CN107813615B - Bus electrode framework, thermal printing head and preparation method thereof - Google Patents
Bus electrode framework, thermal printing head and preparation method thereof Download PDFInfo
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- CN107813615B CN107813615B CN201711207890.3A CN201711207890A CN107813615B CN 107813615 B CN107813615 B CN 107813615B CN 201711207890 A CN201711207890 A CN 201711207890A CN 107813615 B CN107813615 B CN 107813615B
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- bus electrode
- layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/3351—Electrode layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/33515—Heater layers
Abstract
The invention provides a bus electrode structure, a thermal print head and a preparation method thereof, wherein the bus electrode structure comprises: a substrate; a bus electrode disposed on the substrate; a heating resistor transversely arranged on the substrate together with the bus electrode; the heating resistor protection layer is covered on the heating resistor; a bus electrode protection layer covering the bus electrode; the thickness of the bus electrode is larger than that of the heating resistor, the upper surface of the bus electrode and the upper surface of the heating resistor are on the same plane, the plane of the lower surface of the bus electrode is lower than that of the lower surface of the heating resistor, and therefore the thickness of the bus electrode is increased or decreased, the position and the structure of a bus electrode protection layer above the bus electrode are not required to be changed, and the volume of the thermal printing head is not increased; and the wear resistance of the bus electrode protection layer and the heating resistor protection layer can be improved, and the service lives of the bus electrode and the heating resistor can be prolonged.
Description
Technical Field
The invention relates to the technical field of thermal printers, in particular to a bus electrode framework, a thermal printing head and a preparation method of the thermal printing head.
Background
In a thermal printer, one of the most important components is a thermal print head provided with a linear heat generating resistor. When the thermal printer works, the printing medium is pressed on the heating resistor through the pressing roller, the heating resistor on the thermal printing head can selectively heat according to whether the thermal printing head is electrified or not, so that the printing medium contacted with the thermal resistor of the thermal printing head can selectively perform color reaction, and meanwhile, the cylindrical pressing roller rotates around the shaft, and the conveying of the printing medium is realized.
An important structure of the thermal head is a bus electrode for converging currents flowing through the heating resistor, and thus it is desired that the bus electrode portion has a high current capacity, which is currently increased by increasing the cross-sectional area of the bus electrode, in particular, by increasing the width of the bus electrode, but the increase in the width of the bus electrode causes an increase in the volume of the thermal head, which is disadvantageous for miniaturization of the thermal head.
Disclosure of Invention
Accordingly, it is necessary to provide a bus electrode structure, a thermal head, and a method for manufacturing the thermal head, which are against the problem that the increase in the width of the bus electrode causes the increase in the volume of the thermal head, which is disadvantageous for the miniaturization of the thermal head.
A bus electrode architecture, comprising:
a substrate;
a bus electrode disposed on the substrate;
a heating resistor transversely arranged on the substrate together with the bus electrode;
the heating resistor protection layer is covered on the heating resistor;
a bus electrode protection layer covering the bus electrode;
the thickness of the bus electrode is larger than that of the heating resistor, the upper surface of the bus electrode and the upper surface of the heating resistor are on the same plane, and the plane of the lower surface of the bus electrode is lower than that of the lower surface of the heating resistor.
In one embodiment, the thickness of the bus electrode protection layer is the same as the thickness of the heating resistor protection layer, and the upper surface of the bus electrode protection layer and the upper surface of the heating resistor protection layer are on the same plane.
In one embodiment, the bus electrode includes an upper bus electrode layer, a middle bus electrode layer, and a lower bus electrode layer; the lower bus electrode layer, the middle bus electrode layer and the upper bus electrode layer are stacked from bottom to top to form the bus electrode.
In one embodiment, the substrate is provided with a groove, and the bottom of the bus electrode is filled into the groove.
In one embodiment, the bus electrode structure further includes: the glass glaze layer is positioned on the substrate, the glass glaze layer is provided with a groove, and the bus electrode and the heating resistor are transversely arranged on the glass glaze layer; wherein, the bottom of the bus electrode is filled in the groove.
