CN103903929B - A kind of chip-shaped protection element and batch fabrication method thereof - Google Patents
A kind of chip-shaped protection element and batch fabrication method thereof Download PDFInfo
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- CN103903929B CN103903929B CN201410127719.1A CN201410127719A CN103903929B CN 103903929 B CN103903929 B CN 103903929B CN 201410127719 A CN201410127719 A CN 201410127719A CN 103903929 B CN103903929 B CN 103903929B
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Abstract
The invention discloses the batch manufacturing method of a kind of chip-shaped protection element and this element, this element includes insulated substrate, metal bath, tip electrodes, protective layer；The middle part of described insulated substrate is formed with through hole, via openings direction is vertical with tip electrodes, the upper and lower surface of insulated substrate is respectively arranged with the groove being connected with through hole, the side groove of the self-insulating substrate of metal bath penetrates, in diagonally opposed run through through hole after pass from opposite side groove, formed in metal bath two ends are fixed on groove by conducting resinl and with the tip electrodes at insulated substrate two and electrically connect；Described protective layer is formed between tip electrodes.Metal bath is used Vertical Diagonal to wear silk and forms the design of unsettled fuse-wires structure by the present invention; the advantage that the chip-shaped protection element produced has high breaking capacity and high reliability; eliminate two inherent shortcomings of conventional fuse structure; and structure design is simple; low cost, easily realizes mass production.
Description
Technical field
The invention belongs to electrical equipment technical field, relate to a kind of chip-shaped protection element, especially relate to a kind of there is Vertical Diagonal to wear the high breaking capacity of a structure, the overflow protecting element of high reliability and the method manufacturing this protection element.
Background technology
Protection element typically concatenate in circuit, occur in circuit overcurrent or overheated wait abnormal phenomena time, can immediately cut-out circuit and play the effect of protection, to prevent fault from expanding further.Traditional protection element mainly has two kinds of versions, and one is that fuse-link level wears silk is unsettled to be arranged in tubular dielectric housing, with end cap sealed tube body two ends and provide the electrical connection with internal fuse and the function of surface soldered；Another kind is that fuse-link is molded over insulated substrate surface, then the structure such as additional protective layer covers fuse-link, then forms tip electrodes respectively at substrate two ends to draw fuse-link and to carry out surface soldered.The protection component structure that both is traditional all has two similar inherent shortcomings: their tip electrodes is respectively formed just to electrode structure, forms persistence drag arc the most under high voltages during disjunction；Fuse-link is after disjunction, and its metallic vapour is easily deposited on insulation crust or substrate surface, causes product insulation resistance after disjunction to reduce, it may also happen that situation about cannot disconnect for a long time time serious.
In order to overcome existing defect, also carrying out protecting the progressively improvement of element structure in industry, but still there is deficiency:
The Japanese invention patent of such as Publication No. JP2006-244948A and the Chinese invention patent of Application No. 201110123326.X propose the surface mounting fuse protector of a kind of unsettled fuse-wires structure, pass a cavity be arranged on unsettled for fuse-link in the groove at insulated substrate two ends, two inherent shortcomings of conventional surface attachment fuse structure are all made moderate progress, but defect yet suffers from, fails to be fully solved.
The Japanese invention patent of Publication No. JP2012-252846A provides a kind of horizontal diagonal and wears fuse structure and the manufacture method of silk, metal bath is passed by insulation crust diagonal, thus avoids metal bath because the product insulation resistance that causes with insulation crust hypotelorism is low or the integrity problem such as bad that fuses.The Japan Patent of Publication No. JP2008-198562A, disclose a kind of fuse structure, designed by the structure using two pieces of stepped substrates to form cavitys, base ends is formed a projection prevent both ends electrode because of vis-a-vis persistence drag arc under high voltages.But melt need nonetheless remain for drawing from both ends in said two products, and electrically connect with tip electrodes formation, thus melt to be fixed on substrate bumps portion with conducting resinl, both ends electrode can not be intercepted completely, and the design of this structure is extremely complex, mass production difficulty, the explosion energy that the bonding strength of two substrates produces when being the most also difficult to resist melt disjunction.
