CN103956307A - High-reliability fuse - Google Patents
High-reliability fuse Download PDFInfo
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- CN103956307A CN103956307A CN201410215885.7A CN201410215885A CN103956307A CN 103956307 A CN103956307 A CN 103956307A CN 201410215885 A CN201410215885 A CN 201410215885A CN 103956307 A CN103956307 A CN 103956307A
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Abstract
The invention discloses a high-reliability fuse which comprises a fusing chip. The fusing chip mainly consists of two end electrodes, a ceramic substrate, a first melt layer and a first arc extinguishing glass layer, wherein the first arc extinguishing glass layer covers the first melt layer and regions of the end electrodes close to the first melt layer. Each end electrode consists of a surface electrode, a back electrode and a side electrode, and the surface electrodes located on the upper surface of the ceramic substrate are located on one side of the first melt layer. A metal layer is prepared at the end of a fusing body provided with a round through hole in the middle, and the fusing chip is located in the round through hole of the fusing body. The fusing body is made from zirconium oxide doped aluminum oxide ceramic, and the zirconium oxide content is 5%-20%. The ceramic substrate is a forsterite ceramic substrate. The high-reliability fuse decreases arc discharge, reduces the re-short-circuit risk after fusing, is high-temperature-resisting and high-strength and can wrap a fuse wire and arc extinguishing glass well.
Description
Technical field
The present invention relates to fuse technical field, be specifically related to a kind of high reliability fuse.
Background technology
Existing fuse and being manufactured with: the fuse that the fuse that solely lapicide's skill is made, sheet resistance technique are made and wear fuse wiry in insulator.The method that solely lapicide's skill is made is by one or more layers melt of thick film screen printing on ceramic green sheet, through horizontal and vertical cutting, form the green compact of discrete component, again through burning, end-blocking and plating obtain altogether, its advantage is that its glass ceramics has stronger arc extinguishing ability, therefore can reach larger breaking capacity, shortcoming is that its fabrication cycle is longer, and when fuse-link and green compact burn altogether, existence interpenetrates risk and causes consistency not good, sheet resistance technique is a very ripe technique, its basic technology is that first the insulating substrate with positive and negative is provided, on substrate, there is horizontal and vertical grooving, thereby substrate is divided into a plurality of rectangular elements, on on-chip each unit, form respectively subsequently table electrode, back electrode and melt and the protective layer that covers melt, by substrate longitudinally grooving be divided into many substrates, on the end face of the both sides of each substrate, form electrode in termination, thereby finally each substrate is divided into a plurality of rectangular elements by horizontal grooving and obtains needed chip, its advantage is that technique manufacturing process is simple, fabrication cycle is short, can produce in enormous quantities, its shortcoming is to be applied in high voltage, in high reliability environment, in insulator, wearing fuse wiry modal is that fuse is passed on a skill of craft to others after ceramic body internal cavity and is connected with termination electrode, its advantage is that this fuse breaking capacity is larger, and consistency is also better, shortcoming is that fuse is tiny easily broken, wear a complex process, inefficiency, be difficult to carry out large batch of making, and fuse shape can design limited.
Summary of the invention
The object of the invention is to provide a kind of high reliability fuse, the metallic vapour that this high reliability fuse is conducive to melt layer can be absorbed uniformly by arc extinguishing glassy layer, again the risk of short circuit after reducing arcing and reducing fusing, can also increase the insulation resistance after fusing; Secondly, it has high temperature resistant, high strength, can be well by fuse and arc extinguishing glass-coated interior, improve greatly bulk strength and breaking capacity and the cold-hot impact capacity of fuse.
