CN103956306B - Miniature surface-adhered type fuse - Google Patents
Miniature surface-adhered type fuse Download PDFInfo
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- CN103956306B CN103956306B CN201410215883.8A CN201410215883A CN103956306B CN 103956306 B CN103956306 B CN 103956306B CN 201410215883 A CN201410215883 A CN 201410215883A CN 103956306 B CN103956306 B CN 103956306B
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Abstract
The present invention discloses a kind of miniature surface-adhered type fuse, comprise fusing chip, this fusing chip is primarily of two termination electrodes, ceramic substrate, the first melt layer and the first arc extinguishing glassy layer composition, and the second arc extinguishing glassy layer is covered in the region by the second melt layer in the second melt layer and back electrode; There is in the middle of one the fusing body of manhole, the preparation of its termination has metal level, fusing chip is positioned at the manhole of this fusing body, and two crown caps lay respectively at fusing body two ends and cover its manhole thus form closed chamber, and termination electrode is electrically connected with crown cap by weld tabs; Metal level is provided with between crown cap and fusing body side; Glass glazings is provided with between ceramic substrate and first, second melt layer.Miniature surface-adhered type fuse of the present invention reduces arcing and the risk of short circuit again after reduction fusing, and increase the insulation resistance after fusing, the metallic vapour being also conducive to melt layer can be absorbed uniformly by arc extinguishing glassy layer.
Description
Technical field
The present invention relates to fuse technologies field, be specifically related to a kind of miniature surface-adhered type fuse.
Background technology
Existing fuse and being manufactured with: the fuse that fuse, sheet resistance technique that solely lapicide's skill makes make and wear fuse wiry in insulator.The method that only lapicide's skill makes is by one or more layers melt of thick film screen printing on ceramic green sheet, the green compact of discrete component are formed through horizontal and vertical cutting, again through burning, end-blocking and plating obtain altogether, its advantage is that its glass ceramics has stronger arc extinguishing ability, therefore larger breaking capacity can be reached, shortcoming is that its fabrication cycle is longer, exists and interpenetrate risk and cause consistency not good when fuse-link and green compact burn altogether, sheet resistance technique is a very ripe technique, its basic technology first provides the insulating substrate with positive and negative, substrate there is horizontal and vertical grooving, thus substrate is divided into multiple rectangular element, table electrode is formed respectively subsequently on on-chip each unit, the protective layer of back electrode and melt and covering melt, by substrate longitudinally grooving be divided into many substrates, the both sides end face of each bar substrate forms electrode in termination, finally each bar substrate be divided into multiple rectangular element by horizontal grooving thus obtain required chip, its advantage is that manufacture technics flow process is simple, fabrication cycle is short, can produce in enormous quantities, its shortcoming to be applied in high voltage, in high reliability environment, in insulator, wearing fuse wiry modal is passed on a skill of craft to others by fuse after ceramic body internal cavity to be connected with termination electrode again, its advantage is that this fuse breaking capacity is larger, and consistency is also better, shortcoming is that fuse is tiny easily broken, wear a complex process, inefficiency, be difficult to carry out large batch of making, and fuse shape can design limited.
Summary of the invention
The object of the invention is to provide a kind of miniature surface-adhered type fuse, this miniature surface-adhered type fuse reduces arcing and the risk of short circuit again after reduction fusing, increase the insulation resistance after fusing, the metallic vapour being also conducive to melt layer can be absorbed uniformly by arc extinguishing glassy layer.
For achieving the above object, the technical solution used in the present invention is: a kind of miniature surface-adhered type fuse, comprise fusing chip, this fusing chip forms primarily of two termination electrodes, ceramic substrate, the first melt layer and the first arc extinguishing glassy layer, described first melt layer is positioned at ceramic substrate upper surface, two described termination electrodes lay respectively at the first melt layer both sides and are electrically connected with described first melt layer, and described first arc extinguishing glassy layer is covered in the region by melt layer in described first melt layer and termination electrode;
Described termination electrode forms by showing electrode, back electrode and lateral electrode, the described table electrode being positioned at described ceramic substrate upper surface is positioned at described first melt layer side, show the subregion in electrode by the region of the first melt layer in described termination electrode for this reason, described back electrode is positioned at described ceramic substrate lower surface, and described lateral electrode is electrically connected described table electrode and back electrode; One second melt layer is positioned at ceramic substrate lower surface, and two described back electrodes lay respectively at described second melt layer both sides and are electrically connected with described second melt layer; Described second arc extinguishing glassy layer is covered in the region by the second melt layer in described second melt layer and back electrode;
There is in the middle of one the fusing body of manhole, the preparation of its termination has metal level, described fusing chip is positioned at the manhole of this fusing body, two crown caps lay respectively at described fusing body two ends and cover its manhole thus form closed chamber, and described termination electrode is electrically connected with described crown cap by weld tabs; Metal level is provided with between described crown cap and fusing body side; Glass glazings is provided with between described ceramic substrate and first, second melt layer.
