CN103903929A - Chip type protecting element and batch manufacturing method thereof - Google Patents
Chip type protecting element and batch manufacturing method thereof Download PDFInfo
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- CN103903929A CN103903929A CN201410127719.1A CN201410127719A CN103903929A CN 103903929 A CN103903929 A CN 103903929A CN 201410127719 A CN201410127719 A CN 201410127719A CN 103903929 A CN103903929 A CN 103903929A
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Abstract
The invention discloses a chip type protecting element and a batch manufacturing method thereof. The element comprises an insulation base plate, a metal melt body, end electrodes and a protecting layer. A through hole is formed in the middle of the insulation base plate, and the opening direction of the through hole is perpendicular to the end electrodes. Grooves connected with the through hole are formed in the upper surface and the lower surface of the insulation base plate. The metal melt body penetrates in from a groove in one side of the insulation base plate, penetrates through the through hole in the opposite-angle direction and then penetrates out from a groove in the other side. The two ends of the metal melt body are fixed in the grooves through conducting resin and form electric connecting with the end electrodes at the two ends of the insulation base plate. The protecting layer is formed between the end electrodes. The design that the metal melt body forms a suspension melt wire structure by vertical opposite angle wire penetrating is used, the produced chip type protecting element has the advantages of being high in breaking capacity and high in reliability, two inherent defects of a traditional fuse structure are removed, structure design is simple, cost is low, and batch production can be achieved easily.
Description
Technical field
The invention belongs to electric component technical field, relate to a kind of chip-shaped protection component, especially relate to and a kind ofly there is vertical diagonal angle and wear the overflow protecting element of the high breaking capacity of a structure, high reliability and manufacture the method for this protection component.
Background technology
Protection component is generally serially connected in circuit, while there is overcurrent or the anomaly such as overheated, can cut off circuit immediately and play the effect of protection, to prevent that fault from further expanding in circuit.Traditional protection component mainly contains two kinds of versions, and one is that fuse-link level is worn to unsettled being arranged in tubulose insulation shell of silk, with end caps body two ends and provide and being electrically connected and the function of surface soldered of internal fuse; Another kind is that fuse-link is molded over to insulated substrate surface, then the structure such as additional protective layer covers fuse-link, then forms respectively tip electrodes at substrate two ends to draw fuse-link and to carry out surface soldered.These two kinds traditional protection component structures all have two similar inherent shortcomings: their tip electrodes just all forms electrode structure, easily under high voltage, form persistence drag arc when disjunction; Fuse-link point is being had no progeny, and its metallic vapour is easily deposited on insulation crust or substrate surface, causes the product insulation resistance of point having no progeny to reduce, and the situation that cannot disconnect for a long time also may occur seriously time.
In order to overcome existing defect, in industry, also carrying out the progressively improvement of protection component structure, but still existing deficiency:
The Chinese invention patent that the Japanese patent of invention that for example publication number is JP2006-244948A and application number are 201110123326.X proposes a kind of surface mounting fuse protector of unsettled fuse-wires structure, pass a cavity and be arranged in the groove at insulated substrate two ends unsettled fuse-link, two inherent shortcomings that conventional surface mounted to fuse structure all make moderate progress, but defect still exists, fails to solve completely.
The Japanese patent of invention that publication number is JP2012-252846A provides a kind of horizontal diagonal angle to wear fuse structure and the manufacture method of silk, metal bath is passed by insulation crust diagonal, thereby avoided metal bath because the product insulation resistance that causes with insulation crust hypotelorism is low or fuse the integrity problem such as bad.Publication number is the Japan Patent of JP2008-198562A, a kind of fuse structure is disclosed, by adopting two stepped substrates to form the structural design of cavity, substrate end is formed to a projection and prevent that both ends electrode is because of vis-a-vis persistence drag arc under high voltage.But in said two products, melt still need to be drawn from both ends, and form and be electrically connected with tip electrodes, thereby melt will be fixed on substrate bumps portion with conducting resinl, both ends electrode can not be intercepted completely, and this structural design is very complicated, mass production difficulty, the bonding strength of two substrates is generally also difficult to the explosion energy producing while resisting melt disjunction.
