CN110580991A - Resistance card - Google Patents
Resistance card Download PDFInfo
- Publication number
- CN110580991A CN110580991A CN201910945280.6A CN201910945280A CN110580991A CN 110580991 A CN110580991 A CN 110580991A CN 201910945280 A CN201910945280 A CN 201910945280A CN 110580991 A CN110580991 A CN 110580991A
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- CN
- China
- Prior art keywords
- conductor layer
- layer
- insulating substrate
- electrode
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 151
- 239000000758 substrate Substances 0.000 claims abstract description 78
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 20
- 229910052709 silver Inorganic materials 0.000 claims description 20
- 239000004332 silver Substances 0.000 claims description 20
- 230000001681 protective effect Effects 0.000 claims description 18
- 239000011521 glass Substances 0.000 claims description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 15
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 14
- 239000004593 Epoxy Substances 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 229910052763 palladium Inorganic materials 0.000 claims description 7
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 claims description 6
- 229910001925 ruthenium oxide Inorganic materials 0.000 claims description 6
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 claims description 6
- 229920003986 novolac Polymers 0.000 claims description 4
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 229910001020 Au alloy Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 3
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 3
- 229910001252 Pd alloy Inorganic materials 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 239000003353 gold alloy Substances 0.000 claims description 3
- DYIZHKNUQPHNJY-UHFFFAOYSA-N oxorhenium Chemical compound [Re]=O DYIZHKNUQPHNJY-UHFFFAOYSA-N 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 229910003449 rhenium oxide Inorganic materials 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 2
- 230000017525 heat dissipation Effects 0.000 abstract description 16
- 238000003466 welding Methods 0.000 abstract description 6
- 239000010410 layer Substances 0.000 description 182
- 238000009713 electroplating Methods 0.000 description 7
- 238000004891 communication Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- BBKFSSMUWOMYPI-UHFFFAOYSA-N gold palladium Chemical compound [Pd].[Au] BBKFSSMUWOMYPI-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 1
- 229910001950 potassium oxide Inorganic materials 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
- H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/24—Terminating devices
- H01P1/26—Dissipative terminations
Abstract
the invention discloses a resistor disc, and relates to the field of electronic components. The resistor disc comprises an insulating substrate; a first conductor layer and a second conductor layer are arranged on the front surface of the insulating substrate; a third conductor layer, a fourth conductor layer and a fifth conductor layer are arranged on the back surface of the insulating substrate; a sixth conductor layer and a seventh conductor layer are arranged on one end face of the insulating substrate at intervals; the first conductor layer is electrically connected with the third conductor layer through a sixth conductor layer, and the second conductor layer is electrically connected with the fourth conductor layer through a seventh conductor layer; an input electrode is arranged on the third conductor layer, an output electrode is arranged on the fourth conductor layer, and a heat conduction electrode is arranged on the fifth conductor layer; the front surface of the insulating substrate is provided with a resistance layer, the resistance layer is positioned between the first conductor layer and the second conductor layer, and two ends of the resistance layer are respectively electrically connected with the first conductor layer and the second conductor layer. The invention provides a resistor disc, and aims to solve the technical problems that the conventional resistor disc is uneven during welding and low in heat dissipation efficiency during work.
Description
Technical Field
The invention belongs to the technical field of electronic components, and particularly relates to a resistor disc.
Background
The resistor disc is a commonly used electronic component, and is widely applied to microwave communication systems and microwave circuits due to the advantages of light weight, small volume, high use frequency, easy integration with other microwave circuits and the like. The resistor disc is connected to the terminals of the components such as the filter, the antenna, the circulator, the power amplifier and the like in the microwave circuit, the resistor disc does not work when the components work normally, but when the microwave circuit is mismatched due to aging of the devices and the like, larger reflected power can be generated in the circuit to permanently damage the devices in the circuit, and the resistor disc has the function of absorbing the larger reflected power in the circuit, converting the reflected power into heat energy through the resistor film and dissipating the heat energy into air to provide a protection effect for the components.