The technical scheme improved further in technique scheme is as follows:
1, in such scheme, a protective layer is covered in described first arc extinguishing glassy layer, table electrode, the second arc extinguishing glassy layer and back electrode surface.
2, in such scheme, described protective layer is mineral modified bisphenols resin, mineral content 40% ~ 50%.
3, in such scheme, described Ceramic Substrate Material is forsterite ceramics substrate.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
1, miniature surface-adhered type fuse provided by the invention, its chip has on the ceramic substrate of insulating glass glaze layer of the densification of high softening-point in preparation, fuse layer is made by thick film screen printing, step sintering technique, therefore there is not mutual infiltration problem when the fuse that is similar to only lapicide's skill and base material burn altogether, and then there is not the not good problem of chip consistency caused because fuse infiltration.
2, miniature surface-adhered type fuse provided by the invention, in its chip, fuse can be designed to concatemer structure, or chip design is bilateral structure, avoid the thickness or the width that increase fusing unit because fuse rated current increases, cause local molten metal excessive, the metallic vapour produced when arc extinguishing layer all can not absorb fusing when making fusing, concatemer structure can by the separately also uniform arrangement of fusing unit, the metallic vapour produced when fusing can be absorbed uniformly by arc extinguishing layer, reduce arcing and the risk of short circuit again after reduction fusing, the insulation resistance after fusing can also be increased.
Accompanying drawing explanation
Fig. 1 is that the present invention fuses body construction schematic diagram;
Fig. 2 is the fusing body construction schematic diagram that the present invention has metal level;
Fig. 3 is ceramic substrate structural representation of the present invention;
Fig. 4 is the ceramic substrate structural representation that the present invention has glass glazings;
Fig. 5-7 is miniature surface-adhered type fuse manufacturing process schematic diagram of the present invention;
Fig. 8 is the plan structure schematic diagram of accompanying drawing 5;
Fig. 9 is the plan structure schematic diagram of accompanying drawing 6;
Figure 10 is the plan structure schematic diagram of accompanying drawing 7;
Figure 11 is miniature surface-adhered type fuse broken section structural representation of the present invention;
Figure 12 is miniature surface-adhered type fuse broken section structural representation of the present invention;
In above accompanying drawing: 1, fuse chip; 2, termination electrode; 3, ceramic substrate; 4, the first melt layer; 5, the first arc extinguishing glassy layer; 6, manhole; 7, fuse body; 8, crown cap; 9, weld tabs; 10, resilient coating; 11, glass glazings; 12, electrode is shown; 13, back electrode; 14, lateral electrode; 15, protective layer; 16, metal level; 17, the second melt layer; 18, the second arc extinguishing glassy layer.