The Japanese invention patent of Publication No. JP2008-52961A discloses a kind of fuse structure, it has upper and lower two insulated substrates, there is in the middle part of upper substrate a cavity, both sides form concave platform respectively, also have a cavity in the middle part of infrabasal plate, relative with upper substrate cavity, both sides form "convex" shaped platform respectively, row metalization of going forward side by side processes, and sets up metal bath inside platform, and unsettled through cavity.This kind of fuse structure design reduces the end impact just on electrode, also form the structure design of unsettled fuse, surface mounting fuse protector all there is bigger improvement in terms of breaking capacity and unfailing performance, but the complex structural designs of fuse, requirement to the equipment of assembling is the highest, with high costs, it is difficult to realize mass production.
Summary of the invention
For solving the problems referred to above; the invention discloses a kind of chip-shaped protection element and batch fabrication method; metal bath uses Vertical Diagonal wear silk and forms the design of unsettled fuse-wires structure; the advantage that the chip-shaped protection element produced has high breaking capacity and high reliability; eliminate two inherent shortcomings of conventional fuse structure; and structure design is simple, low cost, easily realize mass production.
In order to achieve the above object, the present invention provides following technical scheme:
A kind of chip-shaped protection element, the metal bath including insulated substrate, being arranged in insulated substrate, the tip electrodes being formed at insulated substrate two and be formed at the protective layer of insulated substrate outer surface；The middle part of described insulated substrate is formed with through hole, via openings direction is vertical with tip electrodes, the upper and lower surface of insulated substrate is respectively arranged with the groove being connected with through hole, the side groove of the self-insulating substrate of metal bath penetrates, in diagonally opposed run through through hole after pass from opposite side groove, formed in metal bath two ends are fixed on groove by conducting resinl and with the tip electrodes at insulated substrate two and electrically connect；Described protective layer is formed between tip electrodes.
Further, it is filled with arc quenching material in described through hole；And/or described insulated substrate is internally formed at least one relief groove, described relief groove connects with described through hole.
Further, the both sides, upper and lower surface of described through hole are respectively provided with fluted.
Further, described insulated substrate is formed with the through hole that at least two is parallel to each other, through metal bath in each through hole.
Further, described metal bath intersects with the centrage of through hole.
Present invention also offers the batch manufacturing method of a kind of chip-shaped protection element, comprise the following steps:
Step 1, substrate prepares: the through hole that forms array on insulated substrate, the groove being connected with through hole, and forms the hole, location of fixing metal bath at array two ends；
Step 2, Vertical Diagonal wears silk: wear a process by positioning fixture row and the traction fixture row diagonal angle of metal bath in via-hole array that cooperated on insulated substrate, positioning fixture row is for drawing metal bath to next through hole from a upper through hole, traction fixture row is used for drawing metal bath and through through hole and draws to next through hole, complete insulated substrate each cross through hole array wear silk after, metal bath through hole, location and is strained, is then attached on insulated substrate；
Step 3, conducting resinl printing: print conducting resinl respectively on the upper and lower surface of insulated substrate, and solidify, make the front end of the full groove of conductive paste, thus metal bath is fixed in groove；
Step 4, protective layer adds: forms protective layer respectively on the upper and lower surface of insulated substrate, in order to close through hole and to cover unfilled groove, is exposed by the conducting resinl at product both ends when forming described protective layer；
Step 5, substrate cut: insulated substrate is divided into and meets single the product that design requires；
Step 6, tip electrodes is formed: forms tip electrodes at the insulated substrate two ends of single product, thus obtains chip-shaped protection element.
Further, between described step 3 and step 4, comprise the steps:
Arc quenching material injects: be injected in through hole by arc quenching material.
Further, comprise the steps: before described step 1
Use three laminar substrates, form relief groove array, then pressing together with upper and lower layer in intermediate layer, obtain insulated substrate.