The resistance chip in the prior art sets up conductor layer and resistance layer in insulating substrate's coplanar, and sets up the electrode on the conductor layer, therefore the resistance chip is when welding with the circuit board, because the difference in height of conductor layer and resistance layer, easily leads to welding the unevenness to lead to appearing the clearance between the binding face of resistance chip and circuit board, the heat energy that the resistance layer produced at this moment mainly dispels the heat through the mode of radiation heat dissipation, leads to the radiating efficiency low, can't satisfy the high demand of resistance chip radiating efficiency in microwave communication system and the microwave circuit.
Disclosure of Invention
the invention aims to provide a resistor disc, and aims to solve the technical problem that the existing resistor disc is low in heat dissipation efficiency during work.
In order to solve the above technical problem, the present invention provides a resistor sheet, including:
An insulating substrate;
A conductor layer, the conductor layer comprising: a first conductor layer and a second conductor layer disposed at an interval on the front surface of the insulating substrate; a third conductor layer, a fourth conductor layer and a fifth conductor layer which are arranged on the back surface of the insulating substrate at intervals; a sixth conductor layer and a seventh conductor layer provided at an interval on one end surface of the insulating substrate; the first conductor layer and the third conductor layer are electrically connected through the sixth conductor layer, and the second conductor layer and the fourth conductor layer are electrically connected through the seventh conductor layer; an input electrode is disposed on the third conductor layer, an output electrode is disposed on the fourth conductor layer, and a heat conducting electrode is disposed on the fifth conductor layer;
and the resistance layer is arranged on the front surface of the insulating substrate and is positioned between the first conductor layer and the second conductor layer, and two ends of the resistance layer are respectively electrically connected with the first conductor layer and the second conductor layer.
optionally, the resistor disc further includes a glass protection film layer, and the glass protection film layer is disposed on the resistor layer.
Optionally, the resistor disc further includes a black protection film layer, and the black protection film layer is disposed on the glass protection film layer, the first conductor layer, and the second conductor layer.
Optionally, the black protective film layer is made of at least one of a novolac epoxy layer, a bisphenol a epoxy layer, a urethane layer, and a polyimide layer.
Optionally, the input electrode, the output electrode, and the heat conductive electrode are made of any one of gold, silver, copper, palladium, aluminum, nickel, gold alloy, silver alloy, copper alloy, palladium alloy, aluminum alloy, and nickel alloy.
optionally, the resistive layer is any one of a ruthenium oxide layer, an iridium dioxide layer, and a rhenium oxide layer.
Alternatively, the first conductor layer, the second conductor layer, the third conductor layer, the fourth conductor layer, the fifth conductor layer, the sixth conductor layer, and the seventh conductor layer may be made of any one of silver, gold, and palladium.
Optionally, the insulating substrate is any one of a ceramic substrate, an insulating glass substrate, a diamond substrate, and a silicon carbide substrate.
The resistor disc provided by the invention has the beneficial effects that: compared with the prior art, the resistance chip of the invention arranges the resistance layer on the front surface of the insulating substrate, arranges the input electrode and the output electrode on the back surface of the insulating substrate, and arranges the heat-conducting electrode on the back surface of the insulating substrate, and keeps the input electrode, the output electrode and the heat-conducting electrode at the same height on the back surface of the insulating substrate, namely avoiding the height difference of the three on the back surface of the insulating substrate, thus, when the resistance chip is welded with the circuit board, the input electrode, the output electrode and the heat-conducting electrode on the back surface of the insulating substrate are attached to the attaching surface of the circuit board, avoiding the gap between the resistance chip and the attaching surface of the circuit board, facilitating the installation of the resistance chip, and simultaneously, realizing the circuit connection through the input electrode and the output electrode, welding with the heat-dissipating end of the circuit board through the heat-conducting electrode, the heat energy generated by the resistance layer is transferred, therefore, the heat dissipation efficiency of the resistor is improved, and the requirement of a microwave communication system and a microwave circuit for high heat dissipation efficiency of the resistor is met.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a schematic cross-sectional structure diagram of a resistor disc provided by the present invention;
FIG. 2 is a schematic structural diagram of a front surface of a resistor disc provided by the invention;
FIG. 3 is a schematic diagram of a back structure of a resistor disc provided by the present invention;
FIG. 4 is a schematic side view of a resistor disc provided by the present invention;
Fig. 5 is another schematic side view of the resistor sheet provided by the invention.
