CN101567283A - Surface mounting fuse protector and manufacturing method thereof - Google Patents
Surface mounting fuse protector and manufacturing method thereof Download PDFInfo
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- CN101567283A CN101567283A CNA2008100923533A CN200810092353A CN101567283A CN 101567283 A CN101567283 A CN 101567283A CN A2008100923533 A CNA2008100923533 A CN A2008100923533A CN 200810092353 A CN200810092353 A CN 200810092353A CN 101567283 A CN101567283 A CN 101567283A
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Abstract
The invention provides a surface mounting fuse protector and a manufacturing method thereof. The surface mounting fuse protector comprises an upper base plate, a lower base plate and a fuse wire, wherein one end of the outer side of the upper base plate is provided with a first end electrode, the other end of the same is provided with a second end electrode, and the middle of the inner side of the upper base plate is provided with a first recessed cavity; one end of the outer side of the lower base plate is provided with a third end electrode corresponding to the first end electrode, the other end of the same is provided with a fourth end electrode corresponding to the second end electrode, the middle of the inner side of the lower base plate is provided with a second recessed cavity corresponding to the first recessed cavity, and the first recessed cavity and the second recessed cavity together form a cavity; the fuse wire is clamped between the upper base plate and the lower base plate, a part of the fuse wire is suspended in the cavity, the first end electrode and the third end electrode are electrically connected with one end of the fuse wire, and the second end electrode and the fourth end electrode are electrically connected with the other end of the fuse wire. The wire suspending type surface mounting fuse protector reduces the heat transfer rate of the fuse wire at the periphery, is simple in structure and has the low stress of the fuse wire.
Description
Technical field
The present invention relates to a kind of surface mounting fuse protector and manufacture method thereof, relate in particular to small-sized surface mounting fuse protector of a kind of unsettled lead-type and manufacture method thereof.
Background technology
Current, printed circuit board (PCB) comes how to be applied in the various electric and electronic equipments more.The circuit that forms on these printed circuit board (PCB)s generally all needs overcurrent protection.One of mode that this overcurrent protection is provided is to use the small-sized surface mounting fuse protector that is fixed on the printed circuit board (PCB).
Present small-sized surface mounting fuse protector mainly contains two major types.One class is solid state device type (Solid Body), and another kind of is unsettled lead-type (Wire-In-Air).
The characteristics of the fuse of solid state device type are that fuse (fuse element) is embedded in support on every side or the arc quenching material to form solid structure.In the United States Patent (USP) of listing below, couple description of the fuse of solid state device type: US 5,228,188,5,296,833,5,726 is arranged, 621,5,432,378,5,943,764,5,440,802,6,002,322,6,034,589,7,268,661.The fuse of this type can be done very for a short time, can process the matrix of a plurality of fuses on big plate base simultaneously, has higher production efficiency.But because fuse is higher to the rate of heat transfer of the periphery material of being close to, under the requirement of certain blowout current, fuse will have bigger resistance could produce enough heats with fuse failure.
U.S. Pat 6,002,322 have disclosed a kind of structure and production method thereof of typical solid device type surface mounting fuse protector.This method is made the matrix of a plurality of fuses on the macromolecule sheet material of monolithic, and then cuts into single fuse.This method production efficiency is higher, but can only produce the surface mounting fuse protector of solid state device type, and its fuse is close on the substrate, and rate of heat transfer is higher, and the bigger energy of needs could be with fuse failure.
The caloric value of the fuse of fuse can be expressed with following equation:
Q＝I
2Rt
Wherein Q is a caloric value, and I is an electric current, and R is a resistance, and t is the time.The fuse of specific protective current has certain regulation to electric current I and fusing time t.When the fusing heat Q of needs was big more, resistance R was just big more.Can only make fuse by this method and be close to fuse on the substrate, higher rate of heat transfer causes the increase of required heat energy and resistance.
The fuse that resistance is bigger can consume bigger electric energy on electronic circuit.In adopting battery powered electrical equipment, use the bigger fuse of resistance that reduced the service time of battery.
The midget fuse of unsettled lead-type is that fuse (lead) is suspended in the shell of hollow.The two ends of fuse are fixing in a different manner with the termination electrode.Because the thermal transmission coefficient of air is more much smaller than most solid, therefore the less energy of the fuse of unsettled lead-type needs just can be with fuse failure, and its resistance can also be less.The fuse of this class has detailed explanation: US 5,617,069,5,648,750,5,214,406,5,926,084,6,147,585,6,903,649,4,920,327,4,467,308,3,460,086,6,798,330 in following United States Patent (USP).These patents of invention have been described the distinct methods that how fuse is fixed in the cavity, and its purpose is to avoid contacting of fuse stage casing and chamber wall more, to the stress that fuse applied, increase reliability that fuse is connected with the termination etc. when reducing to install.The fuse of this class adopts earthenware and metal cap parts to assemble one by one at present, and production efficiency is lower.