Further, the specific operation process of described step 2 is as follows:
nullThe initiating terminal positioning fixture of metal bath is arranged and is drawn to below first lead to the hole site of often row through hole，Another same traction fixture row is placed above each through hole that positioning fixture row is corresponding，First traction fixture row clamps metal bath through through hole，Positioning fixture row unclamp simultaneously，Traction fixture row rise，Metal bath is made to pass through hole，Move again to above second through hole，Then declining traction fixture row makes metal bath pass second through hole，Now，Positioning fixture row folding lives metal bath，Traction fixture row unclamp metal bath and rise，Positioning fixture row's traction metal bath moves to below the 3rd lead to the hole site，Traction fixture row be simultaneously moved into above this through hole，Metal bath is clamped through insulated substrate，So circulation，Until complete insulated substrate each cross through hole array wear silk after，Again metal bath through hole, location and is strained，It is then attached on insulated substrate.
Further, described protective layer printing or be bonded on insulated substrate.
Compared with prior art, the invention have the advantages that and beneficial effect: insulated substrate uses integrated molding design, it is possible to completely dense ground closed interior through hole, and avoid when multilager base plate bonds the impact on product bulk strength；Intercepted completely by insulated substrate and protective layer between the electrode of both ends, eliminate conventional fuse when disjunction, the just probability to electrode continuous discharge under high voltages, substantially increase the high voltage breaking capacity of protection element；The opening (i.e. via openings) of insulation shell is vertical with termination, simple in construction, product cost are low, greatly reduce difficulty of processing, simplify procedure of processing, it is particularly susceptible for mass production, the batch fabrication method provided in conjunction with the present invention, it is possible to increase production efficiency, cost-effective；The form that fuse uses Vertical Diagonal to wear silk passes through hole, reduces metallic vapour to the impact of product insulation resistance after disjunction, it is ensured that protection element has high unfailing performance and fusing concordance.Additionally, can extinguish, by filling arc quenching material in through-holes, electric arc, the adsorbing metal steam that metal bath disconnection moment produces, reduce the compression shock of metallic vapour；By arranging relief groove inside insulated substrate, it is possible to effectively reduce the compression shock of metallic vapour, improve the breaking capacity of chip-shaped protection element.
Accompanying drawing explanation
The chip-shaped protection element side sectional view that Fig. 1 provides for embodiment one；
The chip-shaped protection element side sectional view that Fig. 2 provides for embodiment two；
The chip-shaped protection element side sectional view that Fig. 3 provides for embodiment three；
Insulated substrate structural representation in the chip-shaped protection element that Fig. 4 provides for embodiment four, wherein (a) is top view, and (b) is that the A-A ' of (a) is to sectional view；
Insulated substrate top view in the chip-shaped protection element that Fig. 5 provides for embodiment five；
Fig. 6 is the insulated substrate structural representation carrying out batch micro operations in embodiment one；
Fig. 7 is the partial process view of the step 2 of batch fabrication method in embodiment one；
Fig. 8 is the partial process view of the step 2 of batch fabrication method in embodiment one.
Reference numerals list:
1-insulated substrate, 11-through hole, 111-arc quenching material, 12-groove, 13-relief groove, 14-positions hole, 2-metal bath, 3-tip electrodes, 4-protective layer, 5-conducting resinl, 6-positioning fixture row, 6-traction fixture row.
Detailed description of the invention
The technical scheme provided the present invention below with reference to specific embodiment is described in detail, it should be understood that following detailed description of the invention is merely to illustrate the present invention rather than limits the scope of the present invention.It should be noted that the word "front", "rear" used in describing below, "left", "right", "up" and "down" refer to the direction in accompanying drawing, word " interior " and " outward " refer respectively to the direction towards or away from particular elements geometric center.