Publication number is that the Japanese patent of invention of JP2008-52961A discloses a kind of fuse structure, it has upper and lower two insulated substrates, upper substrate middle part has a cavity, both sides form respectively " recessed " font platform, and infrabasal plate middle part also has a cavity, relative with upper substrate cavity, both sides form respectively " protruding " font platform, the row metal processing of going forward side by side, metal bath is set up in platform inner side, and unsettled through cavity.This kind of fuse structure design reduced the just impact on electrode of end, also formed the structural design of unsettled fuse, effects on surface mounts fuse all larger improvement aspect breaking capacity and unfailing performance, but the complex structural designs of fuse, very high to the requirement of mounting equipment, with high costs, be difficult to realize mass production.
Summary of the invention
For addressing the above problem; the invention discloses a kind of chip-shaped protection component and batch fabrication method; adopt vertical diagonal angle to wear the design of the unsettled fuse-wires structure of silk formation metal bath; the chip-shaped protection component of producing has advantages of high breaking capacity and high reliability; two inherent shortcomings of traditional fuse structure are eliminated; and structural design is simple, cost is low, easily realizes mass production.
In order to achieve the above object, the invention provides following technical scheme:
A kind of chip-shaped protection component, comprises insulated substrate, is arranged on metal bath in insulated substrate, is formed at the tip electrodes at insulated substrate two and is formed at the protective layer of insulated substrate outer surface; The middle part of described insulated substrate is formed with through hole, via openings direction is vertical with tip electrodes, the upper and lower surface of insulated substrate is respectively arranged with the groove being connected with through hole, metal bath penetrates, is after through hole is run through in angular direction from a side groove of insulated substrate and passes from opposite side groove, and metal bath two ends are fixed in groove and with the tip electrodes at insulated substrate two and are formed and be electrically connected by conducting resinl; Described protective layer is formed between tip electrodes.
Further, in described through hole, be filled with arc quenching material; And/or inner at least one relief groove that forms of described insulated substrate, described relief groove is communicated with described through hole.
Further, the upper and lower surperficial both sides of described through hole are respectively arranged with groove.
Further, on described insulated substrate, be formed with at least two through holes parallel to each other, in each through hole, pass metal bath.
Further, described metal bath is crossing with the center line of through hole.
The present invention also provides a kind of batch manufacturing method of chip-shaped protection component, comprises the following steps:
Further, between described step 3 and step 4, comprise the steps:
Arc quenching material injects: arc quenching material is injected into through hole.
Further, before described step 1, comprise the steps:
Adopt three laminar substrates, form relief groove array in intermediate layer, then pressing together with upper and lower layer, insulated substrate obtained.
Further, the specific operation process of described step 2 is as follows:
The initiating terminal of metal bath is drawn to first lead to the hole site below in the hole of often working with positioning fixture row, above each through hole corresponding to positioning fixture row, place another same traction fixture row, first draw fixture row and clamp metal bath through through hole, positioning fixture row unclamp simultaneously, traction fixture row rise, make metal bath pass through hole, move to again second through hole top, then the traction fixture row that declines makes metal bath pass second through hole, now, positioning fixture row folding is lived metal bath, traction fixture row unclamp metal bath and rise, positioning fixture row traction metal bath moves to the 3rd lead to the hole site below, traction fixture row moves to this through hole top simultaneously, clamp metal bath through insulated substrate, so circulation, until complete the wearing after silk of the each cross through hole array of insulated substrate, again metal bath is also strained through location hole, then be fixed on insulated substrate.
Further, described protective layer printing or be bonded on insulated substrate.
Compared with prior art, tool of the present invention has the following advantages and beneficial effect: insulated substrate adopts integrated molding design, closed interior through hole completely densely, and the impact on product bulk strength while having avoided multilager base plate bonding; Between the electrode of both ends, intercept completely by insulated substrate and protective layer, eliminated traditional fuse in the time of disjunction, the just possibility to electrode continuous discharge under high voltage, has improved the high voltage breaking capacity of protection component greatly; The opening (being via openings) of insulation shell is vertical with termination, simple in structure, product cost is low, greatly reduce difficulty of processing, simplified procedure of processing, especially be easy to mass production, in conjunction with batch fabrication method provided by the invention, can enhance productivity, cost-saving; The form that fuse adopts vertical diagonal angle to wear silk is passed through hole, has reduced metallic vapour to dividing the impact of the product insulation resistance of having no progeny, and has guaranteed that protection component has high unfailing performance and fusing consistency.In addition, can extinguish by fill arc quenching material in through hole electric arc, the adsorbing metal steam that metal bath disconnection moment produces, reduce the compression shock of metallic vapour; By in insulated substrate inside, relief groove being set, can effectively reduce the compression shock of metallic vapour, improve the breaking capacity of chip-shaped protection component.
