CN106098277B - Flexible LED lamp bar dedicated resistor and its manufacturing method - Google Patents
Flexible LED lamp bar dedicated resistor and its manufacturing method Download PDFInfo
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- CN106098277B CN106098277B CN201610662318.5A CN201610662318A CN106098277B CN 106098277 B CN106098277 B CN 106098277B CN 201610662318 A CN201610662318 A CN 201610662318A CN 106098277 B CN106098277 B CN 106098277B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/04—Arrangements of distinguishing marks, e.g. colour coding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
Abstract
The invention discloses a kind of flexible LED lamp bar dedicated resistor and its manufacturing methods; the resistor includes insulating substrate; the insulating substrate back side is symmetrically printed with backplate on both sides; backplate includes spaced backplate one and backplate two; insulating substrate back side middle part is printed with the resistive layer on the edge for being overlapped on backplate, and insulating protective layer is printed on resistive layer;Sputtering has side electrode respectively on two side elevations of insulating substrate, and side electrode extends to insulating substrate front to be overlapped in insulating substrate front edge, as front electrode;It is formed with one layer of nickel coating on side electrode, the tin coating for covering all nickel coating is formed on nickel coating, and tin coating connects with the end face of insulating protective layer.Resistance integrality of the present invention, stability, thermal diffusivity are good, improve the firm welding of resistor, are conducive to the further promotion of Chip-R power.
Description
Technical field
The present invention relates to a kind of resistor and its manufacturing method, more particularly, to a kind of flexible LED lamp bar dedicated resistor and
Its manufacturing method.
Background technology
With advances in technology, the development in epoch and people appreciate the production of property to the diversification of demand of electronic product
Product need to be more and more, and wherein flexible LED lamp bar is exactly one kind therein, and this kind of product is added to the night scene in city dazzles beautiful color
It is color.Chip resister, also referred to as patch resistor, because steady with small, light-weight, adaptation Reflow Soldering and wave-soldering, electrical property
It is fixed, reliability is high, assembly cost is low and with automatic dress be sticked it is standby match, high mechanical strength and high frequency characteristics are superior the advantages that, obtain
To being widely applied, existing common low resistance patch resistor generally includes insulating substrate, backplate, secondary or positive three times
Electrode, resistive layer, the first protective layer, the second protective layer, character code, side electrode, nickel coating and tin coating etc., still, this production
Product cannot be satisfied the application in flexible LED lamp bar, this is because there is also following disadvantages in product design and manufacturing process:
First, the phenomenon that backplate is likely to occur not prison welding in the welding process.
Second, resistive layer is set on the front of insulating substrate, cannot be satisfied the need of flexible LED lamp bar heat dissipation and power ascension
It wants.
Second, conventional, electric-resistance manufacturing process is cumbersome, manufacturing cost can be caused to rise.
Invention content
In order to solve the above-mentioned technical problem, a kind of flexible LED lamp bar dedicated resistor of present invention proposition and its manufacturing method, should
The resistance accuracy of resistor is high as common chip resistor, and resistance integrality, stability, thermal diffusivity are good, improve electricity
The firm welding for hindering device, is conducive to the further promotion of Chip-R power.
The technical proposal of the invention is realized in this way:
A kind of flexible LED lamp bar dedicated resistor, including a rectangular block-like insulating substrate, the insulating substrate have front
And the back side, backplate, the back side electricity are symmetrically printed on the insulating substrate back side and along the both sides that X-direction extends
Pole includes the backplate two positioned at the backplate one at middle part and positioned at both sides, the backplate one and the back of the body
Gap is formed between two, face electrode;It is printed with resistive layer in the middle part of the insulating substrate back side, the resistive layer prolongs along Y direction
It stretches and is overlapped on the edge of the backplate, insulating protective layer is printed on the resistive layer;The insulating substrate upper edge X-axis
Sputtering has side electrode respectively on two side elevations that direction extends, and the side electrode extends to the insulating substrate back side to be taken
It is connected on the backplate edge, the side electrode extends to the insulating substrate front is being overlapped on the insulating substrate just
On the edge of face, as front electrode;One layer of nickel coating is formed on the side electrode, the nickel coating covers the insulation
The front electrode of substrate front side, the nickel coating extend over residence to the insulating substrate front and state front electrode, institute
It states nickel coating to be overlapped in the backplate to insulating substrate back side extension, is formed with and is completely covered on the nickel coating
The tin coating of nickel coating is stated in residence, and the tin coating connects with the end face of the insulating protective layer.
