CN203787375U - Chip type protection element - Google Patents
Chip type protection element Download PDFInfo
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- CN203787375U CN203787375U CN201420153609.8U CN201420153609U CN203787375U CN 203787375 U CN203787375 U CN 203787375U CN 201420153609 U CN201420153609 U CN 201420153609U CN 203787375 U CN203787375 U CN 203787375U
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- hole
- groove
- insulated substrate
- protection component
- chip
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Abstract
The utility model discloses a chip type protection element. The element comprises an insulating substrate, a metal fusant, end electrodes and a protection layer. A through hole is arranged in the middle of the insulating substrate. The opening direction of the through hole is vertical to the end electrodes. Grooves which are connected with the through hole are respectively arranged on upper and lower surfaces of the insulating substrate. The metal fusant comes in from the groove on one side of the insulating substrate, diagonally runs through the through hole, and comes out from the groove on the other side. Both ends of the metal fusant are fixed in the grooves through conductive adhesives, and are electrically connected with the end electrodes on both ends of the insulating substrate. The protection layer is formed between the end electrodes. According to the utility model, vertical diagonal threading is carried out on the metal fusant to form the design of a hanging fuse structure; and the produced chip type protection element has the advantages of high breaking capacity and high reliability, simple structure design, low cost and easy batch production, and eliminates two inherent defects of the traditional fuse structure.
Description
Technical field
The utility model belongs to electric component technical field, relates to a kind of chip-shaped protection component, especially relates to a kind ofly having vertical diagonal angle and wearing the high breaking capacity of a structure, the overflow protecting element of high reliability.
Background technology
Protection component is generally serially connected in circuit, while there is overcurrent or the anomaly such as overheated in circuit, can cut off circuit immediately and play the effect of protection, to prevent that fault from further expanding.Traditional protection component mainly contains two kinds of versions, and a kind of is that fuse-link level is worn to unsettled being arranged in tubulose insulation shell of silk, with end caps body two ends and provide and being electrically connected to and the function of surface soldered of internal fuse; Another kind is that fuse-link is molded over to insulated substrate surface, then the structure such as additional protective layer covers fuse-link, then at substrate two ends, forms respectively tip electrodes to draw fuse-link and to carry out surface soldered.These two kinds traditional protection component structures all have two similar inherent shortcomings: their tip electrodes all forms over against electrode structure, easily under high voltage, form persistence drag arc during disjunction; Fuse-link minute is being had no progeny, and its metallic vapour is easily deposited on insulation crust or substrate surface, causes the product insulation resistance of minute having no progeny to reduce, and the situation that cannot disconnect for a long time also may occur in the time of seriously.
In order to overcome existing defect, in industry, also carrying out the progressively improvement of protection component structure, but still existing deficiency:
The Chinese invention patent that the Japanese patent of invention that for example publication number is JP2006-244948A and application number are 201110123326.X proposes a kind of surface mounting fuse protector of unsettled fuse-wires structure, pass a cavity and be arranged in the groove at insulated substrate two ends fuse-link is unsettled, two inherent shortcomings that conventional surface mounted to fuse structure all make moderate progress, but defect still exists, fails to solve completely.
The Japanese patent of invention that publication number is JP2012-252846A provides a kind of horizontal diagonal angle to wear fuse structure and the manufacture method of silk, metal bath is passed by insulation crust diagonal, thereby avoided metal bath because the product insulation resistance that causes with insulation crust hypotelorism is low or fuse the integrity problem such as bad.Publication number is the Japan Patent of JP2008-198562A, a kind of fuse structure is disclosed, by adopting two stepped substrates to form the structural design of cavity, substrate end is formed to a projection and prevent that both ends electrode is because of vis-a-vis persistence drag arc under high voltage.But in said two products, melt still need to be drawn from both ends, and form and be electrically connected to tip electrodes, thereby melt will be fixed on substrate bumps portion with conducting resinl, both ends electrode can not be intercepted completely, and this structural design is very complicated, mass production difficulty, the explosion energy that the bonding strength of two substrates produces while generally being also difficult to resist melt disjunction.
Publication number is that the Japanese patent of invention of JP2008-52961A discloses a kind of fuse structure, it has upper and lower two insulated substrates, upper substrate middle part has a cavity, both sides form respectively " recessed " font platform, and infrabasal plate middle part also has a cavity, relative with upper substrate cavity, both sides form respectively " protruding " font platform, the row metalization of going forward side by side is processed, and metal bath is set up in platform inner side, and unsettled through cavity.This kind of fuse structure design reduced the impact of end over against electrode, also formed the structural design of unsettled fuse, effects on surface mounts fuse all larger improvement aspect breaking capacity and unfailing performance, but the complex structural designs of fuse, very high to the requirement of mounting equipment, with high costs, be difficult to realize mass production.
