CN101295569B - Chip resistor and method for manufacturing the same - Google Patents
Chip resistor and method for manufacturing the same Download PDFInfo
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- CN101295569B CN101295569B CN2008100287148A CN200810028714A CN101295569B CN 101295569 B CN101295569 B CN 101295569B CN 2008100287148 A CN2008100287148 A CN 2008100287148A CN 200810028714 A CN200810028714 A CN 200810028714A CN 101295569 B CN101295569 B CN 101295569B
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- layer
- electrode
- extraction electrode
- metal level
- copper
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Abstract
The invention discloses a chip resistor which includes a back electrode, a surface electrode, a resistor body, a glass layer and an extraction electrode; the lowest layer of the extraction electrode is a nickel-chromium layer or a silver layer; the surface layer is a tin or a tin-lead layer; the middle layer of the extraction electrode is a copper layer and a nickel layer; wherein, the copper layer is a metal layer with lower resistance rate and a small temperature coefficient, which can reduce the resistance of the extraction electrode or reduce the change of the extraction extrude value with the temperature to affect the characteristics of a product, thus realizing chip resistance manufacture with a resistance value less than 1 ohm, a temperature coefficient less than 200PPM/ DEG C, a resistance value precision less than one percent and high stability.
Description
Technical field
The present invention relates to a kind of chip resistor and manufacture method thereof, relate in particular to improved resistor of a kind of extraction electrode and preparation method thereof.
Background technology
At present, the extraction electrode of existing multiple chip resistor uses metal material to electroplate the certain thickness nickel metal layer of one deck again as substrate on substrate, at last at nickel metal layer power on tin metal layer or tin lead metal.Its preparation process is: in the substrate material is Al
2O
3Print two back electrodes in the and arranged on left and right sides of substrate lower surface, material is silver-colored Ag.The and arranged on left and right sides printing double-sided electrode of substrate upper surface, material is silver-colored palladium Ag/pd, makes face, back electrode film forming through high temperature sintering; Be connected across printed resistor body between two front electrodes at insulating substrate f, material is that ruthenium is the oxide resistor slurry, through the high temperature sintering film forming; The effect of a glass mainly is a protective resistance body when laser resistor trimming, and printed glass slurry on resistive element forms inner protective layer behind super-dry and sintering; Resistive layer b is carried out laser to be repaiied and enters within the predetermined margin of tolerance until the resistance of resistive layer b quarter; Printing protection slurry forms protective layer behind super-dry and sintering on inner protective layer, and mark layer is to print after the protective layer drying usually, forms with protective layer sintering together (or curing).Apply electrode slurry in the insulating substrate side, form the side electrode that is connected front electrode and backplate behind super-dry and sintering, i.e. extraction electrode partly is perhaps by vacuum sputtering formation side electrode, promptly the part extraction electrode forms termination target and external electrode through electroplating then.Side electrode, target and external electrode combine and are referred to as extraction electrode.
Chinese patent CN1437201 chip resistor has low resistance, low TCR and high accuracy and high reliability.This resistor comprises: substrate; At least be formed at the resistive layer on the substrate one side, this layer is made by corronil; The overlying electrode layer that contacts with the top face at the both ends of resistive layer; And the end electrode of formed covering overlying electrode layer, i.e. extraction electrode.
Summary of the invention
The technical problem that the present invention need solve provides a kind of low resistance section, and promptly resistance is less than 1 ohm, has that superior performance, stability are high, with low cost, the plate resistor product and the manufacture method thereof of environmental protection.
The technical solution adopted in the present invention is: a kind of chip resistor, comprise the back of the body, face electrode, resistive element, glassy layer, extraction electrode, the described extraction electrode bottom is nickel chromium triangle or silver layer, and superficial layer is tin or tin lead layer, and described extraction electrode intermediate layer is copper layer and nickel dam.The intermediate layer that is described extraction electrode is that the intermediate layer of copper layer and nickel dam or described extraction electrode is nickel dam and copper layer from inside to outside successively from inside to outside successively.Described copper layer is 1～5 μ m.The copper layer that increases in the middle of the chip resistor extraction electrode is the metal level that resistivity is low and temperature coefficient is little, can reduce the resistance of extraction electrode or reduce the extraction electrode resistance to vary with temperature the characteristic that influences product.
