CN208781632U - A kind of automobile sulfuration resistant thick film Chip-R - Google Patents
A kind of automobile sulfuration resistant thick film Chip-R Download PDFInfo
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- CN208781632U CN208781632U CN201820734589.1U CN201820734589U CN208781632U CN 208781632 U CN208781632 U CN 208781632U CN 201820734589 U CN201820734589 U CN 201820734589U CN 208781632 U CN208781632 U CN 208781632U
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Abstract
The utility model discloses a kind of automobile sulfuration resistant thick film Chip-Rs, including substrate, the lower surface two sides of substrate are provided with rear electrode, the upper surface two sides of substrate are provided with front electrode group, front electrode group includes the two layers of front electrode stacked gradually from top to bottom, upper surface of base plate between front electrode group is provided with resistance resistance body, the first protective layer is covered on resistance resistance body, the upper surface of first protective layer is provided with laser wires, the second protective layer is covered on first protective layer and laser wires, third protective layer is covered on second protective layer, electrode protecting layer is covered in front electrode group, electrode protecting layer is between one end of resistance resistance body folder and the second protective layer and third protective layer, side electrode is provided in two end side surface of substrate.The utility model improves ESD antistatic effect, while the vulcanization of energy effective protection electrode, prevents resistance from open circuit phenomenon occur.
Description
Technical field
The utility model relates to a kind of automobile sulfuration resistant thick film Chip-Rs, belong to technical field of electronic components.
Background technique
With the development of science and technology the requirement of the development and people in epoch to each electronic product is constantly promoted, reliable performance
And the Chip-R of process stabilizing also answers the specific demand of electronic product that diversified development trend, especially Client application is presented
Antistatic to the ESD of Chip-R, sulfuration resistant ability requirement is held, promotes resistor manufacturer that can develop with high-performance
ESD is antistatic and sulfuration resistant ability, the Chip-R that can be used on automotive grade electronic product.
Utility model content
In order to solve the above-mentioned technical problem, the utility model provides a kind of automobile sulfuration resistant thick film Chip-R.
In order to achieve the above object, the technical scheme adopted by the utility model is
A kind of automobile sulfuration resistant thick film Chip-R, including substrate, the lower surface two sides of substrate are provided with rear electrode,
The upper surface two sides of substrate are provided with front electrode group, and front electrode group includes the two layers of front electricity stacked gradually from top to bottom
Pole, the upper surface of base plate between front electrode group are provided with resistance resistance body, are covered with the first protective layer on resistance resistance body, and first
The upper surface of protective layer is provided with laser wires, and laser wires extend to resistance resistance body, and is covered on the first protective layer and laser wires
Two protective layers are covered with third protective layer on the second protective layer, electrode protecting layer, electrode protecting layer are covered in front electrode group
Between one end of resistance resistance body folder and the second protective layer and third protective layer, side electricity is provided in two end side surface of substrate
Pole, two sides electrode are respectively turned on the front electrode group and rear electrode of two sides.
Definition outermost layer front electrode is second front electrode, and one end of second front electrode connects side electrode,
The other end of second front electrode is located at the top of first front electrode and resistance resistance body lap-joint, and the end and resistance
Resistance body connection.
Front electrode is the front electrode of silver palladium alloy, and palladium content is not less than 5%.
Electrode protecting layer is covered in front electrode group, electrode protecting layer is close to one end of resistance resistance body folder and the second protection
Between layer and third protective layer.
Two protective layers and third protective layer are all made of the resin-insulated material of same specification.
Third protective layer is provided with character code layer on top surface.
It is covered with nickel layer in front electrode group, side electrode and rear electrode, is covered with tin layers on nickel layer.
The utility model is achieved the utility model has the advantages that traditional single layer front electrode is being improved to bilayer just by the utility model
Face electrode, such structure are conducive to improve resistance ESD antistatic effect, while the electrode protecting layer of sandwich design, can effectively prevent
The vulcanization for protecting electrode prevents resistance from open circuit phenomenon occur.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the schematic diagram after step (1)；
Fig. 3 is the schematic diagram after step (2)；
Fig. 4 is the schematic diagram after step (3)；
Fig. 5 is the schematic diagram after step (4)；
Fig. 6 is the schematic diagram after step (5)；
Fig. 7 is the schematic diagram after step (6)；
Fig. 8 is the schematic diagram after step (7)；
Fig. 9 is the schematic diagram after step (8)；
Figure 10 is the schematic diagram after step (9)；
Figure 11 is the schematic diagram after step (10)；
Figure 12 is the schematic diagram after step (11)；
Figure 13 is the schematic diagram after step (12)；
Figure 14 is the schematic diagram after step (13)；
Figure 15 is the schematic diagram after step (14)；
Figure 16 is the schematic diagram after step (15)；
Figure 17 is the schematic diagram after step (16).
