CN101364463A - Chip resistor and preparation thereof - Google Patents
Chip resistor and preparation thereof Download PDFInfo
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- CN101364463A CN101364463A CNA200710140396XA CN200710140396A CN101364463A CN 101364463 A CN101364463 A CN 101364463A CN A200710140396X A CNA200710140396X A CN A200710140396XA CN 200710140396 A CN200710140396 A CN 200710140396A CN 101364463 A CN101364463 A CN 101364463A
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Abstract
The invention discloses a chip resistor and a preparation method thereof. A heat conducting binding layer is oppositely bound with a backing material and a constant resistance resistor body; and a protective layer covers the partial surface of the constant resistance resistor body and divides the region on the surface of the constant resistance resistor body, which is not covered by the protective layer, into two electrode regions, so as to eliminate unnecessary current conduction resistance in the prior art and effectively stabilize and reduce the temperature coefficient of resistance (TCR). The binding design of the backing material and the constant resistance resistor body can overcome the high cost shortcoming in the prior art, in which the chip resistor is formed of a semiconductor, thereby resulting in the advantages of easy production, improved production yield and reduced cost.
Description
Technical field
The present invention relates to a kind of resistor, refer to a kind of chip resister and method for making thereof of high-accuracy humble resistance of low resistance temperature coefficient especially.
Background technology
Development trend in response to various electronic installation portability, microminiaturization, often be used in the circuit for the chip resister that measures the two ends potential difference, also more and more be tending towards microminiaturized thereupon, and in order to reduce error in measurement and to improve the current value that detects, usually need possess resistance value 0.02 Ω to 10 Ω, the low resistance high power characteristic more than the specified allowance power 0.1W, and must satisfy the requirement that reduces temperature coefficient of resistance (TCR), usually adopting under the existing process technique of printing or coating technique at present, existing to be difficult to cheap mass-produced practical difficulty.
TaiWan, China is announced a kind of chip resister of patent disclosure No. 350071, be on ceramic substrate, to utilize fabrography printed resistor film (material is glass and the composite resistive paste of conducting particles), again via processing procedures such as drying, high temperature sinterings and moulding, adopt laser ornamenting method fusion subregion to form groove afterwards, utilize electroplating process to make electrode at last again to adjust its resistance value.Yet because this resistive film is to form with mode of printing, the uniformity of its thickness is difficult to control, and because the diffusion of high temperature sintering variation influence causes the resistance change of this resistive film bigger.Especially, when aforementioned this chip resister is applied to high frequency environment,, cause the high-frequency signal loss bigger, so can't be applicable in the high frequency product because of the porosity height of resistive film, loosely organized.
The another kind of method for making that adopts coating technique is to generate resistive film in order to physical gas phase deposition technology (PVD) or chemical vapour deposition technique manufacture of semiconductor such as (CVD) as sputter (Sputter Deposition) or evaporation (Evaporation) and so on ceramic substrate.Owing to be to adopt manufacture of semiconductor to make chip resister, be very expensive for the investment of equipment, add the restriction of manufacture of semiconductor yield, cause manufacturing cost too expensive, significantly reduce product competitiveness.Simultaneously, because the patterning operation at resistive film in the aforesaid semiconductor processing procedure is to form with little shadow technology, and just can carry out subsequent treatment after need removing the photoresistance film, yet when removing the photoresistance film, often remove complete or not excessive situation, cause the resistive film exposure and subject to pollution or oxidation, influence its electrical characteristic, reduce process rate relatively.
In order to overcome foregoing problems; a kind of method for making of TaiWan, China certificate number I237898 patent disclosure; at first lay respectively at the main electrode at these insulated substrate two ends in the upper surface formation two of an insulated substrate; then form the upper surface of the insulated substrate of a resistive film in abovementioned steps in the thin film deposition mode; on the resistive film of abovementioned steps, form one first protective layer with mode of printing then; this first protective layer shield at least be positioned between described main electrode to the small part resistive film and make the distolateral part resistive film of the vicinity that is positioned on the described main electrode exposed; and this first protective layer part that is positioned between described main electrode is extended incessantly; continuous remove the resistive film of this exposed part as the cover curtain, form the both ends of the surface electrode at last in the both ends of the insulated substrate of abovementioned steps and cover this corresponding main electrode respectively with this first protective layer.