In the figure: 101-an insulating substrate; 102-a first conductor layer; 103-a second conductor layer; 104-a third conductor layer; 1041-an input electrode; 105-a fourth conductor layer; 1051-an output electrode; 106-a fifth conductor layer; 1061-thermally conductive electrode; 107-sixth conductor layer; 108-a seventh conductor layer; 109-a resistive layer; 110-a glass protective film layer; 120-black protective film layer.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship as shown in the drawings, which is used for convenience in describing and simplifying the description, and does not indicate or imply that the referenced device, element, or structure must have a particular orientation, be constructed and operated in a particular orientation, and thus is not to be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "communicating," and the like are to be construed broadly, e.g., as meaning both mechanically and electrically connected; the connection may be direct, indirect or internal, or may be a connection between two elements or an interaction relationship between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
The technical solutions in the embodiments of the present invention are clearly and completely described below with reference to the drawings of the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
in the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described and will be readily apparent to those of ordinary skill in the art without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
As shown in fig. 1 to 5, a resistive sheet according to an embodiment of the present invention includes: an insulating substrate 101; a first conductive layer 102 and a second conductive layer 103 provided at an interval on the front surface of the insulating substrate 101; a third conductor layer 104, a fourth conductor layer 105, and a fifth conductor layer 106 provided at intervals on the rear surface of the insulating substrate 101; a sixth conductor layer 107 and a seventh conductor layer 108 provided on one end surface of the insulating substrate 101 at an interval; the first conductor layer 102 and the third conductor layer 104 are electrically connected by the sixth conductor layer 107, and the second conductor layer 103 and the fourth conductor 105 are electrically connected by the seventh conductor layer 108; an input electrode 1041 is disposed on the third conductor layer 104, an output electrode 1051 is disposed on the fourth conductor layer 105, and a heat conductive electrode 1061 is disposed on the fifth conductor layer 106; and a resistive layer 109, wherein the resistive layer 109 is disposed on the front surface of the insulating substrate 101 and located between the first conductive layer 102 and the second conductive layer 103, and two ends of the resistive layer 109 are electrically connected to the first conductive layer 102 and the second conductive layer 103, respectively.
as described above, in the resistor sheet according to the embodiment of the present invention, the resistive layer 109 is disposed on the front surface of the insulating substrate 101, the input electrode 1041 and the output electrode 1051 are disposed on the back surface of the insulating substrate 101, and the heat conducting electrode 1061 is disposed on the back surface of the insulating substrate 101, and the input electrode 1041, the output electrode 1051 and the heat conducting electrode 1061 are kept at the same height on the back surface of the insulating substrate 101, that is, a height difference between the three on the back surface of the insulating substrate 101 is avoided, so that when the resistor sheet is soldered to a circuit board, the input electrode 1041, the output electrode 1051 and the heat conducting electrode 1061 on the back surface of the insulating substrate 101 are abutted against the bonding surface of the circuit board, a gap between the bonding surface of the resistor sheet and the circuit board is avoided, and the resistor sheet is convenient to mount, and at the same time, the input electrode 1041 and the output electrode 1051 are electrically connected to the circuit board, the heat energy generated by the resistor layer 109 is transferred to the heat dissipation end of the circuit board through the insulating substrate 101 and the heat conducting electrode 1061, so that the heat dissipation efficiency of the resistor sheet is improved, and thus, the requirement of high heat dissipation efficiency of the resistor sheet in a microwave communication system and a microwave circuit is met.
Preferably, the resistive layer 109 is provided with a glass protective film layer 110, and the glass protective film layer 110 may fill the gap between the resistive layers 109, so as to reduce the current jump of the resistive layer 109 during operation, thereby achieving the purpose of improving the power-bearing capacity of the resistive layer 109. Of course, according to practical situations and specific needs, in other embodiments of the present invention, the protective layer disposed on the resistive layer 109 may also be another high thermal conductive material that can fill the gap between the resistive layer 109, and is not limited herein.
Optionally, the glass protective film layer 110 is obtained by baking a glass glaze layer printed on the resistor layer 109, and the material components of the glass glaze layer include silicon dioxide, aluminum oxide, calcium oxide, magnesium oxide, barium oxide, sodium oxide, potassium oxide, and the like.
