JPH0232866A - Manufacture of thermal head - Google Patents
Manufacture of thermal headInfo
- Publication number
- JPH0232866A JPH0232866A JP63184354A JP18435488A JPH0232866A JP H0232866 A JPH0232866 A JP H0232866A JP 63184354 A JP63184354 A JP 63184354A JP 18435488 A JP18435488 A JP 18435488A JP H0232866 A JPH0232866 A JP H0232866A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- paste
- layer
- thermal head
- resistor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000000034 method Methods 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 150000002902 organometallic compounds Chemical class 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 5
- 229910052796 boron Inorganic materials 0.000 claims abstract description 3
- 239000000203 mixture Substances 0.000 claims abstract description 3
- 150000002894 organic compounds Chemical class 0.000 claims abstract description 3
- 229910052797 bismuth Inorganic materials 0.000 claims abstract 2
- 229910052710 silicon Inorganic materials 0.000 claims abstract 2
- 229910052737 gold Inorganic materials 0.000 claims description 10
- 239000010931 gold Substances 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 5
- 239000007791 liquid phase Substances 0.000 claims description 2
- 239000012071 phase Substances 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 238000000053 physical method Methods 0.000 claims 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 229910052720 vanadium Inorganic materials 0.000 claims 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims 1
- 229910052726 zirconium Inorganic materials 0.000 claims 1
- 238000007639 printing Methods 0.000 abstract description 12
- 239000001856 Ethyl cellulose Substances 0.000 abstract description 3
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 abstract description 3
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 abstract description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 3
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 abstract description 3
- 229920001249 ethyl cellulose Polymers 0.000 abstract description 3
- 235000019325 ethyl cellulose Nutrition 0.000 abstract description 3
- 229940116411 terpineol Drugs 0.000 abstract description 3
- 239000005388 borosilicate glass Substances 0.000 abstract description 2
- 150000001875 compounds Chemical class 0.000 abstract description 2
- 229910052703 rhodium Inorganic materials 0.000 abstract description 2
- 229910052707 ruthenium Inorganic materials 0.000 abstract description 2
- 239000006185 dispersion Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 14
- 238000010304 firing Methods 0.000 description 7
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 5
- 238000005299 abrasion Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- -1 gold organometallic compound Chemical class 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000004397 blinking Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- WYXIGTJNYDDFFH-UHFFFAOYSA-Q triazanium;borate Chemical compound [NH4+].[NH4+].[NH4+].[O-]B([O-])[O-] WYXIGTJNYDDFFH-UHFFFAOYSA-Q 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/33515—Heater layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/3355—Structure of thermal heads characterised by materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33555—Structure of thermal heads characterised by type
- B41J2/3357—Surface type resistors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/3359—Manufacturing processes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はファクシミリ、ブリンクなどに用いられるサー
マルヘッドの製造法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing a thermal head used in facsimiles, blinking, etc.
従来の技術
サーマルヘッドは基板上の一対の電極と、この間の発熱
抵抗体層、この発熱抵抗体層の上に形成された耐磨耗層
とから基本的に構成され、従来は薄膜型と厚膜型とが存
在する。Conventional technology A thermal head basically consists of a pair of electrodes on a substrate, a heat generating resistor layer between them, and an abrasion resistant layer formed on the heat generating resistor layer. There is a membrane type.
薄膜型は電極、発熱抵抗体層、耐磨耗層をスパッタリン
グ、蒸着などの真空プロセスにより形成したものである
。厚膜型は例えば金メタルオルガニックペースト、Ｒｕ
ｂ、−ガラスフリットペースト、ホウケイ酸ガラスフリ
ットペースト、の印刷焼成により金電極、Ｒｕｂ２発熱
抵抗体層、耐磨耗層、を得るもので、薄膜型より低コス
トで高性能サーマルヘッドを得ることができる。第４図
は従来の代表的な薄膜サーマルヘッドの断面図であ弘
アルミナグレーズ基板、ホーロ基板、などの絶縁基板（
５０）上に発熱抵抗体層５１．電極層５２，５３．耐酸
化層５４゜耐磨耗層５５が存在する。発熱抵抗体層およ
び金電極はフォトリソエツチング法によりバターニング
される。The thin film type is one in which the electrodes, heating resistor layer, and wear-resistant layer are formed by a vacuum process such as sputtering or vapor deposition. For example, the thick film type is gold metal organic paste, Ru
b. - A gold electrode, a Rub2 heating resistor layer, and an abrasion resistant layer are obtained by printing and firing a glass frit paste and a borosilicate glass frit paste, and it is possible to obtain a high-performance thermal head at a lower cost than a thin film type. can. Figure 4 is a cross-sectional view of a typical conventional thin-film thermal head.