But aforementioned techniques is still the manufacture of semiconductor technology that adopts, and its problem expensive and that yield is not good still exists, moreover must additionally increase the film-plating process of twice protective layer, has improved the processing procedure cost especially.In addition, its resistive film be by main electrode just indirect be electrically connected to end electrode, so will cause the temperature coefficient of resistance (TCR) of resistive film and main electrode to interosculate to contain and increase, cause the temperature coefficient of resistance of made chip resister can't be decreased to requirements, even influence its radiating efficiency.
Hereat, above-mentioned prior art exists that process rate is low, equipment and the processing procedure cost is high, temperature coefficient of resistance can't be decreased to defectives such as requirements, therefore how to propose the chip resister and the method for making thereof of the described defective of a kind of effective solution, real is problem demanding prompt solution in the art technology.
Summary of the invention
In view of the shortcoming of the above technology that sets the scene, a purpose of the present invention is to provide a kind of and is easy to make and can promotes the chip resister and the method for making thereof of process rate.
The chip resister and the method for making thereof that another object of the present invention is to provide a kind of temperature coefficient of resistance to stablize and be decreased to requirements.
Another purpose of the present invention is to provide a kind of chip resister that reduces cost and method for making thereof.
For achieving the above object and other purpose, the invention provides a kind of method for making of chip resister, comprising: base material is provided and hinders resistive element surely; Surely hinder resistive element by a heat conduction cementing layer or fit relatively this base material and this; And cover a protective layer and hinder the resistive element local surfaces surely to this, so that hindering the part that the resistive element surface do not cover this protective layer surely, this separates into two electrode districts.
In the aforementioned method for making, this heat conduction cementing layer can adopt a resin paster or heat conduction gummed slurry, material can be epoxy resin, its applying or print order there is no specific limited, for example in an embodiment, this resin paster or heat conduction gummed slurry can fit in advance or print to this base material, and fitting by this resin paster or heat conduction gummed slurry more afterwards, this hinders resistive element surely; In another embodiment, this resin paster or heat conduction gummed slurry then can fit in advance or print to this and hinder resistive element surely, afterwards again by this resin paster or heat conduction gummed slurry this base material of fitting.In addition, this heat conduction cementing layer is also non-only to adopt resin paster or heat conduction gummed slurry to exceed, the then material that the applying processing procedure can be provided such as and possess heat conduction, insulation characterisitic all can, for example also can form through the printing thermal conductive insulation glue, and preferable mode is that this thermal conductive insulation glue is printed in advance to this base material, and fitting by this thermal conductive insulation glue more afterwards, this hinders resistive element surely.
In an embodiment, this protective layer covers and hinders the stage casing region surface of resistive element surely to this, so that these two ends that hinder zone, corresponding stage casing, resistive element surface surely separate into two electrode districts.In another embodiment, can form electrode respectively in these two electrode district surfaces that hinder resistive element surely again, survey in the circuit board of potential difference for being soldered to requirement for example, preferably, this electrode is to be formed up to this electrode district surface in the barrel plating mode.
Employed base material is to be the fundamental characteristics requirement to possess insulation characterisitic, there is no specific limited, for example can adopt ceramic substrate.And this to hinder resistive element surely be that diaphragm with pre-defined its resistance value is the fundamental characteristics requirement, for example can be the sheet metal that central authorities have punching, can be the metal coating that the surface has groove, also can be the metal die that the surface has groove.
For reaching identical purpose, the present invention also provides a kind of chip resister, comprising: base material; Surely hinder resistive element; The heat conduction cementing layer, fit relatively this base material and this hinder resistive element surely; And protective layer, cover to this local surfaces that hinders resistive element surely, make this hinder the part that the resistive element surface do not cover this protective layer surely and separate into two electrode districts.
