CN103839737B - Surface mounting fuse protector and manufacture method thereof - Google Patents
Surface mounting fuse protector and manufacture method thereof Download PDFInfo
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- CN103839737B CN103839737B CN201410081336.5A CN201410081336A CN103839737B CN 103839737 B CN103839737 B CN 103839737B CN 201410081336 A CN201410081336 A CN 201410081336A CN 103839737 B CN103839737 B CN 103839737B
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 42
- 229910052802 copper Inorganic materials 0.000 claims abstract description 42
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 47
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- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims description 3
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- Fuses (AREA)
Abstract
A kind of surface mounting fuse protector and manufacture method thereof, described surface mounting fuse protector comprises metal bath, tip electrodes and insulated substrate, described insulated substrate is made up of stacked upper insulated substrate and lower insulated substrate, described tip electrodes is coated on the two ends, left and right of insulated substrate, it is characterized in that: described upper insulated substrate is square plate, lower insulated substrate is provided with cavity in the one side relative with upper insulated substrate and lays respectively at the groove of the described cavity left and right sides, described groove side is communicated with cavity, side is through to lower insulated substrate side, depth of groove is less than described cavity, metal bath is between upper and lower substrate, middle part is suspended in described cavity, coated by arc quenching material, and its left and right both ends lay respectively in left and right groove, be filled with the copper product wrapping metal bath in groove, tip electrodes is electrically connected with the copper body in groove.Manufacturing process of the present invention is simple, processing cost is low, and parts connect reliable.
Description
Technical field
The present invention relates to a kind of circuit brake, be specially a kind of surface mounting fuse protector and manufacture method thereof.
Background technology
Fuse is a kind of device be made up of the insulator of melt and support or protection melt; its metal material utilizing fusing point lower or slurry make wire or pellet electrode etc. as melt; be connected in protected circuit; when the apparatus overload in circuit or circuit or when breaking down; melt because of heating by instantaneous fuse; thus cut-out circuit, reach the object of protective circuit or equipment.Along with the development of fuse microminiaturization, when the disjunction safety problem of melt becomes high voltage, big current application gradually, need the emphasis factors considered.The moment that excessive or short circuit disconnects at fault current, the electric arc that on melt, meeting produce power is powerful, if do not arrange the material extinguishing this kind of electric arc near melt, fuse will burn even the danger of generation blast, light then burn other valuable elements in circuit, heavy what for can because of arc ignition breaking out of fire, jeopardize personal safety.
In Chinese patent 201220702979.3, a kind of surface mounting fuse protector is proposed, adopt the method increasing insulation shell internal capacity, the end cap copper sheet of traditional ceramics shell shape fuse is replaced, and fill arc quenching material in insulation shell inside, thus improve the specified breaking capacity of fuse, make it can meet the disjunction requirement of 250VAC/50A.But this explained hereafter cost is relatively high, a large amount of production comparatively difficulty.Chinese patent 200810092353.3, 200910007157.6, 201110123326.X with 201220063222.4 each provide a kind of suspended-fuse-wire-type surface-mount fuse and manufacture method, by upper, a cavity is formed respectively in the middle part of lower insulated substrate, bonded by adhesive between two insulated substrates, metal fuse is placed between two insulated substrates and forms unsettled fuse-wires structure, arc quenching agent is filled in cavity, to absorb the energy that fuse discharges in fuse blowing process, fuse has part to expose outside insulator end and bendingly makes it be close to end electrode, the medial surface that insulation crust cover plate is relative arranges intensifier electrode, and extend to insulator edges at two ends and end electrode is electrically connected, the end of intensifier electrode is contacted with end electrode, make simultaneously the two ends of fuse respectively and between corresponding intensifier electrode forming surface contact, ensure that the reliability that fuse is connected with end electrode.Adopt this technique, the product of below 2A rated current can meet 250VAC/100A disjunction conditional request, and its manufacture method is simple, cost is lower, easily realize industrialization continuous seepage, but product there will be in use for some time because fuse and end electrode adhesive force under thermal shock diminishes and loosens, and the fuse cold resistance caused becomes large bad phenomenon.