Insulating substrates such as alumina glaze substrates, hollow substrates, etc.
50) Heat generating resistor layer 51. Electrode layers 52, 53. An oxidation-resistant layer 54 and a wear-resistant layer 55 are present. The heating resistor layer and the gold electrode are patterned by photolithography.
一方厚膜サーマルヘッドは第５図に示す断面を有し絶縁
基板６０の上の電極層６１．抵抗体層６２．耐磨耗層６
３．から基本的に構成される。On the other hand, the thick film thermal head has a cross section shown in FIG. 5, and has an electrode layer 61 on an insulating substrate 60. Resistor layer 62. Abrasion resistant layer 6
3. It basically consists of
上に述べたサーマルヘッドでの重要特性のひとつは、印
字品質である。すなはち、ライン状に配列した抵抗体層
の個々のドツトから、均一に発熱したエネルギを印画・
紙に伝達し、個々の印字されたドツトの印字濃度をでき
るだけ均一にしなければならない。個々の印字、ドツト
の濃度が不均一であると印画に濃淡のスジが生じ印字品
質が悪くなり、とくに階調印字の要求されるフルカラー
プリンタ用のサーマルヘッドとしては、この特性が重視
される。このような印字濃度ムラの原因としては個々の
抵抗体ドツトの抵抗値のばらつきが考えられる。このよ
うな個々の抵抗体ドツトの抵抗値ばらつきを小さくする
ために、厚膜法では、トリミング工程が採用されている
。この工程は形成された抵抗体層の個々のドツトに過負
荷パルスを印加するこにより抵抗値を目標の値にする方
法である。この方法により抵抗値はＰ−ＰＩ％以内にま
ですることが可能である。一方、薄膜抵抗体の個々の抵
抗体ドツトの抵抗値を均一にするために蒸着、スパッタ
リングの条件の制御によりＰ−Ｐ５％以内の抵抗体層を
得ることができる。One of the important characteristics of the thermal head mentioned above is print quality. In other words, the energy generated uniformly from the individual dots of the resistor layer arranged in a line is used for printing and printing.
The density of each printed dot must be as uniform as possible. If the density of individual prints or dots is uneven, streaks of light and shade will occur in the print, resulting in poor print quality, and this characteristic is particularly important for thermal heads for full-color printers that require gradation printing. A possible cause of such unevenness in print density is variation in the resistance values of individual resistor dots. In order to reduce such variations in resistance values of individual resistor dots, a trimming process is employed in the thick film method. This process is a method of applying an overload pulse to each dot of the formed resistor layer to bring the resistance value to a target value. This method allows the resistance value to be within P-PI%. On the other hand, in order to make the resistance values of the individual resistor dots of the thin film resistor uniform, a resistor layer having a P-P of within 5% can be obtained by controlling the conditions of vapor deposition and sputtering.
発明が解決しようとする課題
しかしながら、薄−膜力式ヘッドでは現在以上の抵抗体
層値のばらつき改善は困・難であり、厚膜方式ヘッドで
は以下に述べるように現行方式に問題点がある。現在の
厚・膜サーマルヘッドの抵抗体層はＲｕＯ２とガラスフ
リットと有機成分とからなる抵抗体ペーストのスクリー
ン印刷およびこれの焼成により形成される。ところが、
（１）得られた抵抗体層中のＲｕＯ２とガラス相とが均
一に分散しにくい、また（２）スクリーンメツシュの形
状が焼成により得られた抵抗体層の形状に影響し表面の
平滑な抵抗体層を得ることが困難である等、抵抗体層ペ
ースト材料およびその抵抗体層としての形成方法に起因
し、優れた印字品質に至っていないのが現状である。Problems to be Solved by the Invention However, with thin-film force type heads, it is difficult to improve the variation in resistor layer values beyond the current level, and with thick-film type heads, the current system has problems as described below. . The resistor layer of current thick-film thermal heads is formed by screen printing and firing a resistor paste consisting of RuO2, glass frit, and organic components. However,
(1) The RuO2 and glass phase in the obtained resistor layer are difficult to disperse uniformly, and (2) the shape of the screen mesh affects the shape of the resistor layer obtained by firing, resulting in a smooth surface. At present, excellent printing quality is not achieved due to the resistor layer paste material and the method of forming the resistor layer, such as the difficulty in obtaining the resistor layer.