Because chip resister provided by the present invention and method for making thereof, be to adopt fit relatively this base material and this of heat conduction cementing layer to hinder resistive element surely, therefore can get rid of prior art and use the expensive shortcoming of manufacture of semiconductor, reach and be easy to make, promote process rate and the effect that reduces cost; And this hinders resistive element surface part not covered by the protective layer surely and directly separates into two electrode districts; can be for directly forming the electrode that is beneficial to welding; also can directly provide welding to use, thereby can get rid of the unnecessary conduction of current impedance of prior art, the effectively stable temperature coefficient of resistance that reduces.
Description of drawings
Figure 1A to Fig. 1 F is the first embodiment schematic flow sheet that shows chip resister method for making of the present invention;
Fig. 2 A to Fig. 2 F is the second embodiment schematic flow sheet that shows chip resister method for making of the present invention; And
Fig. 3 is the user mode heat conduction schematic diagram that shows chip resister of the present invention.
The component symbol explanation
1 base material 2 hinders resistive element surely
21 punchings, 23 electrode districts
3 heat conduction cementing layers, 4 protective layers
5 electrodes, 6 external device (ED)s
61 line contacts
Embodiment
Below by particular specific embodiment explanation embodiments of the present invention, those skilled in the art can understand other advantage of the present invention and effect easily by the content that this specification disclosed.
Figure 1A to Fig. 1 G shows the flow chart of being drawn according to chip resister method for making first embodiment of the present invention, and as shown in the figure, the method for making of chip resister provided by the present invention includes but not limited to the flow process of the following stated.
Shown in Figure 1A and Figure 1B, at first provide a base material 1 and certain resistance resistive element 2.Described this base material 1 is to be that the ceramic substrate of main material is an example to adopt aluminium oxide, but it is to be the fundamental characteristics requirement to possess insulation characterisitic, there is no specific limited, for example in other embodiment, also can adopt glass substrate or plastic base, be not only to exceed with shown in the present embodiment.This hinders resistive element 2 surely is that the sheet metal that has a punching 21 with central authorities is an example, and the material of this sheet metal can be the alloy that comprises copper, manganese, tin or nickel, but it is non-as limit, this punching 21 can be circle or rectangle etc. and is easy to reference area or length and the shape of conversion resistance value, giving punching out by punching press in advance is shaped, certainly the described resistive element 2 that hinders surely is that plate or diaphragm with pre-defined its resistance value is the fundamental characteristics requirement, for example can be the metal coating that the surface has groove, also can be the metal die that the surface has groove, absolutely not only exceed with shown in the present embodiment.
Shown in Fig. 1 C and Fig. 1 D, then hinder resistive element 2 surely with this by a heat conduction cementing layer 3 relative these base materials 1 of fitting.This heat conduction cementing layer 3 can adopt a resin paster, material for example is an epoxy resin, and its coating squence there is no specific limited, in present embodiment, with the resin paster is that this heat conduction cementing layer 3 of example conforms to this base material 1 in advance, and fitting by this heat conduction cementing layer 3 more afterwards, this hinders resistive element 2 surely.Certainly, this heat conduction cementing layer 3 is also non-only to adopt the resin paster to exceed, the then material that the applying processing procedure can be provided such as and possess heat conduction, insulation characterisitic all can, for example also can form through the printing thermal conductive insulation glue, and preferable mode is that this thermal conductive insulation glue is printed in advance to this base material 1, and fitting by this thermal conductive insulation glue more afterwards, this hinders resistive element 2 surely.
Shown in Fig. 1 E, then cover a protective layer 4 and hinder resistive element 2 local surfaces surely to this, so that hindering the part that resistive element 2 surfaces do not cover this protective layer 4 surely, this separates into two electrode districts 23, so far step promptly has been considered as making the finished product of chip resister.Described this protective layer 4 is to be the fundamental characteristics requirement so that insulation effect to be provided; in present embodiment, for example adopt insulating material such as epoxy resin; utilize coating method to cover and hinder the stage casing region surface (comprising end face and side) of resistive element 2 surely, so that these two ends that hinder zone, resistive element 2 surperficial corresponding stage casing surely separate into two electrode districts 23 to this.In practical application, utilize this to hinder resistive element 2 surperficial two electrode districts 23 that separated surely and can be directly welded in external device (ED), for example be directly welded in the predetermining circuit of circuit board.