Preferably, the resistive sheet further includes a black protective film layer 120 disposed on the glass protective film layer 110, the first conductor layer 102, and the second conductor layer 103. The black protective film layer 120 is printed with resistance card product information, and the black protective film layer 120 may protect the first conductor layer 102, the second conductor layer 103, and the glass protective film layer 110 in an airtight manner, or may protect the first conductor layer 102, the second conductor layer 103, and the glass protective film layer 110 mechanically.
Optionally, the black protective film layer 120 is made of at least one of a novolac epoxy layer, a bisphenol a epoxy layer, a urethane layer, and a polyimide layer.
alternatively, the input electrode 1041, the output electrode 1051, and the heat conductive electrode 1061 may be made of any one of gold, silver, copper, palladium, aluminum, nickel, a gold alloy, a silver alloy, a copper alloy, a palladium alloy, an aluminum alloy, and a nickel alloy.
Optionally, the input electrode 1041, the output electrode 1051, and the heat conducting electrode 1061 may be prepared by electroplating deposition, physical vapor deposition, chemical vapor deposition, or the like.
In an application scenario, the input electrode 1041 is prepared by electroplating nickel and then electroplating silver on the third conductor layer 104, the output electrode 1051 is prepared by electroplating nickel and then electroplating silver on the fourth conductor layer 105, and the heat conductive electrode 1061 is prepared by electroplating nickel and then electroplating silver on the fifth conductor layer 106.
In an application scenario, the input electrode 1041 is disposed on the back surface of the insulating substrate 101, and the input electrode 1041 is electrically connected to a circuit signal input terminal by a welding method; the output electrode 1051 is disposed on the back surface of the insulating substrate 101, and the output electrode 1051 is electrically connected to a circuit signal output terminal by soldering; the heat conducting electrode 1061 is disposed on the back surface of the insulating substrate 101, and the heat conducting electrode 1061 is connected to the heat dissipating end of the circuit board by welding, and the input electrode 1041, the output electrode 1051 and the heat conducting electrode 1061 are kept at the same height on the back surface of the insulating substrate 101, i.e. a height difference between the three on the back surface of the insulating substrate 101 is avoided, so that, when the resistor disc is welded to the circuit board, the input electrode 1041, the output electrode 1051 and the heat conducting electrode 1061 on the back surface of the insulating substrate 101 are attached to the attaching surface of the circuit board, a gap between the resistor disc and the attaching surface of the circuit board is avoided, the resistor disc is convenient to mount, and meanwhile, the circuit connection is realized between the input electrode 1041 and the output electrode 1051 and the circuit board, the heat conducting electrode 1061 is welded to the heat dissipating end of the circuit board, the heat generated by the resistor layer 109 is transferred to the heat, thereby improving the heat dissipation efficiency of the resistor disc.
Alternatively, the material of the resistance layer 109 is any one of a ruthenium oxide layer, an iridium dioxide layer, and a rhenium oxide layer.
In one application scenario, the resistive layer 109 is prepared by a thick film process. In a specific embodiment, the resistance layer 109 is obtained by printing a ruthenium oxide material on the front surface of the insulating substrate 101 and then baking the printed ruthenium oxide material at a high temperature. When the resistive layer 109 operates, absorbed circuit reflected power is converted into heat energy, and the heat energy is transmitted to the heat dissipation end of the circuit board through the insulating substrate 101 and the heat conductive electrode 1061.
Alternatively, the first conductor layer 102, the second conductor layer 103, the third conductor layer 104, the fourth conductor layer 105, the fifth conductor layer 106, the sixth conductor layer 107, and the seventh conductor layer 108 may be made of any one of silver and gold palladium.