Further, it is printed with product identification between two parties on the insulating substrate front.
Further, the insulating substrate front is white, and the product identification is the character code of black height protrusion.
Further, the resistive layer is to be adjusted to the resistive layer of setting resistance value by laser.
Further, the resistive layer is overlapped on along Y direction extension on the edge of the backplate one.
Further, the insulating protective layer is overlapped on the backplate one and the back side along Y direction extension
On the edge that electrode is two.
A kind of manufacturing method of flexible LED lamp bar dedicated resistor, includes the following steps:
A, a sheet of insulating substrate is prepared, the insulating substrate has front and back, in the front of the insulating substrate
On the back side, folding bar line that several extend along X-direction is cut by radium-shine cutting mode respectively and is prolonged along Y direction
The folding grain line stretched, the folding bar line intersect vertical with the folding grain line, make dividing on the front and back for the insulating substrate
It is not formed with multiple rectangular grid;
B, on the insulating substrate back side corresponding to printing one layer respectively at the position of each folding bar line and prolong along X-direction
The first electrode material stretched is dried and forms backplate after being sintered, and each the corresponding backplate of rectangular grid includes
Backplate one positioned at middle part and the backplate two positioned at both sides, and each backplate is along the center of X-direction
Line coincides with its corresponding folding bar line respectively;
C, distinguish printed resistor R materials, resistance R in the center position of the rectangular grid in each of the insulating substrate back side
Material is overlapped on along Y direction extension on the edge of backplate one, and is dried and is sintered, and resistive layer is formed;
D, resistance value amendment is carried out to the resistive layer through treated the insulating substrate back sides step a~c using laser, is formed and is swashed
Light;
E, on through the resistive layer on treated the insulating substrate back sides step a~d, one layer of isolation protective material is printed,
And be dried, form insulating protective layer;
F, the product identification for identifying resistance value is stamped on through treated the insulating substrate fronts step a~e;
G, it will pass through step a~f along the folding bar line of the insulating substrate treated that insulating substrate is converted into multiple successively
Shape semi-finished product;Then the side for recycling vacuum sputtering machines to form each strip semi-finished product through folding bar sputters, shape
At side electrode, the side electrode extends to the insulating substrate back side to be overlapped on the backplate edge, the side
Face electrode extends to the insulating substrate front to be overlapped in the insulating substrate front edge, as front electrode;
H, it will pass through step a~g treated that strip semi-finished product are converted into successively is more along the folding grain line of the strip semi-finished product
A bulk semi-finished product;Then recycle barrel plating mode that will be plated on the backplate of each blocky semi-finished product and side electrode
Last layer metallic nickel forms nickel coating, and the nickel coating extends over residence to the insulating substrate front and states front electrode, institute
Nickel coating is stated to be overlapped in the backplate to insulating substrate back side extension,
I, one layer of metallic tin of plating is powered in the nickel plating layer surface using barrel plating mode, forms one layer of tin coating, and described
Tin coating covers all the nickel coating, and the tin coating connects with the end face of the insulating protective layer.
Further, the printing of printed resistor R materials in the mode of printing of first electrode material, step c is printed in step b
The mode of printing of f printings isolation protective material is all made of silk-screen printing in mode, step.
Further, the first electrode material described in step b is high-temperature resin slurry;Resistance R materials described in step c
Material is glass paste;Isolation protective material described in step e is resin slurry;Product identification material described in step f is
The paste resin bed of material.
The beneficial effects of the invention are as follows:
Compared with existing common patch resistor, the flexible LED lamp bar dedicated resistor manufactured by the present invention has following excellent
Point:1. by the symmetrical printed back electrode on the insulating substrate back side and along the both sides that X-direction extends, and to back side electricity
The figure of pole carries out special designing, that is, is designed to include the backplate one at middle part and the backplate two positioned at both sides,
Gap is formed between backplate one and backplate two, i.e., is overleaf formed between one, electrode and backplate two
Gas vent, the special designing are conducive to patch resistor and are preferably welded in welding, can solve backplate and welding
The phenomenon that not prison welding is likely to occur in journey;2. the resistive layer (portions R) of resistor is set on the back side of insulating substrate, it can
Heat dissipation path and radiating condition are significantly improved, the heat of resistance can be dispersed on pcb board rapidly by resistor, so that it is guaranteed that
The further promotion of patch resistor power;3. the process black product identification on the insulating substrate front of white, readily discernible.