In one embodiment, the bus electrode architecture further comprises: and the glass glaze layer is positioned between the substrate and the heating resistor.
According to the bus electrode structure, the thickness of the bus electrode is increased, the thickness of the bus electrode at the substrate side is increased, the upper surface of the bus electrode and the upper surface of the heating resistor are arranged on the same plane, so that the current capacity of the bus electrode is improved, the position and the structure of the bus electrode protection layer above the bus electrode are not required to be changed, and the volume of the thermal printing head is not increased; in addition, the upper surface of the bus electrode and the upper surface of the heating resistor are on the same plane, so that the thickness of the bus electrode protection layer above the bus electrode can be kept consistent with that of the heating resistor protection layer, the wear resistance of the bus electrode protection layer and the heating resistor protection layer can be improved, and the service lives of the bus electrode and the heating resistor can be prolonged.
A thermal printhead comprising a bus electrode architecture as described above.
According to the thermal printing head, the thickness of the bus electrode is increased, the thickness of the bus electrode at the substrate side is increased, the upper surface of the bus electrode and the upper surface of the heating resistor are arranged on the same plane, so that the current capacity of the bus electrode is improved, the position and the structure of the bus electrode protection layer above the bus electrode are not required to be changed, and the volume of the thermal printing head is not increased; in addition, the upper surface of the bus electrode and the upper surface of the heating resistor are on the same plane, so that the thickness of the bus electrode protection layer above the bus electrode can be kept consistent with that of the heating resistor protection layer, the wear resistance of the bus electrode protection layer and the heating resistor protection layer can be improved, and the service lives of the bus electrode and the heating resistor can be prolonged.
A method of manufacturing a thermal printhead, comprising the steps of:
printing a heating resistor above the substrate to form a heating resistor band;
printing a bus electrode above the substrate in the transverse direction of the heating resistor, and starting to print the bus electrode from a starting printing surface lower than the heating resistor until the height of the bus electrode reaches the height of the heating resistor;
and printing a bus electrode protection layer on the bus electrode, and printing a heating resistor protection layer on the heating resistor until the height of the bus electrode protection layer reaches the height of the heating resistor protection layer.
In one embodiment, the step of printing the bus electrode over the substrate comprises: and printing a lower bus electrode layer on a substrate, printing a middle bus electrode layer on the lower bus electrode layer, and printing an upper bus electrode layer on the middle bus electrode layer until the upper surface of the upper bus electrode and the upper surface of the heating resistor are in the same plane.
In one embodiment, the step before printing the heat generating resistor over the substrate includes: printing a glass glaze layer on the substrate, wherein the thickness of the glass glaze layer of a preset bus electrode printing area is smaller than that of the glass glaze layer of the other areas;
the step of printing the heating resistor above the substrate is to print the heating resistor on the glass glaze layer on the substrate;
the step of printing the lower bus electrode layer on the substrate is to print the lower bus electrode layer on the glass glaze layer of the preset bus electrode printing area until the upper surface of the lower bus electrode layer and the upper surface of the glass glaze layer of the rest area are positioned on the same plane;
the steps after printing the glass glaze layer on the substrate comprise: preparing a conductive pattern layer on the glass glaze layer, and then printing a heating resistor layer on the glass glaze layer and the conductive pattern layer to form a heating resistor band; wherein the conductive pattern layer includes a common electrode and an individual electrode; and the preparation of the common electrode, the individual electrodes and the printing of the middle bus electrode layer are performed in the same step.
According to the preparation method of the thermal printing head, the thickness of the bus electrode is increased, the thickness of the bus electrode at the substrate side is increased, the upper surface of the bus electrode and the upper surface of the heating resistor are arranged on the same plane, so that the current capacity of the bus electrode is improved, the position and the structure of the bus electrode protection layer above the bus electrode are not required to be changed, and the volume of the thermal printing head is not increased; in addition, the upper surface of the bus electrode and the upper surface of the heating resistor are on the same plane, so that the thickness of the bus electrode protection layer above the bus electrode can be kept consistent with that of the heating resistor protection layer, the wear resistance of the bus electrode protection layer and the heating resistor protection layer can be improved, and the service lives of the bus electrode and the heating resistor can be prolonged.