In one application scenario, the first conductor layer 102, the second conductor layer 103, the third conductor layer 104, the fourth conductor layer 105, the fifth conductor layer 106, the sixth conductor layer 107, and the seventh conductor layer 108 are prepared by a thick film process. In a specific embodiment, silver paste is printed on the front surface of the insulating substrate 101 at intervals, and the silver paste printed on the front surface of the insulating substrate 101 is baked to obtain the first conductor layer 102 and the second conductor layer 103 which are arranged at intervals; then, silver paste is printed on the back surface of the insulating substrate 101 at intervals, and the silver paste printed on the back surface of the insulating substrate 101 is baked to obtain the third conductor layer 104, the fourth conductor layer 105 and the fifth conductor layer 106 which are arranged at intervals; then, silver paste is printed on one end surface of the insulating substrate 101 at intervals, and the silver paste printed on one end surface of the insulating substrate 101 is baked to obtain the sixth conductor layer 107 and the seventh conductor layer 108; the first conductive layer 102 and the third conductive layer 104 are electrically connected through the sixth conductive layer 107, the second conductive layer 103 and the fourth conductive layer 105 are electrically connected through the seventh conductive layer 108, the resistive layer 109 is located between the first conductive layer 102 and the second conductive layer 103, and two ends of the resistive layer 109 are electrically connected to the first conductive layer 102 and the second conductive layer 103, respectively, thereby forming a load loop.
The silver paste may be one of gold paste and palladium paste, or a combination of silver paste, gold paste and palladium paste, which is not limited herein.
Alternatively, the insulating substrate 101 may be any one of a ceramic substrate, an insulating glass substrate, a diamond substrate, and a silicon carbide substrate.
As can be seen from the foregoing solution, in the resistor sheet provided in the embodiment of the present invention, the resistor layer 109 is disposed on the front surface of the insulating substrate 101, the input electrode 1041 and the output electrode 1051 are disposed on the back surface of the insulating substrate 101, and the heat conducting electrode 1061 is disposed on the back surface of the insulating substrate 101, and the input electrode 1041, the output electrode 1051 and the heat conducting electrode 1061 are kept at the same height on the back surface of the insulating substrate 101, that is, a height difference between the three on the back surface of the insulating substrate 101 is avoided, so that when the resistor sheet is soldered to a circuit board, the input electrode 1041, the output electrode 1051 and the heat conducting electrode 1061 on the back surface of the insulating substrate 101 are abutted against the bonding surface of the circuit board, a gap between the bonding surface of the resistor sheet and the circuit board is avoided, and the sheet is convenient to mount, meanwhile, the input electrode 1041 and the output electrode 1051 are electrically connected to the circuit board, the heat energy generated by the resistor layer 109 is transferred to the heat dissipation end of the circuit board through the insulating substrate 101 and the heat conducting electrode 1061, so that the heat dissipation efficiency of the resistor sheet is improved, and thus, the requirement of high heat dissipation efficiency of the resistor sheet in a microwave communication system and a microwave circuit is met.
The following describes a specific application scenario of the resistor sheet provided by the present invention, and the resistor sheet includes the structure of the resistor sheet. The following description will be made of the application of the resistive sheet by taking the embodiments shown in fig. 1 to 5 as examples:
In the embodiment of the present invention, the resistor sheet includes a beryllium oxide BeO substrate with a size of 1.52mm 1.78mm 0.4mm, the black protective film layer 120 is novolac epoxy, the materials of the input electrode 1041, the output electrode 1051 and the heat conducting electrode 1061 are electroplated nickel + silver Ni + Ag, the resistive layer 109 is ruthenium oxide, the materials of the first conductor layer 102, the second conductor layer 103, the third conductor layer 104, the fourth conductor layer 105, the fifth conductor layer 106, the sixth conductor layer 107 and the seventh conductor layer 108 are silver, and the first conductor layer 102, the second conductor layer 103, the third conductor layer 104, the fourth conductor layer 105, the fifth conductor layer 106, the sixth conductor layer 107 and the seventh conductor layer 108 are specifically obtained by baking printed silver paste.