4. resistive layer (portions R) material of resistor, is completed, it can be ensured that the stability of resistance value by cream product;5. using radium-shine mode pair
Resistance carries out resistance value amendment, it can be ensured that the precision of resistance value;Therefore, the flexible LED lamp bar dedicated resistor manufactured by the present invention
It can be widely used in the manufacture of various flexible LED lamp bars.
Description of the drawings
Fig. 1 is structural schematic diagram of the present invention through step a treated insulating substrates;
Fig. 2 is structural schematic diagram of the present invention through treated the insulating substrate back sides step b;
Fig. 3 is structural schematic diagram of the present invention through treated the insulating substrate back sides step c;
Fig. 4 is structural schematic diagram of the present invention through treated the insulating substrate back sides step d;
Fig. 5 is structural schematic diagram of the present invention through treated the insulating substrate back sides step e;
Fig. 6 is the present invention through step f treated positive structural schematic diagrams of insulating substrate;
Fig. 7 is structural schematic diagram of the present invention through treated the insulating substrate back sides step g;
Fig. 8 is structural schematic diagram of the present invention through treated the insulating substrate back sides step h;
Fig. 9 is structural schematic diagram of the present invention through treated the insulating substrate back sides step i;
Figure 10 is the cross-sectional view of flexible LED lamp bar dedicated resistor of the present invention.
In conjunction with attached drawing, make the following instructions:
1 --- insulating substrate 11 --- rolls over grain line
12 --- folding bar line 13 --- backplates
131 --- backplate one 132 --- backplates two
133 --- gap 14 --- resistive layers
15 --- laser rays 21 --- insulating protective layers
22 --- product identification 30 --- side electrodes
31 --- front electrode 32 --- nickel coatings
33 --- tin coating
Specific implementation mode
In order to be more clearly understood that the technology contents of the present invention, spy are lifted following embodiment and are described in detail, purpose is only
It is to be best understood from the protection domain that present disclosure is not intended to limit the present invention.
Such as Figure 10, a kind of flexible LED lamp bar dedicated resistor, including a rectangular block-like insulating substrate 1, the insulating substrate
With front and back, backplate is symmetrically printed on 1 back side of the insulating substrate and along the both sides that X-direction extends
13, the backplate 13 includes the backplate two 132 positioned at the backplate one 131 at middle part and positioned at both sides, institute
It states and forms gap 133 between backplate one 131 and the backplate two 132;Print in the middle part of the insulating substrate back side
Brushed with resistive layer 14, the resistive layer is overlapped on along Y direction extension on the edge of the backplate, is printed on the resistive layer
Brushed with insulating protective layer 21;Sputtering has side electrode respectively on two side elevations that the insulating substrate upper edge X-direction extends
30, the side electrode to the insulating substrate back side extend is overlapped on the backplate edge, the side electrode to
The insulating substrate front, which extends, to be overlapped in the insulating substrate front edge, as front electrode 31;The side electrode
On be formed with one layer of nickel coating 32, the nickel coating covers the positive front electrode of the insulating substrate, the nickel plating
Layer extends over residence to the insulating substrate front and states front electrode, and the nickel coating extends to the insulating substrate back side to be taken
It is connected in the backplate, the tin coating 33 for covering all the nickel coating is formed on the nickel coating 32, and described
Tin coating connects with the end face of the insulating protective layer.In this way, by the insulating substrate back side and along the two of X-direction extension
Symmetrical printed back electrode on side, and to the figure of the backplate carry out special designing, that is, be designed to include middle part the back side
One, electrode and backplate two positioned at both sides, form gap between backplate one and backplate two, that is, exist
Gas vent is formd between backplate one and backplate two, which is conducive to patch resistor in welding
Preferably welding, can solve the phenomenon that backplate is likely to occur not prison welding in the welding process;Preferably, it forms here
One backplate, one and two backplates two also can overleaf one, electrode and backplate in other embodiment
Backplate three is formed between two.It, can by the way that the resistive layer (portions R) of resistor to be set on the back side of insulating substrate
Heat dissipation path and radiating condition are significantly improved, the heat of resistance can be dispersed on pcb board rapidly by resistor, so that it is guaranteed that
The further promotion of patch resistor power.