Drawings
FIG. 1 is a schematic cross-sectional front view of a bus electrode structure according to one embodiment;
FIG. 2 is a schematic top view of a bus electrode structure according to one embodiment;
FIG. 3 is a schematic cross-sectional front view of another embodiment of a bus electrode structure;
FIG. 4 is a schematic cross-sectional front view of a bus electrode structure according to another embodiment;
FIG. 5 is a schematic cross-sectional elevation view of a thermal print head and platen roller of a thermal printer in one embodiment;
FIG. 6 is a flow chart of a method of manufacturing a thermal print head in one embodiment.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
In one embodiment, referring to fig. 1, the bus electrode structure in fig. 1 includes: a substrate 10, a bus electrode 11, a heating resistor 12, a heating resistor protection layer 13, and a bus electrode protection layer 14; the bus electrode 11 is arranged on the substrate 10, the heating resistor 12 and the bus electrode 11 are transversely arranged on the substrate 10, the heating resistor protection layer 13 is covered on the heating resistor 12, and the bus electrode protection layer 14 is covered on the bus electrode 11; the thickness of the bus electrode 11 is greater than that of the heating resistor 12, the upper surface of the bus electrode 11 and the upper surface of the heating resistor 12 are on the same plane, and the plane of the lower surface of the bus electrode 11 is lower than that of the lower surface of the heating resistor 12. Fig. 2 is a schematic top sectional structure of the bus electrode structure, and fig. 2 shows the structure of the bus electrode, and other structures are not shown.
Specifically, the heat generating resistor 12 forms a heat generating resistor layer. The substrate 10 may be a ceramic insulating substrate. The heat-generating resistor protection layer 13 and the bus electrode protection layer 14 are used for contacting with a printing medium of the thermal printer, and the printing medium is pressed on the heat-generating resistor protection layer 13 and the bus electrode protection layer 14 through a pressing roller.
Therefore, the bus electrode structure in this embodiment increases the thickness of the bus electrode, and increases the thickness of the bus electrode on the substrate side (the bus electrode below), and the upper surface of the bus electrode is in the same plane with the upper surface of the heating resistor, so that the current capacity of the bus electrode is improved, and the position and structure of the bus electrode protection layer above the bus electrode do not need to be changed, so that the volume of the thermal printhead is not increased; in addition, the upper surface of the bus electrode and the upper surface of the heating resistor are on the same plane, so that the thickness of the bus electrode protection layer does not need to be changed, a convex part is not formed in a region corresponding to the bus electrode part on the surface of the thermal printing head, the wear resistance of the bus electrode protection layer and the heating resistor protection layer can be improved, and the service lives of the bus electrode and the heating resistor can be prolonged.
In one embodiment, the thickness of the bus electrode protection layer 14 is the same as the thickness of the heating resistor protection layer 13, and the upper surface of the bus electrode protection layer 14 and the upper surface of the heating resistor protection layer 13 are on the same plane. The bus electrode protection layer 14 is used for protecting the bus electrode 11, the heating resistor protection layer 13 is used for protecting the heating resistor 12, and the upper surfaces of the bus electrode protection layer 14 and the heating resistor protection layer 13 are on the same plane, so that no convex area is formed, and the abrasion speed of the protection layer when being extruded by an external compression roller can be reduced.
For the bus electrode 11, specifically referring to fig. 1, the bus electrode 11 may include an upper bus electrode layer 11a, a middle bus electrode layer 11b, and a lower bus electrode layer 11c; the lower bus electrode layer 11c, the middle bus electrode layer 11b, and the upper bus electrode layer 11a are stacked from bottom to top to form the bus electrode 11.
In one embodiment, referring to fig. 1, the bus electrode structure further includes a glass glaze layer 15, the glass glaze layer 15 is located on the substrate, the bus electrode and the heating resistor are transversely arranged on the glass glaze layer 15, the glass glaze layer 15 is provided with a groove, and the bus electrode 11 and the heating resistor 12 are transversely arranged on the glass glaze layer 15; wherein the bottom of the bus electrode 11 is filled into the groove. A groove is formed in the glass glaze layer area corresponding to the bus electrode 11, the bottom of the bus electrode 11 is filled into the groove, and obviously the thickness of the glass glaze layer in the area corresponding to the bus electrode 11 is smaller than that of the glass glaze layer corresponding to the heating resistor 12, so that the upper surface of the substrate 10 is on a plane.
