CN208690032U - A kind of high reliable high voltage thick film Chip-R - Google Patents
A kind of high reliable high voltage thick film Chip-R Download PDFInfo
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- CN208690032U CN208690032U CN201820734617.XU CN201820734617U CN208690032U CN 208690032 U CN208690032 U CN 208690032U CN 201820734617 U CN201820734617 U CN 201820734617U CN 208690032 U CN208690032 U CN 208690032U
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Abstract
The utility model discloses a kind of high reliable high voltage thick film Chip-Rs, including substrate, the lower surface two sides of substrate are provided with rear electrode, the upper surface two sides of substrate are provided with front electrode group, front electrode group includes the two layers of front electrode stacked gradually from top to bottom, upper surface of base plate between front electrode group is provided with resistance resistance body, the first protective layer is covered on resistance resistance body, the upper surface of first protective layer is provided with laser wires, laser wires extend to resistance resistance body, the second protective layer is covered on first protective layer and laser wires, third protective layer is covered on second protective layer, side electrode is provided in two end side surface of substrate, two sides electrode is respectively turned on the front electrode group and rear electrode of two sides.Traditional single layer front electrode is improved to two layers of front electrode by the utility model; the thermal diffusivity of resistance can be improved in such structure; increase resistance resistance body design area simultaneously; and carry out the design of third protective layer; so as to effectively improve the operating voltage of product, meet requirement of the client to high reliable high voltage thick film Chip-R.
Description
Technical field
The utility model relates to a kind of high reliable high voltage thick film Chip-Rs, belong to technical field of electronic components.
Background technique
With the development of science and technology the requirement of the development and people in epoch to each electronic product is constantly promoted, reliable performance
And the thick film Chip-R of process stabilizing also answers the specific demand of electronic product that diversified development trend is presented, it is also brilliant to thick film
Sheet resistance bring new opportunity to develop, especially client application end have to the working electronic of thick film Chip-R pressure index it is higher
Requirement.Currently, the voltage of thick film Chip-R common in existing industry is lower, people are unable to satisfy to high voltage thick film chip
The demand of resistance.
Utility model content
In order to solve the above-mentioned technical problem, the utility model provides a kind of high reliable high voltage thick film Chip-R.
In order to achieve the above object, the technical scheme adopted by the utility model is
A kind of high reliable high voltage thick film Chip-R, including substrate, the lower surface two sides of substrate are provided with the back side
Electrode, the upper surface two sides of substrate are provided with front electrode group, and front electrode group includes two layers stacked gradually from top to bottom
Front electrode, the upper surface of base plate between front electrode group are provided with resistance resistance body, the first protection are covered on resistance resistance body
Layer, the upper surface of the first protective layer are provided with laser wires, and laser wires extend to resistance resistance body, cover on the first protective layer and laser wires
It is stamped the second protective layer, third protective layer is covered on the second protective layer, is provided with side electrode in two end side surface of substrate, two
Side electrode is respectively turned on the front electrode group and rear electrode of two sides.
When the resistance specification is 0603, the area of resistance resistance body is 0.46mm2；When the resistance specification be 0805, electricity
The area for hindering resistance body is 1.28mm2；When the resistance specification is 1206, the area of resistance resistance body is 2.26mm2。
All front electrodes are all made of silver-colored palladium material and are all made of silver-colored palladium material.
Third protective layer covers all the second protective layer, and using the resin-insulated material of same specification.
Third protective layer is provided with character code layer on top surface.
It is covered with nickel layer in front electrode group, side electrode and rear electrode, is covered with tin layers on nickel layer.
Nickel layer thickness is 3~15 μm, and tin thickness is 3~15 μm.
The utility model is achieved the utility model has the advantages that the more traditional common thick film Chip-R of 1, the utility model is using improvement
And the design of the printing area of resistance resistance body is increased, the operating voltage of product can be effectively improved.Voltage indexes can reach: 0603 rule
Lattice 500V, 0805 specification 800V, 1206 specification 1000V.2, front electrode uses and the second front electrode covers all first
Front electrode, and using function admirable silver-colored palladium material, such design can increase product electric conductivity and radiate it is hot, from
And the operating voltage and reliability of product can be effectively improved.3, it is provided with third protective layer on resistance resistance body and covers all second
Protective layer, and using the resin-insulated material of same specification, in this way, further protective resistance resistance body can be played, so as to effective
Improve the operating voltage and reliability of product.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the semi-finished product structure schematic diagram after step 1 described in the utility model；
Fig. 3 is the semi-finished product structure schematic diagram after step 2 described in the utility model；
Fig. 4 is the semi-finished product structure schematic diagram after step 3 described in the utility model；
Fig. 5 is the semi-finished product structure schematic diagram after step 4 described in the utility model；
Fig. 6 is the semi-finished product structure schematic diagram after step 5 described in the utility model；
Fig. 7 is the semi-finished product structure schematic diagram after step 6 described in the utility model；
Fig. 8 is the semi-finished product structure schematic diagram after step 7 described in the utility model；
Fig. 9 is the semi-finished product structure schematic diagram after step 8 described in the utility model；
Figure 10 is the semi-finished product structure schematic diagram after step 9 described in the utility model；
Figure 11 is the semi-finished product structure schematic diagram after step 10 described in the utility model；
Figure 12 is the semi-finished product structure schematic diagram after step 11 described in the utility model；
Figure 13 is the finished product structure schematic diagram after step 12 described in the utility model.
