CN210271948U - Resistance card - Google Patents
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- CN210271948U CN210271948U CN201921689900.6U CN201921689900U CN210271948U CN 210271948 U CN210271948 U CN 210271948U CN 201921689900 U CN201921689900 U CN 201921689900U CN 210271948 U CN210271948 U CN 210271948U
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Abstract
The utility model discloses a resistance card relates to the electronic components field. The resistor disc comprises an insulating substrate; a first conductor layer and a second conductor layer are arranged on the front surface of the insulating substrate; a third conductor layer, a fourth conductor layer and a fifth conductor layer are arranged on the back surface of the insulating substrate; a sixth conductor layer and a seventh conductor layer are arranged on one end face of the insulating substrate at intervals; the first conductor layer is electrically connected with the third conductor layer through a sixth conductor layer, and the second conductor layer is electrically connected with the fourth conductor layer through a seventh conductor layer; an input electrode is arranged on the third conductor layer, an output electrode is arranged on the fourth conductor layer, and a heat conduction electrode is arranged on the fifth conductor layer; the front surface of the insulating substrate is provided with a resistance layer, the resistance layer is positioned between the first conductor layer and the second conductor layer, and two ends of the resistance layer are respectively electrically connected with the first conductor layer and the second conductor layer. The utility model provides a resistance card aims at solving current resistance card unevenness when the welding and at the technical problem that the during operation radiating efficiency is low.
Description
Technical Field
The utility model belongs to the technical field of electronic components, especially, relate to a resistance card.
Background
The resistor disc is a commonly used electronic component, and is widely applied to microwave communication systems and microwave circuits due to the advantages of light weight, small volume, high use frequency, easy integration with other microwave circuits and the like. The resistor disc is connected to the terminals of the components such as the filter, the antenna, the circulator, the power amplifier and the like in the microwave circuit, the resistor disc does not work when the components work normally, but when the microwave circuit is mismatched due to aging of the devices and the like, larger reflected power can be generated in the circuit to permanently damage the devices in the circuit, and the resistor disc has the function of absorbing the larger reflected power in the circuit, converting the reflected power into heat energy through the resistor film and dissipating the heat energy into air to provide a protection effect for the components.
The resistance chip in the prior art sets up conductor layer and resistance layer in insulating substrate's coplanar, and sets up the electrode on the conductor layer, therefore the resistance chip is when welding with the circuit board, because the difference in height of conductor layer and resistance layer, easily leads to welding the unevenness to lead to appearing the clearance between the binding face of resistance chip and circuit board, the heat energy that the resistance layer produced at this moment mainly dispels the heat through the mode of radiation heat dissipation, leads to the radiating efficiency low, can't satisfy the high demand of resistance chip radiating efficiency in microwave communication system and the microwave circuit.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a resistance card aims at solving current resistance card at the technical problem that the during operation radiating efficiency is low.
In order to solve the technical problem, the utility model provides a resistance card, include:
an insulating substrate;
a conductor layer, the conductor layer comprising: a first conductor layer and a second conductor layer disposed at an interval on the front surface of the insulating substrate; a third conductor layer, a fourth conductor layer and a fifth conductor layer which are arranged on the back surface of the insulating substrate at intervals; a sixth conductor layer and a seventh conductor layer provided at an interval on one end surface of the insulating substrate; the first conductor layer and the third conductor layer are electrically connected through the sixth conductor layer, and the second conductor layer and the fourth conductor layer are electrically connected through the seventh conductor layer; an input electrode is disposed on the third conductor layer, an output electrode is disposed on the fourth conductor layer, and a heat conducting electrode is disposed on the fifth conductor layer;
and the resistance layer is arranged on the front surface of the insulating substrate and is positioned between the first conductor layer and the second conductor layer, and two ends of the resistance layer are respectively electrically connected with the first conductor layer and the second conductor layer.
Optionally, the resistor disc further includes a glass protection film layer, and the glass protection film layer is disposed on the resistor layer.