Specifically, the lower bus electrode layer 11c may be located on the groove of the glass glaze layer 15, and the upper surface of the lower bus electrode layer 11c is on the same plane with the upper surface of the glass glaze layer below the heating unit, that is, the depth of the groove of the glass glaze layer may be equal to the thickness of the lower bus electrode layer 11c, and fig. 1 shows the case that the heights of the two are equal.
The glass glaze layer may not be printed under the bus electrode, as shown in fig. 3, and the bus electrode 11 may be directly contacted with the substrate 10. In another embodiment, the glass glaze layer 15 is arranged between the heating resistor and the substrate 10, the glass glaze layer 15 is not arranged between the bus electrode and the substrate, and the glass glaze layer 15 and the bus electrode 11 are transversely arranged on the substrate 10.
In one embodiment, the lower surface of the glass frit layer 15 and the lower surface of the bus electrode may be on the same plane. Specifically, the thickness of the lower bus electrode layer 11c is equal to the thickness of the glass glaze layer, and then the sum of the thicknesses of the upper bus electrode layer 11a and the middle bus electrode layer 11b is the same as the thickness of the heating resistor, so that the upper surface of the upper bus electrode layer 11a is in the same plane as the upper surface of the heating resistor layer, the lower surface of the middle bus electrode layer 11b is in the same plane as the lower surface of the heating resistor layer, and the upper surface of the lower bus electrode layer 11c, the lower surface of the heating resistor 13, and the upper surface of the glass glaze layer 15 are in the same plane.
In the embodiment shown in fig. 3, since the glass glaze layer 15 is not arranged below the bus electrode 11, the thickness of the bus electrode 11 is increased, the larger the current capacity is, the lower the resistance is, the smaller the heat productivity of the bus electrode is, and the lower the power consumption is.
The thickness of the bus electrode may be further increased, in one embodiment, referring to fig. 4, the substrate 10 is provided with a groove, and the bottom of the bus electrode 11 is filled into the groove of the substrate 10. Obviously, the plane of the lower surface of the bus electrode 11 is lower than that of the lower surface of the glass glaze layer 15, the thickness of the bus electrode 11 is thicker, the current capacity is larger, the resistance is lower, the heat productivity of the bus electrode in operation is smaller, and the power consumption is lower.
The invention also provides a thermal print head.
In one embodiment, a thermal printhead includes a bus electrode architecture as in any of the embodiments above. Referring to fig. 1, 3 and 4, the thermal printhead further includes a glass glaze layer 15 between the substrate and the heating resistor. The thermal print head further includes a conductive pattern layer including a common electrode 16 and an individual electrode 17; referring to fig. 2, the common electrode 16 and the individual electrodes 17 are arranged on the glass frit layer 15 at a spacing in the lateral direction. Specifically, the heating resistor, the common electrode 16, and the individual electrodes 17 are arranged on the glass frit layer 15, and the heating resistor in the intermediate region of the common electrode 16 and the individual electrodes 17 is a heating element.
Referring to fig. 1, a glass glaze layer 15 is also disposed between the substrate 10 and the bus electrode 11, a glass glaze layer region corresponding to the bus electrode 11 is provided with a groove, the bottom of the bus electrode is filled into the groove, and it is obvious that the thickness of the glass glaze layer in the corresponding region of the bus electrode is smaller than that of the glass glaze layer corresponding to the heating resistor, so that the upper surface of the substrate 10 is on a plane.
The invention also provides a thermal printer.
In one embodiment, the thermal printer includes the thermal print head in any of the above embodiments, and the thermal print head may be a linear thermal print head, referring to fig. 5, and further includes a platen roller 18, and the platen roller 18 may be a cylindrical platen roller, and the print medium is pressed against the thermal print head by the platen roller 18.
