CN2280339Y

CN2280339Y - Microminiaturization, integration and printing type chip resistor

Info

Publication number: CN2280339Y
Application number: CN 96244604
Authority: CN
Inventors: 廖世昌
Original assignee: Cyntec Co Ltd
Current assignee: Cyntec Co Ltd; Qiankun Science and Technology Co Ltd
Priority date: 1996-11-25
Filing date: 1996-11-25
Publication date: 1998-04-29
Anticipated expiration: 2006-11-25

Abstract

The utility model relates to a printing type chip resistor, particularly a chip resistor which is more miniature and integrated than a conventional chip resistor. The printing type chip resistor comprises a base layer, a resistive layer, and a conductor layer. The utility model is characterized in that the resistive layer is formed on the base layer, the conductor layer is arranged on the resistive layer, and the conductor layer and the resistive layer are partially overlapped. The printing type chip resistor can greatly increase the applicable space for chip resistor printing, so that the chip resistor can obtain the minimum possible size. Accordingly, the up-to-standard rate of the successive technics is greatly improved, and the degree of confidence of the chip resistor is better than the traditional chip resistor.

Description

Microminiaturization and integrated printing-type wafer resistor

The utility model is relevant a kind of printing-type wafer resistor, especially about a kind of more common wafer resistor more microminiaturization and integrated wafer resistor.

Along with electronic equipment is light, thin, short, little trend, the general size of wafer resistor is also more and more littler, simultaneously, integrated level is also more and more higher, it is by in the past EIA1206, DIA0805, the single resistance of EIA0402 size that the EIA0603 size evolves to today, and by 8 branch connecting pins of EIA1206,4 resistance have evolved to 10 branch connecting pins of EIA1206 today, 8 resistance, hence one can see that, and the miniaturization of Chip-R and integrated trend are more and more higher, and for the printing-type technology that tradition is made Chip-R, because the restriction on the size, the product of part specification have surpassed the ability that technology can reach; Though the product of part specification is within technological ability, the subsequent technique qualification rate after the printing is subjected to typography result's restriction and can't breaks through.Therefore, promptly have producer partly to change with thin-film technique and produce the Chip-R that traditional printing formula technology has no idea to produce, still, make wafer resistor with thin-film technique, the investment of equipment is very expensive.

Tradition is as shown in Figure 1 with the prepared wafer resistor of typography mode unit, there is one deck to be positioned at the conductor layer 200 of top in its basic unit 100, on the conductor layer 200, it then is resistive layer 300, this kind is with the prepared wafer resistor of typography mode, mostly be to use in the product of surface adhering technology, be used as termination electrode so must have the part that conductor exposes, and in typography, conductor layer and resistive layer must have the overlay region 230 of size, the size of this overlay region is according to typography ability or printing precision and decide, because this overlay region must exist, relative, the effective resistance printable area promptly reduces, and the size of wafer resistor is more little, and the minimizing of effective resistance printable area is also just serious more, when effective resistance printable area little of to a certain degree, although typography still can be carried out, and still, is right after and comes the adjustment of resistance, because the result that space, resistance Printing Zone reduces, with the equipment of same precision, after the adjustment, its qualification rate also significantly reduces.In addition, the printing of resistive layer is restricted, and the termination electrode size is also less relatively, and under the identical situation of printing equipment, the printing qualification rate also can be lower.

Because existing traditional type has above-mentioned shortcoming with the prepared wafer resistor of typography, this new design people is devoted to study the road of improvement and this novel generation is arranged eventually.

Shortcoming at prior art, main purpose of the present utility model is promptly providing a kind of microminiaturization and integrated printing-type wafer resistor, according to this novel this kind printing-type wafer resistor, its effective resistance printable area can't reduce, so can under identical manufacturing equipment condition, obtain qualification rate and the higher result of reliability.

This novel including: a basic unit, a resistive layer and a conductor layer is characterized in that: resistive layer is formed in the basic unit, then is conductor layer on the resistive layer, and conductor layer and resistive layer are partly overlapping.

As for this novel printing-type wafer resistor, it constitutes and technology in detail, can understand fully with reference to the explanation that accompanying drawing is done.

Fig. 1 is the formation longitudinal section schematic diagram of conventional wafer resistor.

Fig. 2 is the formation longitudinal section schematic diagram of this novel printing formula wafer resistor.

Fig. 3～Fig. 5 is the process schematic representation of this novel printing formula wafer resistor.

Fig. 6 is the relative dimensions figure of the EIA0603 wafer resistor of traditional printing technology manufacturing.

Fig. 7 is the relative dimensions figure of the EIA0402 wafer resistor of traditional printing technology manufacturing.

Fig. 8 is the relative dimensions figure of the EIA0603 wafer resistor of this novel process manufacturing.

Fig. 9 is the relative dimensions figure of the EIA0402 wafer resistor of this novel process manufacturing.

Conventional wafer resistor shown in Figure 1, its formation, technique with and shortcoming described as above repeated description no longer herein in detail.

Referring to shown in Figure 2, this novel this kind printing-type wafer resistor is made of basic unit's 1, one conductor layer, 2, one resistive layers 3 and a bottom electrode 4, and wherein, resistive layer 3 ties up to the below of conductor layer 2. Its manufacture process such as Fig. 3～shown in Figure 5, in basic unit 1, carry out first the printing (Fig. 3) of backplate 4, secondly, carry out the printing (Fig. 4) of front resistive layer 3, last, carry out the printing of conductor layer; The gap of two resistive layers of two plates resistor unit also covers with conductor layer.