For achieving the above object, the technical solution used in the present invention is: a kind of high reliability fuse, comprise fusing chip, this fusing chip is mainly comprised of two termination electrodes, ceramic substrate, the first melt layer and the first arc extinguishing glassy layer, described the first melt layer is positioned at ceramic substrate upper surface, two described termination electrodes lay respectively at the first melt layer both sides and are electrically connected to described the first melt layer, and described the first arc extinguishing glassy layer is covered in the region of leaning on melt layer in described the first melt layer and termination electrode;
Described termination electrode forms by showing electrode, back electrode and lateral electrode, the described table electrode that is positioned at described ceramic substrate upper surface is positioned at described the first melt layer one side, the subregion in electrode is shown in region by the first melt layer in described termination electrode for this reason, described back electrode is positioned at described ceramic substrate lower surface, and described lateral electrode is electrically connected to described table electrode and back electrode; One second melt layer is positioned at ceramic substrate lower surface, and two described back electrodes lay respectively at described the second melt layer both sides and are electrically connected to described the second melt layer; One second arc extinguishing glassy layer is covered in the region of leaning on the second melt layer in described the second melt layer and back electrode;
The fusing body in the middle of one with manhole, its termination is prepared with metal level, described fusing chip is positioned at the manhole of this fusing body, thereby two crown caps lay respectively at described fusing body two ends and cover its manhole and form closed chamber, and described termination electrode is electrically connected to described crown cap by weld tabs; Described fusing bulk material is zirconia doped aluminium pottery, and wherein zirconia content 5% ~ 20%; Described Ceramic Substrate Material is forsterite ceramics substrate.
In technique scheme, further improved technical scheme is as follows:
1, in such scheme, in described manhole, between fusing chip and fusing body, be filled with resilient coating, this resilient coating is silica modified silica gel, and wherein dioxide-containing silica 20% ~ 60%.
2, in such scheme, a protective layer is covered in described the first arc extinguishing glassy layer, table electrode, the second arc extinguishing glassy layer and back electrode surface, and this protective layer is mineral modified bisphenols resin, mineral content 40% ~ 50%.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
1, high reliability fuse provided by the invention, its chip is on the ceramic substrate of fine and close insulating glass glaze layer that is prepared with high softening-point, by thick film screen printing, step sintering technique, make fuse layer, therefore while not existing the fuse that is similar to only lapicide's skill to burn altogether with base material, do not interpenetrate problem, and then do not exist and permeate the not good problem of chip consistency causing because of fuse.
2, high reliability fuse provided by the invention, in its chip, fuse can be designed to concatermer structure or chip design is bilateral structure, avoid increasing because of fuse rated current thickness or the width of fusing unit, cause local melt metal excessive, the metallic vapour producing when arc extinguishing layer can not all absorb fusing while making to fuse.Concatermer structure can separately and uniformly be arranged fusing unit, and the metallic vapour producing when fusing can be absorbed uniformly by arc extinguishing layer, and the risk of short circuit again after reducing arcing and reducing fusing, can also increase the insulation resistance after fusing.
Accompanying drawing explanation
Fig. 1 is the present invention's body construction schematic diagram that fuses;
Fig. 2 is the fusing body construction schematic diagram that the present invention has metal level;
Fig. 3 is ceramic substrate structural representation of the present invention;
Fig. 4 is the ceramic substrate structural representation that the present invention has glass glaze layer;
Fig. 5 ~ 7 are high reliability fuse manufacturing process schematic diagram of the present invention;
Fig. 8 is the plan structure schematic diagram of accompanying drawing 5;
Fig. 9 is the plan structure schematic diagram of accompanying drawing 6;
Figure 10 is the plan structure schematic diagram of accompanying drawing 7;
Figure 11 is high reliability fuse broken section structural representation of the present invention;
Figure 12 is high reliability fuse broken section structural representation of the present invention.
In above accompanying drawing: 1, fusing chip; 2, termination electrode; 3, ceramic substrate; 4, the first melt layer; 5, the first arc extinguishing glassy layer; 6, manhole; 7, fusing body; 8, crown cap; 9, weld tabs; 10, resilient coating; 11, glass glaze layer; 12, table electrode; 13, back electrode; 14, lateral electrode; 15, protective layer; 16, metal level; 17, the second melt layer; 18, the second arc extinguishing glassy layer.