Embodiment one:
As shown in Figure 1, Figure 2, Figure 3 shows; the invention provides a kind of surface-adhered type chip-shaped protection element; the metal bath 2 including insulated substrate 1, being arranged in insulated substrate 1, the tip electrodes 3 being formed at insulated substrate 1 two and be formed at the protective layer 4 of insulated substrate 1 outer surface, described metal bath 2 is formed with the tip electrodes 3 at insulated substrate 1 two and electrically connects；The middle part of described insulated substrate 1 is formed with through hole 11, through hole 11 opening direction vertical with tip electrodes 3 (line i.e. formed between tip electrodes is vertical with through hole 11 axis direction), insulated substrate 1 upper, lower surface (is wherein gone up, under refer to the direction in Fig. 1) be respectively arranged with the groove 12 being connected with through hole 11, (we are as the criterion with the profile shown in Fig. 1 in the side of the self-insulating substrate of metal bath 21, described side refers to the left side in Fig. 1 or right side, opposite side is side the most in opposite direction) groove 12 penetrates, in diagonally opposed run through through hole 11 after pass from opposite side groove 12, metal bath 2 two ends are fixed in groove 12 by conducting resinl 5.Metal bath 2 preferably intersects with the axis (centrage) of through hole 11.It can easily be seen that metal bath 4 to be made forms diagonal angle in through hole wears a structure, then groove 12 have to be arranged on the not homonymy of through hole 11.Described protective layer is formed between tip electrodes, it is possible to intercept both ends electrodes, eliminates conventional fuse when disjunction, and the just probability to electrode continuous discharge under high voltages substantially increases the high voltage breaking capacity of protection element.
Described insulated substrate 1 can use the conventional material such as pottery, glass, fire resistant resin, and described protective layer is formed at the upper and lower surface of insulated substrate, preferably the protective layer material such as epoxy resin, in order to protect metal bath 2 to exempt to be affected by.The silver conductive adhesive of described conducting resinl 5 preferred Conventional cryogenic solidification.Tip electrodes 3 is preferably conventional copper/nickel/stannum three-decker, and tip electrodes 3 is electrically connected with metal bath 2 formation by conducting resinl 5.Described metal bath 2 is the common metal silk material such as silver, copper or their alloy or tinsel is wound on the bar structure on glass fibre or ceramic fibre line.The above-mentioned material enumerated selects merely exemplary, as long as the conventional material selected broadly falls into protection scope of the present invention in the industry.
The cross sectional shape of described through hole 11 is circular, square or the possible conventional shape used of other those skilled in that art, this example is preferably formed as manhole 11, the size of through hole 11 and the diameter (or thickness) of the metal bath 2 of selection, product specification and to wear the conditions such as a convenience relevant.
The conventional shape that the shape of described groove 12 can be selected for square groove, semi-circular groove or other those skilled in that art may use, its width and depth requirements is more bigger than the diameter of metal bath 2 (or thickness) is advisable.
Chip-shaped protection element in this example can manufacture by the following method:
First form a through hole 11 at the middle part of insulated substrate 1, and thereon, lower surface one groove 12 is respectively set and is connected with through hole 11, and the not homonymy of two groove 12 through holes to be positioned at 11；Metal bath 2 passes perpendicularly through through hole 11, and strains in groove 12, is fixed in groove 12 by metal bath 2 by conducting resinl 5；Above through hole 11 and near zone formed protective layer 4, prevent metal bath 2 from being affected by external environment；Finally, form tip electrodes 3 at insulated substrate 1 two ends, make metal bath 2 be drawn by conducting resinl 5 and tip electrodes 3, and there is the function of surface soldered.I.e. can get the chip-shaped protection element described in this example.
In order to promote the production efficiency of this protection element further, present invention also offers the batch manufacturing method of chip-shaped protection element, comprise the following steps:
(1) substrate prepares: select conventional ceramic substrate or FR-4 substrate, on substrate as shown in Figure 6, in modes such as machine cut, punching press or laser borings, the through hole 11 forming array on insulated substrate 1 and the groove 12 being connected with through hole accordingly, and the hole, location 14 of fixing metal bath 2 is formed at horizontal array two ends；It must be noted that the substrate material mentioned in this example and processing mode are merely exemplary, and should not be a limitation of the present invention, as long as the conventional substrate material selected and processing mode all should include protection scope of the present invention in the industry.