U.S. Pat 5,214,406 have disclosed a kind of structure of typical unsettled lead-type surface mounting fuse protector.This fuse comprises in one the shell of circle foreign side, two termination metal caps, and two ends are welded on the fuse on the two ends metal cap.This fuse has the characteristics of unsettled lead-type fuse, because the peritropous rate of heat transfer of unsettled lead (fuse) is lower, required fusing heat is less, so its resistance also can be done lessly.
But described as above-mentioned document US 5,214,406, the fuse of many unsettled lead-type fuses is tiny easily broken, and certain difficulty is arranged when mounted.For guarantee fuse except that two ends not with the influence of housing contacts to avoid conducting heat to operating chacteristics, have to again the bending two ends of fuse is fixed on the end face at two diagonal angles.When being pressed into two ends copper cap, the friction between copper cap and fuse can produce tension force to fuse.These bendings and tension force all may make tiny easily broken fuse produce distortion or fracture.There are the shell of constant slope, the tension force that when being pressed into to reduce the copper cap fuse is produced in the improvement design employing two ends of the prior art.But copper cap and housing contacts will have enough friction can not come off when installing and use to guarantee the copper cap.This just must make the inside dimension of copper cap be less than external dimensions with the housing contacts place.The design of this fuse can reduce but can not eliminate the tension force that when being pressed into two ends copper cap fuse is produced.And the minimizing of this tension force that fuse is produced is to be cost with the minimizing of copper cap and the friction of housing contacts and the reliability that is connected.Improvement design in the above-mentioned document is with scolding tin the fuse two ends to be welded on two terminations.But this improvement design also can not be eliminated because of the fuse bending two ends and cause the injury possible to fuse.And scolding tin when fusion can with fuse materials commonly used, as copper, form low-melting alloy.The formation of this low-melting alloy can reduce the consistency of fuse blows characteristic.In addition, this fuse need adopt the method for assembling one by one to be assembled, and production efficiency is lower.
Summary of the invention
The small-sized surface mounting fuse protector and the manufacture method thereof that the purpose of this invention is to provide a kind of unsettled lead-type, thereby when keeping advantages such as unsettled lead-type fuse is little with respect to solid state device type resistive fuse, power consumption is low, eliminate when making the bending of fuse and the tension force that is produced, and avoid producing low-melting alloy, improve reliability of products and consistency.In addition, can produce above-mentioned fuse fast, in large quantities by corresponding method of manufacture.
A first aspect of the present invention relates to a kind of surface mounting fuse protector, and this surface mounting fuse protector comprises: upper substrate, and an end in this upper substrate outside is provided with first termination electrode, and the other end is provided with second termination electrode, and the middle part of this upper substrate inboard is provided with first cavity; Infrabasal plate, one end in this infrabasal plate outside is provided with and the corresponding three-end electrode of described first termination electrode, the other end is provided with four termination electrode corresponding with described second termination electrode, the middle part of this infrabasal plate inboard is provided with and corresponding second cavity of described first cavity, and the common cavity that forms of described first and second cavity; Fuse, this fuse clip are located between the described upper and lower substrate, the part of this fuse is suspended in the described cavity; One end of described first termination electrode, three-end electrode and described fuse is electrically connected, and the other end of described second termination electrode, the 4th termination electrode and described fuse is electrically connected.
This surface mounting fuse protector can guarantee that metal fuse is fixed on the middle part of cavity, has reduced its rate of heat transfer to periphery, thereby reduces required fusing energy and resistance.
The surface mounting fuse protector of above-mentioned first aspect according to the present invention, also can preferably be set to: the described fuse described cavity of process also suspends in described cavity, and the both ends of described fuse extend to the side, two ends that is provided with first and second termination electrode of described surface mounting fuse protector respectively, and the respective end portions of described first and second termination electrode and described fuse is electrically connected by the plating belt that is located at the respective end side respectively.
Described plating belt can utilize the fusing point metal higher than scolding tin to form by chemical plating or plating.
According to above-mentioned preferred version, the two ends of fuse make it form reliable the connection with four termination electrodes at fuse two ends with the method for plating, and the fusing point of metal lining is higher than the fusing point of fuse, can prevent to produce low-melting alloy.
A second aspect of the present invention relates to a kind of method of making the surface mounting fuse protector of first aspect present invention, and this method comprises the steps:
(i) prepare upper and lower substrate and fuse, be equipped with termination electrode at the two ends in the described upper and lower substrate outside;
(ii) respectively at the corresponding cavity of the inboard formation of described upper and lower substrate;
(iii) described fuse is placed described upper substrate or described infrabasal plate inboard, the part of this fuse is suspended in this cavity;
Inboard that (iv) will this upper and lower substrate aligns applying, and described fuse is suspended in by in the formed cavity of the cavity of this upper and lower substrate, and the respective end lateral ends that is positioned at of the upper and lower substrate outside corresponding termination electrode in two ends and described fuse is electrically connected.
When utilizing above-mentioned manufacture method to produce surface mounting fuse protector of the present invention, fuse is not carried out bending, the tension force that acts on the fuse is also very little, can effectively keep its intensity, prevents fracture.