Shown in Fig. 1 F, welding convenience in response to follow-up practical application, can form electrode 5 respectively in these two electrode districts, 23 surfaces that hinder resistive element 2 surely again, survey in the circuit board of potential difference for being soldered to requirement for example, in a preferred embodiment, this electrode 5 is to be formed up to this electrode district 23 surfaces in the barrel plating mode, but it is non-as limit, such as the method that can directly form electrode 5 in these electrode district 23 surfaces all can, its primary condition is no longer connected by any in-between medium, for example can adopt other plating mode or hot pressing mode, all belong to the feasible method of no intermediate medium.Provide convenience to external welding based on the purpose that forms electrode 5, the material of this electrode 5 is to be good with the alloy material that possesses tin, for example comprises the alloy of copper, nickel, three kinds of metal materials of tin.
What need special Chen Ming is, be that example describes all in the present embodiment with the making flow process of making the one chip resistor, but non-appointment technological thought of the present invention only is confined to this, such as in order to produce the production conventional process of doing in batches, for example aforementioned ceramic substrate 1 is integrated into the state of a plurality of arranged, and this is hindered the state that resistive element 2 is integrated into a plurality of arranged surely, after successive process is finished a plurality of chip resisters synchronously, cut singly again and finished, its fabrication steps is under the situation that does not break away from the technology of the present invention thought, all should be subordinate to the present invention contains, produce synchronization job in batches and cut single job and habitually practise for technical staff in the affiliated technical field and can understand tool with enforcement and do, give unnecessary details separately in this other embodiment that no longer arranges in pairs or groups.
Fig. 2 A to Fig. 2 G shows the flow chart of being drawn according to chip resister method for making second embodiment of the present invention, the method for making of the chip resister that provides wherein, comprise that the overwhelming majority is same as the processing procedure of aforementioned first embodiment, do not change the structure of any obtained chip resister, for making specification clear understandable, therefore all components identical all will adopt same-sign to represent, distinguish label no longer separately, only the common of processing procedure to be described in detail in detail and to be changed to the master.
Shown in Fig. 2 A and Fig. 2 B, at first provide a base material 1 and certain resistance resistive element 2.The characteristic that described this base material 1 and this hinder resistive element 2 surely is all identical with first embodiment with variation, repeats no more in this.
Shown in Fig. 2 C and Fig. 2 D, then hinder resistive element 2 surely with this by a heat conduction cementing layer 3 relative these base materials 1 of fitting.This heat conduction cementing layer 3 can adopt a resin paster, material for example is an epoxy resin, and its coating squence there is no specific limited, in present embodiment, with the resin paster is that this heat conduction cementing layer 3 of example is to conform to this in advance to hinder resistive element 2 surely, afterwards again by this heat conduction cementing layer 3 this base materials 1 of fitting.The characteristic of this heat conduction cementing layer 3 and variation are same as first embodiment, repeat no more equally in this.
Shown in Fig. 2 E and Fig. 2 F; then carry out protective mulch 4 step and according to the required step that forms electrode 5 in two electrode districts, 23 surfaces respectively of practical application, and the characteristic of this protective layer 4 and electrode 5 all be same as first embodiment with changing, also repeat no more in this.
In addition; the present invention also provides a kind of chip resister; shown in Fig. 1 E or Fig. 2 E; comprise base material 1, surely hinder resistive element 2, this base material 1 of fitting hinders the heat conduction cementing layer 3 of resistive element 2 surely and covers with this and hinders the protective layer 4 of resistive element 2 local surfaces surely to this relatively, make this hinder the part that resistive element 2 surfaces do not cover this protective layer 4 surely by this protective layer 4 and separate into two electrode districts 23.
Aforementioned this base material 1, hindering the material behavior of resistive element 2, heat conduction cementing layer 3, protective layer 4 and structural change surely, all to be same as aforementioned method for making described, gives unnecessary details no longer separately in this.In addition, chip resister provided by the present invention also can also comprise the electrode 5 that is formed at two electrode districts, 23 surfaces shown in Fig. 1 F or Fig. 2 F.