In the embodiment of the invention, the absorbed power of the resistance card can reach 10 watts, which is far higher than the absorbed power of the existing resistance card by 0.5 watt. In the resistor sheet provided by the embodiment of the present invention, the resistor layer 109 is disposed on the front surface of the insulating substrate 101, the input electrode 1041 and the output electrode 1051 are disposed on the back surface of the insulating substrate 101, and the heat conducting electrode 1061 is disposed on the back surface of the insulating substrate 101, and the input electrode 1041, the output electrode 1051 and the heat conducting electrode 1061 are kept at the same height on the back surface of the insulating substrate 101, i.e. a height difference between the three on the back surface of the insulating substrate 101 is avoided, so that when the resistor sheet is soldered to a circuit board, the input electrode 1041, the output electrode 1051 and the heat conducting electrode 1061 on the back surface of the insulating substrate 101 are abutted to the bonding surface of the circuit board, a gap between the resistor sheet and the bonding surface of the circuit board is avoided, and the resistor sheet is convenient to mount, meanwhile, the circuit connection is realized with the circuit board through the input electrode 1041 and the output electrode 1051, the heat conducting electrode 1061 is soldered to the heat dissipation end of the circuit board, therefore, the heat dissipation efficiency of the resistor is improved, and the requirement of a microwave communication system and a microwave circuit for high heat dissipation efficiency of the resistor is met.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and reference may be made to the related descriptions of other embodiments for parts that are not described or illustrated in a certain embodiment.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art; the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the embodiments of the present invention, and they should be construed as being included therein.
Claims (8)
1. A resistive sheet, comprising:
An insulating substrate;
A conductor layer, the conductor layer comprising: the first conductor layer and the second conductor layer are arranged on the front surface of the insulating substrate at intervals; the third conductor layer, the fourth conductor layer and the fifth conductor layer are arranged on the back surface of the insulating substrate at intervals; the sixth conductor layer and the seventh conductor layer are arranged on one end face of the insulating substrate at intervals; the first conductor layer and the third conductor layer are electrically connected through the sixth conductor layer, and the second conductor layer and the fourth conductor layer are electrically connected through the seventh conductor layer; an input electrode is arranged on the third conductor layer, an output electrode is arranged on the fourth conductor layer, and a heat conduction electrode is arranged on the fifth conductor layer;
the resistance layer is arranged on the front face of the insulating substrate and located between the first conductor layer and the second conductor layer, and two ends of the resistance layer are electrically connected with the first conductor layer and the second conductor layer respectively.
2. The resistive sheet of claim 1, further comprising a glass protective film layer disposed on the resistive layer.
3. the resistive sheet of claim 2, further comprising a black protective film layer disposed on the glass protective film layer, on the first conductor layer, and on the second conductor layer.
4. The resistance card of claim 3, wherein the black protective film layer is at least one of a novolac epoxy layer, a bisphenol A epoxy layer, a urethane layer and a polyimide layer.
5. The resistive sheet of claim 4, wherein the input electrode, the output electrode, and the thermally conductive electrode are made of any one of gold, silver, copper, palladium, aluminum, nickel, a gold alloy, a silver alloy, a copper alloy, a palladium alloy, an aluminum alloy, and a nickel alloy.
6. A resistive sheet according to claim 5, wherein the resistive layer is any one of a ruthenium oxide layer, an iridium dioxide layer and a rhenium oxide layer.
7. The resistor sheet according to claim 6, wherein the first conductor layer, the second conductor layer, the third conductor layer, the fourth conductor layer, the fifth conductor layer, the sixth conductor layer and the seventh conductor layer are made of any one of silver, gold and palladium.