Summary of the invention
Technical purpose of the present invention is the shortcoming for existing in above-mentioned prior art, provide a kind of processing technology simple, be easy to manufacture and the reliable surface mounting fuse protector of product and manufacture method thereof.
For realizing above-mentioned technical purpose, technical scheme provided by the invention is:
A kind of surface mounting fuse protector, comprise metal bath, tip electrodes and insulated substrate, described insulated substrate is made up of stacked upper insulated substrate and lower insulated substrate, and described tip electrodes is coated on the two ends, left and right of insulated substrate, it is characterized in that:
Described upper insulated substrate is slab construction, described lower insulated substrate is provided with a cavity in its one side relative with upper insulated substrate and lays respectively at the groove of the described cavity left and right sides, described groove side is communicated with cavity, and side is through to lower insulated substrate side, and depth of groove is less than described cavity;
Described metal bath is arranged between upper and lower insulated substrate, and metal bath middle part is suspended in described cavity, is filled with the arc quenching material (play extinguish arcs, improve the effect of breaking capacity) being enough to envelope suspension metal bath in cavity; Metal bath two-end part lays respectively in left and right groove, is filled with the copper product wrapping metal bath in groove, and described tip electrodes is connected with the copper body in groove.
The present invention, by setting up the copper product wrapping metal bath in the end of metal bath, ensures the reliability that metal bath is electrically connected with tip electrodes further.
Further, the corresponding each groove of described lower insulated substrate is equipped with a through lower insulated substrate upper and lower surface and passes the lower through-hole of described groove; Described upper insulated substrate the position of each lower through-hole of correspondence be provided with through on the upper through hole of insulated substrate upper and lower surface, after upper and lower insulated substrate is stacked, upper through hole is communicated with corresponding groove, and be all filled with copper product in upper and lower through hole, copper body in through hole is connected with described tip electrodes, increases the reliability that metal bath is connected with tip electrodes further.Upper and lower through hole is all preferably arranged on the middle part of groove.
Described groove is provided with the nonconductive adhesive layer being highly not less than described depth of groove near one end of cavity, metal bath is fixed in groove by described adhesive.Adhesive has the colloid of excellent mechanical strength and insulation property after preferably having lazy flow and solidification.
As preferably, described metal bath is that sheet metal, metal wire material or wire are around any one in the structure on glass fibre or ceramic fibre wire rod.
Further, the degree of depth of described cavity is set to 1/2 ~ 2/3 of lower insulated substrate height.And the degree of depth of described groove is 1/3 ~ 1/2 of the described cavity degree of depth.
Described upper insulated substrate or lower insulated substrate are preferably the materials such as oxide ceramics, glass or thermoset plastics.For reducing costs further, described upper insulated substrate or lower insulated substrate adopt one or more materials in the fire resistant resin materials such as epoxy resin, bakelite, polyamide or polyimides to be mixed.
As preferably, described arc quenching material is liquid silica gel, silicon dioxide or the two mixture are the composite mortar of matrix, and described silicon dioxide can adopt granularity at 300 order ~ 10000 object crystalline silicas or amorphous silica or both mixtures.Described amorphous silica then further preferably aerosil or take diatomite as the silicon dioxide (one of diatomite and amorphous silica, except diatomite, a small amount of impurity is contained in the inside) of main component.
A kind of surface mounting fuse protector manufacture method, is characterized in that, comprise the following steps:
A) insulated substrate is prepared: select the upper and lower dielectric substrate material met design requirement, pre-set line of cut in plate of material surface by deisgn product size; Lower dielectric substrate material plate body processes cavity and the groove of some row or column, and arbitrary cavity left and right sides is equipped with groove, and go together between adjacent cavity and be connected by described groove, depth of groove is less than described cavity;
B) silk is worn: be placed in the row direction in described groove by complete metal bath bar, and unsettled through cavity;
C) put glue: be injected into by the adhesive meeting performance requirement in described groove, fixing metal melt, adhesive spots is in groove one end near cavity, and ulking thickness otherwise lower than the degree of depth in groove, enter in groove to prevent the arc quenching material in cavity;
D) arc quenching material is filled: by the filled therewith of arc quenching material in cavity, make the metal bath in cavity completely coated by arc quenching material;
E) substrate is stacking with solidification: fill stacked on complete lower dielectric substrate material plate on dielectric substrate material plate, and make the two line of cut alignment, be put in baking in baking oven, carry out the solidification of arc quenching material and adhesive;
F) substrate cut: cut by the line of cut in plate of material, namely forms multiple surface mounting fuse protector monomer;
G) filling perforation copper facing: utilize the electroplates in hole technology to carry out electro-coppering filling perforation in described groove, forms the filling perforation copper coating wrapping metal bath;
H) tip electrodes is formed: the tip electrodes fuse monomer after filling perforation processing two ends, coated fuse monomer left and right, described tip electrodes is formed with described filling perforation copper coating and is electrically connected, and namely obtains surface mounting fuse protector finished product.