A third aspect of the present invention relates to a kind of method of making the surface mounting fuse protector of a plurality of first aspect present invention, and this method comprises the steps:
(a) preparation is provided with first and second baseplate material plate and fuse of electrode material on a side;
(b) electrode material on first and second baseplate material plate is processed to form the termination electrode pattern;
(c) opposite side at first and second baseplate material plate is provided with cavity array and intercommunicating pore array, make each described intercommunicating pore all pass the electrode material of described termination electrode pattern, and the two ends corresponding with described termination electrode pattern of each described cavity are equipped with described intercommunicating pore, thereby described cavity and described intercommunicating pore are arranged in rows;
(d) lateral root that is provided with the cavity array of a baseplate material plate is provided with fuse according to described cavity and the described intercommunicating pore of arranging of embarking on journey therein, makes each described fuse pass through in the described cavity array the described intercommunicating pore of cavity and described cavity two ends accordingly respectively;
(e) side that is provided with the cavity array with the described first and second baseplate material plates aligns applying, make the corresponding common respectively cavity that forms of cavity on each cavity and the described second baseplate material plate on the described first baseplate material plate, described fuse is through settings that suspend of the part of each described cavity, and makes in the described first and second baseplate material plates that intercommunicating pore is communicated with respectively accordingly;
(f) described intercommunicating pore being carried out plating handles, this plating processing intercommunicating pore at described first and second baseplate material plate in step (c) carries out respectively, perhaps in step (e), described first and second baseplate material plate aligned and carry out at the described intercommunicating pore that is communicated with respectively after fitting, thereby make the electrode material and form on the described first and second baseplate material plates that align applying be electrically connected through the described fuse of described intercommunicating pore;
(g) correspondingly cut according to described cavity array and described intercommunicating pore array for the described first and second baseplate material buttresses, thereby form a plurality of described surface mounting fuse protectors.
This method can be made a plurality of fuses simultaneously on two bigger polymeric substrates, through being cut into single fuse separately, production method is simple, improves the production efficiency of having produced small-sized unsettled lead-type surface mounting fuse protector, the corresponding cost that reduced.
The method of the above-mentioned third aspect according to the present invention; also can be preferably before in described step (g); plate the nickel dam and the soldering-tin layer of protection on the surface of the coating that after described plating is handled, forms and the surface of termination electrode pattern successively, to guarantee the reliability and the solderability of termination electrode.
Description of drawings
Fig. 1 is that surface mounting fuse protector of the present invention is welded in the stereogram on the circuit pattern of circuit board;
Fig. 2 is the stereogram of surface mounting fuse protector of the present invention;
Fig. 3 is the sectional block diagram of surface mounting fuse protector of the present invention;
Fig. 4 is the longitudinal sectional view of surface mounting fuse protector of the present invention;
Fig. 5 is the key diagram of manufacturing terminal electrode pattern when making surface mounting fuse protector of the present invention;
Fig. 6 is the partial enlarged drawing of Fig. 5;
Fig. 7 is a key diagram of making intercommunicating pore array and cavity array when making surface mounting fuse protector of the present invention;
Fig. 8 is the partial enlarged drawing of Fig. 7;
Fig. 9 is a key diagram of making the groove of sunkening cord when making surface mounting fuse protector of the present invention;
Figure 10 is the partial enlarged drawing of Fig. 9;
Figure 11 is the local longitudinal sectional view that when making surface mounting fuse protector of the present invention two baseplate materials and fuse is aligned after fitting together;
Figure 12 is transverse cut and the vertically key diagram of line of cut of expression when cutting for fuse array when making surface mounting fuse protector of the present invention;
Figure 13 is the operating chacteristics curve chart of an example of surface mounting fuse protector of the present invention;
Figure 14 is the operating chacteristics curve chart of another example of surface mounting fuse protector of the present invention.
Embodiment
Below, with reference to accompanying drawing 1-14 the concrete structure and the manufacture method of surface mounting fuse protector of the present invention are elaborated.
The concrete structure of surface mounting fuse protector of the present invention
Referring to Fig. 1-4, surface mounting fuse protector 1 of the present invention comprises the upper and lower substrate 100,200 that constitutes its shell and unsettled fuse 1000 between these two substrates.The two ends in upper and lower substrate 100,200 outsides are respectively equipped with termination electrode 300,500,400,600, wherein two of infrabasal plate 200 termination electrodes 400,600 for example are fixed on the circuit pattern that separates 3 on the circuit board 2 by welding respectively, and the circuit pattern 3 that separates is electrically connected by the fuse 1000 of fuse 1.Reach predetermined value as electric current, fuse 1000 disconnection that will fuse, thus provide overcurrent protection to the circuit on the circuit board 2.
The monnolithic case of upper and lower substrate 100,200 is basic identical, all is roughly parallelepiped shape, and the length and width size is basic identical.Be located at respectively upper and lower substrate 100,200 substantially the termination electrode 300,500,400,600 at smooth lateral surface two ends can make by metal such as copper or other electric conducting material.