8. the resistor sheet according to claim 7, wherein the insulating substrate is any one of a ceramic substrate, an insulating glass substrate, a diamond substrate, and a silicon carbide substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910945280.6A CN110580991A (en) | 2019-09-30 | 2019-09-30 | Resistance card |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910945280.6A CN110580991A (en) | 2019-09-30 | 2019-09-30 | Resistance card |
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| CN110580991A true CN110580991A (en) | 2019-12-17 |
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Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2280339Y (en) * | 1996-11-25 | 1998-04-29 | 乾坤科技股份有限公司 | Microminiaturization, integration and printing type chip resistor |
| JPH1116701A (en) * | 1997-06-23 | 1999-01-22 | Matsushita Electric Ind Co Ltd | Multiple chip resistor |
| TW556958U (en) * | 2002-08-20 | 2003-10-01 | Jeng-Shi Juang | Chip-type high-precision low-impedance device structure |
| CN101026028A (en) * | 2006-02-24 | 2007-08-29 | Koa株式会社 | Electronic device equipped with resistance component and its making method |
| JP2008235523A (en) * | 2007-03-20 | 2008-10-02 | Koa Corp | Electronic component including resistive element |
| US20140240083A1 (en) * | 2013-02-26 | 2014-08-28 | Rohm Co., Ltd. | Chip resistor and method for making the same |
| CN105304241A (en) * | 2014-06-20 | 2016-02-03 | 昆山厚声电子工业有限公司 | Thick-film patch resistor with high power and low resistance value and manufacturing method of thick-film patch resistor |
| CN105355349A (en) * | 2015-11-12 | 2016-02-24 | 广东风华高新科技股份有限公司 | Film resistor and preparation method thereof |
| CN106098277A (en) * | 2016-08-12 | 2016-11-09 | 昆山厚声电子工业有限公司 | Flexible LED lamp bar dedicated resistor and manufacture method thereof |
| CN107230537A (en) * | 2016-03-25 | 2017-10-03 | 昆山厚声电子工业有限公司 | Metal foil chip current sensing resistor and its manufacture craft |
| CN207124084U (en) * | 2017-06-14 | 2018-03-20 | 昆山厚声电子工业有限公司 | Thick film high pressure patch resistor |
| CN109346255A (en) * | 2018-11-29 | 2019-02-15 | 昆山厚声电子工业有限公司 | A kind of low resistivity value resistor and its manufacture craft |
| CN210271948U (en) * | 2019-09-30 | 2020-04-07 | 深圳市禹龙通电子有限公司 | Resistance card |
-
2019
- 2019-09-30 CN CN201910945280.6A patent/CN110580991A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2280339Y (en) * | 1996-11-25 | 1998-04-29 | 乾坤科技股份有限公司 | Microminiaturization, integration and printing type chip resistor |
| JPH1116701A (en) * | 1997-06-23 | 1999-01-22 | Matsushita Electric Ind Co Ltd | Multiple chip resistor |
| TW556958U (en) * | 2002-08-20 | 2003-10-01 | Jeng-Shi Juang | Chip-type high-precision low-impedance device structure |
| CN101026028A (en) * | 2006-02-24 | 2007-08-29 | Koa株式会社 | Electronic device equipped with resistance component and its making method |
| JP2008235523A (en) * | 2007-03-20 | 2008-10-02 | Koa Corp | Electronic component including resistive element |
| US20140240083A1 (en) * | 2013-02-26 | 2014-08-28 | Rohm Co., Ltd. | Chip resistor and method for making the same |
| CN105304241A (en) * | 2014-06-20 | 2016-02-03 | 昆山厚声电子工业有限公司 | Thick-film patch resistor with high power and low resistance value and manufacturing method of thick-film patch resistor |
| CN105355349A (en) * | 2015-11-12 | 2016-02-24 | 广东风华高新科技股份有限公司 | Film resistor and preparation method thereof |
| CN107230537A (en) * | 2016-03-25 | 2017-10-03 | 昆山厚声电子工业有限公司 | Metal foil chip current sensing resistor and its manufacture craft |
| CN106098277A (en) * | 2016-08-12 | 2016-11-09 | 昆山厚声电子工业有限公司 | Flexible LED lamp bar dedicated resistor and manufacture method thereof |
| CN207124084U (en) * | 2017-06-14 | 2018-03-20 | 昆山厚声电子工业有限公司 | Thick film high pressure patch resistor |
| CN109346255A (en) * | 2018-11-29 | 2019-02-15 | 昆山厚声电子工业有限公司 | A kind of low resistivity value resistor and its manufacture craft |
| CN210271948U (en) * | 2019-09-30 | 2020-04-07 | 深圳市禹龙通电子有限公司 | Resistance card |
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Address after: 518000 third and fourth floor, building D, Chiwan Industrial Park, No. 1, Shaodi Road, Chiwan, Shekou, Nanshan District, Shenzhen, Guangdong Province Applicant after: Shenzhen yulongtong Electronic Co., Ltd Address before: 518000 third and fourth floor, building D, Chiwan Industrial Park, No. 1, Shaodi Road, Chiwan, Shekou, Nanshan District, Shenzhen, Guangdong Province Applicant before: SHENZHEN YULONGTONG ELECTRON Co.,Ltd. |