Specifically, the printing medium is pressed against the bus electrode protective layer 14 and the heat generating resistor protective layer 13 by the pressing roller 18.
When the thermal printer works, the printing medium is pressed on the heating resistor through the cylindrical pressing roller (namely, the printing medium is positioned between the pressing roller and the thermal printing head), the heating resistor on the thermal printing head can selectively generate heat according to whether the thermal printing head is electrified or not, so that the printing medium contacted with the thermal printing hair heating resistor can selectively perform color reaction, and meanwhile, the cylindrical pressing roller rotates around the shaft, so that the printing medium is conveyed.
The invention also provides a preparation method of the thermal printing head.
Referring to fig. 6, a method for manufacturing a thermal print head according to an embodiment includes the following steps:
s11: and printing a heating resistor above the substrate to form a heating resistor band.
Specifically, a heating resistor layer is printed on the upper side of a substrate to form a heating resistor band. In one embodiment, the common electrode and the individual electrode are printed on the substrate, and then the heating resistor is printed so as to cover the common electrode and the individual electrode and the substrate in the area between the common electrode and the individual electrode, thereby forming the heating resistor band.
S12: and printing a bus electrode above the substrate in the transverse direction of the heating resistor, and starting to print the bus electrode from a starting printing surface lower than the heating resistor until the height of the bus electrode reaches the height of the heating resistor.
S13: and printing a bus electrode protection layer on the bus electrode, and printing a heating resistor protection layer on the heating resistor until the height of the bus electrode protection layer reaches the height of the heating resistor protection layer.
The glass glaze layer can be printed on the substrate, the thickness of the glass glaze layer is unequal, the thickness of the glass glaze layer of the printing area of the preset bus electrode is smaller than that of the glass glaze layer of the other areas, a groove with preset depth can be formed in the glass glaze layer area where the bus electrode is to be placed in advance, the thickness of the bus electrode which is larger than the heating resistor is equal to the preset depth of the groove, and the bus electrode starts to be printed in the groove of the glass glaze layer. The bus electrode can also be directly printed on the substrate, i.e. the bus electrode and the substrate are directly free of glass glaze.
In one embodiment, the step of printing the bus electrode over the substrate comprises: and printing a lower bus electrode layer on a substrate, printing a middle bus electrode layer on the lower bus electrode layer, and printing an upper bus electrode layer on the middle bus electrode layer until the upper surface of the upper bus electrode and the upper surface of the heating resistor are in the same plane. The steps before printing the heating resistor above the substrate comprise: and printing a glass glaze layer on the substrate, wherein the thickness of the glass glaze layer of the preset bus electrode printing area is smaller than that of the glass glaze layer of the rest areas.
For step S11, referring to fig. 1, the step of printing a heating resistor on the substrate is to print the heating resistor on the glass glaze layer on the substrate; the step of printing the lower bus electrode layer on the substrate is to print the lower bus electrode layer on the glass glaze layer of the preset bus electrode printing area until the upper surface of the lower bus electrode layer and the upper surface of the glass glaze layer of the rest area are positioned on the same plane.
The lower bus electrode and the substrate may be directly free of glass glaze layer, referring to fig. 3, i.e. the lower bus electrode layer may be directly printed on the substrate until the upper surface of the lower bus electrode layer and the upper surface of the rest glass glaze layer are in the same plane.
Further, referring to fig. 4, the thickness of the lower bus electrode layer may be greater than that of the glass glaze layer, a groove is formed on the substrate at a position where the bus electrode is to be printed, and the lower bus electrode layer is printed on the groove until the upper surface of the lower bus electrode layer and the upper surface of the glass glaze layer are in a plane.
In one embodiment, the step after printing the glass enamel layer on the substrate comprises:
preparing a conductive pattern layer on the glass glaze layer; wherein the conductive pattern layer includes a common electrode and an individual electrode; after preparing a conductive pattern layer on the glass glaze layer, printing a heating resistor layer on the glass glaze layer and the conductive pattern layer to form a heating resistor band;
and when the heating resistor is printed with the heating resistor protection layer, covering the conductive pattern layer with the heating resistor protection layer.