The medial surface of upper and lower substrate 100,200 can by mill, machine-tooled method such as punching press forms cavity 901,902 respectively.After upper and lower substrate 100,200 was assembled together, corresponding cavity 901,902 can constitute cavity 900, was used for the unsettled fuse 1000 that is provided with.
Two ends at the cavity 902 of infrabasal plate 200 are respectively equipped with the groove 1001 of sunkening cord, and are used to locate fuse 1000.The groove 1001 of sunkening cord extends outwardly into infrabasal plate 200 corresponding end side surface from the end of cavity 902.Certainly, this groove 1001 of sunkening cord also can be located on the relevant position of upper substrate 100, or upper and lower substrate 100,200 all correspondingly is provided with the groove 1001 of sunkening cord.
Certainly, the groove 1001 of sunkening cord can be set according to circumstances yet, but fuse 1000 direct folders be established the medial surface that is fixed on two substrates 100,200 and it is suspended in the cavity 900 by adhesive 1100.
Also be respectively equipped with plating belt 700,800 in the side, two ends of upper and lower substrate 100,200, thereby respectively with the termination electrode 300,500,400,600 at upper and lower substrate 100,200 two ends and the both ends electrical connection that extends to the fuse 1000 of two substrates 100,200 respective end sides via the groove 1001 of sunkening cord.Like this, when with this fuse 1 for example by two end electrodes 400,600 being welded on when being fixed on the circuit board 2 on the circuit pattern 3 separately, two circuit patterns that separate 3 form via two end electrodes 400,600, plating belt 700,800 and fuse 1000 and are electrically connected.
Plating belt 700,800 can use copper and/or nickel to form by chemical plating or electric plating method, can certainly adopt other metal depositions.Metal lining has the fusing point higher than scolding tin, thereby forms the connection that better heat resistance is arranged than scolding tin.In addition, adopt metal deposition to connect and also avoided forming the possible of low-melting alloy, thereby make the operating chacteristics of fuse more consistent by being welded to connect the scolding tin and the fuse that cause.Can certainly adopt other electric connection mode commonly used except that plating.
In order to guarantee the solderability of termination electrode, use plating or plating and wave-soldering to cover soldering-tin layer on the surface of the termination electrode on the circuit pattern that separates 3 that will be welded on the circuit board 2 at least, on the surface of plating belt 700,800, also soldering-tin layer can be set.If termination electrode 300,500,400,600 and plating belt 700,800 are for example formed by copper, directly the covering soldering-tin layer can produce low-melting alloy and copper is melted on the surface of copper, thereby influences the performance of fuse.In this case, need before covering soldering-tin layer, plate the nickel that one deck shields on the surface of copper by electroplating.
Introduce two embodiment of the method for producing surface mounting fuse protector 1 of the present invention below.
The fuse 1 of making the invention described above can comprise the steps.
Prepare two insulation boards (macromolecular material plates such as thermoplasticity or thermoset plastics) as upper and lower substrate 100,200, and adhere to Copper Foil to form termination electrode 300,500,400,600 at the two ends of the one side of substrate 100,200.Also can prepare the substrate that one side is stained with Copper Foil, then adopt the method for electrochemical corrosion or machining to remove the part Copper Foil and make the termination electrode 300,500,400,600 of the separation at two ends.Certainly, termination electrode 300,500,400,600 also can be formed by other electric conducting material.
At the opposite side that does not form termination electrode of upper and lower substrate 100,200, use mechanical means, as mill, punching press etc. processes corresponding cavity 901,902.
In the one side that is formed with cavity of one of them substrate of upper and lower substrate 100,200, use mechanical means, process the groove 1001 of sunkening cord that is positioned at the cavity midline position as sawing, mill etc.The groove 1001 of sunkening cord extends to the end side surface of substrate correspondence respectively from the two ends of cavity.In the groove 1001 of sunkening cord, imbed fuse 1000, and make fuse 1000 extend to the side, two ends of upper and lower substrate 100,200.Fuse 1000 is made with metal, alloy, composition metal or metal and nonmetal recombination line.
Certainly, the groove 1001 of sunkening cord can be set according to circumstances yet, but fuse 1000 direct folders be established the medial surface that is fixed on two substrates 100,200 and it is suspended in the cavity 900 that is made of cavity 901,902 by adhesive 1100.
Make fuse 1000 be electrically connected then with the termination electrode 300,500,400,600 at fuse two ends about in the of 1.For example can be with the presumptive area activation of the side, two ends of upper and lower substrate 100,200, realize being electrically connected with chemical plating or electric plating method plated with copper and/or nickel.Other metal depositions can also adopt, and metal lining has the fusing point higher than scolding tin, thereby form the connection that better heat resistance is arranged than scolding tin.In addition, adopt metal deposition to connect and also avoided forming the possible of low-melting alloy, thereby make the operating chacteristics of fuse more consistent by being welded to connect the scolding tin and the fuse that cause.
As mentioned above, can use plating or plating and wave-soldering to cover soldering-tin layer at termination electrode and plating belt surface, to guarantee the solderability of electrode.Under the situation that termination electrode and plating belt are for example formed by copper, also can between soldering-tin layer and copper, plate the nickel that one deck shields.