Optionally, the resistor disc further includes a black protection film layer, and the black protection film layer is disposed on the glass protection film layer, the first conductor layer, and the second conductor layer.
Optionally, the black protective film layer is made of at least one of a novolac epoxy layer, a bisphenol a epoxy layer, a urethane layer, and a polyimide layer.
Optionally, the input electrode, the output electrode, and the heat conductive electrode are made of any one of gold, silver, copper, palladium, aluminum, nickel, gold alloy, silver alloy, copper alloy, palladium alloy, aluminum alloy, and nickel alloy.
Optionally, the resistive layer is any one of a ruthenium oxide layer, an iridium dioxide layer, and a rhenium oxide layer.
Alternatively, the first conductor layer, the second conductor layer, the third conductor layer, the fourth conductor layer, the fifth conductor layer, the sixth conductor layer, and the seventh conductor layer may be made of any one of silver, gold, and palladium.
Optionally, the insulating substrate is any one of a ceramic substrate, an insulating glass substrate, a diamond substrate, and a silicon carbide substrate.
The utility model provides a resistance card's beneficial effect lies in: compared with the prior art, the resistance chip of the utility model arranges the resistance layer on the front of the insulating substrate, arranges the input electrode and the output electrode on the back of the insulating substrate, and arranges the heat conducting electrode on the back of the insulating substrate, and keeps the input electrode, the output electrode and the heat conducting electrode at the same height on the back of the insulating substrate, namely, avoids the height difference generated by the three on the back of the insulating substrate, thus, when the resistance chip is welded with the circuit board, the input electrode, the output electrode and the heat conducting electrode on the back of the insulating substrate are attached to the attaching surface of the circuit board, avoiding the gap between the resistance chip and the attaching surface of the circuit board, facilitating the installation of the resistance chip, meanwhile, realizing circuit connection with the circuit board through the input electrode and the output electrode, welding with the heat radiating end of the circuit board through the heat conducting electrode, the heat energy generated by the resistance layer is transmitted to the heat radiating end of the, therefore, the heat dissipation efficiency of the resistor is improved, and the requirement of a microwave communication system and a microwave circuit for high heat dissipation efficiency of the resistor is met.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.
Fig. 1 is a schematic cross-sectional structure diagram of a resistor disc provided by the present invention;
fig. 2 is a schematic structural diagram of a front surface of a resistor disc provided by the present invention;
fig. 3 is a schematic back structure diagram of a resistor disc provided by the present invention;
fig. 4 is a schematic side view of a resistor disc provided by the present invention;
fig. 5 is another side structure schematic diagram of the resistance chip provided by the present invention.
In the figure: 101-an insulating substrate; 102-a first conductor layer; 103-a second conductor layer; 104-a third conductor layer; 1041-an input electrode; 105-a fourth conductor layer; 1051-an output electrode; 106-a fifth conductor layer; 1061-thermally conductive electrode; 107-sixth conductor layer; 108-a seventh conductor layer; 109-a resistive layer; 110-a glass protective film layer; 120-black protective film layer.
Detailed Description
Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The following embodiments with reference to the drawings are illustrative and intended to explain the present invention, and should not be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present invention and to simplify the description, but are not intended to indicate or imply that the device, element, or structure so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "communicating" are to be construed broadly, e.g., as meaning mechanically or electrically connected; the connection may be direct, indirect or internal, or may be a connection between two elements or an interaction relationship between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
The technical solutions in the embodiments of the present invention are clearly and completely described below with reference to the drawings of the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be embodied in other specific forms other than those described herein, and it will be apparent to those skilled in the art that the present invention may be practiced without departing from the spirit and scope of the invention.