Summary of the invention
For addressing the above problem; the utility model discloses a kind of chip-shaped protection component; adopt vertical diagonal angle to wear the design that silk forms unsettled fuse-wires structure metal bath; the chip-shaped protection component of producing has advantages of high breaking capacity and high reliability; two inherent shortcomings of traditional fuse structure have been eliminated; and structural design is simple, cost is low, easily realizes mass production.
In order to achieve the above object, the utility model provides following technical scheme:
A chip-shaped protection component, comprises insulated substrate, is arranged on the metal bath in insulated substrate, the protective layer that is formed at the tip electrodes at insulated substrate two and is formed at insulated substrate outer surface; The middle part of described insulated substrate is formed with through hole, via openings direction is vertical with tip electrodes, the upper and lower surface of insulated substrate is respectively arranged with the groove being connected with through hole, metal bath penetrates, is after through hole is run through in angular direction from a side groove of insulated substrate and passes from opposite side groove, and metal bath two ends are fixed in groove and with the tip electrodes at insulated substrate two and are formed and be electrically connected to by conducting resinl; Described protective layer is formed between tip electrodes.
Further, in described through hole, be filled with arc quenching material; And/or inner at least one relief groove that forms of described insulated substrate, described relief groove is communicated with described through hole.
Further, the upper and lower surperficial both sides of described through hole are respectively arranged with groove.
Further, on described insulated substrate, be formed with at least two through holes parallel to each other, in each through hole, pass metal bath.
Further, the center line of described metal bath and through hole intersects.
Further, described through hole cross sectional shape is circular or square.
Further, described groove is square groove or semi-circular groove.
Compared with prior art, the utlity model has following advantage and beneficial effect: insulated substrate adopts integrated molding design, closed interior through hole completely densely, and the impact on product bulk strength while having avoided multilager base plate bonding; Between the electrode of both ends, by insulated substrate and protective layer, intercept completely, eliminated traditional fuse when disjunction, over against the possibility of electrode continuous discharge under high voltage, greatly improved the high voltage breaking capacity of protection component; Insulation shell opening (being via openings) vertical with termination, simple in structure, product cost is low, greatly reduce difficulty of processing, simplified procedure of processing, is especially easy to mass production; The form that fuse adopts vertical diagonal angle to wear silk is passed through hole, has reduced metallic vapour to dividing the impact of the product insulation resistance of having no progeny, and has guaranteed that protection component has high unfailing performance and fusing consistency.In addition, by fill arc quenching material in through hole, can extinguish electric arc, the adsorbing metal steam that metal bath disconnects moment generation, reduce the compression shock of metallic vapour; By in insulated substrate inside, relief groove being set, can effectively reduce the compression shock of metallic vapour, improve the breaking capacity of chip-shaped protection component.
Accompanying drawing explanation
The chip-shaped protection component side sectional view that Fig. 1 provides for embodiment mono-;
The chip-shaped protection component side sectional view that Fig. 2 provides for embodiment bis-;
The chip-shaped protection component side sectional view that Fig. 3 provides for embodiment tri-;
Insulated substrate structural representation in the chip-shaped protection component that Fig. 4 provides for embodiment tetra-, wherein (a) is vertical view, is (b) that the A-A ' of (a) is to cutaway view;
Insulated substrate vertical view in the chip-shaped protection component that Fig. 5 provides for embodiment five.
Reference numerals list:
1-insulated substrate, 11-through hole, 111-arc quenching material, 12-groove, 13-relief groove, 2-metal bath, 3-tip electrodes, 4-protective layer, 5-conducting resinl.
Embodiment
Technical scheme the utility model being provided below with reference to specific embodiment is elaborated, and should understand following embodiment and only for the utility model is described, be not used in restriction scope of the present utility model.It should be noted that, word 'fornt', 'back', " left side ", " right side ", "up" and "down" that use is described below refer to the direction in accompanying drawing, and word " interior " and " outward " refer to respectively the direction towards or away from specific features geometric center.