According to this novel printing-type wafer resistor, under being printed on of its front resistive layer 3, and being printed on of front electrode conductor layer 2, the product that this kind printing-type wafer resistor can make original traditional printing technique accomplish becomes possibility, even have microminiaturization more and integrated printing-type wafer resistor product to occur, need not can utilize inexpensive mode of printing to realize by the thin-film technique of costliness.

＜embodiment 〉

Referring to Fig. 8 and Fig. 9, be of a size of EIA0603 and EIA0402 wafer resistor with this novel gained, comparative descriptions is as follows: (A) EIA0603

Imperial sizing: L0.06in * W0.03in

Suitable metric size: L1.6mm * wide 0.8mm

Termination electrode size: 0.3mm

Typography ability 0.1mm

Overlapping process: 0.3-0.05=0.25mm

(resistive layer is below conductor layer, so technological ability can be reduced to 0.25mm in the L direction)

But maximum resistance layer printed dimensions L (1.6-0.05 * 2) * W (0.8-0.1 * 2)

＝L(1.5mm)×W(0.6mm)

Maximum resistance layer effective resistance size L (1.6-0.3 * 2) * W (0.8-0.1 * 2)

＝L(0.1mm)×W(0.6mm)(B)EIA0402

Imperial sizing: L0.04in * W0.02in

Suitable metric size: L1.0mm * W0.5mm

Termination electrode size: 0.25mm

Typography ability 0.1mm

Overlapping process: 0.25-0.05=0.2mm

(resistive layer is below conductor layer, so technological ability can be reduced to 0.2mm in the L aspect) but maximum resistance layer printed dimensions: L (1.0-0.05 * 2) * W (0.5-0.1 * 2)

=L (0.9mm) * W (0.3mm) maximum resistance layer effective resistance size=L (1.0-0.25 * 2) * W (0.5-0.1 * 2)

=L (0.5mm) * W (0.3mm)＜reference examples 〉

With reference to Fig. 6 and Fig. 7, the applicant does an explanation with the wafer resistor that traditional technology gained is of a size of EIA0603 and EIA0402: (A) EIA0603

Imperial sizing: long 0.06in * wide 0.03in

Suitable metric size: long 1.6mm * wide 0.8mm

Termination electrode size: 0.3mm

But typography ability 0.1mm maximum resistance layer printed dimensions: L (1.6-0.3 * 2) * W (0.8-0.1 * 2)

=L (1.0mm) * W (0.6mm) maximum resistance layer effective resistance size: L (1.0-0.1 * 2) * W (0.8-0.1 * 2)

＝L(0.8mm)×W(0.6mm)(A)EIA0402

Imperial sizing: long 0.04in * wide 0.02in

Suitable metric size: long 1.0mm * wide 0.5mm

Termination electrode size: 0.25mm

Typography ability 0.1mm

But maximum resistance layer printed dimensions: L (1.0-0.25 * 2) * W (0.5-0.1 * 2)

＝L(0.5mm)×W(0.3mm)

Maximum resistance layer effective resistance size: L (0.5-0.1 * 2) * W (0.5-0.1 * 2)

＝L(0.3mm)×W(0.3mm)

Reference examples can clearly be found out thus, and when product size was dwindled, its influence was very serious, even this is single resistor-type, if 10 pins, 8 resistance of EIA1206, its size is littler than the single resistance of EIA0402, with traditional printing technology, real its technological ability that surpasses far away.＜relatively 〉

The results list of embodiment and reference examples gained is as follows:

	Traditional handicraft	This novel process	This novel raising ratio
	Traditional handicraft	This novel process	This novel raising ratio	But EIA0603 maximum resistance layer printed dimensions	1.0×0.6	1.5×0.6	50％
EIA0603 maximum resistance layer effective resistance size	0.8×0.6	1.0×0.6	25％	But EIA0603 maximum resistance layer printed dimensions	1.0×0.6	1.5×0.6	50％
EIA0603 maximum resistance layer effective resistance size	0.8×0.6	1.0×0.6	25％	But EIA0402 maximum resistance layer printed dimensions	0.5×0.3	0.9×0.3	80％
EIA0402 maximum resistance layer effective resistance size	0.3×0.3	0.5×0.3	67％	But EIA0402 maximum resistance layer printed dimensions	0.5×0.3	0.9×0.3	80％
EIA0402 maximum resistance layer effective resistance size	0.3×0.3	0.5×0.3	67％	EIA0603 resistive layer/conductor layer overlapping dimension	0.1	0.25	150％
EIA0402 resistive layer/conductor layer overlapping dimension	0.1	0.2	100％		0.1	0.25	150％

By above comparison, it is littler to work as the wafer resistor size as can be known, and it is obvious more to improve benefit.

From the above this novel a kind of microminiaturization and integrated printing-type wafer resistor and manufacture method thereof as can be known, really the advantage that has conventional wafer resistor institute nothing, the developing rapidly of printing-type wafer resistor industry that can benefit from is for unquestionable, and be not seen in open use, should belong to original creation undoubtedly.

Claims

1, a kind of microminiaturization and integrated printing-type wafer resistor, include: a basic unit, a resistive layer and a conductor layer is characterized in that: resistive layer is formed in the basic unit, then is conductor layer on the resistive layer, and conductor layer and resistive layer are partly overlapping.

2, microminiaturization as claimed in claim 1 and integrated printing-type wafer resistor is characterized in that: the gap of two resistive layers of two plates resistor unit also covers with conductor layer.