As described in fig. 1 to fig. 5, the embodiment of the present invention provides a resistor disc including: an insulating substrate 101; a first conductive layer 102 and a second conductive layer 103 provided at an interval on the front surface of the insulating substrate 101; a third conductor layer 104, a fourth conductor layer 105, and a fifth conductor layer 106 provided at intervals on the rear surface of the insulating substrate 101; a sixth conductor layer 107 and a seventh conductor layer 108 provided on one end surface of the insulating substrate 101 at an interval; the first conductor layer 102 and the third conductor layer 104 are electrically connected by the sixth conductor layer 107, and the second conductor layer 103 and the fourth conductor 105 are electrically connected by the seventh conductor layer 108; an input electrode 1041 is disposed on the third conductor layer 104, an output electrode 1051 is disposed on the fourth conductor layer 105, and a heat conductive electrode 1061 is disposed on the fifth conductor layer 106; and a resistive layer 109, wherein the resistive layer 109 is disposed on the front surface of the insulating substrate 101 and located between the first conductive layer 102 and the second conductive layer 103, and two ends of the resistive layer 109 are electrically connected to the first conductive layer 102 and the second conductive layer 103, respectively.
As described above, in the resistor sheet according to the embodiment of the present invention, the resistor layer 109 is disposed on the front surface of the insulating substrate 101, the input electrode 1041 and the output electrode 1051 are disposed on the back surface of the insulating substrate 101, and the heat conducting electrode 1061 is disposed on the back surface of the insulating substrate 101, and the input electrode 1041, the output electrode 1051 and the heat conducting electrode 1061 are kept at the same height on the back surface of the insulating substrate 101, that is, a height difference between the three on the back surface of the insulating substrate 101 is avoided, so that when the resistor sheet is welded to the circuit board, the input electrode 1041, the output electrode 1051 and the heat conducting electrode 1061 on the back surface of the insulating substrate 101 are abutted against the joint surface of the circuit board, thereby avoiding a gap between the joint surface of the resistor sheet and the circuit board, facilitating the mounting of the resistor sheet, and simultaneously, the circuit connection is realized between the input electrode 1041 and the output electrode 1051, and the heat dissipation end, the heat energy generated by the resistor layer 109 is transferred to the heat dissipation end of the circuit board through the insulating substrate 101 and the heat conducting electrode 1061, so that the heat dissipation efficiency of the resistor sheet is improved, and thus, the requirement of high heat dissipation efficiency of the resistor sheet in a microwave communication system and a microwave circuit is met.
Preferably, the resistive layer 109 is provided with a glass protective film layer 110, and the glass protective film layer 110 may fill the gap between the resistive layers 109, so as to reduce the current jump of the resistive layer 109 during operation, thereby achieving the purpose of improving the power-bearing capacity of the resistive layer 109. Of course, according to practical situations and specific requirements, in other embodiments of the present invention, the protective layer disposed on the resistive layer 109 may also be another high thermal conductive material that can fill the gap between the resistive layer 109, and is not limited herein.
Optionally, the glass protective film layer 110 is obtained by baking a glass glaze layer printed on the resistor layer 109, and the material components of the glass glaze layer include silicon dioxide, aluminum oxide, calcium oxide, magnesium oxide, barium oxide, sodium oxide, potassium oxide, and the like.
Preferably, the resistive sheet further includes a black protective film layer 120 disposed on the glass protective film layer 110, the first conductor layer 102, and the second conductor layer 103. The black protective film layer 120 is printed with resistance card product information, and the black protective film layer 120 may protect the first conductor layer 102, the second conductor layer 103, and the glass protective film layer 110 in an airtight manner, or may protect the first conductor layer 102, the second conductor layer 103, and the glass protective film layer 110 mechanically.
Optionally, the black protective film layer 120 is made of at least one of a novolac epoxy layer, a bisphenol a epoxy layer, a urethane layer, and a polyimide layer.
Alternatively, the input electrode 1041, the output electrode 1051, and the heat conductive electrode 1061 may be made of any one of gold, silver, copper, palladium, aluminum, nickel, a gold alloy, a silver alloy, a copper alloy, a palladium alloy, an aluminum alloy, and a nickel alloy.
Optionally, the input electrode 1041, the output electrode 1051, and the heat conducting electrode 1061 may be prepared by electroplating deposition, physical vapor deposition, chemical vapor deposition, or the like.