Embodiment
Below in conjunction with embodiment, the invention will be further described:
Embodiment: a kind of high reliability fuse, comprise fusing chip 1, this fusing chip 1 is mainly comprised of two termination electrodes 2, ceramic substrate 3, the first melt layer 4 and the first arc extinguishing glassy layer 5, described the first melt layer 4 is positioned at ceramic substrate 3 upper surfaces, two described termination electrodes 2 lay respectively at the first melt layer 4 both sides and are electrically connected to described the first melt layer 4, and described the first arc extinguishing glassy layer 5 is covered in the region of leaning on melt layer in described the first melt layer 4 and termination electrode 2;
Described termination electrode 2 is comprised of table electrode 12, back electrode 13 and lateral electrode 14, the described table electrode 12 that is positioned at described ceramic substrate 3 upper surfaces is positioned at described the first melt layer 4 one sides, the subregion in electrode 12 is shown in region by the first melt layer 4 in described termination electrode 2 for this reason, described back electrode 13 is positioned at described ceramic substrate 3 lower surfaces, and described lateral electrode 14 is electrically connected to described table electrode 12 and back electrode 13; One second melt layer 17 is positioned at ceramic substrate 3 lower surfaces, and two described back electrodes 13 lay respectively at described the second melt layer 17 both sides and are electrically connected to described the second melt layer 17; One second arc extinguishing glassy layer 18 is covered in the region of leaning on the second melt layer 17 in described the second melt layer 17 and back electrode 13;
The fusing body 7 in the middle of one with manhole 6, its termination is prepared with metal level 19, described fusing chip 1 is positioned at the manhole 6 of this fusing body 7, thereby two crown caps 8 lay respectively at described fusing body 7 two ends and cover its manhole 6 and form closed chamber, and described termination electrode 2 is electrically connected to described crown cap 8 by weld tabs 9; Described fusing body 7 materials are zirconia doped aluminium pottery, and wherein zirconia content 5% ~ 20%; Described ceramic substrate 3 materials are forsterite ceramics substrate.
Between the interior fusing chip 1 of above-mentioned manhole 6 and fusing body 7, be filled with resilient coating 10, this resilient coating 10 is silica modified silica gel, and wherein dioxide-containing silica 20% ~ 60%.
One protective layer 15 is covered in described the first arc extinguishing glassy layer 5, table electrode 12, the second arc extinguishing glassy layer 18 and back electrode 13 surfaces, and this protective layer 15 is mineral modified bisphenols resin, mineral content 40% ~ 50%.
The present embodiment foregoing is further described below.
1. fusing body is selected: as shown in Figure 1, select the fusing body 7 of hollow ceramic, its endoporus is shaped as circle, and its material must meet high-insulation and good heat-insulating property, and can bear-65 ℃ to 125 ℃ thousands of inferior thermal shocks.Can select is aluminium oxide ceramics or aluminium oxide and zirconia composite ceramics.
2. fuse termination metal level is made, and as shown in Figure 2, on fusing body 7 terminations and endoporus, makes metal level 16.
3. the ceramic substrate of chip 1 is selected, as shown in Figure 3, the ceramic substrate 3 of chip, it be positive with the aluminium oxide ceramics of direction indentation in length and breadth, if need to consider heat conduction aspect, must be at ceramic substrate the surperficial and back side all make glass glaze layer 11.
4. glass glaze layer 11 is made, and adopts thick film screen printing technique on ceramic substrate, to make glass glaze layer 11, and as shown in Figure 4, its softening point is greater than the firing temperature of metal fuse, and has good heat-proof quality, its thickness 0.01 ~ 0.1mm after burning till.Conventional glass glaze layer 11 material are that SiO2B2O3 is or SiO2B2O3Pb2O3 is glass.