Accompanying drawing explanation
The chip-shaped protection component side sectional view that Fig. 1 provides for embodiment mono-;
The chip-shaped protection component side sectional view that Fig. 2 provides for embodiment bis-;
The chip-shaped protection component side sectional view that Fig. 3 provides for embodiment tri-;
Insulated substrate structural representation in the chip-shaped protection component that Fig. 4 provides for embodiment tetra-, wherein (a) is vertical view, is (b) that the A-A ' of (a) is to cutaway view;
Insulated substrate vertical view in the chip-shaped protection component that Fig. 5 provides for embodiment five;
Fig. 6 carries out the insulated substrate structural representation of manufacture in batches in embodiment mono-;
Fig. 7 is the part flow chart of the step 2 of batch fabrication method in embodiment mono-;
Fig. 8 is the part flow chart of the step 2 of batch fabrication method in embodiment mono-.
Reference numerals list:
1-insulated substrate, 11-through hole, 111-arc quenching material, 12-groove, 13-relief groove, 14-location hole, 2-metal bath, 3-tip electrodes, 4-protective layer, 5-conducting resinl, 6 '-positioning fixture row, 6-traction fixture row.
Embodiment
Below with reference to specific embodiment, technical scheme provided by the invention is elaborated, should understands following embodiment and only be not used in and limit the scope of the invention for the present invention is described.It should be noted that, word 'fornt', 'back', " left side ", " right side ", "up" and "down" that use is described below refer to the direction in accompanying drawing, and word " interior " and " outward " refer to respectively the direction towards or away from specific features geometric center.
Embodiment mono-:
As shown in Figure 1, Figure 2, Figure 3 shows, the invention provides the chip-shaped protection component of a kind of surface-adhered type, comprise insulated substrate 1, be arranged on metal bath 2 in insulated substrate 1, be formed at the tip electrodes 3 at insulated substrate 1 two and be formed at the protective layer 4 of insulated substrate 1 outer surface, described metal bath 2 forms and is electrically connected with the tip electrodes 3 at insulated substrate 1 two, the middle part of described insulated substrate 1 is formed with through hole 11, through hole 11 opening directions and tip electrodes 3 vertical (be form between tip electrodes line vertical with through hole 11 axis directions), insulated substrate 1 upper, lower surface (is wherein gone up, under refer to the direction in Fig. 1) be respectively arranged with the groove 12 being connected with through hole 11, from a side of insulated substrate 1, (our metal bath 2 be as the criterion with the profile shown in Fig. 1, a described side refers to left side or the right side in Fig. 1, opposite side is opposite direction side with it) groove 12 penetrates, be after through hole 11 is run through in angular direction and pass from opposite side groove 12, metal bath 2 two ends are fixed in groove 12 by conducting resinl 5.Metal bath 2 is preferably crossing with the axis (center line) of through hole 11.Easily find out, make metal bath 4 in through hole, form diagonal angle and wear a structure, groove 12 must be arranged on the not homonymy of through hole 11.Described protective layer is formed between tip electrodes, can intercept both ends electrode, has eliminated traditional fuse in the time of disjunction, and the just possibility to electrode continuous discharge under high voltage has improved the high voltage breaking capacity of protection component greatly.