In an application scenario, the input electrode 1041 is prepared by electroplating nickel and then electroplating silver on the third conductor layer 104, the output electrode 1051 is prepared by electroplating nickel and then electroplating silver on the fourth conductor layer 105, and the heat conductive electrode 1061 is prepared by electroplating nickel and then electroplating silver on the fifth conductor layer 106.
In an application scenario, the input electrode 1041 is disposed on the back surface of the insulating substrate 101, and the input electrode 1041 is electrically connected to a circuit signal input terminal by a welding method; the output electrode 1051 is disposed on the back surface of the insulating substrate 101, and the output electrode 1051 is electrically connected to a circuit signal output terminal by soldering; the heat conducting electrode 1061 is disposed on the back surface of the insulating substrate 101, and the heat conducting electrode 1061 is connected to the heat dissipating end of the circuit board by welding, and the input electrode 1041, the output electrode 1051 and the heat conducting electrode 1061 are kept at the same height on the back surface of the insulating substrate 101, i.e. a height difference between the three on the back surface of the insulating substrate 101 is avoided, so that, when the resistor disc is welded to the circuit board, the input electrode 1041, the output electrode 1051 and the heat conducting electrode 1061 on the back surface of the insulating substrate 101 are attached to the attaching surface of the circuit board, a gap between the resistor disc and the attaching surface of the circuit board is avoided, the resistor disc is convenient to mount, and meanwhile, the circuit connection is realized between the input electrode 1041 and the output electrode 1051 and the circuit board, the heat conducting electrode 1061 is welded to the heat dissipating end of the circuit board, the heat generated by the resistor layer 109 is transferred to the heat, thereby improving the heat dissipation efficiency of the resistor disc.
Alternatively, the material of the resistance layer 109 is any one of a ruthenium oxide layer, an iridium dioxide layer, and a rhenium oxide layer.
In one application scenario, the resistive layer 109 is prepared by a thick film process. In a specific embodiment, the resistance layer 109 is obtained by printing a ruthenium oxide material on the front surface of the insulating substrate 101 and then baking the printed ruthenium oxide material at a high temperature. When the resistive layer 109 operates, absorbed circuit reflected power is converted into heat energy, and the heat energy is transmitted to the heat dissipation end of the circuit board through the insulating substrate 101 and the heat conductive electrode 1061.
Alternatively, the first conductor layer 102, the second conductor layer 103, the third conductor layer 104, the fourth conductor layer 105, the fifth conductor layer 106, the sixth conductor layer 107, and the seventh conductor layer 108 may be made of any one of silver and gold palladium.
In one application scenario, the first conductor layer 102, the second conductor layer 103, the third conductor layer 104, the fourth conductor layer 105, the fifth conductor layer 106, the sixth conductor layer 107, and the seventh conductor layer 108 are prepared by a thick film process. In a specific embodiment, silver paste is printed on the front surface of the insulating substrate 101 at intervals, and the silver paste printed on the front surface of the insulating substrate 101 is baked to obtain the first conductor layer 102 and the second conductor layer 103 which are arranged at intervals; then, silver paste is printed on the back surface of the insulating substrate 101 at intervals, and the silver paste printed on the back surface of the insulating substrate 101 is baked to obtain the third conductor layer 104, the fourth conductor layer 105 and the fifth conductor layer 106 which are arranged at intervals; then, silver paste is printed on one end surface of the insulating substrate 101 at intervals, and the silver paste printed on one end surface of the insulating substrate 101 is baked to obtain the sixth conductor layer 107 and the seventh conductor layer 108; the first conductive layer 102 and the third conductive layer 104 are electrically connected through the sixth conductive layer 107, the second conductive layer 103 and the fourth conductive layer 105 are electrically connected through the seventh conductive layer 108, the resistive layer 109 is located between the first conductive layer 102 and the second conductive layer 103, and two ends of the resistive layer 109 are electrically connected to the first conductive layer 102 and the second conductive layer 103, respectively, thereby forming a load loop.