Referring to Fig. 5-12, can process a plurality of above-mentioned fuses 1 by two blocks of larger substrate materials are disposable.
Baseplate material can adopt wide material sources and lower-cost single side printed wiring board base material.This base material is coated with one deck Copper Foil on macromolecular material.Certainly, two-sided printed substrate also can use behind the Copper Foil of removing one side.Other surfaces are stained with the thermoplasticity or the heat cured plastics of Copper Foil or other conductive material layer, also are included in the adoptable baseplate material.
Referring to Fig. 5,6, the Copper Foil 10 that adopts the method for electrochemical corrosion or machining will cover on the macromolecular material 11 of baseplate material is made the termination electrode pattern corresponding with termination electrode.This termination electrode pattern for example can be parallel strip shown in Fig. 5,6, also can be other suitable shape as required.After the cutting action of mentioning in the back, this termination electrode pattern will form the termination electrode 300,500,400,600 of each fuse 1.
Referring to Fig. 7,8, use mechanical means, on baseplate material, process intercommunicating pore 801 arrays as brill, punching press, and use mechanical means in a side (inboard) opposite of baseplate material with above-mentioned termination electrode pattern, as mill, punching press etc. is processed into cavity 901 arrays that are complementary with the intercommunicating pore array, thereby makes the two ends of each cavity 901 be equipped with corresponding intercommunicating pore.The cavity 901 and the intercommunicating pore 801 of space are aligned, and each row of intercommunicating pore 801 arrays are corresponding with each bar of the parallel strip termination electrode pattern shown in Fig. 5,6.And if adopt other termination electrode pattern, then intercommunicating pore 801 arrays also should be correspondingly corresponding with this termination electrode pattern, thereby make each intercommunicating pore 801 all pass Copper Foil 10.
Certainly, intercommunicating pore 801 arrays of two baseplate materials also can align two baseplate materials disposable the processing in back.
Referring to Fig. 9,10, a side of cavity 901 arrays of a baseplate material is used mechanical means therein, processes the groove 1001 of sunkening cord that is positioned at cavity 901 midline positions as sawing, mill etc.Imbed fuse 1000 in the groove 1001 of sunkening cord, fuse 1000 is made with metal, alloy, composition metal or metal and nonmetal recombination line.
At the inner surface coating binder 1100 of two baseplate materials, scribble adhesive 150 in the contact portion of fuse 1000 and the groove 1001 of sunkening cord, and keep unsettled at cavity 901 part fuses 1000.Fuse 1000 can not be subjected to bending and extruding in installation process.
Referring to Figure 11, after fuse 1000 is bumped into the groove 1001 of sunkening cord, align two baseplate materials bonding, make each corresponding intercommunicating pore 801 of two baseplate materials communicate respectively, the corresponding cavity 901,902 of each of two baseplate materials forms cavity 900 respectively, fuse 1000 suspension arrangement in these cavitys 900.
Certainly, the groove 1001 of sunkening cord can be set according to circumstances yet, but fuse 1000 direct folders be established the medial surface that is fixed on two baseplate materials and it is suspended in the cavity 900 by adhesive 1100.
Then with intercommunicating pore 801 inner wall surface activation,, form being electrically connected of termination electrode pattern outside fuse 1000 and two baseplate materials with chemical plating or electric plating method plated with copper and/or nickel.Other metal depositions can also adopt, and metal lining has the fusing point higher than scolding tin, thereby form the connection that better heat resistance is arranged than scolding tin.In addition, adopt metal deposition to connect and also avoided forming the possible of low-melting alloy, thereby make the operating chacteristics of fuse more consistent by being welded to connect the scolding tin and the fuse that cause.
Above-mentioned plating carries out respectively for two baseplate materials after handling and also can processing intercommunicating pore 801 arrays on two baseplate materials.And then the operations such as bonding that align of fuse 1000 and two baseplate materials are set, thereby form being electrically connected of termination electrode pattern outside fuse 1000 and two baseplate materials.
Similar with the foregoing description 1, can on the surface of the coating that forms after termination electrode pattern and the plating processing, use plating or plating and wave-soldering to cover soldering-tin layer, with the solderability of assurance electrode.Under the situation that termination electrode pattern and coating are formed by copper, can between soldering-tin layer and copper, plate the nickel that one deck shields.
Like this, made the array of the fuse 1 of a plurality of unsettled lead-types by two baseplate materials.
At last, referring to Figure 12, this fuse 1 array is carried out horizontal and vertical cutting and forms each single fuse 1 along transverse cut 1200 and vertical line of cut 1300.
In each fuse 1, fuse 1000 can be fixed in the middle of the cavity 900, reduces its rate of heat transfer to periphery, thereby reduces required fusing energy and resistance.In this way, can on two substrates, assemble a plurality of fuses 1 simultaneously.Production efficiency is higher than the conventional method that employing is assembled one by one.