Specific embodiment
The utility model is further described with reference to the accompanying drawing.Following embodiment is only used for clearly illustrating this
The technical solution of utility model, and cannot be used as a limitation the limitation protection scope of the utility model.
As shown in Figure 1, a kind of automobile sulfuration resistant thick film Chip-R, including substrate 01, the lower surface two sides of substrate 01 are equal
It is provided with rear electrode 06, the upper surface two sides of substrate 01 are provided with front electrode group, and front electrode group includes from top to bottom
The two layers of front electrode stacked gradually, are followed successively by the second front electrode 09 and the first front electrode 07 from top to bottom, in positive electricity
01 upper surface of substrate between the group of pole is provided with resistance resistance body 08, and the first protective layer 10 is covered on resistance resistance body 08, and first protects
The upper surface of sheath 10 is provided with laser wires 11, and laser wires 11 extend to resistance resistance body 08, the first protective layer 10 and laser wires 11
On be covered with the second protective layer 12, third protective layer 14 is covered on the second protective layer 12, third protective layer is arranged on 14 top surface
There is character code layer 15, electrode protecting layer 13 is covered in front electrode group, electrode protecting layer 13 is pressed from both sides close to one end of resistance resistance body 08
Between the second protective layer and third protective layer 14, side electrode 16, two sides electrode are provided in 01 liang of end side surface of substrate
16 are respectively turned on the front electrode group and rear electrode 06 of two sides, cover in front electrode group, side electrode 16 and rear electrode 06
It is stamped nickel layer 17, tin layers 18 are covered on nickel layer 17.
Aforesaid substrate 01 is ceramic substrate, is made of the good oxidation aluminium material of high-purity, thermal diffusivity.
One end of above-mentioned second front electrode connects side electrode 16, and the other end of second front electrode is located at first
The top of a front electrode and 08 lap-joint of resistance resistance body, and the end is connect with resistance resistance body 08.
The silver palladium alloy that above-mentioned first front electrode 07 and the second front electrode 09 are all made of the high amount containing palladium is made, palladium content
Not less than 5%, the characteristic that tool has good wearability with resistance to vulcanization environmental corrosion, while the double-deck front electrode is more advantageous to favorably
In improving ESD antistatic effect, the antistatic index of ESD is up to 2KV.
Above-mentioned electrode protecting layer 13 uses resin ag material, using the interlayer between the second protective layer 12 and third protection
Design, the vulcanization of energy effective protection electrode prevent resistance from open circuit phenomenon occur.
Above-mentioned second protective layer and third protective layer 14 are all made of the resin-insulated material of same specification, make the two weight completely
It is folded, further protective resistance resistance body 08.
Above-mentioned nickel layer 17 is with a thickness of 4~15 μm, and tin layers 18 are with a thickness of 5~15 μm.
The preparation method of above-mentioned resistance, comprising the following steps:
Step (1), as shown in Fig. 2, carving a plurality of folding bar line and folding grain in the upper surface (02S marked in figure) of substrate 01
Line, folding bar line and folding grain line are mutually perpendicular to, and the upper surface 02 of substrate 01 is divided into multiple units by folding bar line 03 and folding grain line 04
Lattice, such one piece of substrate 01, it is possible to produce multiple resistance improve production efficiency；
Step (2), as shown in figure 3, passing through silk screen thick film screen printing side in the lower surface (05S marked in figure) of substrate 01
Formula coats silver paste, and is sintered, sintering temperature are as follows: 850 ± 5 DEG C, forms rear electrode 06；
Step (3) is gone forward side by side as shown in figure 4, coating silver-colored palladium slurry by silk screen thick film screen printing mode in the two sides of cell
Row sintering, sintering temperature are as follows: 850 ± 5 DEG C, form the first front electrode 07；
Step (4), as shown in figure 5, coating one layer of electricity between the first front electrode 07 by silk screen thick film screen printing mode
08 slurry of resistance body is hindered, and is sintered, sintering temperature are as follows: 850 ± 5 DEG C, forms resistance resistance body 08；
Step (5), as shown in fig. 6, by silk screen thick film screen printing mode in the upper surface, first just of the first front electrode 07
The lap-joint of face electrode 07 and resistance resistance body 08 coats one layer of silver-colored palladium slurry, and is sintered, sintering temperature are as follows: and 850 ± 5 DEG C,
Form the second front electrode 09；
Step (6), as shown in fig. 7, the upper surface of resistance resistance body 08 coats one layer of glass by silk screen thick film screen printing mode
Slurry, and be sintered, sintering temperature are as follows: 600 ± 5 DEG C, form the first protective layer 10；
Step (7) forms client as shown in figure 8, being modified using the mode that laser is cut to resistance resistance body 08
Required resistance value and precision forms laser wires 11；
Step (8), as shown in figure 9, coating one layer by silk screen thick film screen printing mode in the upper surface of the first protective layer 10