本発明は上記問題点に鑑み有機金属化合物ペーストの性
質に最適な性膜法を用いた製造法を提供するものである
。In view of the above-mentioned problems, the present invention provides a manufacturing method using a film method that is optimal for the properties of organometallic compound paste.
課題を解決するための手段
本発明は、この様なサーマルヘッドの印字品質の改善を
目的としたもので、金属の有機化合物を含むペーストを
描画法もしくはスピンナ、ロールコータにより基板の上
に施し、これを分解することによって、抵抗体層を得る
ことを特徴とするサーマルヘッドの製造法である。Means for Solving the Problems The present invention aims to improve the printing quality of such a thermal head, and involves applying a paste containing a metal organic compound onto a substrate using a drawing method, a spinner, or a roll coater. This method of manufacturing a thermal head is characterized in that a resistor layer is obtained by disassembling this.
作用
本発明によれば有機金属化合物を含む抵抗体ペーストに
最適な施、膜性を用いているため非常に厚さの薄い、か
つＲｕＯ２の分散性に優れた抵抗体層を得ることができ
、高熱効率、高印字品質のサーマルヘッドを低コストで
提供する。According to the present invention, since the coating and film properties are optimal for a resistor paste containing an organometallic compound, it is possible to obtain a resistor layer that is extremely thin and has excellent dispersibility of RuO2. To provide a thermal head with high thermal efficiency and high print quality at low cost.
実施例
本発明の実施例を示す前に本発明の基本的な内容につい
て図面に従って説明する。Embodiments Before showing embodiments of the present invention, the basic content of the present invention will be explained with reference to the drawings.
Ｒｕの様な金属の有機化合物をテルピネオール、エチル
セルローズ、などと混合して得たペーストは、その粘性
のために通常のスクリーン製版を用いてスクリーン印刷
した膜はその端部がペーストの”たれ”のために直線性
が悪くエツジの直角性にも劣る。第３ａ図はこの様子を
示したものであり抵抗体膜の直線性２０．直角性２１が
悪いものになる。The paste obtained by mixing an organic compound of metal such as Ru with terpineol, ethyl cellulose, etc. is viscous, so when a film is screen printed using ordinary screen printing, the edges of the paste "sag". Therefore, linearity is poor and edge perpendicularity is also poor. Figure 3a shows this situation and shows the linearity of the resistor film 20. The perpendicularity 21 becomes poor.
この影響は抵抗体層の幅が狭い時（例えば２５０μｍ）
にドツト間の抵抗値のばらつきとなる。第３ｂ図は本発
明の描画法、エツチング法を用いて得た抵抗体層の断面
形状であるが、非常にエツジの直角性に優れ抵抗体値の
ばらつきも小さくなる。This effect occurs when the width of the resistor layer is narrow (for example, 250 μm).
This results in variations in resistance values between dots. FIG. 3b shows the cross-sectional shape of a resistor layer obtained using the drawing method and etching method of the present invention, and the edge perpendicularity is excellent and the variation in resistor values is also small.
次に本発明の具体的な実施例を図面に従って以下に示す
。Next, specific embodiments of the present invention will be shown below according to the drawings.
実施例１
第１図に示すグレーズ層をその表面に有するアルミナ基
板１の上に一対の電極層２を形成する。Example 1 A pair of electrode layers 2 are formed on an alumina substrate 1 having a glaze layer shown in FIG. 1 on its surface.