Figure 13 shows the operating chacteristics curve of 1 ampere of 125VAC fuse with fuse structure of the present invention, and Figure 14 shows the operating chacteristics curve of 5 amperes of 125VAC fuses with fuse structure of the present invention.The Fabrication parameter of each parts of two example fuses is as shown in table 1:
Table 1
| |
1 ampere of 125VAC fuse | 5 amperes of 125VAC fuses |
| Upper substrate is thick | 0.7mm | 0.7mm |
| Infrabasal plate is thick | 1mm | 1mm |
| The intercommunicating pore diameter | 1.2mm | 1.2mm |
| Cavity semicircle diameter | 1.2mm | 1.2mm |
| Spacing in the semicircle center of circle, cavity two ends | 2.8mm | 2.8mm |
| The electrode copper thickness | 0.035mm | 0.035mm |
| The groove depth of sunkening cord | 0.127mm | 0.127mm |
| The well width of sunkening cord | 0.3mm | 0.3mm |
| Fuse (copper covered steel) line footpath | 0.06mm | 0.1mm |
| Average resistance | 0.0736Ω | 0.012Ω |
。
Claims (51)
1, a kind of surface mounting fuse protector (1), this surface mounting fuse protector (1) comprising:
Upper substrate (100), an end in this upper substrate (100) outside is provided with first termination electrode (300), and the other end is provided with second termination electrode (500), and the inboard middle part of this upper substrate (100) is provided with first cavity (901);
Infrabasal plate (200), one end in this infrabasal plate (200) outside is provided with the three-end electrode (400) corresponding with described first termination electrode (300), the other end is provided with four termination electrode (600) corresponding with described second termination electrode (500), the inboard middle part of this infrabasal plate (200) is provided with and corresponding second cavity of described first cavity (901) (902), and described first cavity (901) and described second cavity (902) form a cavity (900) jointly;
Molten (1000), these molten (1000) are folded between the described upper and lower substrate (100,200) and are somebody's turn to do a part that melts (1000) and are suspended in the described cavity (900);
Described first termination electrode (300), three-end electrode (400) and a described end that melts (1000) are electrically connected, and the other end of described second termination electrode (500), the 4th termination electrode (600) and described fuse (1000) is electrically connected.
2, surface mounting fuse protector according to claim 1 is characterized in that,
Described fuse (1000) process described cavity (900) also suspends in described cavity (900), and the both ends of described fuse (1000) extend to an end side surface of described first termination electrode of being provided with of described surface mounting fuse protector (1) (300) and described three-end electrode (400) respectively and are provided with described second termination electrode (500) and the other end side of described the 4th termination electrode (600), described first termination electrode (300), three-end electrode (400) and described second termination electrode (500), the 4th termination electrode (600) is electrically connected by the plating belt (700,800) that is located at the respective end side respectively with the respective end portions of described molten (1000).
3, surface mounting fuse protector according to claim 1 is characterized in that,
The inner surface of described upper and lower substrate (100,200) is adhesively fixed together.
4, surface mounting fuse protector according to claim 3 is characterized in that,
The inner surface of described upper and lower substrate (100,200) is adhesively fixed together by adhesive (1100).
5, surface mounting fuse protector according to claim 1 is characterized in that,
Described first and/or second cavity (901 and/or 902) corresponding to described first, second, third and fourth termination electrode (300,500,400,600) two ends are respectively equipped with the groove of sunkening cord (1001), the described groove of sunkening cord (1001) from described first and/or second cavity (901 and/or 902) extend out to described on/infrabasal plate (100/200) distolateral accordingly, described fuse (1000) is arranged in the described groove of sunkening cord (1001).
6, surface mounting fuse protector according to claim 5 is characterized in that,
In the described groove of sunkening cord (1001), be applied with adhesive (150).
7, surface mounting fuse protector according to claim 1 is characterized in that,
Described upper and lower substrate (100,200) is made by macromolecular material, and described first, second and third made by Copper Foil with four termination electrodes (300,500,400,600).
8, surface mounting fuse protector according to claim 1 is characterized in that,
Surface at least one termination electrode of described first, second and third and four termination electrodes (300,500,400,600) is provided with soldering-tin layer.
9, surface mounting fuse protector according to claim 8 is characterized in that,
Between the described surface of described soldering-tin layer and corresponding described termination electrode, be provided with nickel dam.
10, surface mounting fuse protector according to claim 7 is characterized in that,
Described macromolecular material comprises substrate for printed circuit board, thermoplastics and thermoset plastics.
11, surface mounting fuse protector according to claim 1 is characterized in that,
Described fuse (1000) is made by metal wire, alloy wire, composite metal wire or metal and nonmetal recombination line.
12, surface mounting fuse protector according to claim 2 is characterized in that,
Described plating belt (700,800) utilizes the fusing point metal higher than scolding tin to form by chemical plating or plating.
13, surface mounting fuse protector according to claim 12 is characterized in that,
Described chemical plating or the electroplated metal of being used for comprises at least a of the group be made up of copper and mickel.
14, surface mounting fuse protector according to claim 2 is characterized in that,
Surface at described plating belt (700,800) is provided with soldering-tin layer.
15, surface mounting fuse protector according to claim 14 is characterized in that,
Between the described surface of described soldering-tin layer and described plating belt (700,800), be provided with nickel dam.