(2) Vertical Diagonal wears silk: as shown in Figure 7, by through hole 11 array direction and quantity in insulated substrate 1, the quantity of fixture in positioning fixture row 6 and traction fixture row 6 is set, in positioning fixture row 6, the quantity of fixture should meet the line number of through hole in insulated substrate as far as possible, in positioning fixture row 6, the spacing of fixture matches with the line-spacing of through hole, traction fixture row 6 and the fixture one_to_one corresponding in positioning fixture row 6, in a line that cooperated through hole, metal bath wears a process, positioning fixture row 6 for being drawn to next through hole by metal bath from a upper through hole, traction fixture row 6 is used for drawing metal bath through through hole, and draw to next through hole.As shown in Figure 7, Figure 8, it specifically comprises the following steps that
Step1: the initiating terminal positioning fixture of metal bath 2 is arranged 6 and is drawn to below first through hole 11 position of often row through hole 11, arranges at positioning fixture and places another same traction fixture row 6 above each through hole 11 of 6 correspondences,
Step2: first traction fixture row 6 clamps metal bath 2 through through hole 11 along the rear end of positioning fixture row 6, and positioning fixture row 6 unclamps simultaneously,
Step3: traction fixture row 6 rising, makes metal bath 2 pass through hole 11,
Step4: traction fixture row 6 moves again to above second through hole 11,
Step5: decline traction fixture row 6 and make metal bath 2 pass second through hole 11,
Step6: now, positioning fixture row 6 clamps metal bath 2 along the front end of traction fixture row 6, and traction fixture row 6 unclamps metal bath 2 and rises,
Step7: positioning fixture row 6 traction metal bath 2 moves to below the 3rd through hole 11 position, traction fixture row 6 is simultaneously moved into above this through hole 11, drop to through insulated substrate 1 be close to positioning fixture row 6 rear end clamp metal bath 2, positioning fixture row 6 unclamps simultaneously, it is achieved thereby that a circulation；
Start to wear silk from Step3 again, so circulate, until complete insulated substrate 1 each cross through hole 11 array wears silk,
Step8: after completing to wear silk, then metal bath 2 through hole 14, location and is strained, it is then attached on insulated substrate 1.
In this example, positioning fixture row 6 moves below through hole 11 position, traction fixture row 6 and moves in through hole 11 above through hole 11 position, but should be noted that, described " top ", " lower section " and traction fixture row's 6 moving directions in through hole 11 are only a kind of relative direction, if the insulated substrate shown in figure is turned upside down, then positioning fixture row 6 is necessarily placed at above through hole 11 position, traction fixture row 6 is arranged on below through hole 11 position, traction fixture row's 6 moving directions in through hole also in opposite direction with above-mentioned detailed description of the invention (Step1～Step7).
(3) conducting resinl printing: print conducting resinl 5 respectively on the upper and lower surface of insulated substrate 1, and solidify, makes the front end of the full groove 12 of conductive paste, thus is fixed in groove 12 by metal bath 2.
(4) protective layer adds: print the protective layer materials such as epoxy resin or the insulated substrate of bonding design size respectively on the upper and lower surface of insulated substrate 1; form protective layer 4; in order to close through hole 11 and to cover unfilled groove 12, thus metal bath 2 is protected to exempt to be affected by.The conducting resinl 5 at product both ends should be exposed when forming described protective layer 4, electrically connect so that metal bath 2 is formed with tip electrodes 3.
(5) substrate cut: insulated substrate 1 is divided into by the line of cut of its surface molding in advance single the product meeting design requirement.
(6) tip electrodes is formed: in the tip electrodes formation process known to the employing in the industry of insulated substrate 1 two ends of single product, forms tri-layers of tip electrodes 3 of Cu/Ni/Sn, thus obtains the chip-shaped protection element of the present invention as shown in Figure 1.
Embodiment two:
As the improvement of embodiment one, as in figure 2 it is shown, be filled with arc quenching material 111 in described through hole 11, it is possible to extinguish the electric arc that metal bath produces when disjunction, improve the arc extinguishing ability of this product.Remaining architectural feature in this example is identical with embodiment one.
When the chip-shaped protection element that this example of batch micro operations provides, batch micro operations step (3) conducting resinl printing and step (4) protective layer in embodiment one add between two steps, increase following step: arc quenching material implantation step:
Use point gum machine gluing process (may be used without other common process), arc quenching material 111 is injected in through hole 11, the moment that described arc quenching material 111 disconnects at metal bath 2, it is possible to extinguish electric arc, adsorbing metal steam that it produces, reduce the compression shock of metallic vapour.