この電極層２の間に３５０μｍＸ １０μｍのスリット
を何する描画ベン３を用いて抵抗体ペースト４を吐出し
て線を引く。５．６はそれぞれペースト吐出のためのシ
リンジ、描画コントール部である。抵抗体ペーストとし
てＲｕ、Ｒｈ、Ｓｔ 、Ｂ、Ｂ＋ 、それぞれの有機金
属化合物とエチルセルロース、テルピネオールとの混合
物（粘度５００００ｃ’ｐ）を用いた。放置乾燥後８０
０℃で焼成し抵抗体層７とした。抵抗体層７の上に硼珪
酸ガラスフリットペーストの印刷焼成により耐磨耗層（
８）を形成する。Between this electrode layer 2, a line is drawn by discharging resistor paste 4 using a drawing ben 3 having a slit of 350 μm x 10 μm. 5 and 6 are a syringe for discharging paste and a drawing control unit, respectively. As the resistor paste, a mixture (viscosity: 50,000 c'p) of Ru, Rh, St, B, B+, each organometallic compound, ethyl cellulose, and terpineol was used. 80 minutes after being left to dry
The resistor layer 7 was obtained by firing at 0°C. A wear-resistant layer (
8).
実施例２
絶縁基板の上に実施例１と同じ抵抗体ペーストを描画法
により線引き焼成する。この上に抵抗体層が中心に来る
ように電極層を印刷焼成エツチング法、もしくは蒸着、
スパッタリングなどの真空膜形成、エツチング法によっ
て形成する。さらに実施例１と同じ方法で耐磨耗層を形
成する。Example 2 The same resistor paste as in Example 1 was drawn and fired on an insulating substrate using a drawing method. On top of this, an electrode layer is printed, fired, etched, or vapor-deposited so that the resistor layer is centered.
It is formed by vacuum film formation such as sputtering or etching. Furthermore, a wear-resistant layer is formed by the same method as in Example 1.
実施例３
第２図に示す厚さ１００μｍのホーロ層を有するホーロ
基板１０の上に粘度が１０００ｃｐの有機金属化合物ペ
ースト（実施例１と同じもの）の膜１１をスピンナを用
いて形成する。スピンナの回転数は２０００ｒｐｍトし
た。８００℃焼成後ホトリソエツチング法により抵抗体
パターン１２形成する。ただし、エツチング液として硫
酸と硼酸アンモニウムとの混合液を用いた。次に金の有
機金属化合物ペーストの印刷焼成により金層１３を抵抗
体層１２の上に形成し、引き続きホトリソエツチング法
により電極層パターン１４形成する。実施例−１と同じ
方法で耐磨耗層１５を形成する。Example 3 A film 11 of an organometallic compound paste (same as in Example 1) having a viscosity of 1000 cp is formed on a hollow substrate 10 having a hollow layer with a thickness of 100 μm as shown in FIG. 2 using a spinner. The rotation speed of the spinner was 2000 rpm. After baking at 800°C, a resistor pattern 12 is formed by photolithography. However, a mixed solution of sulfuric acid and ammonium borate was used as the etching solution. Next, a gold layer 13 is formed on the resistor layer 12 by printing and baking a gold organometallic compound paste, and then an electrode layer pattern 14 is formed by photolithography. A wear-resistant layer 15 is formed by the same method as in Example-1.
実施例４
ホーロ基板の上にロールツータにより実施例３と同じ抵
抗体ペースト膜を施す。８００℃焼成により抵抗体層と
する。抵抗体層の上に金の有機金属化合物ペーストの印
刷焼成により金層を形成する。Example 4 The same resistor paste film as in Example 3 is applied on a hollow substrate using a roll tool. A resistor layer is formed by firing at 800°C. A gold layer is formed on the resistor layer by printing and firing a gold organometallic compound paste.
引き続き金層のホトリソエツチング、抵抗体層のホトリ
ソエツチングのより抵抗体層、電極層のパターン形成す
る。耐・磨耗層は実施例１と同じ方法で形成する。Subsequently, patterns of the resistor layer and electrode layer are formed by photolithography of the gold layer and photolithography of the resistor layer. The anti-abrasion layer is formed by the same method as in Example 1.
実施例５
ホーロ基板の上にスピンナによりＲｕの有機金属化合物
を含む抵抗体ペーストで紫外線エネルギによりＲｕがＲ
ｕＯ２に分解する抵抗ペースト膜を施す。Example 5 A resistor paste containing an organometallic compound of Ru was placed on a hollow substrate using a spinner, and Ru was heated using ultraviolet energy.
Apply a resistive paste film that decomposes into uO2.