Embodiment mono-:
As shown in Figure 1, Figure 2, Figure 3 shows, the utility model provides a kind of surface-adhered type chip-shaped protection component, comprise insulated substrate 1, be arranged on the metal bath 2 in insulated substrate 1, the protective layer 4 that is formed at the tip electrodes 3 at insulated substrate 1 two and is formed at insulated substrate 1 outer surface, described metal bath 2 forms and is electrically connected to the tip electrodes 3 at insulated substrate 1 two, the middle part of described insulated substrate 1 is formed with through hole 11, through hole 11 opening directions vertical with tip electrodes 3 (be form between tip electrodes line vertical with through hole 11 axis directions), insulated substrate 1 upper, lower surface (is wherein gone up, under refer to the direction in Fig. 1) be respectively arranged with the groove 12 being connected with through hole 11, from a side of insulated substrate 1, (our metal bath 2 be as the criterion with the profile shown in Fig. 1, a described side refers to left side or the right side in Fig. 1, opposite side is opposite direction side with it) groove 12 penetrates, be after through hole 11 is run through in angular direction and pass from opposite side groove 12, metal bath 2 two ends are fixed in groove 12 by conducting resinl 5.Metal bath 2 axis (center line) preferred and through hole 11 intersects.Easily find out, make metal bath 4 in through hole, form diagonal angle and wear a structure, groove 12 must be arranged on the not homonymy of through hole 11.Described protective layer is formed between tip electrodes, can intercept both ends electrode, has eliminated traditional fuse when disjunction, over against the possibility of electrode continuous discharge under high voltage, has greatly improved the high voltage breaking capacity of protection component.
Described insulated substrate 1 can adopt the conventional materials such as pottery, glass, fire resistant resin, and described protective layer is formed at the upper and lower surface of insulated substrate, is preferably the protective layer materials such as epoxy resin, in order to protect metal bath 2 to avoid the impact of external environment condition.The silver conductive adhesive of described conducting resinl 5 preferred conventional low-temperature settings.Tip electrodes 3 is preferably conventional copper/nickel/tin three-decker, and tip electrodes 3 is formed and is electrically connected to metal bath 2 by conducting resinl 5.Described metal bath 2 is silver, copper or their the common metal silk materials such as alloy or wire around the bar structure on glass fibre or ceramic fibre line.The above-mentioned material of enumerating is selected as just example, so long as the conventional material of selecting all belongs to protection range of the present utility model in the industry.
The cross sectional shape of described through hole 11 is conventional shape circular, square or that other those skilled in that art may adopt, in this example, be preferably formed manhole 11, diameter (or thickness), the product specification of the size of through hole 11 and the metal bath of selecting 2 and to wear the conditions such as a convenience relevant.
The conventional shape that the shape of described groove 12 can select square groove, semi-circular groove or other those skilled in that art to adopt, its width and depth requirements are than bigger being advisable of the diameter of metal bath 2 (or thickness).
Chip-shaped protection component in this example can be manufactured by the following method:
First at the middle part of insulated substrate 1, form a through hole 11, and thereon, lower surface respectively arranges a groove 12 and is connected with through hole 11, and two grooves 12 will be positioned at the not homonymy of through hole 11; Metal bath 2 is vertical through through hole 11, and in the interior tension of groove 12, by conducting resinl 5, metal bath 2 is fixed in groove 12; Above through hole 11 and near zone form protective layer 4, prevent that metal bath 2 is subject to the impact of external environment; Finally, at insulated substrate 1 two ends, form tip electrodes 3, metal bath 2 is drawn by conducting resinl 5 and tip electrodes 3, and there is the function of surface soldered.Can obtain the described chip-shaped protection component of this example.
Embodiment bis-:
As the improvement of embodiment mono-, as shown in Figure 2, in described through hole 11, be filled with arc quenching material 111, can extinguish the electric arc that metal bath produces when disjunction, improved the arc extinguishing ability of this product.All the other architectural features in this example are identical with embodiment mono-.
Embodiment tri-:
Improvement as embodiment mono-or embodiment bis-; as shown in Figure 3, inner at least one relief groove 13 that forms of described insulated substrate 1, described relief groove 13 is communicated with through hole 11; thereby the impact of the metallic vapour pressure producing in the time of can reducing disjunction to protective layer 4, has improved the breaking capacity of product.Relief groove 13 is preferably vertical with through hole direction, and reduced pressure capabilities is strong.In this example, all the other architectural features of fuse are identical with embodiment mono-or identical with embodiment bis-.Arc quenching material 111 can extinguish the electric arc that metal bath produces when disjunction, and relief groove 13 can effectively reduce the compression shock of metallic vapour, thereby obtains having the more chip-shaped protection component of high breaking capacity.