5. the first melt layer and table electrode fabrication, as shown in Figure 5, can adopt the methods such as silk screen printing, inkjet printing, miniature carving seal, bat printing on ceramic substrate or glass glaze, to make the first melt layer 4 and table electrode 12.If table electrode is too thin, can thicken by thick film screen printing technique.
6. the second melt layer and back electrode are made, and as shown in Figure 5, can adopt the methods such as silk screen printing, inkjet printing, miniature carving seal, bat printing on ceramic substrate or glass glaze, to make the second melt layer 17 and back electrode 13.If back electrode is too thin, can thicken by thick film screen printing technique.
7. arc extinguishing layer is made, and as shown in Figure 6, in the first melt layer 4 and part, shows to make on electrode 12 arc extinguishing glassy layer 5; And make arc extinguishing glassy layer 5 on the second melt layer 17 and part back electrode 13; The metallic vapour producing in order to absorb fuse failure time more, arc extinguishing layer is designed to loose structure, for example, selects the arc extinguishing glass between 350 ℃ ~ 650 ℃ of softening points, be made into pore diameter between 0.001mm ~ 0.1mm, the arc extinguishing glassy layer 5 of thickness between 0.05mm ~ 0.5mm.
8. protective layer is made, and as shown in Figure 7, in arc extinguishing glassy layer 5 and part, shows to make on electrode 12 protective layer 15; And make protective layer 15 on arc extinguishing glassy layer 5 and part back electrode 13.
9. side conductive layer is made, and as shown in Figure 7, makes lateral electrode 14 in ceramic substrate side.
10. fuse assembling, as shown in Figure 11, installs to chipset in fuse pottery endoporus, then by vacuum welding technique, uses weld tabs 9 that two crown caps 8 are welded on the fuse pottery termination that is assembled with melt in endoporus.After electroplating, become finished product.In order to improve product reliability, can consider to fill additive (as shown in Figure 12) in chip and fuse pottery endoporus space.
Above-described embodiment is only explanation technical conceive of the present invention and feature, and its object is to allow person skilled in the art can understand content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences that Spirit Essence is done according to the present invention change or modify, within all should being encompassed in protection scope of the present invention.
Claims (3)
1. a high reliability fuse, comprise fusing chip (1), this fusing chip (1) is mainly comprised of two termination electrodes (2), ceramic substrate (3), the first melt layer (4) and the first arc extinguishing glassy layer (5), described the first melt layer (4) is positioned at ceramic substrate (3) upper surface, two described termination electrodes (2) lay respectively at the first melt layer (4) both sides and are electrically connected to described the first melt layer (4), described the first arc extinguishing glassy layer (5) is covered in the region of leaning on melt layer in described the first melt layer (4) and termination electrode (2), it is characterized in that:
Described termination electrode (2) is comprised of table electrode (12), back electrode (13) and lateral electrode (14), the described table electrode (12) that is positioned at described ceramic substrate (3) upper surface is positioned at described the first melt layer (4) one sides, the subregion in electrode (12) is shown in region by the first melt layer (4) in described termination electrode (2) for this reason, described back electrode (13) is positioned at described ceramic substrate (3) lower surface, and described lateral electrode (14) is electrically connected to described table electrode (12) and back electrode (13); One second melt layer (17) is positioned at ceramic substrate (3) lower surface, and two described back electrodes (13) lay respectively at described the second melt layer (17) both sides and are electrically connected to described the second melt layer (17); One second arc extinguishing glassy layer (18) is covered in the region of leaning on the second melt layer (17) in described the second melt layer (17) and back electrode (13);
The fusing body (7) in the middle of one with manhole (6), its termination is prepared with metal level (19), described fusing chip (1) is positioned at the manhole (6) of this fusing body (7), two crown caps (8) lay respectively at described fusing body (7) two ends and cover its manhole (6) thereby formation closed chamber, and described termination electrode (2) is electrically connected to described crown cap (8) by weld tabs (9); Described fusing body (7) material is zirconia doped aluminium pottery, and wherein zirconia content 5% ~ 20%; Described ceramic substrate (3) material is forsterite ceramics substrate.