16, the method for a kind of manufacturing surface mounting fuse protector as claimed in claim 1 (1), this method comprises the steps:
(i) prepare upper and lower substrate (100,200) and fuse (1000), be equipped with termination electrode (300,500 at the two ends in described upper and lower substrate (100, the 200) outside; 400,600);
(ii) respectively at the inboard corresponding cavity (901,902) that forms of described upper and lower substrate (100,200);
(iii) described fuse (1000) is placed described upper substrate (100) or described infrabasal plate (200) inboard, the part of this fuse (1000) is suspended in this cavity (901 or 902);
(iv) should upper and lower substrate (100,200) inboard aligns applying, described fuse (1000) is suspended in by this upper and lower substrate (100,200) cavity (901,902) in the formed cavity (900), and make the corresponding termination electrode (300,500 in two ends, upper and lower substrate (100, the 200) outside; 400,600) and the respective end lateral ends that is positioned at of described fuse (1000) be electrically connected.
17, method according to claim 16 is characterized in that,
Step (iii) in, make described fuse (1000) through described cavity (901 or 902) and unsettled in this cavity (901 or 902), and what the both ends that make this fuse (1000) extended to described upper substrate (100) or described infrabasal plate (200) respectively is provided with termination electrode (300,500; 400,600) place, side, two ends; And step (iv) in, by side, described two ends plating belt (700,800) is set respectively, with the corresponding termination electrode (300,500 in two ends, upper and lower substrate (100, the 200) outside at described surface mounting fuse protector (1); 400,600) and the respective end lateral ends that is positioned at of described fuse (1000) be electrically connected.
18, method according to claim 16 is characterized in that,
Described step (iv) in, before the inboard with described upper and lower substrate (100,200) aligns applying, coating binder (1100) on described upper and lower substrate (100,200) inboard.
19, method according to claim 16 is characterized in that,
Described step (ii) in, also described cavity (901 and/or 902) corresponding to described termination electrode (300,500; 400,600) two ends are provided with the groove of sunkening cord (1001) respectively, this groove of sunkening cord (1001) extend out to described above and/or under the corresponding end side surface of substrate (100 and/or 200), described step (iii) in, described fuse (1000) is arranged in the described groove of sunkening cord (1001).
20, method according to claim 19 is characterized in that,
Described step (iv) in, in the described groove of sunkening cord (1001), apply adhesive (150).
21, method according to claim 16 is characterized in that,
On the surface of at least one termination electrode, soldering-tin layer is set.
22, method according to claim 17 is characterized in that,
On the surface of described plating belt (700,800), soldering-tin layer is set.
23, according to claim 21 or 22 described methods, it is characterized in that,
By plating or plating and wave-soldering described soldering-tin layer is set.
24, method according to claim 21 is characterized in that,
Between the described surface of described soldering-tin layer and corresponding described termination electrode, nickel dam is set.
25, method according to claim 22 is characterized in that,
Between the described surface of described soldering-tin layer and described plating belt (700,800), nickel dam is set.
26, according to claim 24 or 25 described methods, it is characterized in that, described nickel dam is set by plating.
27, method according to claim 17 is characterized in that,
Described plating belt (700,800) utilizes the fusing point metal higher than scolding tin to form by chemical plating or plating.
28, method according to claim 27 is characterized in that,
Described chemical plating or the electroplated metal of being used for comprises at least a of the group be made up of copper and mickel.
29, method according to claim 16 is characterized in that,
Described upper and lower substrate (100,200) is made by macromolecular material, described termination electrode (300,500; 400,600) make by Copper Foil.
30, the method for a kind of a plurality of surface mounting fuse protectors as claimed in claim 1 of manufacturing (1), this method comprises the steps:
(a) preparation is provided with first and second baseplate material plate and the fuse (1000) of electrode material on a side;
(b) electrode material on first and second baseplate material plate is processed to form the termination electrode pattern;
(c) opposite side at first and second baseplate material plate is provided with cavity (901,902) array and intercommunicating pore (801) array, make each described intercommunicating pore (801) all pass the electrode material of described termination electrode pattern, and each described cavity (901,902) the two ends corresponding with described termination electrode pattern are equipped with described intercommunicating pore (801), thereby described cavity (901,902) is arranged in rows with described intercommunicating pore (801);
(d) the described cavity (901/902) arranged according to embarking on journey of a lateral root that is provided with cavity (901/902) array of a baseplate material plate is provided with fuse (1000) with described intercommunicating pore (801) therein, makes each described fuse (1000) pass through the described intercommunicating pore (801) of corresponding cavity (901/902) and described cavity (901/902) two ends in described cavity (901/902) array respectively;
(e) side that is provided with cavity array (901/902) with the described first and second baseplate material plates aligns applying, make the corresponding common respectively cavity (900) that forms of cavity on each cavity and the described second baseplate material plate on the described first baseplate material plate, described fuse (1000) is through settings that suspend of the part of each described cavity (900), and makes in the described first and second baseplate material plates that intercommunicating pore (801) is communicated with respectively accordingly;
(f) described intercommunicating pore (801) being carried out plating handles, this plating processing intercommunicating pore (801) at described first and second baseplate material plate in step (c) carries out respectively, perhaps in step (e), described first and second baseplate material plate aligned the back of fitting and carry out, thereby make the electrode material and form on the described first and second baseplate material plates that align applying be electrically connected through the described fuse (1001) of described intercommunicating pore (801) at the intercommunicating pore (801) that is communicated with respectively;
(g) correspondingly cut according to described cavity (901/902) array and described intercommunicating pore (801) array for the described first and second baseplate material buttresses, thereby form a plurality of described surface mounting fuse protectors (1).