Described insulated substrate 1 can adopt the conventional materials such as pottery, glass, fire resistant resin, and described protective layer is formed at the upper and lower surface of insulated substrate, is preferably the protective layer materials such as epoxy resin, in order to protect metal bath 2 to avoid the impact of external environment condition.The silver conductive adhesive of described conducting resinl 5 preferred conventional low-temperature settings.Tip electrodes 3 is preferably conventional copper/nickel/tin three-decker, and tip electrodes 3 is formed and is electrically connected with metal bath 2 by conducting resinl 5.Described metal bath 2 is the common metal silk materials such as silver, copper or their alloy or wire around the bar structure on glass fibre or ceramic fibre line.The above-mentioned material of enumerating is selected as just example, as long as the material of conventional selection in the industry all belongs to protection scope of the present invention.
The cross sectional shape of described through hole 11 is conventional shape circular, square or that other those skilled in that art may adopt, in this example, be preferably formed manhole 11, diameter (or thickness), the product specification of the size of through hole 11 and the metal bath of selecting 2 and to wear the conditions such as a convenience relevant.
The conventional shape that the shape of described groove 12 can select square groove, semi-circular groove or other those skilled in that art to adopt, its width and depth requirements are than bigger being advisable of the diameter of metal bath 2 (or thickness).
Chip-shaped protection component in this example can be manufactured by the following method:
First form a through hole 11 at the middle part of insulated substrate 1, and thereon, lower surface respectively arranges a groove 12 and is connected with through hole 11, and two grooves 12 will be positioned at the not homonymy of through hole 11; Metal bath 2 is vertical through through hole 11, and in the interior tension of groove 12, by conducting resinl 5, metal bath 2 is fixed in groove 12; Above through hole 11 and near zone form protective layer 4, prevent that metal bath 2 is subject to the impact of external environment; Finally, form tip electrodes 3 at insulated substrate 1 two ends, metal bath 2 is drawn by conducting resinl 5 and tip electrodes 3, and there is the function of surface soldered.Can obtain the described chip-shaped protection component of this example.
In order further to promote the production efficiency of this protection component, the present invention also provides the batch manufacturing method of chip-shaped protection component, comprises the following steps:
(1) substrate is prepared: select conventional ceramic substrate or FR-4 substrate, on substrate, press shown in Fig. 6, in modes such as machine cut, punching press or laser drillings, on insulated substrate 1, form the through hole 11 and the groove 12 being connected with through hole accordingly of array, and form the location hole 14 of fixing metal melt 2 at horizontal array two ends; It must be noted that, the substrate material of mentioning in this example and processing mode be as just example, and should not serve as restriction of the present invention, as long as conventional substrate material and the processing mode of selecting in the industry all should be included protection scope of the present invention in.
(2) silk is worn at vertical diagonal angle: as shown in Figure 7, press through hole 11 array directions and quantity in insulated substrate 1, arrange positioning fixture row 6 ' and traction fixture row 6 in the quantity of fixture, the quantity of positioning fixture row 6 ' middle fixture should meet the line number of through hole in insulated substrate as far as possible, positioning fixture row's spacing of 6 ' middle fixture and the line-spacing of through hole match, traction fixture row 6 and positioning fixture arrange 6 ' in fixture corresponding one by one, in a line that cooperatively interacted through hole, metal bath wears a process, positioning fixture row 6 ' for metal bath is drawn to next through hole from a upper through hole, traction fixture row 6 is for drawing metal bath through through hole, and traction is to next through hole.As shown in Figure 7, Figure 8, its concrete steps are as follows:
Step1: the initiating terminal of metal bath 2 with positioning fixture row 6 ' be drawn to first through hole 11 belows, positions in the hole 11 of often working, is placed to another same traction fixture row 6 above each through hole 11 of positioning fixture row 6 ' corresponding,
Step2: first draw fixture row 6 through through hole 11 along positioning fixture row 6 ' rear end clamp metal bath 2, positioning fixture row 6 ' simultaneously unclamp,
Step3: traction fixture row 6 rises, and makes metal bath 2 through through hole 11,
Step4: traction fixture row 6 moves to second through hole 11 top again,
Step5: the traction fixture row 6 that declines makes metal bath 2 through second through hole 11,
Step6: now, positioning fixture row 6 ' clamp metal bath 2 along traction fixture row 6 front end, traction fixture row 6 unclamps metal bath 2 and rises,
Step7: positioning fixture row 6 ' traction metal bath 2 moves to the 3rd through hole 11 belows, position, traction fixture row 6 moves to this through hole 11 tops simultaneously, through insulated substrate 1 drop to be close to positioning fixture row 6 ' rear end clamp metal bath 2, positioning fixture row 6 ' simultaneously unclamp, thus realize a circulation;
Start to wear silk from Step3 again, so circulation, until complete the silk of wearing of each cross through hole 11 arrays of insulated substrate 1,
Step8: complete and wear after silk, then metal bath 2 is also strained through location hole 14, be then fixed on insulated substrate 1.