Fig. 3 shows that chip resister provided by the present invention is applied to the user mode heat conduction schematic diagram of external device (ED), as shown in the figure.The electrode 5 on two electrode districts, 23 surfaces of chip resister can be soldered to line contacts 61 corresponding in the circuit of external device (ED) 6 (for example circuit board); in the structural design in response to aforementioned chip resister; this electrode 5 is connected directly to decides resistance resistive element 2; therefore when this hinders resistive element 2 work generation heats surely; can be shown in the direction of arrow among the figure; making heat conduction towards the preferable base material 1 of thermal conductivity because of stopping of protective layer 4, is that more optimal way conducts to line contacts 61 by base material 1 via the electrode that hinders resistive element 2 both sides surely again.Be with, heat can pass through base material 1 thermal diffusion, also be directly conducted in the printed wire of external device (ED) 6 simultaneously by line contacts 61, prevent heat directly diffuse to the below and cause for example burning for the external device (ED) 6 of circuit board, thus, and can effectively suppress because electrode 5 is soaring and cause the excessive variation of temperature coefficient of resistance with the temperature that hinders resistive element 2 surely, be with in the product that can be applicable to utmost point low-resistance value.
In sum, chip resister provided by the present invention and method for making thereof, be to adopt fits relatively this base material and this of heat conduction cementing layer to hinder resistive element surely, so can get rid of the expensive shortcoming of prior art use manufacture of semiconductor, reach and be easy to the effect making, promote process rate and reduce cost; And this hinders resistive element surface part not covered by the protective layer surely and directly separates into two electrode districts; can be for directly forming the electrode that is beneficial to welding; also can directly provide welding to use, thereby can get rid of the unnecessary conduction of current impedance of prior art, the effectively stable temperature coefficient of resistance that reduces.Therefore, chip resister provided by the present invention and method for making thereof overcome many disadvantages of the prior art already.
Above-described specific embodiment, only release characteristics of the present invention and effect in order to example, but not in order to limit the category of implementing of the present invention, do not breaking away under above-mentioned spirit of the present invention and the technology category, the disclosed content of any utilization and the equivalence finished changes and modify, the scope that all still should be claims contains.
Claims (23)
1. the method for making of a chip resister comprises:
Base material is provided and hinders resistive element surely;
Surely hinder resistive element by fit relatively this base material and this of a heat conduction cementing layer; And
Cover a protective layer and hinder the resistive element local surfaces surely, separate into two electrode districts so that this hinders the part that the resistive element surface do not cover this protective layer surely to this.
2. the method for making of chip resister according to claim 1, wherein, this heat conduction cementing layer is a resin paster.
3. the method for making of chip resister according to claim 2, wherein, this resin paster conforms to this base material in advance, and fitting by this resin paster more afterwards, this hinders resistive element surely.
4. the method for making of chip resister according to claim 2, wherein, this resin paster conforms to this in advance and hinders resistive element surely, afterwards again by this resin paster this base material of fitting.
5. the method for making of chip resister according to claim 2, wherein, the material of this resin paster is an epoxy resin.
6. the method for making of chip resister according to claim 1, wherein, this heat conduction cementing layer is to form through the printing thermal conductive insulation glue.
7. the method for making of chip resister according to claim 6, wherein, this thermal conductive insulation glue prints in advance to this base material, and fitting by this thermal conductive insulation glue more afterwards, this hinders resistive element surely.
8. the method for making of chip resister according to claim 1, wherein, this protective layer covers and hinders the stage casing region surface of resistive element surely to this, so that these two ends that hinder zone, corresponding stage casing, resistive element surface surely separate into two electrode districts.
9. the method for making of chip resister according to claim 8 is included in these two electrode district surfaces that hinder resistive element surely again and forms electrode respectively.
10. the method for making of chip resister according to claim 9, wherein, this electrode is to be formed up to this electrode district surface in the barrel plating mode.
11. the method for making of chip resister according to claim 1, wherein, this base material be selected from ceramic substrate, glass substrate, and plastic base wherein one.
12. the method for making of chip resister according to claim 11, wherein, the material of this ceramic substrate is an aluminium oxide.
13. the method for making of chip resister according to claim 1, wherein, this hinders resistive element has punching for central authorities sheet metal surely.