Resin slurry, and be sintered, sintering temperature are as follows: 200 ± 10 DEG C, form the second protective layer 12；
Step (9), as shown in Figure 10, in the upper surface of the second front electrode 09, the second front electrode 09 and the second protection
The lap-joint of layer 12, coats one layer of resin silver paste by silk screen thick film screen printing mode, and be sintered, sintering temperature are as follows: 200
± 10 DEG C, form electrode protecting layer 13；
Step (10), as shown in figure 11, in the upper surface of the second protective layer 12, electrode protecting layer 13 and the second protective layer 12
Lap-joint, one layer of resin slurry is coated by silk screen thick film screen printing mode, and be sintered, sintering temperature are as follows: 200 ± 10
DEG C, form third protective layer 14；
Step (11) coats one by silk screen thick film screen printing mode in the upper surface of third protective layer 14 as shown in figure 12
15 slurry of layer character code layer, and be sintered, sintering temperature are as follows: 200 ± 10 DEG C, form character code layer 15；
Step (12) as shown in figure 13 will be by step (1)-step (11) treated substrate 01, folding along folding bar line 03
Resistance strip semi-finished product into strips；
Resistance strip semi-finished product are stacked in such a way that jig stacks, use as shown in figure 14 by step (13)
Nickel plating chromium alloy material mode plates side electrode 16 to the two sides of resistance strip semi-finished product；
Step (14) as shown in figure 15 will be by step (12)-step (13) treated resistance strip along folding grain line 04
Semi-finished product are converted into the granular semi-finished product of resistance；
Step (15), as shown in figure 16, by the front electrode group of the granular semi-finished product of resistance, side electrode 16 and rear electrode
One layer of metallic nickel is electroplated by barrel plating mode in 06 surface, forms nickel layer 17；
Step (16) is electroplated one layer of metallic tin by barrel plating mode on 17 surface of nickel layer, forms tin layers as shown in figure 17
18。
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
For art personnel, without deviating from the technical principle of the utility model, several improvement and deformations can also be made, these change
It also should be regarded as the protection scope of the utility model into deformation.
Claims (6)
1. a kind of automobile sulfuration resistant thick film Chip-R, it is characterised in that: including substrate, the lower surface two sides of substrate are provided with
Rear electrode, the upper surface two sides of substrate are provided with front electrode group, and front electrode group includes stacking gradually from top to bottom
Two layers of front electrode, the upper surface of base plate between front electrode group are provided with resistance resistance body, are covered with first on resistance resistance body
Protective layer, the upper surface of the first protective layer are provided with laser wires, and laser wires extend to resistance resistance body, the first protective layer and laser wires
On be covered with the second protective layer, third protective layer is covered on the second protective layer, is covered with electrode protecting layer in front electrode group,
Electrode protecting layer is respectively provided in two end side surface of substrate between one end of resistance resistance body folder and two protective layers and third protective layer
There is side electrode, two sides electrode is respectively turned on the front electrode group and rear electrode of two sides.
2. a kind of automobile sulfuration resistant thick film Chip-R according to claim 1, it is characterised in that: define outermost layer front
Electrode is second front electrode, and one end of second front electrode connects side electrode, the other end of second front electrode
Positioned at the top of first front electrode and resistance resistance body lap-joint, and the end is connect with resistance resistance body.
3. a kind of automobile sulfuration resistant thick film Chip-R according to claim 1 or 2, it is characterised in that: front electrode is equal
For the front electrode of silver palladium alloy, palladium content is not less than 5%.
4. a kind of automobile sulfuration resistant thick film Chip-R according to claim 1, it is characterised in that: the second protective layer and
Three protective layers are all made of the resin-insulated material of same specification.
5. a kind of automobile sulfuration resistant thick film Chip-R according to claim 1, it is characterised in that: third protective layer top surface
On be provided with character code layer.
6. a kind of automobile sulfuration resistant thick film Chip-R according to claim 1, it is characterised in that: front electrode group, side
It is covered with nickel layer on face electrode and rear electrode, is covered with tin layers on nickel layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820734589.1U CN208781632U (en) | 2018-05-17 | 2018-05-17 | A kind of automobile sulfuration resistant thick film Chip-R |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820734589.1U CN208781632U (en) | 2018-05-17 | 2018-05-17 | A kind of automobile sulfuration resistant thick film Chip-R |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208781632U true CN208781632U (en) | 2019-04-23 |
Family
ID=66148486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820734589.1U Active CN208781632U (en) | 2018-05-17 | 2018-05-17 | A kind of automobile sulfuration resistant thick film Chip-R |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208781632U (en) |
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2018
- 2018-05-17 CN CN201820734589.1U patent/CN208781632U/en active Active
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