Embodiment
Below in conjunction with embodiment, the invention will be further described:
Embodiment: a kind of miniature surface-adhered type fuse, comprise fusing chip 1, this fusing chip 1 forms primarily of two termination electrodes 2, ceramic substrate 3, first melt layer 4 and the first arc extinguishing glassy layer 5, described first melt layer 4 is positioned at ceramic substrate 3 upper surface, two described termination electrodes 2 lay respectively at the first melt layer 4 both sides and are electrically connected with described first melt layer 4, and described first arc extinguishing glassy layer 5 is covered in the region by melt layer in described first melt layer 4 and termination electrode 2;
Described termination electrode 2 is made up of table electrode 12, back electrode 13 and lateral electrode 14, the described table electrode 12 being positioned at described ceramic substrate 3 upper surface is positioned at described first melt layer 4 side, show the subregion in electrode 12 by the region of the first melt layer 4 in described termination electrode 2 for this reason, described back electrode 13 is positioned at described ceramic substrate 3 lower surface, and described lateral electrode 14 is electrically connected described table electrode 12 and back electrode 13; One second melt layer 17 is positioned at ceramic substrate 3 lower surface, and two described back electrodes 13 lay respectively at described second melt layer 17 both sides and are electrically connected with described second melt layer 17; Described second arc extinguishing glassy layer 18 is covered in the region by the second melt layer 17 in described second melt layer 17 and back electrode 13;
There is in the middle of one the fusing body 7 of manhole 6, the preparation of its termination has metal level 19, described fusing chip 1 is positioned at the manhole 6 of this fusing body 7, two crown caps 8 lay respectively at described fusing body 7 two ends and cover its manhole 6 thus form closed chamber, and described termination electrode 2 is electrically connected with described crown cap 8 by weld tabs 9; Metal level 16 is provided with between described crown cap 8 and fusing body 7 side; Glass glazings 11 is provided with between described ceramic substrate 3 and first, second melt layer 4,17.
One protective layer 15 is covered in described first arc extinguishing glassy layer 5, table electrode 12, second arc extinguishing glassy layer 18 and back electrode 13 surface.
Above-mentioned protective layer 15 is mineral modified bisphenols resin, mineral content 40% ~ 50%; Above-mentioned ceramic substrate 3 material is forsterite ceramics substrate.
The present embodiment foregoing is further described below.
1. the body that fuses is selected: as shown in Figure 1, select the fusing body 7 of hollow ceramic, and its internal via shape is circular, and its material must meet high-insulation and good heat-insulating property, and can bear-65 DEG C to 125 DEG C thousands of secondary thermal shocks.Can select to be aluminium oxide ceramics or aluminium oxide and zirconia composite ceramics.
2. fuse termination metal level makes, and as shown in Figure 2, fusing body 7 termination and endoporus makes metal level 16.
3. the ceramic substrate of chip 1 is selected, and as shown in Figure 3, the ceramic substrate 3 of chip, it is front with the aluminium oxide ceramics of direction indentation in length and breadth, if need consider heat conduction aspect, must all make glass glazings 11 in ceramic substrate surface and the back side.
4. glass glazings 11 makes, adopt thick film print technology on ceramic substrate, make glass glazings 11, as shown in Figure 4, its softening point is greater than the firing temperature of metal fuse, and has good heat-proof quality, its burn till after thickness 0.01 ~ 0.1mm.Conventional glass glazings 11 material is SiO2B2O3 system or SiO2B2O3Pb2O3 system glass.
5. the first melt layer and table electrode fabrication, as shown in Figure 5, can adopt the methods such as silk screen printing, inkjet printing, miniature carving print, bat printing on ceramic substrate or glass glaze, make the first melt layer 4 and table electrode 12.If table electrode is too thin, thicken by thick film print technology.
6. the second melt layer and back electrode make, and as shown in Figure 5, can adopt the methods such as silk screen printing, inkjet printing, miniature carving print, bat printing on ceramic substrate or glass glaze, make the second melt layer 17 and back electrode 13.If back electrode is too thin, thicken by thick film print technology.
7. arc extinguishing layer makes, and as shown in Figure 6, the first melt layer 4 and part table electrode 12 makes arc extinguishing glassy layer 5; And arc extinguishing glassy layer 5 is made in the second melt layer 17 and part back electrode 13; In order to the metallic vapour produced when can absorb fuse failure more, arc extinguishing layer is designed to loose structure, such as, selects the arc extinguishing glass between softening point 350 DEG C ~ 650 DEG C, be made into pore diameter between 0.001mm ~ 0.1mm, the arc extinguishing glassy layer 5 of thickness between 0.05mm ~ 0.5mm.
8. protective layer makes, and as shown in Figure 7, arc extinguishing glassy layer 5 and part table electrode 12 makes protective layer 15; And protective layer 15 is made on arc extinguishing glassy layer 5 and part back electrode 13.
9. lateral conduction layer makes, and as shown in Figure 7, makes lateral electrode 14 in ceramic substrate side.
10. fuse assembling, as shown in Figure 11, installs to chipset in fuse pottery endoporus, then by vacuum soldering process, two crown caps 8 are welded in endoporus on the ceramic termination of the fuse being assembled with melt by use weld tabs 9.After plating, become finished product.In order to improve product reliability, can consider to fill additive (as shown in Figure 12) in chip and fuse pottery endoporus space.