Specific embodiment
The utility model is further described with reference to the accompanying drawing.Following embodiment is only used for clearly illustrating this
The technical solution of utility model, and cannot be used as a limitation the limitation protection scope of the utility model.
As shown in Figure 1, a kind of high reliable high voltage thick film Chip-R, including substrate 01, the lower surface two of substrate 01
Side is provided with rear electrode 02, and the upper surface two sides of substrate 01 are provided with front electrode group, and front electrode group includes from upper
The two layers of front electrode stacked gradually down, respectively the second front electrode 04 and the first front electrode 03, own from top to bottom
Front electrode is all made of silver-colored palladium material, and 01 upper surface of substrate between front electrode group is provided with resistance resistance body 05, resistance resistance
The first protective layer 06 is covered on body 05, the upper surface of the first protective layer 06 is provided with laser wires 07, and laser wires 07 extend to electricity
Resistance body 05 is hindered, the second protective layer 08 is covered on the first protective layer 06 and laser wires 07, is covered with third on the second protective layer 08
Protective layer 09 is provided with character code layer 10 on 09 top surface of third protective layer, is provided with side electrode 11 in 01 liang of end side surface of substrate,
Two sides electrode 11 is respectively turned on the front electrode group and rear electrode 02 of two sides, front electrode group, side electrode 11 and the back side
Be covered with nickel layer 12 on electrode 02, be covered with tin layers 13 on nickel layer 12, nickel layer 12 with a thickness of 3~15 μm, tin layers 13 with a thickness of 3~
15μm。
The specification of above-mentioned resistance is different, and the area of resistance resistance body 05 is also different, the 0.46mm of 0603 specification2, 0805 specification
1.28mm2, the 2.26mm of 1206 specifications2.More traditional common thick film Chip-R is using the printing surface for improving and increasing resistance resistance body
Long-pending design can effectively improve the operating voltage of product.Voltage indexes can reach: 0603 specification 500V, 0805 specification 800V,
1206 specification 1000V.
The single layer front electrode of the above-mentioned more traditional common thick film Chip-R of resistance is improved to two layers of front electrode, and second
Front electrode covers all the first front electrode, while front electrode uses the silver-colored palladium material of function admirable, such design
Electric conductivity and the heat dissipation that product can be increased are hot, so as to effectively improve the operating voltage and reliability of product.
It is provided with third protective layer on the above-mentioned more traditional common thick film Chip-R resistance resistance body of resistance and covers all
Two protective layers, and using the resin-insulated material of same specification, in this way, further protective resistance resistance body can be played, so as to have
Effect improves the operating voltage and reliability of product.