この上に金の様化合物の印刷焼成により金層を形成し電
極パタニングする。実施例１と同じ方法で耐磨耗層を形
成する。A gold layer is formed on this by printing and firing a gold-like compound, and electrode patterning is performed. A wear-resistant layer is formed using the same method as in Example 1.
以上の実施例で得られたサーマルヘッドの特性を表に示
す。The characteristics of the thermal head obtained in the above examples are shown in the table.
（以下余白）
比較のために、従来の構成のサーマルヘッドの特性も並
記した。比、較１例１はスクリーン印・刷？法、ガラス
フ・リット−Ｒｕ０２粉末系ペースト、による抵抗体層
を有するヘッド、比較例２はスクリーン印刷、金属の有
機化合物系ペースト、による抵抗体層を有するヘッド、
比較１例３は、描書画一法、ガラスフリット−Ｒｕｂｓ
粉末系ペースト、によるヘッド、比較例−４は、薄膜プ
ロセスによるヘッドである。なお具体的な実施例、にお
いて液相化学エツチングを用いたがＲＩＥ法などの物・
理的気相エツチングを用いてもよい。(Left below) For comparison, the characteristics of a thermal head with a conventional configuration are also listed. Comparison, Comparison 1 Example 1 is screen printing/printing? Comparative Example 2 is a head with a resistor layer made by screen printing, a metal organic compound paste,
Comparison 1 Example 3 is a drawing method, glass frit-Rubs
Comparative Example 4, a head based on a powder paste, is a head based on a thin film process. Although liquid phase chemical etching was used in the specific examples, methods such as RIE method and
Physical vapor phase etching may also be used.
発明の効果
以上のように本発明の製造法になるサーマルヘッドは有
機金属化合物ペーストの性質に最適な成膜法を用いて抵
抗体層を形成するため、抵抗体層の形状、抵抗値の均一
化が達成され、優れた印字品質のサーマルヘッドが得ら
れる。Effects of the Invention As described above, in the thermal head manufactured by the method of the present invention, the resistor layer is formed using a film forming method that is optimal for the properties of the organometallic compound paste, so the shape and resistance value of the resistor layer are uniform. This results in a thermal head with excellent print quality.
第１図および第２図は、本発明の一実施１例のサーマル
ヘッドの製造工程図、第３図は同製造法の原理説明図、
第４図および第５図は従来例のサーマルヘッドの構成図
である。
１・・絶縁基板、２・・電極、３・・描画ペン、４・・
ペースト、５・・シリンジ、６・・描１画コントロール
部。
代理人の氏名 弁理士 粟野重孝 ほか１名第２図
第
図
／Ｓ
第
図
（ユン
第
図
芽1 and 2 are manufacturing process diagrams of a thermal head according to one embodiment of the present invention, and FIG. 3 is a diagram illustrating the principle of the manufacturing method.
FIGS. 4 and 5 are configuration diagrams of conventional thermal heads. 1. Insulating substrate, 2. Electrode, 3. Drawing pen, 4.
Paste, 5...Syringe, 6...Draw 1 stroke control section. Name of agent: Patent attorney Shigetaka Awano and one other person
Claims (3)
極層の上に、金属の有機化合物を含むペーストをノズル
から吐出する描画法により抵抗体パターンを形成し、前
記ペーストの分解により抵抗体層を形成することを特徴
とするサーマルヘッドの製造法。(1) A resistor pattern is formed on an insulating substrate or an electrode layer formed on an insulating substrate by a drawing method in which a paste containing a metal organic compound is discharged from a nozzle, and the resistor pattern is formed by decomposing the paste. A method for manufacturing a thermal head characterized by forming layers.
極層の上に金属の有機化合物を含む抵抗体ペーストの層
を形成し、前記金属の有機化合物の分解によって抵抗体
層を形成し、この抵抗体を液相もしくは気相の、化学的
もしくは物理的方法によりエッチングしてパターン化す
ることを特徴とするサーマルヘッドの製造法。(2) forming a layer of a resistor paste containing a metal organic compound on an insulating substrate or an electrode layer formed on an insulating substrate, and forming a resistor layer by decomposing the metal organic compound; A method for manufacturing a thermal head, characterized in that the resistor is patterned by etching using a chemical or physical method in a liquid phase or gas phase.