Remaining step is identical with embodiment six, the i.e. available present invention chip-shaped protection element as shown in Fig. 2 structure.
Embodiment three:
As embodiment one or the improvement of embodiment two; as it is shown on figure 3, described insulated substrate 1 is internally formed at least one relief groove 13, described relief groove 13 connects with through hole 11; it is thus possible to the impact that the metallic vapour pressure produced when reducing disjunction is to protective layer 4, improve the breaking capacity of product.Relief groove 13 is preferably vertical with through hole direction, and reduced pressure capabilities is strong.In this example, remaining architectural feature of fuse is identical with embodiment one or identical with embodiment two.Arc quenching material 111 can extinguish the electric arc that metal bath produces when disjunction, and relief groove 13 can effectively reduce the compression shock of metallic vapour, thus obtains the chip-shaped protection element with more high breaking capacity.
When the chip-shaped protection element that this example of batch micro operations provides, comprise the steps: that preferably employing three layers of FR-4 baseplate material (may be used without other organic insulation baseplate materials before manufacturing step (1) in embodiment one or embodiment two, such as polyimides, bakelite etc.), relief groove 13 array is formed in intermediate layer, again with upper, lower floor's pressing together, obtain insulated substrate 1, this insulated substrate can be formed the chip-shaped protection element as shown in Fig. 3 structure as the manufacturing step in embodiment one, this insulated substrate can be formed by the manufacturing step in embodiment two and there is relief groove simultaneously and in through hole, be filled with the protection element of arc quenching material.
Embodiment four:
As improvement, the both sides, upper and lower surface of insulated substrate 1 through hole 11 can be respectively provided with fluted 12, as shown in Figure 4, groove on the left of insulated substrate 1 upper surface and the groove on the right side of lower surface are available for melt diagonal angle and wear silk, groove on the left of lower surface and the groove on the right side of upper surface also are available for melt diagonal angle and wear silk, so can eliminate directivity when wearing in through hole 11 thread, the beneficially lifting of production efficiency.Remaining technical characteristic in this example is identical with embodiment one.The set-up mode of this example further groove is particularly suited for the batch processing method in embodiment one～three.
Embodiment five:
Metal bath 2 in the present invention can be designed as single melt structure, it is also possible to is designed as many melt structures, and when melt is many, every melt needs guiding through single through hole 11, in order to wear silk.Accordingly, need to form two or more through holes arranged side by side 11 and corresponding groove 12 at the middle part of insulated substrate 1, as it is shown in figure 5, there is a metal bath 2 to pass in each through hole 11, form two or the structure of many metal baths 2 parallel connection.
Technological means disclosed in the present invention program is not limited only to the technological means disclosed in above-mentioned embodiment, also includes the technical scheme being made up of above technical characteristic combination in any.It should be pointed out that, for those skilled in the art, under the premise without departing from the principles of the invention, it is also possible to make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a chip-shaped protection element, including insulated substrate, the metal bath being arranged in insulated substrate, it is formed at the tip electrodes at insulated substrate two and is formed at the protective layer of insulated substrate outer surface, it is characterized in that: the middle part of described insulated substrate is formed with through hole, via openings direction is vertical with tip electrodes, the line formed between tip electrodes is vertical with through-bore axis direction, insulated substrate upper, lower surface is respectively arranged with the groove being connected with through hole, the side groove of the self-insulating substrate of metal bath penetrates, in diagonally opposed run through through hole after pass from opposite side groove, metal bath two ends are fixed in groove by conducting resinl, and electrically connect with the tip electrodes formation at insulated substrate two；Described protective layer is formed between tip electrodes；Described insulated substrate is internally formed at least one relief groove, and described relief groove connects with described through hole.
Chip-shaped protection element the most according to claim 1, it is characterised in that: it is filled with arc quenching material in described through hole.
Chip-shaped protection element the most according to claim 1 and 2, it is characterised in that: the both sides, upper and lower surface of described through hole are respectively provided with fluted.