Further, in described step a), corresponding each groove, upper and lower dielectric substrate material plate processes the through hole on the through upper and lower surface of material plate body respectively, lower insulated substrate through hole is through the groove on lower insulated substrate, and the groove of upper insulated substrate through hole in correspondence after upper and lower material plate body is stacked is communicated with; In described step g), utilize the electroplates in hole technology to carry out electro-coppering filling perforation in the through hole of upper and lower insulated substrate, filled up by through hole, form through hole copper coating, described through hole copper coating is formed with described tip electrodes and is electrically connected.
Beneficial effect of the present invention:
(1) by adopting the technology such as copper facing filling perforation, reliability of electrical connection between fuse and copper coating is improved greatly, eliminate fuse in use due between metal bath, tip electrodes, insulated substrate by the impact that thermal coefficient of expansion inconsistency during thermal shock causes;
(2) adopt the design of filling the coated melt of arc quenching material in cavity, especially adopt the good liquid silica gel of arc extinction performance, silicon dioxide or the composite material arc extinguishing of the two, substantially increase the breaking capacity of product under high-voltage large current;
(3) melt design can adopt the various structures such as metal wire material, sheet material or wrapping wire, can meet the designing requirement of rated current at 5A and following fuse products;
(4) production technique is simple, and processing cost is low, easily realizes industrialization continuous seepage.
Accompanying drawing explanation
Fig. 1 is the three-dimensional appearance schematic diagram of surface mounting fuse protector embodiment of the present invention;
Fig. 2 is the sectional axonometric drawing of Figure 1A-A ' to surface mounting fuse protector cross section;
Fig. 3 is the side sectional view of surface mounting fuse protector band via design of the present invention;
Fig. 4 is the upper dielectric substrate material plate body outward appearance partial enlarged drawing processing line of cut in the present invention;
Fig. 5 is the lower dielectric substrate material plate body outward appearance partial enlarged drawing processing line of cut in the present invention;
Fig. 6 is that surface mounting fuse protector of the present invention wears a process schematic;
Fig. 7 is surface mounting fuse protector side sectional view of the present invention;
Fig. 8 is the side sectional view of surface mounting fuse protector band via design insulated substrate of the present invention.
In upper figure, the upper insulated substrate of 1-, insulated substrate under 2-, 3-tip electrodes, 4-metal bath, 5-arc quenching material, 51-cavity, 6-adhesive, 7-filling perforation copper coating, 71-groove, groove outside 711-, 8-through hole copper coating, the upper through hole of 81-, 82-lower through-hole.
Embodiment
In order to illustrate technical scheme of the present invention and technique effect, below in conjunction with drawings and the specific embodiments, the present invention is described further.
As shown in Figure 1, Figure 2, a kind of surface mounting fuse protector shown in Fig. 7, comprise following composition component:
1) insulated substrate;
Described insulated substrate is made up of stacked upper insulated substrate 1 and lower insulated substrate 2.Described upper insulated substrate 1 is a square plate, and described lower insulated substrate 2 is provided with cavity 51 in its one side relative with upper insulated substrate 1 and lays respectively at the groove 71 of the described cavity left and right sides.
Described groove 71 side is communicated with cavity 51, the through side to lower insulated substrate 2, side, and groove 71 degree of depth is less than described cavity 51(and is placed on after in groove 71 to make metal bath 4 two ends, and the middle part of metal bath 4 is unsettled in cavity 51).Described groove 71 its cross section preferred is semicircle or rectangle, the degree of depth are semicolumn or the square column type groove of cavity 51 degree of depth 1/3 ~ 1/2.