Preferably, it is printed with product identification 22 between two parties on the insulating substrate front.In this way, being printed on insulating substrate front
Product identification, it is readily discernible.
Preferably, the insulating substrate front is white, and the product identification is the character code of black height protrusion.In this way,
The character code of process black height protrusion on the insulating substrate front of white, it is easier to recognize, resin slurry can be used in character code material.
Preferably, the resistive layer is to be adjusted to the resistive layer of setting resistance value by laser.In this way, using radium-shine side
Formula carries out resistance value amendment to resistance, it can be ensured that the precision of resistance value.
Preferably, the resistive layer is overlapped on along Y direction extension on the edge of the backplate one.
Preferably, the insulating protective layer is overlapped on the backplate one and back side electricity along Y direction extension
On the edge that pole is two.
A kind of manufacturing method of flexible LED lamp bar dedicated resistor, includes the following steps:
A, prepare a sheet of insulating substrate 1, the insulating substrate has front and back, the insulating substrate 1 just
On face and the back side, folding bar line 12 that several extend along X-direction is cut by radium-shine cutting mode respectively and along Y-axis side
To the folding grain line 11 of extension, the folding bar line intersects vertical with the folding grain line, makes front and the back of the body of the insulating substrate
Multiple rectangular grid are respectively formed on face;
B, on the insulating substrate back side corresponding to printing one layer respectively at the position of each folding bar line and prolong along X-direction
The first electrode material stretched forms backplate 13, each the corresponding backplate packet of rectangular grid after being dried and being sintered
The backplate two 132 positioned at the backplate one 131 at middle part and positioned at both sides is included, and each backplate is along X-axis side
To center line coincide respectively with its corresponding folding bar line;
C, distinguish printed resistor R materials, resistance R in the center position of the rectangular grid in each of the insulating substrate back side
Material is overlapped on along Y direction extension on the edge of backplate one, and is dried and is sintered, and resistive layer 14 is formed;
D, resistance value amendment is carried out to the resistive layer through treated the insulating substrate back sides step a~c using laser, is formed and is swashed
Light 15;
E, on through the resistive layer on treated the insulating substrate back sides step a~d, one layer of isolation protective material is printed,
And be dried, form insulating protective layer 21;
F, the product identification 22 for identifying resistance value is stamped on through treated the insulating substrate fronts step a~e;
G, it will pass through step a~f treated that insulating substrate is converted into successively is multiple along the folding bar line 12 of the insulating substrate
Strip semi-finished product;Then the side for recycling vacuum sputtering machines to form each strip semi-finished product through folding bar sputters,
Side electrode 30 is formed, the side electrode extends to the insulating substrate back side to be overlapped on the backplate edge, institute
It states side electrode to be overlapped in the insulating substrate front edge to insulating substrate front extension, as front electrode;
H, it will pass through step a~g treated that strip semi-finished product are converted into successively is more along the folding grain line of the strip semi-finished product
A bulk semi-finished product;Then recycle barrel plating mode that will be plated on the backplate of each blocky semi-finished product and side electrode
Last layer metallic nickel forms nickel coating 32, and the nickel coating extends over residence to the insulating substrate front and states front electrode,
The nickel coating extends to the insulating substrate back side to be overlapped in the backplate;
I, one layer of metallic tin of plating is powered in the nickel plating layer surface using barrel plating mode, forms one layer of tin coating 33, and institute
It states tin coating and covers all the nickel coating, and the tin coating connects with the end face of the insulating protective layer.
Preferably, the printing side of printed resistor R materials in the mode of printing of first electrode material, step c is printed in step b
The mode of printing of f printings isolation protective material is all made of silk-screen printing in formula, step.
Preferably, the first electrode material described in step b is high-temperature resin slurry;Resistance R materials described in step c
For glass paste;Isolation protective material described in step e is resin slurry;Product identification material described in step f is tree
Fat pulp layer.