Positioning fixture row 6 in this example ' move below through hole 11 positions, traction fixture row 6 is above through hole 11 positions and the interior movement of through hole 11, but should be noted that, described " top ", " below " and the moving direction of traction fixture row 6 in through hole 11 are only a kind of relative directions, if the insulated substrate shown in figure is turned upside down, positioning fixture row 6 ' must be arranged on through hole 11 tops, position, traction fixture row 6 is arranged on through hole 11 belows, position, the moving direction of traction fixture row 6 in through hole also with above-mentioned embodiment (Step1～Step7) in opposite direction.
(3) conducting resinl printing: at the upper and lower surface of insulated substrate 1 printing conductive glue 5 respectively, and solidify, make conducting resinl fill the front end of full groove 12, thereby metal bath 2 is fixed in groove 12.
(4) protective layer adds: the insulated substrate that prints respectively the protective layer materials such as epoxy resin or bonding design size on the upper and lower surface of insulated substrate 1; form protective layer 4; in order to seal through hole 11 and to cover unfilled groove 12, thereby protection metal bath 2 is avoided the impact of external environment condition.While forming described protective layer 4, the conducting resinl at product both ends 5 should be exposed, so that metal bath 2 forms and is electrically connected with tip electrodes 3.
(5) substrate cut: insulated substrate 1 is divided into single the product meeting design requirement by the line of cut of its surface moulding in advance.
(6) tip electrodes forms: adopt the tip electrodes of knowing in the industry to form technique at insulated substrate 1 two ends at single product, form tri-layers of tip electrodes 3 of Cu/Ni/Sn, thereby obtain the chip-shaped protection component of the present invention as shown in Figure 1.
Embodiment bis-:
As the improvement of embodiment mono-, as shown in Figure 2, in described through hole 11, be filled with arc quenching material 111, can extinguish the electric arc that metal bath produces in the time of disjunction, improve the arc extinguishing ability of this product.All the other architectural features in this example are identical with embodiment mono-.
In the time manufacturing in batches the chip-shaped protection component that this example provides, between two steps of batch manufacturing step (3) conducting resinl printing and the interpolation of step (4) protective layer of embodiment mono-, increase following step: arc quenching material implantation step:
Adopt point gum machine gluing process (also can adopt other common process), arc quenching material 111 is injected in through hole 11, the moment that described arc quenching material 111 disconnects at metal bath 2, can extinguish electric arc, the adsorbing metal steam of its generation, reduce the compression shock of metallic vapour.
All the other steps are identical with embodiment six, can obtain the chip-shaped protection component of the present invention as shown in Fig. 2 structure.
Embodiment tri-:
As the improvement of embodiment mono-or embodiment bis-; as shown in Figure 3, inner at least one relief groove 13 that forms of described insulated substrate 1, described relief groove 13 is communicated with through hole 11; thereby the impact of the metallic vapour pressure producing can reduce disjunction time to protective layer 4, has improved the breaking capacity of product.Relief groove 13 is preferably vertical with through hole direction, and reduced pressure capabilities is strong.In this example, all the other architectural features of fuse are identical with embodiment mono-or identical with embodiment bis-.Arc quenching material 111 can extinguish the electric arc that metal bath produces in the time of disjunction, and relief groove 13 can effectively reduce the compression shock of metallic vapour, thereby obtains having the more chip-shaped protection component of high breaking capacity.