Further: in the preparation method of above-mentioned resistor, be included in Al
2O
3Form resistive element on the substrate, attached to Al
2O
3The face electrode at the substrate front side and the back side and back electrode, attached to the glassy layer on the resistive element be coated on Al
2O
3The formation of the extraction electrode at substrate and face electrode and back electrode two ends, laser resistor trimming, folding grain step, after folding grain step, product is put into electroplating bath electro-coppering metal level, realize the copper layer coating of 1～5 μ m, again product is put into electroplating bath electronickelling metal level, at last product is put into electroplating bath electrotinning metal level.During described electro-coppering metal level, the anode that is adopted is the metal that resistivity is low and temperature coefficient is little, as copper.
Perhaps: be included in Al
2O
3Form resistive element on the substrate, attached to Al
2O
3The face electrode at the substrate front side and the back side and back electrode, attached to the glassy layer on the resistive element be coated on Al
2O
3The formation of the termination electrode at substrate and face electrode and back electrode two ends, laser resistor trimming, folding grain step, after folding grain step, product is put into electroplating bath electronickelling metal level, again product is put into electroplating bath copper facing metal level, realize the copper layer coating of 1～5 μ m, at last product is put into electroplating bath electrotinning metal level.During described electro-coppering metal level, the anode that is adopted is the metal that resistivity is low and temperature coefficient is little, as copper.
Realize resistance less than 1 ohm, temperature coefficient is less than 200PPM/ ℃, and resistance accuracy is less than 1%, and the sheet impaction that stability is high is produced.
Embodiment
Purport of the present invention is that this copper layer is the metal level that resistivity is low and temperature coefficient is little by increase layer of copper layer in the middle of the chip resistor extraction electrode, can reduce the resistance of extraction electrode or reduce the extraction electrode resistance varying with temperature the characteristic that influences product.This technical scheme can realize the low resistance section, and promptly resistance is less than 1 ohm, and temperature coefficient is less than 200PPM/ ℃, and resistance accuracy is less than 1%, and the sheet impaction that stability is high is produced.Below in conjunction with embodiment content of the present invention is described in further detail, mentioned content is not a limitation of the invention among the embodiment.At first, the basic scheme of summary the inventive method.A kind of chip resistor comprises the back of the body, face electrode, resistive element, glassy layer, extraction electrode, and the described extraction electrode bottom is nickel chromium triangle or silver layer, and superficial layer is tin or tin lead layer, and described extraction electrode intermediate layer is copper layer and nickel dam.
Embodiment 1
A kind of chip resistor, comprise the back of the body, face electrode, resistive element, glassy layer, extraction electrode, the described extraction electrode bottom is nickel chromium triangle or silver layer, and superficial layer is tin or tin lead layer, described extraction electrode intermediate layer is copper layer and nickel dam from inside to outside successively, and described copper layer is 1～5 μ m.
Further: in the preparation method of above-mentioned resistor, be included in Al
2O
3Form resistive element on the substrate, attached to Al
2O
3The face electrode at the substrate front side and the back side and back electrode, attached to the glassy layer on the resistive element be coated on Al
2O
3The formation of the termination electrode at substrate and face electrode and back electrode two ends, laser resistor trimming, folding grain step, after folding grain step, product is put into electroplating bath electro-coppering metal level, realize the copper layer coating of 1～5 μ m, again product is put into electroplating bath electronickelling metal level, at last product is put into electroplating bath electrotinning metal level.During described electro-coppering metal level, the anode that is adopted is the metal that resistivity is low and temperature coefficient is little, as copper.
Realize resistance less than 1 ohm, temperature coefficient is less than 200PPM/ ℃, and resistance accuracy is less than 1%, and the sheet impaction that stability is high is produced.
Embodiment 2
A kind of chip resistor comprises the back of the body, face electrode, resistive element, glassy layer, extraction electrode, and the described extraction electrode bottom is nickel chromium triangle or silver layer, and superficial layer is tin or tin lead layer, and described extraction electrode intermediate layer is nickel dam and copper layer from inside to outside successively.Described copper layer is 1～5 μ m.
Further: in the preparation method of above-mentioned resistor, be included in Al
2O
3Form resistive element on the substrate, attached to Al
2O
3The face electrode at the substrate front side and the back side and back electrode, attached to the glassy layer on the resistive element be coated on Al
2O
3The formation of the extraction electrode at substrate and face electrode and back electrode two ends, laser resistor trimming, folding grain step, after folding grain step, product is put into electroplating bath electronickelling metal level, again product is put into electroplating bath copper facing metal level, realize the copper layer coating of 1～5 μ m, at last product is put into electroplating bath electrotinning metal level.During described electro-coppering metal level, the anode that is adopted is the metal that resistivity is low and temperature coefficient is little, as copper.