Embodiment tetra-:
As improvement, the upper and lower surperficial both sides of insulated substrate 1 through hole 11 can be respectively arranged with groove 12, as shown in Figure 4, insulated substrate 1 groove in upper surface left side and the groove on lower surface right side can be worn silk for melt diagonal angle, the groove in lower surface left side and the groove on upper surface right side also can be worn silk for melt diagonal angle, can eliminate like this directivity while wearing thread in through hole 11, be conducive to the lifting of production efficiency.All the other technical characterictics in this example are identical with embodiment mono-.
Embodiment five:
Metal bath 2 in the utility model can be designed as single melt structure, also can be designed as many melt structures, and when melt is many, every melt need be through independent through hole 11, so that wear silk.Accordingly, need to form at the middle part of insulated substrate 1 two or more through holes arranged side by side 11 and corresponding groove 12, as shown in Figure 5, in each through hole 11, have a metal bath 2 to pass, form the structure of two or many metal bath 2 parallel connections.
The disclosed technological means of the utility model scheme is not limited only to the disclosed technological means of above-mentioned execution mode, also comprises the technical scheme being comprised of above technical characterictic combination in any.It should be pointed out that for those skilled in the art, not departing under the prerequisite of the utility model principle, can also make some improvements and modifications, these improvements and modifications are also considered as protection range of the present utility model.
Claims (7)
1. a chip-shaped protection component, comprise insulated substrate, be arranged on the metal bath in insulated substrate, the protective layer that is formed at the tip electrodes at insulated substrate two and is formed at insulated substrate outer surface, it is characterized in that: the middle part of described insulated substrate is formed with through hole, via openings direction is vertical with tip electrodes, insulated substrate upper, lower surface is respectively arranged with the groove being connected with through hole, metal bath penetrates from a side groove of insulated substrate, be after through hole is run through in angular direction and pass from opposite side groove, metal bath two ends are fixed in groove by conducting resinl, and form and be electrically connected to the tip electrodes at insulated substrate two, described protective layer is formed between tip electrodes.
2. chip-shaped protection component according to claim 1, is characterized in that: in described through hole, be filled with arc quenching material; And/or inner at least one relief groove that forms of described insulated substrate, described relief groove is communicated with described through hole.
3. chip-shaped protection component according to claim 1 and 2, is characterized in that: the upper and lower surperficial both sides of described through hole are respectively arranged with groove.
4. chip-shaped protection component according to claim 1 and 2, is characterized in that: on described insulated substrate, be formed with at least two through holes parallel to each other, pass metal bath in each through hole.
5. chip-shaped protection component according to claim 1 and 2, is characterized in that: the center line of described metal bath and through hole intersects.
6. chip-shaped protection component according to claim 1 and 2, is characterized in that: described through hole cross sectional shape is for circular or square.
7. chip-shaped protection component according to claim 1 and 2, is characterized in that: described groove is square groove or semi-circular groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420153609.8U CN203787375U (en) | 2014-04-01 | 2014-04-01 | Chip type protection element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420153609.8U CN203787375U (en) | 2014-04-01 | 2014-04-01 | Chip type protection element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203787375U true CN203787375U (en) | 2014-08-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420153609.8U Expired - Fee Related CN203787375U (en) | 2014-04-01 | 2014-04-01 | Chip type protection element |
Country Status (1)
| Country | Link |
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| CN (1) | CN203787375U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103903929A (en) * | 2014-04-01 | 2014-07-02 | 南京萨特科技发展有限公司 | Chip type protecting element and batch manufacturing method thereof |
| CN105428179A (en) * | 2015-12-31 | 2016-03-23 | 洪湖市蓝光电子有限责任公司 | Alloy type thermal link with breaking current resistance |
-
2014
- 2014-04-01 CN CN201420153609.8U patent/CN203787375U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103903929A (en) * | 2014-04-01 | 2014-07-02 | 南京萨特科技发展有限公司 | Chip type protecting element and batch manufacturing method thereof |
| CN103903929B (en) * | 2014-04-01 | 2016-08-31 | 南京萨特科技发展有限公司 | A kind of chip-shaped protection element and batch fabrication method thereof |
| CN105428179A (en) * | 2015-12-31 | 2016-03-23 | 洪湖市蓝光电子有限责任公司 | Alloy type thermal link with breaking current resistance |
| CN105428179B (en) * | 2015-12-31 | 2018-10-30 | 洪湖市蓝光电子有限责任公司 | A kind of alloy-type thermal fuse-link of resistance to turn-off current |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140820 Termination date: 20210401 |