Above-described embodiment, only for technical conceive of the present invention and feature are described, its object is to person skilled in the art can be understood content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences done according to Spirit Essence of the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (4)
1. a miniature surface-adhered type fuse, comprise fusing chip (1), this fusing chip (1) is primarily of two termination electrodes (2), ceramic substrate (3), first melt layer (4) and the first arc extinguishing glassy layer (5) composition, described first melt layer (4) is positioned at ceramic substrate (3) upper surface, two described termination electrodes (2) lay respectively at the first melt layer (4) both sides and are electrically connected with described first melt layer (4), described first arc extinguishing glassy layer (5) is covered in the region by melt layer in described first melt layer (4) and termination electrode (2), it is characterized in that:
Described termination electrode (2) is made up of table electrode (12), back electrode (13) and lateral electrode (14), the described table electrode (12) being positioned at described ceramic substrate (3) upper surface is positioned at described first melt layer (4) side, show the subregion in electrode (12) by the region of the first melt layer (4) in described termination electrode (2) for this reason, described back electrode (13) is positioned at described ceramic substrate (3) lower surface, and described lateral electrode (14) is electrically connected described table electrode (12) and back electrode (13); One second melt layer (17) is positioned at ceramic substrate (3) lower surface, and two described back electrodes (13) lay respectively at described second melt layer (17) both sides and are electrically connected with described second melt layer (17); One second arc extinguishing glassy layer (18) is covered in the region by the second melt layer (17) in described second melt layer (17) and back electrode (13);
There is in the middle of one the fusing body (7) of manhole (6), the preparation of its termination has the first metal layer (19), described fusing chip (1) is positioned at the manhole (6) of this fusing body (7), two crown caps (8) lay respectively at described fusing body (7) two ends and cover its manhole (6) thus form closed chamber, and described termination electrode (2) is electrically connected with described crown cap (8) by weld tabs (9); Arrange second between described crown cap (8) and fusing body (7) side and have metal level (16); Glass glazings (11) is provided with between described ceramic substrate (3) and first, second melt layer (4,17).
2. miniature surface-adhered type fuse according to claim 1, is characterized in that: a protective layer (15) is covered in described first arc extinguishing glassy layer (5), table electrode (12), the second arc extinguishing glassy layer (18) and back electrode (13) surface.
3. miniature surface-adhered type fuse according to claim 2, is characterized in that: described protective layer (15) is mineral modified bisphenols resin, mineral content 40% ~ 50%.
4. miniature surface-adhered type fuse according to claim 1, is characterized in that: described ceramic substrate (3) material is forsterite ceramics substrate.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210142757.5A CN102646558B (en) | 2012-05-10 | 2012-05-10 | High pressure resistant surface mounted fuse |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210142757.5A Division CN102646558B (en) | 2012-05-10 | 2012-05-10 | High pressure resistant surface mounted fuse |
Publications (2)
| Publication Number | Publication Date |
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| CN103956306A CN103956306A (en) | 2014-07-30 |
| CN103956306B true CN103956306B (en) | 2016-01-20 |
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Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410215885.7A Active CN103956307B (en) | 2012-05-10 | 2012-05-10 | High reliability fuse |
| CN201410216621.3A Active CN103972002B (en) | 2012-05-10 | 2012-05-10 | Anti-arcing pasting type fuse |