To sum up, compared with existing common patch resistor, the flexible LED lamp bar dedicated resistor manufactured by the present invention has such as
Lower advantage:1. by the symmetrical printed back electrode on the insulating substrate back side and along the both sides that X-direction extends, and to the back of the body
The figure of face electrode carries out special designing, that is, is designed to include the backplate one at middle part and the backplate two positioned at both sides
Portion forms gap between backplate one and backplate two, which is conducive to the welding of patch resistor, can
Solve the phenomenon that backplate is likely to occur not prison welding in the welding process;2. the resistive layer (portions R) of resistor is set to
On the back side of insulating substrate, heat dissipation path and radiating condition can be significantly improved, resistor can be rapidly by the heat of resistance
It is dispersed on pcb board, so that it is guaranteed that the further promotion of patch resistor power;3. being printed on the insulating substrate front of white
Black product identifies, readily discernible.4. resistive layer (portions R) material of resistor, is completed by cream product, it can be ensured that resistance value it is steady
It is qualitative;5. carrying out resistance value amendment to resistance using radium-shine mode, it can be ensured that the precision of resistance value;Therefore, manufactured by the present invention
Flexible LED lamp bar dedicated resistor can be widely used in the manufacture of various flexible LED lamp bars.
Above example is with reference to attached drawing, to a preferred embodiment of the present invention will be described in detail.Those skilled in the art
Member by above-described embodiment carry out various forms on modification or change, but without departing substantially from the present invention essence in the case of, all
It falls within the scope and spirit of the invention.
Claims (7)
1. a kind of flexible LED lamp bar dedicated resistor, it is characterised in that:Including a rectangular block-like insulating substrate (1), the insulation
Substrate has front and back, and back side electricity is symmetrically printed on the insulating substrate back side and along the both sides that X-direction extends
Pole (13), the backplate include the backplate two positioned at the backplate one at middle part and positioned at both sides, the back of the body
Gap is formed between one, face electrode and the backplate two;It is printed with resistive layer in the middle part of the insulating substrate back side
(14), the resistive layer is overlapped on along Y direction extension on the edge of the backplate, and insulation is printed on the resistive layer
Protective layer (21);Sputtering has side electrode (30), institute respectively on two side elevations that the insulating substrate upper edge X-direction extends
State side electrode to the insulating substrate back side extend be overlapped on the backplate edge, the side electrode to it is described absolutely
The extension of edge substrate front side is overlapped in the insulating substrate front edge, as front electrode (31);Shape on the side electrode
Cheng Youyi layers of nickel coating (32), the nickel coating cover the positive front electrode of the insulating substrate, the nickel coating
Residence is extended over to the insulating substrate front and states front electrode, and the nickel coating extends to the insulating substrate back side to be overlapped
In the backplate, the tin coating (33) for covering all the nickel coating, and institute are formed on the nickel coating (32)
Tin coating is stated with the end face of the insulating protective layer to connect;Product identification (22) is printed on the insulating substrate front between two parties;
The resistive layer is to be adjusted to the resistive layer of setting resistance value by laser.
2. flexible LED lamp bar dedicated resistor according to claim 1, it is characterised in that:The insulating substrate front is white
Color, the product identification are the character code of black height protrusion.
3. flexible LED lamp bar dedicated resistor according to claim 1, it is characterised in that:The resistive layer prolongs along Y direction
It stretches and is overlapped on the edge of the backplate one.
4. flexible LED lamp bar dedicated resistor according to claim 1, it is characterised in that:The insulating protective layer is along Y-axis side
It is overlapped on to extension on the edge of the backplate one and the backplate two.