ル、クロム、シリコン、ジルコニウム、チタン、硼素、
ビスマス、バナジウム、鉛、から選ばれた金属のエステ
ル、アルコラート、メルカプチド、その他のレジネート
、ロジネートの、単体もしくは混合物であることを特徴
とする請求項１または２記載のサーマルヘッドの製造法
。(3) Organic compounds of metals include platinum group elements, gold, silver, nickel, chromium, silicon, zirconium, titanium, boron,
3. The method for producing a thermal head according to claim 1, wherein the thermal head is a single substance or a mixture of metal esters, alcoholates, mercaptides, and other resinates and rhosinates selected from bismuth, vanadium, and lead.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63184354A JP2548314B2 (en) | 1988-07-22 | 1988-07-22 | Manufacturing method of thermal head |
| PCT/JP1988/001239 WO1989005232A1 (en) | 1987-12-10 | 1988-12-08 | Thermal head and production thereof |
| KR1019890701511A KR920005760B1 (en) | 1987-12-10 | 1988-12-08 | Thermal head and production thereof |
| EP19890900304 EP0344329A4 (en) | 1987-12-10 | 1988-12-08 | Thermal head and production thereof. |
| US07/830,457 US5250958A (en) | 1987-12-10 | 1992-02-05 | Thermal head and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63184354A JP2548314B2 (en) | 1988-07-22 | 1988-07-22 | Manufacturing method of thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0232866A true JPH0232866A (en) | 1990-02-02 |
| JP2548314B2 JP2548314B2 (en) | 1996-10-30 |
Family
ID=16151781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63184354A Expired - Fee Related JP2548314B2 (en) | 1987-12-10 | 1988-07-22 | Manufacturing method of thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2548314B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107901613A (en) * | 2017-11-27 | 2018-04-13 | 山东华菱电子股份有限公司 | A kind of novel thermosensitive printhead heating base plate and its manufacture method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56110201A (en) * | 1980-02-05 | 1981-09-01 | Nippon Denso Co | Method of forming positive temperature coefficient porcelain semiconductor |
| JPS5752024A (en) * | 1980-09-13 | 1982-03-27 | Alps Electric Co Ltd | Manufacture of transparent electrode substrate |
| JPS57199102A (en) * | 1981-06-03 | 1982-12-07 | Taiyo Yuden Kk | Conductive paste for forming conductive layer on surface of porcelain |
| JPS58164217A (en) * | 1982-03-25 | 1983-09-29 | 松下電器産業株式会社 | Electronic part |
| JPS6063174A (en) * | 1983-09-17 | 1985-04-11 | Alps Electric Co Ltd | Manufacture of thermal head |
| JPS61262139A (en) * | 1985-05-16 | 1986-11-20 | Rohm Co Ltd | Method for forming heat generating resistor in thick film type thermal printing head |
| JPS62196898A (en) * | 1986-02-24 | 1987-08-31 | 富士ゼロックス株式会社 | Matrix wiring board and manufacture of the same |
-
1988
- 1988-07-22 JP JP63184354A patent/JP2548314B2/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56110201A (en) * | 1980-02-05 | 1981-09-01 | Nippon Denso Co | Method of forming positive temperature coefficient porcelain semiconductor |
| JPS5752024A (en) * | 1980-09-13 | 1982-03-27 | Alps Electric Co Ltd | Manufacture of transparent electrode substrate |
| JPS57199102A (en) * | 1981-06-03 | 1982-12-07 | Taiyo Yuden Kk | Conductive paste for forming conductive layer on surface of porcelain |
| JPS58164217A (en) * | 1982-03-25 | 1983-09-29 | 松下電器産業株式会社 | Electronic part |
| JPS6063174A (en) * | 1983-09-17 | 1985-04-11 | Alps Electric Co Ltd | Manufacture of thermal head |
| JPS61262139A (en) * | 1985-05-16 | 1986-11-20 | Rohm Co Ltd | Method for forming heat generating resistor in thick film type thermal printing head |
| JPS62196898A (en) * | 1986-02-24 | 1987-08-31 | 富士ゼロックス株式会社 | Matrix wiring board and manufacture of the same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107901613A (en) * | 2017-11-27 | 2018-04-13 | 山东华菱电子股份有限公司 | A kind of novel thermosensitive printhead heating base plate and its manufacture method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2548314B2 (en) | 1996-10-30 |
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