14. the method for making of chip resister according to claim 1, wherein, this hinders resistive element has groove for the surface metal coating surely.
15. the method for making of chip resister according to claim 1, wherein, this hinders resistive element has groove for the surface metal die surely.
16. a chip resister comprises:
Base material;
Surely hinder resistive element;
The heat conduction cementing layer, fit relatively this base material and this hinder resistive element surely; And
Protective layer covers to this local surfaces that hinders resistive element surely, makes this hinder the part that the resistive element surface do not cover this protective layer surely and separates into two electrode districts.
17. chip resister according to claim 16, wherein, this heat conduction cementing layer is a resin paster.
18. chip resister according to claim 17, wherein, the material of this resin paster is an epoxy resin.
19. chip resister according to claim 16, wherein, this heat conduction cementing layer is to form through the printing thermal conductive insulation glue.
20. chip resister according to claim 16, wherein, this protective layer covers to this stage casing region surface that hinders resistive element surely, makes these two ends that hinder zone, corresponding stage casing, resistive element surface surely separate into two electrode districts.
21. chip resister according to claim 20 comprises two electrodes again, is formed at the two electrode district surfaces that this hinders resistive element surely respectively.
22. chip resister according to claim 16, wherein, this base material be selected from ceramic substrate, glass substrate, and plastic base wherein one.
23. chip resister according to claim 16, wherein, this hinder surely resistive element be selected from sheet metal that central authorities have punching, metal coating that the surface has groove, and the surface have groove the metal die wherein one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA200710140396XA CN101364463A (en) | 2007-08-10 | 2007-08-10 | Chip resistor and preparation thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA200710140396XA CN101364463A (en) | 2007-08-10 | 2007-08-10 | Chip resistor and preparation thereof |
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| Publication Number | Publication Date |
|---|---|
| CN101364463A true CN101364463A (en) | 2009-02-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA200710140396XA Pending CN101364463A (en) | 2007-08-10 | 2007-08-10 | Chip resistor and preparation thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102903467A (en) * | 2011-07-29 | 2013-01-30 | 乾坤科技股份有限公司 | Micro resistor element having soft material layer, and manufacturing method thereof |
| US9024204B2 (en) | 2011-07-28 | 2015-05-05 | Cyntec Co., Ltd. | Aresistive device with flexible substrate and method for manufacturing the same |
| CN104952569A (en) * | 2009-08-11 | 2015-09-30 | 釜屋电机株式会社 | Sheet-type resistor with low resistance and manufacture method of sheet-type resistor |
| CN106356167A (en) * | 2015-07-17 | 2017-01-25 | 乾坤科技股份有限公司 | Microresistor |
| CN108520811A (en) * | 2018-03-14 | 2018-09-11 | 成都明杰科技有限公司 | A kind of precision resister reducing resistance varying-ratio |
-
2007
- 2007-08-10 CN CNA200710140396XA patent/CN101364463A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104952569A (en) * | 2009-08-11 | 2015-09-30 | 釜屋电机株式会社 | Sheet-type resistor with low resistance and manufacture method of sheet-type resistor |
| US9024204B2 (en) | 2011-07-28 | 2015-05-05 | Cyntec Co., Ltd. | Aresistive device with flexible substrate and method for manufacturing the same |
| CN102903467A (en) * | 2011-07-29 | 2013-01-30 | 乾坤科技股份有限公司 | Micro resistor element having soft material layer, and manufacturing method thereof |
| CN102903467B (en) * | 2011-07-29 | 2016-04-06 | 乾坤科技股份有限公司 | There is micro-resistive element and the manufacture method thereof of flexible material layer |
| CN106356167A (en) * | 2015-07-17 | 2017-01-25 | 乾坤科技股份有限公司 | Microresistor |
| CN108520811A (en) * | 2018-03-14 | 2018-09-11 | 成都明杰科技有限公司 | A kind of precision resister reducing resistance varying-ratio |
| CN108520811B (en) * | 2018-03-14 | 2020-10-30 | 深圳市吉利通电子有限公司 | High-precision resistor capable of reducing resistance change rate |
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Open date: 20090211 |