compound heating resistor slurry along a main printing direction in an under glaze pattern area exposed between two adjacent water-soluble photoresist patterns on a first pattern substrate, and drying to form an organic metal resistance slurry film layer;
and 5: dissolving the photoresist pattern in the step 4 by using water or an alkaline aqueous solution, removing the organic metal resistance slurry film layer attached to the surface of the photoresist pattern, and forming a second pattern of the required heating resistor slurry on the ground coat layer;
step 6: sintering the second pattern substrate obtained in the step 5 to prepare the required organic metal compound heating resistor;
and 7: printing and sintering organic metal conductor slurry on the ground glaze layer and the heating resistor body in the step 6 to form a metal film conductor layer to prepare a metalized substrate;
and 8: patterning the metalized substrate in the step 7 by adopting a photoetching technology to form a third patterned substrate comprising a prospective common electrode, an individual electrode, a COM electrode connected with the common electrode, a bonding pad formed by extending the individual electrode and a welding part electrode;
and step 9: and 8, printing the sintered glass slurry on the third patterned substrate except for the bonding pad and the welding part electrode to form a wear-resistant protective layer, thus obtaining the heating substrate for the thermal printing head.
2. The method for manufacturing a organometallic compound resistor thermal head substrate according to claim 1, wherein the tape-like organometallic compound heating resistor paste in the step 4 is prepared by mixing at least one of noble metal organic compounds such as ruthenium and iridium and at least one of organic compounds of base metals titanium and zirconium in a molar ratio of ruthenium and iridium metal atoms to titanium and zirconium base metal atoms of 10:2 to 10: 10, mixing, wherein the content of ruthenium and iridium in the slurry is 1-5%, the organic solvent is at least one of terpineol, butyl carbitol acetate, isobornyl acetate and turpentine, and rosin, nitrocellulose or other water-insoluble organic resins are added.
3. The method for manufacturing a thermal head substrate having an organometallic compound resistor according to claim 1, wherein the water-soluble photoresist mask layer material in the step 2 is composed of a component which is soluble in water and insoluble in an organic solvent such as alcohols, esters, ketones, and ethers.
4. The method of manufacturing a thermal printhead substrate having a resistor formed of an organometallic compound according to claim 1, wherein the first pattern formed in the step 3 includes at least two water-soluble photoresist masks along a main printing direction and an under-glaze region having a width of 10 to 300 μm exposed between the two water-soluble photoresist masks.
5. The method for manufacturing a thermal head substrate having a resistor of an organometallic compound according to claim 2, wherein the paste for a heating resistor having a tape-like shape in the step 4 is composed of a water-insoluble or alkaline solution or a system in which hydrolysis does not occur in water or alkaline solution.
6. The method for manufacturing a thermal head substrate having a heat-generating resistor made of an organometallic compound according to claim 1, wherein the paste for heat-generating resistor printed or drawn in the step 4 has a uniform thickness in an intermediate region disposed in the ground coat region of the first pattern, and has a thickness of 1 μm to 10 μm.
7. The method for manufacturing a thermal print head substrate of an organometallic compound resistor according to claim 1, wherein the pattern width of the paste for the heating resistor printed or drawn in the step 4 is larger than the pattern width of the ground coat and not larger than the width of the mask region of the water-soluble photoresist.
8. The method for manufacturing a thermal head substrate having a heating resistor made of an organometallic compound according to claim 1, wherein the drying temperature of the paste pattern for heating resistor printed or drawn in the step 4 is not higher than the glass transition temperature of the water-soluble photoresist material used for the substrate having the first pattern.
9. The method of manufacturing a thermal head substrate having an organic metal compound resistor according to claim 1, wherein the organic metal conductor paste in the step 7 includes one of organic gold, organic silver, and organic platinum paste.
10. The organometallic compound resistor thermal print head substrate manufactured by the method for manufacturing an organometallic compound resistor thermal print head substrate according to any one of claims 1 to 9, comprising an insulating substrate, wherein a ground coat layer is formed by printing and sintering a surface of the insulating substrate, wherein an organometallic compound heating resistor is formed in an intermediate region where a surface thickness of the ground coat layer is uniform, wherein a metal film conductor layer is formed on surfaces of the ground coat layer and the organometallic compound heating resistor, wherein a common electrode, an individual electrode, and a pad where the individual electrode is formed by extending are provided on a surface of the metal film conductor layer, and wherein an abrasion resistant protective layer is formed on surfaces of the common electrode, the individual electrode, and the organometallic compound heating resistor other than the pad.
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| CN202010299324.5A CN111361295B (en) | 2020-04-16 | 2020-04-16 | Organometallic compound resistor thermal print head substrate and manufacturing method thereof |
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| CN202010299324.5A CN111361295B (en) | 2020-04-16 | 2020-04-16 | Organometallic compound resistor thermal print head substrate and manufacturing method thereof |
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| CN111361295B true CN111361295B (en) | 2021-03-16 |
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|---|---|---|---|---|
| JPH0272970A (en) * | 1988-09-09 | 1990-03-13 | Hitachi Ltd | Manufacture of thermal head |
| JP2550327B2 (en) * | 1986-09-04 | 1996-11-06 | ロ−ム株式会社 | Method of manufacturing thermal head |
| CN1849220A (en) * | 2003-09-16 | 2006-10-18 | 罗姆股份有限公司 | Thermal printhead and method for manufacturing same |
| CN101143521A (en) * | 2006-09-12 | 2008-03-19 | 阿尔卑斯电气株式会社 | Thermal headand method of manufacturing the same |
| CN101934637A (en) * | 2009-06-30 | 2011-01-05 | 山东华菱电子有限公司 | Thermal print head and preparation method thereof |
| CN102555515A (en) * | 2010-11-19 | 2012-07-11 | 罗姆股份有限公司 | Thermal print head and method of manufacturing the same |
| CN109484039B (en) * | 2018-12-03 | 2020-03-24 | 山东华菱电子股份有限公司 | Method for manufacturing heating substrate for thermal printing head |
| CN109986888B (en) * | 2019-05-15 | 2020-03-24 | 山东华菱电子股份有限公司 | Heating substrate for thermal printing head |
-
2020
- 2020-04-16 CN CN202010299324.5A patent/CN111361295B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2550327B2 (en) * | 1986-09-04 | 1996-11-06 | ロ−ム株式会社 | Method of manufacturing thermal head |
| JPH0272970A (en) * | 1988-09-09 | 1990-03-13 | Hitachi Ltd | Manufacture of thermal head |
| CN1849220A (en) * | 2003-09-16 | 2006-10-18 | 罗姆股份有限公司 | Thermal printhead and method for manufacturing same |
| CN101143521A (en) * | 2006-09-12 | 2008-03-19 | 阿尔卑斯电气株式会社 | Thermal headand method of manufacturing the same |
| CN101934637A (en) * | 2009-06-30 | 2011-01-05 | 山东华菱电子有限公司 | Thermal print head and preparation method thereof |
| CN102555515A (en) * | 2010-11-19 | 2012-07-11 | 罗姆股份有限公司 | Thermal print head and method of manufacturing the same |
| CN109484039B (en) * | 2018-12-03 | 2020-03-24 | 山东华菱电子股份有限公司 | Method for manufacturing heating substrate for thermal printing head |
| CN109986888B (en) * | 2019-05-15 | 2020-03-24 | 山东华菱电子股份有限公司 | Heating substrate for thermal printing head |
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| CN111361295A (en) | 2020-07-03 |
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