| CN201410215883.8A Active CN103956306B (en) | 2012-05-10 | 2012-05-10 | Miniature surface-adhered type fuse |
| CN201210142757.5A Active CN102646558B (en) | 2012-05-10 | 2012-05-10 | High pressure resistant surface mounted fuse |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410215885.7A Active CN103956307B (en) | 2012-05-10 | 2012-05-10 | High reliability fuse |
| CN201410216621.3A Active CN103972002B (en) | 2012-05-10 | 2012-05-10 | Anti-arcing pasting type fuse |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210142757.5A Active CN102646558B (en) | 2012-05-10 | 2012-05-10 | High pressure resistant surface mounted fuse |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102664127B (en) * | 2012-05-10 | 2014-11-26 | 苏州晶讯科技股份有限公司 | Surface-mounted fuser |
| CN104319208B (en) * | 2014-10-27 | 2016-08-31 | 南京萨特科技发展有限公司 | Explosion-proof miniature protection element and preparation method thereof |
| TWI569399B (en) * | 2015-11-27 | 2017-02-01 | Cheering Sun Applied Materials Co Ltd | Chip fuse element with pre-cut substrate and method for making the same |
| CN109192635B (en) * | 2018-10-19 | 2024-02-13 | Aem科技(苏州)股份有限公司 | Fuse and production method thereof |
| US11063320B2 (en) * | 2019-01-08 | 2021-07-13 | Lg Chem, Ltd. | Terminal busbar |
| CN110137055A (en) * | 2019-05-07 | 2019-08-16 | 南京萨特科技发展有限公司 | A kind of insulation tube inside adds the protection element of grid |
| CN112951680A (en) * | 2021-02-25 | 2021-06-11 | 西安交通大学 | Structure for improving rated current capacity of vacuum fuse based on double-gap structure |
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| US4260976A (en) * | 1979-02-09 | 1981-04-07 | Westinghouse Electric Corp. | Current limiting fuse with auxiliary element |
| US4926153A (en) * | 1989-06-02 | 1990-05-15 | Cooper Industries, Inc. | Ceramic fuse wire coating |
| US5097246A (en) * | 1990-04-16 | 1992-03-17 | Cooper Industries, Inc. | Low amperage microfuse |
| JPH06342623A (en) * | 1993-06-01 | 1994-12-13 | S O C Kk | Chip fuse |
| CN1131334A (en) * | 1994-12-22 | 1996-09-18 | 中岛卓夫 | Thermal fuse |
| JP3777284B2 (en) * | 2000-03-28 | 2006-05-24 | 釜屋電機株式会社 | Manufacturing method of chip-type fuse resistor |
| JP2003249403A (en) * | 2002-02-25 | 2003-09-05 | Koa Corp | Chip resistor |
| EP1797576A4 (en) * | 2004-09-15 | 2008-12-10 | Littelfuse Inc | High voltage/high current fuse |
| US7268661B2 (en) * | 2004-09-27 | 2007-09-11 | Aem, Inc. | Composite fuse element and methods of making same |
| US20060119465A1 (en) * | 2004-12-03 | 2006-06-08 | Dietsch G T | Fuse with expanding solder |
| JP2007115601A (en) * | 2005-10-21 | 2007-05-10 | Tdk Corp | Chip type fuse element and its manufacturing method |
| US8154376B2 (en) * | 2007-09-17 | 2012-04-10 | Littelfuse, Inc. | Fuses with slotted fuse bodies |
| US9190235B2 (en) * | 2007-12-29 | 2015-11-17 | Cooper Technologies Company | Manufacturability of SMD and through-hole fuses using laser process |
| CN101441960B (en) * | 2008-11-25 | 2011-05-11 | 南京萨特科技发展有限公司 | Multilayer tablet fuse and method of manufacturing the same |
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| CN101593585A (en) * | 2009-04-30 | 2009-12-02 | 中国振华集团云科电子有限公司 | Plate type fuse resistor |
| US8203420B2 (en) * | 2009-06-26 | 2012-06-19 | Cooper Technologies Company | Subminiature fuse with surface mount end caps and improved connectivity |
| CN201829441U (en) * | 2010-10-08 | 2011-05-11 | Aem科技(苏州)股份有限公司 | Surface mount fuse |
| CN201829440U (en) * | 2010-10-08 | 2011-05-11 | Aem科技(苏州)股份有限公司 | Slow fusion type surface mounted fuse |
-
2012
- 2012-05-10 CN CN201410215885.7A patent/CN103956307B/en active Active
- 2012-05-10 CN CN201410216621.3A patent/CN103972002B/en active Active
- 2012-05-10 CN CN201410215883.8A patent/CN103956306B/en active Active
- 2012-05-10 CN CN201210142757.5A patent/CN102646558B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN102646558B (en) | 2014-07-09 |
| CN103956306A (en) | 2014-07-30 |
| CN103956307B (en) | 2016-02-10 |
| CN103956307A (en) | 2014-07-30 |
| CN103972002B (en) | 2016-02-10 |
| CN102646558A (en) | 2012-08-22 |
| CN103972002A (en) | 2014-08-06 |
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