Described upper insulated substrate 1 and lower insulated substrate 2 can select the materials such as oxide ceramics, glass or thermoset plastics, and preferred material has the fire resistant resin materials such as epoxy resin, bakelite, polyamide or polyimides.
2) tip electrodes 3;
Described tip electrodes 3 be coated on stacked after upper insulated substrate 1 and lower insulated substrate 2 two ends;
3) metal bath 4;
Metal bath 4 is clipped between insulated substrate 1 and lower insulated substrate 2, and metal bath 4 can adopt sheet metal, metal wire material or any one version of wrapping wire on glass fibre, ceramic fibre, or other Conventional melt structural material.
Metal bath 4 middle part is suspended in described cavity 51, is wrapped by arc quenching material 5.The slurry that it is matrix that arc quenching material 5 can adopt with liquid silica gel, silicon dioxide or the two mixture, described silicon dioxide is granularity at 300 order ~ 10000 object crystalline silicas or amorphous silica or both mixtures.And described amorphous silica is preferably aerosil or take diatomite as the silicon dioxide of main component.
The left and right two-end part of metal bath 4 is separately positioned in left and right groove 71.For ensureing the reliability that metal bath 4 is electrically connected with tip electrodes 3, be filled with copper product in groove 71 and wrap metal bath 4, tip electrodes 3 contacts with the copper body (copper product of namely filling) in metal bath 4 and groove, realizes electrical connection.
Another embodiment as shown in Figure 3, the corresponding left and right groove 71 in the left and right sides of described insulated substrate, lower insulated substrate 2 is set up a through lower insulated substrate upper and lower surface also through the through hole 82 of groove 71, through hole 81 is set up at the correspondence position of upper insulated substrate 1, also copper product is filled with in described through hole 81, through hole 82, form copper body after filling to be electrically connected with tip electrodes 3, because the copper body in through hole 81 is connected with the copper body in groove 71, further enhancing the reliability that metal bath 4 is electrically connected with tip electrodes 3.
Add man-hour, left and right two grooves 71 are filled with the adhesive 6 being highly not less than described groove 71 degree of depth in its one end near cavity 51, be fixed on by metal bath 4 in groove 71, after upper and lower insulated substrate is stacked, the binding agent exceeding groove 71 also can be used in the bonding of upper and lower substrate.
Above-mentioned surface mounting fuse protector makes by following steps, specifically comprises:
A) insulated substrate is prepared:
First, select the upper and lower dielectric substrate material met design requirement, pre-set line of cut in plate of material surface by deisgn product size, as shown in Figure 4, Figure 5.
Lower insulated substrate 2 material plate body processes cavity 51 and the groove 71 of some row or column (or say transversely or longitudinally), arbitrary cavity 51 left and right sides is equipped with groove 71, go together between adjacent cavity 51 and be connected by described groove 71, groove 71 degree of depth is less than described cavity 51.
B) silk is worn:
Thread, banded or bar-shaped whole piece metal bath 4 are placed in described groove 71 in the row direction, and unsettled through cavity 51, as shown in Figure 6.
C) glue is put:
In groove 71 as described in the adhesive meeting performance requirement (as low mobility and excellent electrical insulating property etc.) is injected into, fixing metal melt 4,6, adhesive is in groove 71 one end near cavity 51, and ulking thickness otherwise lower than the degree of depth of groove 71.
D) arc quenching material is filled:
By the filled therewith of arc quenching material 5 in cavity 51, make the metal bath 4 in cavity 51 completely coated by arc quenching material 5, be preferably filled into the position of arc quenching material 5 and lower insulated substrate 2 upper surface flush;
E) substrate is stacking with solidification:
Insulated substrate 1 plate of material on stacked in lower insulated substrate 2 plate of material that filling is complete, and make the two line of cut alignment, be put in baking in baking oven, carry out the solidification of arc quenching material 5 and adhesive 6;
F) substrate cut:
Cut by the line of cut in plate of material, namely form multiple surface mounting fuse protector monomer.