In the time manufacturing in batches the chip-shaped protection component that this example provides, manufacturing step (1) in embodiment mono-or embodiment bis-comprises the steps: preferably to adopt three layers of FR-4 baseplate material (also can adopt other organic insulation baseplate materials before, as polyimides, bakelite etc.), form relief groove 13 arrays in intermediate layer, again with upper, lower floor is pressing together, obtain insulated substrate 1, on this insulated substrate, can form the chip-shaped protection component as shown in Fig. 3 structure by the manufacturing step in embodiment mono-, on this insulated substrate, can form by the manufacturing step in embodiment bis-protection component that there is relief groove simultaneously and be filled with arc quenching material in through hole.
Embodiment tetra-:
As improvement, the upper and lower surperficial both sides of insulated substrate 1 through hole 11 can be respectively arranged with groove 12, as shown in Figure 4, insulated substrate 1 groove in upper surface left side and the groove on lower surface right side can be worn silk for melt diagonal angle, the groove in lower surface left side and the groove on upper surface right side also can be worn silk for melt diagonal angle, can eliminate like this directivity while wearing thread in through hole 11, be conducive to the lifting of production efficiency.All the other technical characterictics in this example are identical with embodiment mono-.The set-up mode of this routine further groove is particularly useful for the batch processing method in embodiment mono-～tri-.
Embodiment five:
The disclosed technological means of the present invention program is not limited only to the disclosed technological means of above-mentioned execution mode, also comprises the technical scheme being made up of above technical characterictic combination in any.It should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention, can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a chip-shaped protection component, comprise insulated substrate, be arranged on the metal bath in insulated substrate, be formed at the tip electrodes at insulated substrate two and be formed at the protective layer of insulated substrate outer surface, it is characterized in that: the middle part of described insulated substrate is formed with through hole, via openings direction is vertical with tip electrodes, insulated substrate upper, lower surface is respectively arranged with the groove being connected with through hole, metal bath penetrates from a side groove of insulated substrate, be after through hole is run through in angular direction and pass from opposite side groove, metal bath two ends are fixed in groove by conducting resinl, and form and be electrically connected with the tip electrodes at insulated substrate two, described protective layer is formed between tip electrodes.
2. chip-shaped protection component according to claim 1, is characterized in that: in described through hole, be filled with arc quenching material; And/or inner at least one relief groove that forms of described insulated substrate, described relief groove is communicated with described through hole.
3. chip-shaped protection component according to claim 1 and 2, is characterized in that: the upper and lower surperficial both sides of described through hole are respectively arranged with groove.
4. chip-shaped protection component according to claim 1 and 2, is characterized in that: on described insulated substrate, be formed with at least two through holes parallel to each other, pass metal bath in each through hole.
5. chip-shaped protection component according to claim 1 and 2, is characterized in that: described metal bath is crossing with the center line of through hole.
6. a batch manufacturing method for chip-shaped protection component, is characterized in that, comprises the following steps:
Step 1, substrate is prepared: the groove that forms the through hole of array on insulated substrate, be connected with through hole, and form the location hole of fixing metal melt at array two ends;
Step 2, silk is worn at vertical diagonal angle: arrange and arranged on the insulated substrate that cooperatively interacted the diagonal angle of metal bath in via-hole array with traction fixture and wear a process by positioning fixture, positioning fixture row is for drawing metal bath to next through hole from a upper through hole, traction fixture row is used for drawing metal bath and passes through hole, also draws to next through hole, complete wearing after silk of the each cross through hole array of insulated substrate, metal bath, through location hole tension, is then fixed on insulated substrate;
Step 3, conducting resinl printing: at the upper and lower surface of insulated substrate printing conductive glue respectively, and solidify, make conducting resinl fill the front end of full groove, thereby metal bath is fixed in groove;
Step 4, protective layer adds: the upper and lower surface at insulated substrate forms respectively protective layer, in order to seal through hole and to cover unfilled groove, while forming described protective layer, the conducting resinl at product both ends is exposed;
Step 5, substrate cut: insulated substrate is divided into single the product meeting design requirement;
Step 6, tip electrodes forms: the insulated substrate two ends at single product form tip electrodes, thereby obtain chip-shaped protection component.
7. the batch manufacturing method of chip-shaped protection component according to claim 6, is characterized in that, between described step 3 and step 4, comprises the steps:
Arc quenching material injects: arc quenching material is injected into through hole.