The silver paste may be one of gold paste and palladium paste, or a combination of silver paste, gold paste and palladium paste, which is not limited herein.
Alternatively, the insulating substrate 101 may be any one of a ceramic substrate, an insulating glass substrate, a diamond substrate, and a silicon carbide substrate.
As can be seen from the foregoing solution, in the resistor disc provided in the embodiment of the present invention, the resistor layer 109 is disposed on the front surface of the insulating substrate 101, the input electrode 1041 and the output electrode 1051 are disposed on the back surface of the insulating substrate 101, and the heat conducting electrode 1061 is disposed on the back surface of the insulating substrate 101, and the input electrode 1041, the output electrode 1051, and the heat conducting electrode 1061 are kept at the same height on the back surface of the insulating substrate 101, that is, a height difference between the three on the back surface of the insulating substrate 101 is avoided, so that, when the resistor disc is welded to the circuit board, the input electrode 1041, the output electrode 1051, and the heat conducting electrode 1061 on the back surface of the insulating substrate 101 are attached to the attaching surface of the circuit board, thereby avoiding a gap between the attaching surfaces of the resistor disc and the circuit board, facilitating the mounting of the disc, and simultaneously, the resistor disc is electrically connected to the circuit board through the input electrode 1041 and, the heat energy generated by the resistor layer 109 is transferred to the heat dissipation end of the circuit board through the insulating substrate 101 and the heat conducting electrode 1061, so that the heat dissipation efficiency of the resistor sheet is improved, and thus, the requirement of high heat dissipation efficiency of the resistor sheet in a microwave communication system and a microwave circuit is met.
The utility model provides a resistance card is explained with a concrete application scene below, and this resistance card contains the structure of above-mentioned resistance card. The following description will be made of the application of the resistive sheet by taking the embodiments shown in fig. 1 to 5 as examples:
the embodiment of the present invention provides an embodiment, the resistance card includes beryllium oxide BeO substrate with size of 1.52mm 1.78mm 0.4mm, black protection film layer 120 is novolac epoxy, input electrode 1041, output electrode 1051 and heat conducting electrode 1061 are nickel + silver Ni + Ag of electroplating, resistance layer 109 is ruthenium oxide layer, first conductor layer 102, second conductor layer 103, third conductor layer 104, fourth conductor layer 105, fifth conductor layer 106, sixth conductor layer 107 and seventh conductor layer 108 are made of silver, above-mentioned first conductor layer 102, above-mentioned second conductor layer 103, above-mentioned third conductor layer 104, above-mentioned fourth conductor layer 105, above-mentioned fifth conductor layer 106, above-mentioned sixth conductor layer 107 and above-mentioned seventh conductor layer 108 are obtained after the silver paste that is specifically printed is baked.
In the embodiment of the present invention, the power absorbed by the resistor disc can reach 10 watts, which is far higher than the power absorbed by the existing resistor disc by 0.5 watts. The embodiment of the present invention provides a resistor sheet, wherein the resistor sheet is disposed on the front surface of an insulating substrate 101, an input electrode 1041 and an output electrode 1051 are disposed on the back surface of the insulating substrate 101, and a heat conducting electrode 1061 is disposed on the back surface of the insulating substrate 101, and the input electrode 1041, the output electrode 1051 and the heat conducting electrode 1061 are kept at the same height on the back surface of the insulating substrate 101, i.e. the three are prevented from generating a height difference on the back surface of the insulating substrate 101, so that, when the resistor sheet is welded to a circuit board, the input electrode 1041, the output electrode 1051 and the heat conducting electrode 1061 on the back surface of the insulating substrate 101 are attached to the attaching surface of the circuit board, thereby preventing a gap from occurring between the resistor sheet and the attaching surface of the circuit board, facilitating the installation of the resistor sheet, and simultaneously, the circuit connection is realized with the circuit board through the input electrode 1041 and the output electrode 1051, the heat conducting electrode 1061 is welded to the heat dissipating end of the circuit board, therefore, the heat dissipation efficiency of the resistor is improved, and the requirement of a microwave communication system and a microwave circuit for high heat dissipation efficiency of the resistor is met.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and reference may be made to the related descriptions of other embodiments for parts that are not described or illustrated in a certain embodiment.