G) filling perforation copper facing:
Utilize the electroplates in hole technology to carry out electro-coppering filling perforation in described groove 71, groove 71 is filled up and wraps metal bath 4.
H) tip electrodes is formed:
Fuse monomer after filling perforation processes the tip electrodes 3 of left and right two end surfaces of coated fuse monomer, described tip electrodes 3 is electrically connected with described metal bath 4 and described filling perforation copper coating 7, namely obtains surface mounting fuse protector finished product.
As set up through hole, then in described step a), corresponding each groove 71, upper and lower dielectric substrate material plate processes the through hole on the through upper and lower surface of material plate body respectively, and the lower through-hole 82 of lower insulated substrate is through the groove 71 on lower insulated substrate 2; In described step g), utilize the electroplates in hole technology to carry out electro-coppering filling perforation in the through hole of upper and lower insulated substrate, filled up by through hole, form through hole copper coating 8, described through hole copper coating 8 is connected with described tip electrodes.
The method that surface mounting fuse protector of the present invention carries out producing in batches is introduced further below in conjunction with two specific embodiments:
embodiment 1
First, by FR-4 substrate (or other common printed circuit board (PCB)) by being pressed into a square plate structure shown in Fig. 4, and be pre-formed transverse cut and longitudinal line of cut by deisgn product size, form location hole in mechanical stamping mode, thus obtain the material plate body making insulated substrate 1; Under making during insulated substrate 2 material plate body, by the plate of material of another identical material, (thickness is more than 2 times of upper insulated substrate 1 thickness, and two substrates gross thickness meets product thickness requirement) form the line of cut corresponding with upper insulated substrate 1 material plate body and location hole by the same manner, groove 71 and cavity 51 is formed again, as shown in Figure 5 in the mode of machine cut.Wherein cavity 51 is rectangular structure, and groove 71 is semicylinder structure.
Secondly, to be wound on fuse on glass wire as metal bath 4, it is laterally unsettled through the cavity 51 on lower insulated substrate 2, and frame is on groove 71, as shown in Figure 6, the outermost end winding support of whole piece metal bath is on the corresponding outermost groove 711 of lower insulated substrate 2.
Again, by point gum machine gluing process, by the inner side (namely near the position of cavity 51) of high viscosity bi-component AB silica adhesive point to groove 71, the some glue height outline of adhesive 6 exceeds the surface of lower insulated substrate 2, and fills up groove 71 section completely.Arc quenching material 5 is filled toward cavity 51 inside again by gluing process, preferably be filled into its surface surperficial concordant with lower insulated substrate 2 till, to ensure that metal bath 4 is coated to arc quenching material 5 inside and reaches adequate thickness, guarantee that fuse has excellent high voltage interrupting performance.The slurry that the mixture of arc quenching material 5 mainly liquid silica gel and silicon dioxide forms, wherein silicon dioxide is made up of at least one of granularity in 300 order ~ 10000 object crystalline silicas or amorphous silica, aerosil etc., to regulate the conductive coefficient of arc extinction slurry, improve the operating chacteristics of fuse.
Then, upper insulated substrate 1 material plate body is located by location hole, is stacked to above lower insulated substrate 2, then entirety is put into the solidification carrying out adhesive and arc quenching material 5 in baking oven, make them have enough intensity.After solidification, fuse array is carried out horizontal and vertical cutting along the transverse cut of baseplate material and longitudinal line of cut and forms each fuse monomer.
Finally, adopt the conventional the electroplates in hole technology of printed circuit board (PCB) to carry out electro-coppering filling perforation at groove 71 place and obtain filling perforation copper coating 7, then with tip electrodes formation process known in the art, form Cu/Ni/Sn tri-layers of tip electrodes structure, thus obtain surface mounting fuse protector of the present invention, as Fig. 7.