2. high reliability fuse according to claim 1, it is characterized in that: in described manhole (6), between fusing chip (1) and fusing body (7), be filled with resilient coating (10), this resilient coating (10) is silica modified silica gel, and wherein dioxide-containing silica 20% ~ 60%.
3. high reliability fuse according to claim 1; it is characterized in that: a protective layer (15) is covered in described the first arc extinguishing glassy layer (5), table electrode (12), the second arc extinguishing glassy layer (18) and back electrode (13) surface; this protective layer (15) is mineral modified bisphenols resin, mineral content 40% ~ 50%.
Priority Applications (1)
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CN201410215885.7A CN103956307B (en) | 2012-05-10 | 2012-05-10 | High reliability fuse |
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CN201410215885.7A CN103956307B (en) | 2012-05-10 | 2012-05-10 | High reliability fuse |
CN201210142757.5A CN102646558B (en) | 2012-05-10 | 2012-05-10 | High pressure resistant surface mounted fuse |
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CN201210142757.5A Division CN102646558B (en) | 2012-05-10 | 2012-05-10 | High pressure resistant surface mounted fuse |
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CN103956307A true CN103956307A (en) | 2014-07-30 |
CN103956307B CN103956307B (en) | 2016-02-10 |
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CN201410216621.3A Active CN103972002B (en) | 2012-05-10 | 2012-05-10 | Anti-arcing pasting type fuse |
CN201410215885.7A Active CN103956307B (en) | 2012-05-10 | 2012-05-10 | High reliability fuse |
CN201210142757.5A Active CN102646558B (en) | 2012-05-10 | 2012-05-10 | High pressure resistant surface mounted fuse |
CN201410215883.8A Active CN103956306B (en) | 2012-05-10 | 2012-05-10 | Miniature surface-adhered type fuse |
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CN201410216621.3A Active CN103972002B (en) | 2012-05-10 | 2012-05-10 | Anti-arcing pasting type fuse |
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CN201210142757.5A Active CN102646558B (en) | 2012-05-10 | 2012-05-10 | High pressure resistant surface mounted fuse |
CN201410215883.8A Active CN103956306B (en) | 2012-05-10 | 2012-05-10 | Miniature surface-adhered type fuse |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112292746A (en) * | 2019-01-08 | 2021-01-29 | 株式会社Lg化学 | Terminal bus bar |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102664127B (en) * | 2012-05-10 | 2014-11-26 | 苏州晶讯科技股份有限公司 | Surface-mounted fuser |
CN104319208B (en) * | 2014-10-27 | 2016-08-31 | 南京萨特科技发展有限公司 | Explosion-proof miniature protection element and preparation method thereof |
TWI569399B (en) * | 2015-11-27 | 2017-02-01 | Cheering Sun Applied Materials Co Ltd | Chip fuse element with pre-cut substrate and method for making the same |
CN109192635B (en) * | 2018-10-19 | 2024-02-13 | Aem科技(苏州)股份有限公司 | Fuse and production method thereof |
CN110137055A (en) * | 2019-05-07 | 2019-08-16 | 南京萨特科技发展有限公司 | A kind of insulation tube inside adds the protection element of grid |
CN112951680A (en) * | 2021-02-25 | 2021-06-11 | 西安交通大学 | Structure for improving rated current capacity of vacuum fuse based on double-gap structure |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4926153A (en) * | 1989-06-02 | 1990-05-15 | Cooper Industries, Inc. | Ceramic fuse wire coating |