The above-mentioned embodiments are only used for illustrating the technical solution of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art; the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the embodiments of the present invention, and should be construed as being included therein.
Claims (8)
1. A resistive sheet, comprising:
an insulating substrate;
a conductor layer, the conductor layer comprising: the first conductor layer and the second conductor layer are arranged on the front surface of the insulating substrate at intervals; the third conductor layer, the fourth conductor layer and the fifth conductor layer are arranged on the back surface of the insulating substrate at intervals; the sixth conductor layer and the seventh conductor layer are arranged on one end face of the insulating substrate at intervals; the first conductor layer and the third conductor layer are electrically connected through the sixth conductor layer, and the second conductor layer and the fourth conductor layer are electrically connected through the seventh conductor layer; an input electrode is arranged on the third conductor layer, an output electrode is arranged on the fourth conductor layer, and a heat conduction electrode is arranged on the fifth conductor layer;
the resistance layer is arranged on the front face of the insulating substrate and located between the first conductor layer and the second conductor layer, and two ends of the resistance layer are electrically connected with the first conductor layer and the second conductor layer respectively.
2. The resistive sheet of claim 1, further comprising a glass protective film layer disposed on the resistive layer.
3. The resistive sheet of claim 2, further comprising a black protective film layer disposed on the glass protective film layer, on the first conductor layer, and on the second conductor layer.
4. The resistance card of claim 3, wherein the black protective film layer is at least one of a novolac epoxy layer, a bisphenol A epoxy layer, a urethane layer and a polyimide layer.
5. The resistive sheet of claim 4, wherein the input electrode, the output electrode, and the thermally conductive electrode are made of any one of gold, silver, copper, palladium, aluminum, nickel, a gold alloy, a silver alloy, a copper alloy, a palladium alloy, an aluminum alloy, and a nickel alloy.
6. A resistive sheet according to claim 5, wherein the resistive layer is any one of a ruthenium oxide layer, an iridium dioxide layer and a rhenium oxide layer.
7. The resistor sheet according to claim 6, wherein the first conductor layer, the second conductor layer, the third conductor layer, the fourth conductor layer, the fifth conductor layer, the sixth conductor layer and the seventh conductor layer are made of any one of silver, gold and palladium.
8. The resistor sheet according to claim 7, wherein the insulating substrate is any one of a ceramic substrate, an insulating glass substrate, a diamond substrate, and a silicon carbide substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921689900.6U CN210271948U (en) | 2019-09-30 | 2019-09-30 | Resistance card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921689900.6U CN210271948U (en) | 2019-09-30 | 2019-09-30 | Resistance card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210271948U true CN210271948U (en) | 2020-04-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921689900.6U Active CN210271948U (en) | 2019-09-30 | 2019-09-30 | Resistance card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210271948U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110580991A (en) * | 2019-09-30 | 2019-12-17 | 深圳市禹龙通电子有限公司 | Resistance card |
-
2019
- 2019-09-30 CN CN201921689900.6U patent/CN210271948U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110580991A (en) * | 2019-09-30 | 2019-12-17 | 深圳市禹龙通电子有限公司 | Resistance card |
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Address after: 518000 third and fourth floor, building D, Chiwan Industrial Park, No. 1, Shaodi Road, Chiwan, Shekou, Nanshan District, Shenzhen, Guangdong Province Patentee after: Shenzhen yulongtong Electronic Co., Ltd Address before: 518000 third and fourth floor, building D, Chiwan Industrial Park, No. 1, Shaodi Road, Chiwan, Shekou, Nanshan District, Shenzhen, Guangdong Province Patentee before: SHENZHEN YULONGTONG ELECTRON Co.,Ltd. |
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