It is 5A and the following product disjunction conditional request at 250VAC/100A that the fuse produced can meet rated current.
embodiment 2:
See Fig. 8, by design size, on the lower insulated substrate 2 material plate body formed by embodiment 1, corresponding each groove 71 forms the through hole 82 of a communication groove 71 and lower insulated substrate 2 material plate body lower surface, correspondence position on upper insulated substrate 1 material plate body formed one through on the through hole 81 of insulated substrate 1 upper and lower surface, adopt the conventional the electroplates in hole technology of printed circuit board (PCB) to carry out electro-coppering filling perforation to obtain through hole copper coating 8 equally in above-mentioned through hole 81 and through hole 82.
Through hole 81 and through hole 82 can adopt laser drilling or machine cut, Sheet Metal Forming Technology obtains.
Filling perforation copper coating 7 take copper electroplating liquid as raw material, adopts chemical plating or electroplating technology to be formed, obtain through hole copper coating 8 with same process filling through hole 81 and through hole 82.
Other techniques, with embodiment 1, obtain surface mounting fuse protector as shown in Figure 3.
More than show and describe general principle of the present invention, principal character and advantage of the present invention.The technical staff of the industry should understand, the present invention is not restricted to the described embodiments, what describe in above-described embodiment and specification just illustrates principle of the present invention, and without departing from the spirit and scope of the present invention, the present invention also has various changes and modifications.Application claims protection range is defined by appending claims, specification and equivalent thereof.
Claims (9)
1. a surface mounting fuse protector, comprises metal bath, tip electrodes and insulated substrate, and described insulated substrate is made up of stacked upper insulated substrate and lower insulated substrate, and described tip electrodes is coated on the two ends, left and right of insulated substrate, it is characterized in that:
Described upper insulated substrate is slab construction, described lower insulated substrate is provided with a cavity in the one side relative with upper insulated substrate and lays respectively at the groove of the described cavity left and right sides, described groove side is communicated with cavity, and side is through to lower insulated substrate side, and depth of groove is less than described cavity;
Described metal bath is arranged between upper and lower insulated substrate, and metal bath middle part is suspended in described cavity, is filled with the arc quenching material being enough to envelope metal bath in cavity; Metal bath two-end part lays respectively in left and right groove, is filled with the copper product wrapping metal bath in groove, and tip electrodes is connected with the copper body in groove; The corresponding each groove of described lower insulated substrate is equipped with a through lower insulated substrate upper and lower surface and passes the lower through-hole of described groove; Described upper insulated substrate the position of each lower through-hole of correspondence be provided with through on the upper through hole of insulated substrate upper and lower surface, after upper and lower insulated substrate is stacked, upper through hole is communicated with corresponding groove, and is all filled with copper product in upper through hole and lower through-hole, and the copper body in through hole is connected with described tip electrodes.
2. a kind of surface mounting fuse protector according to claim 1, is characterized in that, described groove is provided with the nonconductive adhesive layer being highly not less than described depth of groove near one end of cavity, and metal bath is fixed in groove by described adhesive.
3. a kind of surface mounting fuse protector according to claim 1, is characterized in that, described metal bath is that sheet metal, metal wire material or wire are around any one in the structure on glass fibre or ceramic fibre wire rod.
4. a kind of surface mounting fuse protector according to claim 1, is characterized in that, the degree of depth of described cavity is 1/2 ~ 2/3 of lower insulated substrate height; The degree of depth of described groove is 1/3 ~ 1/2 of the described cavity degree of depth.
5. a kind of surface mounting fuse protector according to claim 1, it is characterized in that, described upper insulated substrate or lower insulated substrate are any one in oxide ceramics, glass or thermoset plastics, and described thermoset plastics is one or more in epoxy resin, bakelite, polyamide or polyimides.
6. a kind of surface mounting fuse protector according to claim 1, it is characterized in that, the composite mortar that described arc quenching material is is matrix with liquid silica gel, silicon dioxide or the two mixture, described silicon dioxide is granularity at 300 order ~ 10000 object crystalline silicas or amorphous silica or both mixtures.
7. a kind of surface mounting fuse protector according to claim 6, is characterized in that, described amorphous silica is aerosil or take diatomite as the silicon dioxide of main component.