31, method according to claim 30 is characterized in that,
In described step (e), before the described first and second baseplate material plates are aligned applying, coating binder (1100) on described two baseplate material plate inboards.
32, method according to claim 30 is characterized in that,
In described step (c), also described first and/or the side setting that described cavity (901 and/or 902) array is set of the second baseplate material plate groove (1001) of sunkening cord, the described groove of sunkening cord (1001) passes through described cavity (901 and/or 902) and described intercommunicating pore (801) respectively accordingly, in described step (d), described fuse (1000) is arranged in the described groove of sunkening cord (1001).
33, method according to claim 32 is characterized in that,
And in described step (e), in the described groove of sunkening cord (1001), apply adhesive (150).
34, method according to claim 30 is characterized in that,
In described step (c), described intercommunicating pore (801) array is made by cut.
35, surface mounting fuse protector according to claim 34 is characterized in that,
Described cut comprises bores and punching press.
36, method according to claim 30 is characterized in that,
In described step (c), two blocks of baseplate material plates are being aligned disposable intercommunicating pore (801) array that processes two blocks of baseplate material plates in back.
37, according to claim 16 or 30 described methods, it is characterized in that,
Described cavity (901,902) is made by cut.
38, according to the described method of claim 37, it is characterized in that,
Described cut comprises mills and punching press.
39, according to claim 19 or 32 described methods, it is characterized in that,
The described groove of sunkening cord (1001) is made by cut.
40, according to the described method of claim 39, it is characterized in that,
Described cut comprises saw and mills.
41, according to claim 16 or 30 described methods, it is characterized in that,
Described fuse (1000) is made by metal wire, alloy wire, composite metal wire or metal and nonmetal recombination line.
42, method according to claim 30 is characterized in that,
In described step (f), utilize the fusing point metal higher to carry out chemical plating or plating than scolding tin.
43, according to the described method of claim 42, it is characterized in that,
Described chemical plating or the electroplated metal of being used for comprises at least a of the group be made up of copper and mickel.
44, method according to claim 30 is characterized in that,
Described first, second baseplate material plate is made by macromolecular material, and described termination electrode pattern is made by Copper Foil.
45, according to claim 29 or 44 described methods, it is characterized in that,
Described macromolecular material comprises substrate for printed circuit board, thermoplastics and thermoset plastics.
46, method according to claim 30 is characterized in that,
In described step (g) before, on the surface of described termination electrode pattern soldering-tin layer is set.
47, method according to claim 30 is characterized in that,
In described step (g) before, on the surface of the coating that after described plating is handled, forms soldering-tin layer is set.
48, according to claim 46 or 47 described methods, it is characterized in that, described soldering-tin layer is set by plating or plating and wave-soldering.
49, according to the described method of claim 46, it is characterized in that,
Between the described surface of described termination electrode pattern and described soldering-tin layer, nickel dam is set.
50, according to the described method of claim 47, it is characterized in that, between the described surface of described coating and described soldering-tin layer, nickel dam is set.
51, according to claim 49 or 50 described methods, it is characterized in that, described nickel dam is set by plating.
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| CN103515166A (en) * | 2012-06-27 | 2014-01-15 | 功得电子工业股份有限公司 | Fuse structure |
| CN103839737A (en) * | 2014-02-28 | 2014-06-04 | 南京萨特科技发展有限公司 | Surface mounting fuse protector and manufacturing method thereof |
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| CN103515165A (en) * | 2012-06-27 | 2014-01-15 | 功得电子工业股份有限公司 | Micro-current protection element structure |
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| CN105788993A (en) * | 2016-04-22 | 2016-07-20 | 南京萨特科技发展有限公司 | Current protector manufacturing method and PCB |
| CN105810527B (en) * | 2016-04-22 | 2019-03-01 | 南京萨特科技发展有限公司 | A kind of current protector and manufacturing method |
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| CN106024549B (en) * | 2016-07-13 | 2019-01-11 | 南京萨特科技发展有限公司 | A kind of current protector and manufacturing method |
| CN106057603A (en) * | 2016-09-07 | 2016-10-26 | 南京萨特科技发展有限公司 | Novel suspension surface mounting fuse |
| CN106057603B (en) * | 2016-09-07 | 2019-09-03 | 南京萨特科技发展有限公司 | A kind of hanging surface mounting fuse protector |
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| CN101567283B (en) | 2012-04-18 |
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