In one embodiment, the conductive pattern layer may include a common electrode, an individual electrode, and a middle bus electrode layer, i.e., the preparation of the common electrode, the individual electrode, and the printing of the middle bus electrode layer on the lower bus electrode layer are performed in the same step, so that the process steps of the thermal print head may be simplified.
The following describes a process flow of a method for manufacturing a thermal print head in one embodiment. In a specific embodiment, a glass glaze layer is printed on the substrate, the thicknesses of the glass glaze layers are unequal, and the thickness of the glass glaze layer of the preset bus electrode printing area is smaller than that of the glass glaze layer of the other areas; then printing a lower bus electrode layer on a glass glaze layer of a preset bus electrode area to be printed until the upper surface of the lower bus electrode layer and the upper surface of the glass glaze layer of a non-bus electrode printing area are positioned on the same horizontal plane; then printing a middle bus electrode layer on the lower bus electrode region, and printing a conductive pattern layer (the conductive pattern layer comprises a common electrode and an individual electrode) on the glass glaze layer in the transverse direction of the middle bus electrode layer; then printing a heating resistor layer on the conductive pattern layer and the glass glaze layer to form a heating resistor band; then printing an upper bus electrode layer on the middle bus electrode layer until the upper surface of the upper bus electrode layer and the upper surface of the heating resistor layer are positioned on the same plane, wherein the lower, middle and upper bus electrode layers form a bus electrode; finally, printing a bus electrode protection layer on the upper bus electrode layer and printing a heating resistor protection layer on the heating resistor layer.
The preparation method of the thermal printhead of the embodiment increases the thickness of the bus electrode, and increases the thickness of the bus electrode at the substrate side (the bus electrode below), the upper surface of the bus electrode and the upper surface of the heating resistor are on the same plane, so that the current capacity of the bus electrode is improved, the position and the structure of the bus electrode protection layer above the bus electrode are not required to be changed, and the volume of the thermal printhead is not increased; in addition, the upper surface of the bus electrode and the upper surface of the heating resistor are on the same plane, so that the thickness of the bus electrode protection layer does not need to be changed, a convex part is not formed in a region corresponding to the bus electrode part on the surface of the thermal printing head, the wear resistance of the bus electrode protection layer and the heating resistor protection layer can be improved, and the service lives of the bus electrode and the heating resistor can be prolonged.
The technical features of the above embodiments may be arbitrarily combined, and for brevity, all of the possible combinations of the technical features of the above embodiments are not described, but all of them should be within the scope of the disclosure as long as there is no contradiction.
The above-described embodiments represent only a few embodiments of the present invention, which are described in more detail and are not to be construed as limiting the scope of the present invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (7)
1. A bus electrode architecture, comprising:
a substrate;
a bus electrode disposed on the substrate; the bus electrode comprises an upper bus electrode layer, a middle bus electrode layer and a lower bus electrode layer; the lower bus electrode layer, the middle bus electrode layer and the upper bus electrode layer are stacked from bottom to top to form the bus electrode; a heating resistor transversely arranged on the substrate together with the bus electrode;
the heating resistor protection layer is covered on the heating resistor;
a bus electrode protection layer covering the bus electrode;
the thickness of the bus electrode is larger than that of the heating resistor, the upper surface of the bus electrode and the upper surface of the heating resistor are on the same plane, and the plane of the lower surface of the bus electrode is lower than that of the lower surface of the heating resistor;
the glass glaze layer is positioned on the substrate, the glass glaze layer is provided with a groove, and the bus electrode and the heating resistor are transversely arranged on the glass glaze layer; the bottom of the bus electrode is filled in the groove;
the upper surface of the lower bus electrode layer and the upper surface of the glass glaze layer in the rest area are positioned on the same plane.
2. The bus electrode structure of claim 1, wherein the thickness of the bus electrode protection layer is the same as the thickness of the heating resistor protection layer, and the upper surface of the bus electrode protection layer and the upper surface of the heating resistor protection layer are on the same plane.
3. The bus electrode structure as set forth in any one of claims 1-2,
the substrate is provided with a groove, and the bottom of the bus electrode is filled in the groove.