Chip-shaped protection element the most according to claim 1 and 2, it is characterised in that: it is formed with the through hole that at least two is parallel to each other on described insulated substrate, through metal bath in each through hole.
Chip-shaped protection element the most according to claim 1 and 2, it is characterised in that: described metal bath intersects with the centrage of through hole.
6. the batch manufacturing method of a chip-shaped protection element, it is characterised in that comprise the following steps:
Step 1, substrate prepares: the through hole that forms array on insulated substrate, the groove being connected with through hole, and forms the hole, location of fixing metal bath at array two ends；
Step 2, Vertical Diagonal wears silk: wear a process by positioning fixture row and the traction fixture row diagonal angle of metal bath in via-hole array that cooperated on insulated substrate, positioning fixture row is for drawing metal bath to next through hole from a upper through hole, traction fixture row is used for drawing metal bath and through through hole and draws to next through hole, complete insulated substrate each cross through hole array wear silk after, metal bath through hole, location and is strained, is then attached on insulated substrate；
Step 3, conducting resinl printing: print conducting resinl respectively on the upper and lower surface of insulated substrate, and solidify, make the front end of the full groove of conductive paste, thus metal bath is fixed in groove；
Step 4, protective layer adds: forms protective layer respectively on the upper and lower surface of insulated substrate, in order to close through hole and to cover unfilled groove, is exposed by the conducting resinl at product both ends when forming described protective layer；
Step 5, substrate cut: insulated substrate is divided into and meets single the product that design requires；
Step 6, tip electrodes is formed: forms tip electrodes at the insulated substrate two ends of single product, thus obtains chip-shaped protection element.
The batch manufacturing method of chip-shaped protection element the most according to claim 6, it is characterised in that between described step 3 and step 4, comprise the steps:
Arc quenching material injects: be injected in through hole by arc quenching material.
8. according to the batch manufacturing method of the chip-shaped protection element described in claim 6 or 7, it is characterised in that comprise the steps: before described step 1
Use three laminar substrates, form relief groove array, then pressing together with upper and lower layer in intermediate layer, obtain insulated substrate.
The batch manufacturing method of chip-shaped protection element the most according to claim 6, it is characterised in that the specific operation process of described step 2 is as follows:
nullThe initiating terminal positioning fixture of metal bath is arranged and is drawn to below first lead to the hole site of often row through hole，Another same traction fixture row is placed above each through hole that positioning fixture row is corresponding，First traction fixture row clamps metal bath through through hole，Positioning fixture row unclamp simultaneously，Traction fixture row rise，Metal bath is made to pass through hole，Move again to above second through hole，Then declining traction fixture row makes metal bath pass second through hole，Now，Positioning fixture row folding lives metal bath，Traction fixture row unclamp metal bath and rise，Positioning fixture row's traction metal bath moves to below the 3rd lead to the hole site，Traction fixture row be simultaneously moved into above this through hole，Metal bath is clamped through insulated substrate，So circulation，Until complete insulated substrate each cross through hole array wear silk after，Again metal bath through hole, location and is strained，It is then attached on insulated substrate.
10. according to the batch manufacturing method of the chip-shaped protection element described in claim 6 or 9, it is characterised in that: described protective layer printing or be bonded on insulated substrate.
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| CN112735930A (en) * | 2020-12-18 | 2021-04-30 | 中国振华集团云科电子有限公司 | Arc suppression material for improving breaking capacity of fuse and preparation method thereof |
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| DE50312316D1 (en) * | 2003-03-04 | 2010-02-25 | Wickmann Werke Gmbh | Fuse component with a temporary quasi-hermetic seal of the interior |
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| JP2006244948A (en) * | 2005-03-07 | 2006-09-14 | Matsuo Electric Co Ltd | Manufacturing method of chip type fuse |
| JP2007220645A (en) * | 2006-01-23 | 2007-08-30 | Matsushita Electric Ind Co Ltd | Surface mounting type current fuse and its manufacturing method |
| CN101807500A (en) * | 2009-02-13 | 2010-08-18 | Aem科技（苏州）有限公司 | Surface mounting fuse protector and manufacturing method thereof |
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