Realize resistance less than 1 ohm, temperature coefficient is less than 200PPM/ ℃, and resistance accuracy is less than 1%, and the sheet impaction that stability is high is produced.
Claims (8)
1. a chip resistor comprises the back of the body, face electrode, resistive element, glassy layer, extraction electrode, and the described extraction electrode bottom is nickel chromium triangle or silver layer, and superficial layer is tin or tin lead layer, it is characterized in that: described extraction electrode intermediate layer is copper layer and nickel dam.
2. chip resistor according to claim 1 is characterized in that: the intermediate layer of described extraction electrode is copper layer and nickel dam from inside to outside successively.
3. chip resistor according to claim 1 is characterized in that: the intermediate layer of described extraction electrode is nickel dam and copper layer from inside to outside successively.
4. according to claim 2 or 3 described chip resistors, it is characterized in that: described copper layer is 1～5 μ m.
5. the preparation method of claim 2 chip resistor is included in Al
2O
3Form resistive element on the substrate, attached to Al
2O
3The face electrode at the substrate front side and the back side and back electrode, attached to the glassy layer on the resistive element be coated on Al
2O
3The formation of the extraction electrode at substrate and face electrode and back electrode two ends, laser resistor trimming, folding grain step, it is characterized in that: after folding grain step, product is put into electroplating bath electro-coppering metal level, realize the copper layer coating of 1～5 μ m, again product is put into electroplating bath electronickelling metal level, at last product is put into electroplating bath electrotinning metal level.
6. preparation method according to claim 5 is characterized in that: during described electro-coppering metal level, the anode that is adopted is a metallic copper.
7. the preparation method of claim 3 chip resistor is included in Al
2O
3Form resistive element on the substrate, attached to Al
2O
3The face electrode at the substrate front side and the back side and back electrode, attached to the glassy layer on the resistive element be coated on Al
2O
3The formation of the extraction electrode at substrate and face electrode and back electrode two ends, laser resistor trimming, folding grain step, it is characterized in that: after folding grain step, product is put into electroplating bath electronickelling metal level, again product is put into electroplating bath copper facing metal level, realize the copper layer coating of 1～5 μ m, at last product is put into electroplating bath electrotinning metal level.
8. preparation method according to claim 7 is characterized in that: during described electro-coppering metal level, the anode that is adopted is a metallic copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100287148A CN101295569B (en) | 2008-06-06 | 2008-06-06 | Chip resistor and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100287148A CN101295569B (en) | 2008-06-06 | 2008-06-06 | Chip resistor and method for manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101295569A CN101295569A (en) | 2008-10-29 |
| CN101295569B true CN101295569B (en) | 2011-04-27 |
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ID=40065766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100287148A Expired - Fee Related CN101295569B (en) | 2008-06-06 | 2008-06-06 | Chip resistor and method for manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101295569B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103762051A (en) * | 2013-12-30 | 2014-04-30 | 深圳市慧瑞电子材料有限公司 | High-holding current PPTC (polymeric positive temperature coefficient) overcurrent protector and manufacturing method thereof |
| CN108806906A (en) * | 2018-06-12 | 2018-11-13 | 深圳市业展电子有限公司 | The method and its Chip-R of alloy Chip-R are made for rectangular metal composite material strip for a kind of section |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1367497A (en) * | 2001-01-26 | 2002-09-04 | 奠基石传感器公司 | Thermistor and its production method |
| CN1416310A (en) * | 2001-10-30 | 2003-05-07 | 李俊豪 | Method for quick resistance trimming by using laser on printed circuit board directly |
| CN1437201A (en) * | 1996-09-11 | 2003-08-20 | 松下电器产业株式会社 | Pellet electrical resistor and producing method thereof |
-
2008
- 2008-06-06 CN CN2008100287148A patent/CN101295569B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1437201A (en) * | 1996-09-11 | 2003-08-20 | 松下电器产业株式会社 | Pellet electrical resistor and producing method thereof |
| CN1367497A (en) * | 2001-01-26 | 2002-09-04 | 奠基石传感器公司 | Thermistor and its production method |
| CN1416310A (en) * | 2001-10-30 | 2003-05-07 | 李俊豪 | Method for quick resistance trimming by using laser on printed circuit board directly |
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| Publication number | Publication date |
|---|---|
| CN101295569A (en) | 2008-10-29 |
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| C14 | Grant of patent or utility model | ||
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Granted publication date: 20110427 Termination date: 20170606 |