4. The bus electrode architecture of any one of claims 1-2, further comprising: and the glass glaze layer is positioned between the substrate and the heating resistor.
5. A thermal printhead comprising the bus electrode architecture of any one of claims 1-4.
6. A method of manufacturing a thermal printhead, comprising the steps of:
printing a glass glaze layer on the substrate, wherein the thickness of the glass glaze layer of a preset bus electrode printing area is smaller than that of the glass glaze layer of the other areas;
printing a heating resistor above the substrate to form a heating resistor band;
the step of printing the heating resistor above the substrate is to print the heating resistor on the glass glaze layer on the substrate;
printing a bus electrode over the substrate in a lateral direction of the heat generating resistor, comprising: printing a lower bus electrode layer on a substrate, printing a middle bus electrode layer on the lower bus electrode layer, and printing an upper bus electrode layer on the middle bus electrode layer until the upper surface of the upper bus electrode and the upper surface of the heating resistor are in the same plane;
the step of printing the lower bus electrode layer on the substrate is to print the lower bus electrode layer on the glass glaze layer of the preset bus electrode printing area until the upper surface of the lower bus electrode layer and the upper surface of the glass glaze layer of the rest area are positioned on the same plane;
printing the bus electrode from the initial printing surface lower than the heating resistor until the height of the bus electrode reaches the height of the heating resistor;
and printing a bus electrode protection layer on the bus electrode, and printing a heating resistor protection layer on the heating resistor until the height of the bus electrode protection layer reaches the height of the heating resistor protection layer.
7. The method of manufacturing a thermal print head as claimed in claim 6, wherein,
the steps after printing the glass glaze layer on the substrate comprise: preparing a conductive pattern layer on the glass glaze layer, and then printing a heating resistor layer on the glass glaze layer and the conductive pattern layer to form a heating resistor band; wherein the conductive pattern layer includes a common electrode and an individual electrode; and the preparation of the common electrode, the individual electrodes and the printing of the middle bus electrode layer are performed in the same step.
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| CN201711207890.3A CN107813615B (en) | 2017-11-27 | 2017-11-27 | Bus electrode framework, thermal printing head and preparation method thereof |
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| CN201711207890.3A CN107813615B (en) | 2017-11-27 | 2017-11-27 | Bus electrode framework, thermal printing head and preparation method thereof |
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| CN109263295B (en) * | 2018-08-31 | 2020-04-10 | 潮州三环（集团）股份有限公司 | Thermal printing head and preparation method thereof |
| CN113386469B (en) * | 2020-03-11 | 2022-07-01 | 深圳市博思得科技发展有限公司 | Thermal print head and method of manufacturing the same |
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| JPH07108694A (en) * | 1993-10-12 | 1995-04-25 | Rohm Co Ltd | Thermal head, and printer using the head |
| KR100359635B1 (en) * | 1999-02-18 | 2002-11-04 | 로무 가부시키가이샤 | Thermal print head and method of manufacture thereof |
| JP4515858B2 (en) * | 2004-08-18 | 2010-08-04 | ローム株式会社 | Manufacturing method of thermal print head |
| JP4633442B2 (en) * | 2004-11-04 | 2011-02-16 | ローム株式会社 | Thermal head |
| CN101020391B (en) * | 2006-02-14 | 2010-04-14 | 山东华菱电子有限公司 | Thermosensitive printing head and thermal printer therewith |
| CN201573391U (en) * | 2010-01-06 | 2010-09-08 | 山东华菱电子有限公司 | Thermal sensitive printhead |
| WO2014051143A1 (en) * | 2012-09-28 | 2014-04-03 | 京セラ株式会社 | Thermal head and thermal printer provided with same |
| JP2015182366A (en) * | 2014-03-25 | 2015-10-22 | 京セラ株式会社 | Thermal head and thermal printer |
| JP6352786B2 (en) * | 2014-11-28 | 2018-07-04 | 京セラ株式会社 | Thermal head and thermal printer equipped with the same |
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2017
- 2017-11-27 CN CN201711207890.3A patent/CN107813615B/en active Active
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| CN107813615A (en) | 2018-03-20 |
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