8. according to the batch manufacturing method of the chip-shaped protection component described in claim 6 or 7, it is characterized in that, before described step 1, comprise the steps:
Adopt three laminar substrates, form relief groove array in intermediate layer, then pressing together with upper and lower layer, insulated substrate obtained.
9. the batch manufacturing method of chip-shaped protection component according to claim 6, is characterized in that, the specific operation process of described step 2 is as follows:
The initiating terminal of metal bath is drawn to first lead to the hole site below in the hole of often working with positioning fixture row, above each through hole corresponding to positioning fixture row, place another same traction fixture row, first draw fixture row and clamp metal bath through through hole, positioning fixture row unclamp simultaneously, traction fixture row rise, make metal bath pass through hole, move to again second through hole top, then the traction fixture row that declines makes metal bath pass second through hole, now, positioning fixture row folding is lived metal bath, traction fixture row unclamp metal bath and rise, positioning fixture row traction metal bath moves to the 3rd lead to the hole site below, traction fixture row moves to this through hole top simultaneously, clamp metal bath through insulated substrate, so circulation, until complete the wearing after silk of the each cross through hole array of insulated substrate, again metal bath is also strained through location hole, then be fixed on insulated substrate.
10. according to the batch manufacturing method of the chip-shaped protection component described in claim 6 or 9, it is characterized in that: described protective layer printing or be bonded on insulated substrate.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410127719.1A CN103903929B (en) | 2014-04-01 | 2014-04-01 | A kind of chip-shaped protection element and batch fabrication method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410127719.1A CN103903929B (en) | 2014-04-01 | 2014-04-01 | A kind of chip-shaped protection element and batch fabrication method thereof |
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| CN103903929A true CN103903929A (en) | 2014-07-02 |
| CN103903929B CN103903929B (en) | 2016-08-31 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112735930A (en) * | 2020-12-18 | 2021-04-30 | 中国振华集团云科电子有限公司 | Arc suppression material for improving breaking capacity of fuse and preparation method thereof |
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| US20040183646A1 (en) * | 2003-03-04 | 2004-09-23 | Andre Jollenbeck | Fuse element with a temporary quasi-hermetic seal of its interior |
| JP2006244948A (en) * | 2005-03-07 | 2006-09-14 | Matsuo Electric Co Ltd | Manufacturing method of chip type fuse |
| JP2007220645A (en) * | 2006-01-23 | 2007-08-30 | Matsushita Electric Ind Co Ltd | Surface mounting type current fuse and its manufacturing method |
| CN101807500A (en) * | 2009-02-13 | 2010-08-18 | Aem科技（苏州）有限公司 | Surface mounting fuse protector and manufacturing method thereof |
| JP2012252846A (en) * | 2011-06-02 | 2012-12-20 | Koa Corp | Manufacturing method of cylindrical current fuse |
| CN203787375U (en) * | 2014-04-01 | 2014-08-20 | 南京萨特科技发展有限公司 | Chip type protection element |
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2014
- 2014-04-01 CN CN201410127719.1A patent/CN103903929B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040183646A1 (en) * | 2003-03-04 | 2004-09-23 | Andre Jollenbeck | Fuse element with a temporary quasi-hermetic seal of its interior |
| JP2006244948A (en) * | 2005-03-07 | 2006-09-14 | Matsuo Electric Co Ltd | Manufacturing method of chip type fuse |
| JP2007220645A (en) * | 2006-01-23 | 2007-08-30 | Matsushita Electric Ind Co Ltd | Surface mounting type current fuse and its manufacturing method |
| CN101807500A (en) * | 2009-02-13 | 2010-08-18 | Aem科技（苏州）有限公司 | Surface mounting fuse protector and manufacturing method thereof |
| JP2012252846A (en) * | 2011-06-02 | 2012-12-20 | Koa Corp | Manufacturing method of cylindrical current fuse |
| CN203787375U (en) * | 2014-04-01 | 2014-08-20 | 南京萨特科技发展有限公司 | Chip type protection element |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112735930A (en) * | 2020-12-18 | 2021-04-30 | 中国振华集团云科电子有限公司 | Arc suppression material for improving breaking capacity of fuse and preparation method thereof |
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| CN103903929B (en) | 2016-08-31 |
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