5. a kind of manufacturing method of flexible LED lamp bar dedicated resistor, it is characterised in that:Include the following steps:
A, prepare a sheet of insulating substrate (1), the insulating substrate has front and back, the insulating substrate (1) just
On face and the back side, folding bar line (12) that several extend along X-direction is cut by radium-shine cutting mode respectively and along Y-axis
The folding grain line (11) that direction extends, the folding bar line intersect vertical with the folding grain line, make the front of the insulating substrate
With multiple rectangular grid are respectively formed on the back side;
B, extend along X-direction corresponding to printing one layer respectively at the position of each folding bar line on the insulating substrate back side
First electrode material forms backplate (13) after being dried and being sintered, each the corresponding backplate of rectangular grid includes
Backplate one positioned at middle part and the backplate two positioned at both sides, and each backplate is along the center of X-direction
Line coincides with its corresponding folding bar line respectively;
C, distinguish printed resistor R materials, resistance R materials in the center position of the rectangular grid in each of the insulating substrate back side
It is overlapped on the edge of backplate one along Y direction extension, and is dried and is sintered, form resistive layer (14);
D, resistance value amendment is carried out to the resistive layer through treated the insulating substrate back sides step a~c using laser, forms laser rays
(15);
E, on through the resistive layer on treated the insulating substrate back sides step a~d, one layer of isolation protective material is printed, is gone forward side by side
Row drying forms insulating protective layer (21);
F, the product identification (22) for identifying resistance value is stamped on through treated the insulating substrate fronts step a~e;
G, it will pass through step a~f along the folding bar line (12) of the insulating substrate treated that insulating substrate is converted into multiple successively
Shape semi-finished product;Then the side for recycling vacuum sputtering machines to form each strip semi-finished product through folding bar sputters, shape
At side electrode (30), the side electrode extends to the insulating substrate back side to be overlapped on the backplate edge, institute
It states side electrode to be overlapped in the insulating substrate front edge to insulating substrate front extension, as front electrode;
H, it will pass through step a~g along the folding grain line of the strip semi-finished product treated that strip semi-finished product are converted into multiple pieces successively
Shape semi-finished product;Then recycle barrel plating mode that will plate one on the backplate of each blocky semi-finished product and side electrode
Layer metallic nickel, forms nickel coating (32), and the nickel coating extends over residence to the insulating substrate front and states front electrode, institute
Nickel coating is stated to be overlapped in the backplate to insulating substrate back side extension,
I, one layer of metallic tin of plating is powered in the nickel plating layer surface using barrel plating mode, forms one layer of tin coating (33), and described
Tin coating covers all the nickel coating, and the tin coating connects with the end face of the insulating protective layer.
6. the manufacturing method of flexible LED lamp bar dedicated resistor according to claim 5, it is characterised in that:It is printed in step b
E prints isolation protective material in the mode of printing of printed resistor R materials, step in the mode of printing of first electrode material, step c
Mode of printing be all made of silk-screen printing.
7. the manufacturing method of flexible LED lamp bar dedicated resistor according to claim 6, it is characterised in that:Described in step b
First electrode material be high-temperature resin slurry;Resistance R materials described in step c are glass paste;It is exhausted described in step e
Edge protection materials are resin slurry;Product identification material described in step f is the paste resin bed of material.
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108231371A (en) * | 2016-12-15 | 2018-06-29 | 昆山福仕电子材料工业有限公司 | Two-side film membrane inductor and preparation method thereof |
IL250305B (en) * | 2017-01-26 | 2021-02-28 | Vishay Israel Ltd | Electronic component with flexible terminal |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203071239U (en) * | 2013-01-15 | 2013-07-17 | 广东风华高新科技股份有限公司 | Connection structure of chip resistor and PCB |
CN204991310U (en) * | 2015-09-28 | 2016-01-20 | 丽智电子(昆山)有公司 | Soft lamp strip LED chip resistor |
CN205959705U (en) * | 2016-08-12 | 2017-02-15 | 昆山厚声电子工业有限公司 | Special resistor of soft lamp strip of LED |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3060597B2 (en) * | 1991-06-04 | 2000-07-10 | 松下電器産業株式会社 | Manufacturing method of chip type resistor series |
JP2001143903A (en) * | 1999-11-16 | 2001-05-25 | Matsushita Electric Ind Co Ltd | Resistor and its manufacturing method |
-
2016
- 2016-08-12 CN CN201610662318.5A patent/CN106098277B/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203071239U (en) * | 2013-01-15 | 2013-07-17 | 广东风华高新科技股份有限公司 | Connection structure of chip resistor and PCB |
CN204991310U (en) * | 2015-09-28 | 2016-01-20 | 丽智电子(昆山)有公司 | Soft lamp strip LED chip resistor |
CN205959705U (en) * | 2016-08-12 | 2017-02-15 | 昆山厚声电子工业有限公司 | Special resistor of soft lamp strip of LED |
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