JP2003249403A (en) * | 2002-02-25 | 2003-09-05 | Koa Corp | Chip resistor |
CN101404233A (en) * | 2007-09-17 | 2009-04-08 | 保险丝公司 | Fuses with slotted fuse bodies |
CN101911238A (en) * | 2007-12-29 | 2010-12-08 | 库帕技术公司 | Manufacturability of SMD and through-hole fuses using laser process |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4260976A (en) * | 1979-02-09 | 1981-04-07 | Westinghouse Electric Corp. | Current limiting fuse with auxiliary element |
US5097246A (en) * | 1990-04-16 | 1992-03-17 | Cooper Industries, Inc. | Low amperage microfuse |
JPH06342623A (en) * | 1993-06-01 | 1994-12-13 | S O C Kk | Chip fuse |
CN1131334A (en) * | 1994-12-22 | 1996-09-18 | 中岛卓夫 | Thermal fuse |
JP3777284B2 (en) * | 2000-03-28 | 2006-05-24 | 釜屋電機株式会社 | Manufacturing method of chip-type fuse resistor |
EP1797576A4 (en) * | 2004-09-15 | 2008-12-10 | Littelfuse Inc | High voltage/high current fuse |
US7268661B2 (en) * | 2004-09-27 | 2007-09-11 | Aem, Inc. | Composite fuse element and methods of making same |
US20060119465A1 (en) * | 2004-12-03 | 2006-06-08 | Dietsch G T | Fuse with expanding solder |
JP2007115601A (en) * | 2005-10-21 | 2007-05-10 | Tdk Corp | Chip type fuse element and its manufacturing method |
CN101441960B (en) * | 2008-11-25 | 2011-05-11 | 南京萨特科技发展有限公司 | Multilayer tablet fuse and method of manufacturing the same |
US20110234362A1 (en) * | 2008-12-10 | 2011-09-29 | Raytheon Company | Shape memory circuit breakers |
CN101593585A (en) * | 2009-04-30 | 2009-12-02 | 中国振华集团云科电子有限公司 | Plate type fuse resistor |
US8203420B2 (en) * | 2009-06-26 | 2012-06-19 | Cooper Technologies Company | Subminiature fuse with surface mount end caps and improved connectivity |
CN201829440U (en) * | 2010-10-08 | 2011-05-11 | Aem科技(苏州)股份有限公司 | Slow fusion type surface mounted fuse |
CN201829441U (en) * | 2010-10-08 | 2011-05-11 | Aem科技(苏州)股份有限公司 | Surface mount fuse |
-
2012
- 2012-05-10 CN CN201410216621.3A patent/CN103972002B/en active Active
- 2012-05-10 CN CN201410215885.7A patent/CN103956307B/en active Active
- 2012-05-10 CN CN201210142757.5A patent/CN102646558B/en active Active
- 2012-05-10 CN CN201410215883.8A patent/CN103956306B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4926153A (en) * | 1989-06-02 | 1990-05-15 | Cooper Industries, Inc. | Ceramic fuse wire coating |
JP2003249403A (en) * | 2002-02-25 | 2003-09-05 | Koa Corp | Chip resistor |
CN101404233A (en) * | 2007-09-17 | 2009-04-08 | 保险丝公司 | Fuses with slotted fuse bodies |
CN101911238A (en) * | 2007-12-29 | 2010-12-08 | 库帕技术公司 | Manufacturability of SMD and through-hole fuses using laser process |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112292746A (en) * | 2019-01-08 | 2021-01-29 | 株式会社Lg化学 | Terminal bus bar |
CN112292746B (en) * | 2019-01-08 | 2024-04-09 | 株式会社Lg新能源 | Terminal bus bar |
Also Published As
Publication number | Publication date |
---|---|
CN103956307B (en) | 2016-02-10 |
CN102646558A (en) | 2012-08-22 |
CN103956306A (en) | 2014-07-30 |
CN103972002A (en) | 2014-08-06 |
CN103972002B (en) | 2016-02-10 |
CN103956306B (en) | 2016-01-20 |
CN102646558B (en) | 2014-07-09 |
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