8. a surface mounting fuse protector manufacture method, is characterized in that, comprises the following steps:
A) insulated substrate is prepared: select the upper and lower dielectric substrate material met design requirement, pre-set line of cut in plate of material surface by deisgn product size; Lower dielectric substrate material plate body processes cavity and the groove of some row or column, and arbitrary cavity left and right sides is equipped with groove, and go together between adjacent cavity and be connected by described groove, depth of groove is less than described cavity;
B) silk is worn: be placed in the row direction in described groove by complete metal bath bar, and unsettled through cavity;
C) put glue: be injected into by the adhesive meeting performance requirement in described groove, fixing metal melt, adhesive spots is in groove one end near cavity, and ulking thickness otherwise lower than the degree of depth in groove;
D) arc quenching material is filled: by the filled therewith of arc quenching material in cavity, make the metal bath in cavity completely coated by arc quenching material;
E) substrate is stacking with solidification: fill stacked on complete lower dielectric substrate material plate on dielectric substrate material plate, and make the two line of cut alignment, be put in baking in baking oven, carry out the solidification of arc quenching material and adhesive;
F) substrate cut: cut by the line of cut in plate of material, namely forms multiple surface mounting fuse protector monomer;
G) filling perforation copper facing: utilize the electroplates in hole technology to carry out electro-coppering filling perforation in described groove, forms the filling perforation copper coating wrapping metal bath;
H) tip electrodes is formed: the tip electrodes fuse monomer after filling perforation processing two ends, coated fuse monomer left and right, described tip electrodes is formed with described filling perforation copper coating and is electrically connected, and namely obtains surface mounting fuse protector finished product.
9. a kind of surface mounting fuse protector manufacture method according to claim 8, is characterized in that:
In described step a), corresponding each groove, upper and lower dielectric substrate material plate processes the through hole on the through upper and lower surface of material plate body respectively, lower insulated substrate through hole is through the groove on lower insulated substrate, and the groove of upper insulated substrate through hole in correspondence after upper and lower material plate body is stacked is communicated with;
In described step g), utilize the electroplates in hole technology to carry out electro-coppering filling perforation in the through hole of upper and lower insulated substrate, filled up by through hole, form through hole copper coating, described through hole copper coating is formed with described tip electrodes and is electrically connected.
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| CN201410081336.5A CN103839737B (en) | 2014-02-28 | 2014-03-07 | Surface mounting fuse protector and manufacture method thereof |
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| CN105428179B (en) * | 2015-12-31 | 2018-10-30 | 洪湖市蓝光电子有限责任公司 | A kind of alloy-type thermal fuse-link of resistance to turn-off current |
| CN105551905B (en) * | 2016-02-18 | 2017-11-21 | Aem科技(苏州)股份有限公司 | A kind of suspended-fuse-wire-type surface-mount fuse and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101567283A (en) * | 2008-04-24 | 2009-10-28 | Aem科技（苏州）有限公司 | Surface mounting fuse protector and manufacturing method thereof |
| CN101937813A (en) * | 2009-06-26 | 2011-01-05 | 库帕技术公司 | Subminiature fuse with surface mount end caps and improved connectivity |
| JP2011175958A (en) * | 2010-01-28 | 2011-09-08 | Kyocera Corp | Fuse device, component for fuse device, and electronic device |
| JP2012174443A (en) * | 2011-02-21 | 2012-09-10 | Kamaya Denki Kk | Chip fuse and manufacturing method thereof |
| CN203871288U (en) * | 2014-02-28 | 2014-10-08 | 南京萨特科技发展有限公司 | Surface-mount fuse |
-
2014
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101567283A (en) * | 2008-04-24 | 2009-10-28 | Aem科技（苏州）有限公司 | Surface mounting fuse protector and manufacturing method thereof |
| CN101937813A (en) * | 2009-06-26 | 2011-01-05 | 库帕技术公司 | Subminiature fuse with surface mount end caps and improved connectivity |
| JP2011175958A (en) * | 2010-01-28 | 2011-09-08 | Kyocera Corp | Fuse device, component for fuse device, and electronic device |
| JP2012174443A (en) * | 2011-02-21 | 2012-09-10 | Kamaya Denki Kk | Chip fuse and manufacturing method thereof |
| CN203871288U (en) * | 2014-02-28 | 2014-10-08 | 南京萨特科技发展有限公司 | Surface-mount fuse |
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