The preparation process of above-mentioned resistance is as follows:
Step 1: as shown in Fig. 2, coating silver paste is printed by silk screen thick film screen printing mode in the lower surface of substrate 01, with
Defined temperature is sintered, to form rear electrode 02 in the lower surface of substrate 01；
Step 2: as shown in figure 3, printing the silver-colored palladium slurry of coating by silk screen thick film screen printing mode in the upper surface of substrate 01
Material, is sintered with defined temperature, to form the first front electrode 03 in the upper surface of substrate 01；
Step 3: as shown in figure 4, printing painting by silk screen thick film screen printing mode in the upper surface of above-mentioned first front electrode 03
Silver-colored palladium slurry is covered, is sintered with defined temperature, to form the second front electrode 04 on 03 surface of the first front electrode；
Step 4: as shown in figure 5, by silk screen thick film screen printing mode in the first front electrode 03 and the second front electrode 04
Between printing coating one layer of resistance body slurry, be sintered with defined temperature, formed resistance resistance body 05, the printing of resistance resistance body 05
Area are as follows: 0603 specification 0.46mm2, 0805 specification 1.28mm2, 1206 specification 2.26mm2；
Step 5: as shown in fig. 6, printing one layer of coating by silk screen thick film screen printing mode on above-mentioned resistance resistance body 05
Glass paste is sintered with defined temperature, forms the first protective layer 06；
Step 6: as shown in fig. 7, resistance resistance body 05 is modified to Client application by using the mode that laser is cut
Resistance value and precision needed for end, form laser wires 07；
Step 7: as shown in figure 8, passing through screen printing mode in the upper surface of above-mentioned first protective layer 06 and laser wires 07
Printing one layer of resin slurry of coating, is sintered with defined temperature, forms the second protective layer 08；
Step 8: as shown in figure 9, passing through one layer of coating of screen printing mode printing in the upper surface of above-mentioned second protective layer 08
Resin slurry is sintered with defined temperature, forms third protective layer 09, third protective layer 09 and the second protective layer 08 are completely
Overlapping, such third protective layer 09 cover all the second protective layer 08, play the role of further protective resistance resistance body 05；
Step 9: as shown in Figure 10, in the upper surface middle position of above-mentioned third protective layer 09, passing through silk screen thick film screen printing
Mode prints one layer of character code slurry of coating, is sintered with defined temperature, forms the character code layer 10 as mark resistance value size；
Step 10: as shown in figure 11, using true nickel plating chromium alloy material mode in 01 liang of end side surface of substrate, form side electricity
Pole 11；
Step 11: as shown in figure 12, overleaf passing through barrel plating mode electricity on electrode 02, front electrode group and side electrode 11
One layer of metallic nickel is plated, nickel layer 12 is formed；
Step 12: as shown in figure 13, one layer of metallic tin of plating being electroplated by barrel plating mode, forms tin layers 13.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
For art personnel, without deviating from the technical principle of the utility model, several improvement and deformations can also be made, these change
It also should be regarded as the protection scope of the utility model into deformation.
Claims (7)
1. a kind of high reliable high voltage thick film Chip-R, it is characterised in that: including substrate, the lower surface two sides of substrate are all provided with
It is equipped with rear electrode, the upper surface two sides of substrate are provided with front electrode group, and front electrode group includes successively heap from top to bottom
Two layers of folded front electrode, respectively the second front electrode and the first front electrode from top to bottom, between front electrode group
Upper surface of base plate is provided with resistance resistance body, and the first protective layer is covered on resistance resistance body, and the upper surface of the first protective layer is provided with
Laser wires, laser wires extend to resistance resistance body, are covered with the second protective layer on the first protective layer and laser wires, on the second protective layer
It is covered with third protective layer, side electrode is provided in two end side surface of substrate, two sides electrode is respectively turned on the front of two sides
Electrode group and rear electrode.
2. a kind of high reliable high voltage thick film Chip-R according to claim 1, it is characterised in that: when the resistance
Specification is 0603, and the area of resistance resistance body is 0.46mm2；When the resistance specification is 0805, the area of resistance resistance body is
1.28mm2；When the resistance specification is 1206, the area of resistance resistance body is 2.26mm2。
3. a kind of high reliable high voltage thick film Chip-R according to claim 1, it is characterised in that: all front electricity
Pole is all made of silver-colored palladium material.
4. a kind of high reliable high voltage thick film Chip-R according to claim 1, it is characterised in that:
Third protective layer covers all the second protective layer, and using the resin-insulated material of same specification.
5. a kind of high reliable high voltage thick film Chip-R according to claim 1, it is characterised in that: third protective layer
Character code layer is provided on top surface.
6. a kind of high reliable high voltage thick film Chip-R according to claim 1, it is characterised in that: front electrode
It is covered with nickel layer in group, side electrode and rear electrode, is covered with tin layers on nickel layer.
7. a kind of high reliable high voltage thick film Chip-R according to claim 6, it is characterised in that: nickel layer thickness is
3~15 μm, tin thickness is 3~15 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820734617.XU CN208690032U (en) | 2018-05-17 | 2018-05-17 | A kind of high reliable high voltage thick film Chip-R |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820734617.XU CN208690032U (en) | 2018-05-17 | 2018-05-17 | A kind of high reliable high voltage thick film Chip-R |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208690032U true CN208690032U (en) | 2019-04-02 |
Family
ID=65877195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820734617.XU Active CN208690032U (en) | 2018-05-17 | 2018-05-17 | A kind of high reliable high voltage thick film Chip-R |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208690032U (en) |
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2018
- 2018-05-17 CN CN201820734617.XU patent/CN208690032U/en active Active
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