JP2018147940A - 受光素子の製造方法 - Google Patents
受光素子の製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000004065 semiconductor Substances 0.000 claims abstract description 46
- 239000012535 impurity Substances 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 230000031700 light absorption Effects 0.000 claims description 21
- 238000005530 etching Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- 238000009792 diffusion process Methods 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- 239000011701 zinc Substances 0.000 claims description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 238000007788 roughening Methods 0.000 abstract 1
- 230000005684 electric field Effects 0.000 description 10
- 238000000137 annealing Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 230000003746 surface roughness Effects 0.000 description 6
- 238000001312 dry etching Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 230000015556 catabolic process Effects 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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- H01L31/1844—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP comprising ternary or quaternary compounds, e.g. Ga Al As, In Ga As P
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- Manufacturing & Machinery (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
最初に、本願発明の実施形態の内容を列記して説明する。
本願発明は、半導体基板上に第1導電型の第1半導体層を形成する工程と、前記第1半導体層上に光吸収層を形成する工程と、前記光吸収層上に増倍層を形成する工程と、前記増倍層上に第2導電型の第2半導体層を形成する工程と、前記第2半導体層上の第1の領域を覆うマスク層を形成する工程と、前記マスク層の開口から前記増倍層までの間を含む領域に不純物を導入する工程と、前記マスク層の開口の領域を含む前記第1半導体層、前記光吸収層、前記増倍層、および前記第2半導体層を除去し、前記増倍層の側面に前記不純物が導入された領域を有するメサ構造体を形成する工程と、を含む、受光素子の製造方法である。これにより、メサ構造体の上面が荒れることを抑制できる。
本願発明の実施形態に係る受光素子の具体例を、以下に図面を参照しつつ説明する。なお、本願発明はこれらの例示に限定されるものではなく、特許請求の範囲によって示され、特許請求の範囲と均等の意味及び範囲内での全ての変更が含まれることが意図される。また、本願発明の効果がある限りにおいて他の成分が含まれていてもよい。
12 バッファ層
14 光吸収層
16 衝撃緩和層
18 電界降下層
20 増倍層
22 ウィンドウ層
24 コンタクト層
26 絶縁層
28 絶縁層
30 メサ構造体
32 パッシベーション膜
34 p電極
36 n電極
38 保護膜
40 バリア電極
42 金属層
44 バンプ
46 レンズ
48 受光領域
50 レジスト
Claims (3)
- 半導体基板上に第1導電型の第1半導体層を形成する工程と、
前記第1半導体層上に光吸収層を形成する工程と、
前記光吸収層上に増倍層を形成する工程と、
前記増倍層上に第2導電型の第2半導体層を形成する工程と、
前記第2半導体層上の第1の領域を覆うマスク層を形成する工程と、
前記マスク層の開口から前記増倍層までの間を含む領域に不純物を導入する工程と、
前記マスク層の開口の領域を含む前記第1半導体層、前記光吸収層、前記増倍層、および前記第2半導体層を除去し、前記増倍層の側面に前記不純物が導入された領域を有するメサ構造体を形成する工程と、
を含む、受光素子の製造方法。 - 前記不純物を導入する工程は、3.0×10−3torr以下の亜鉛雰囲気において80分以上行う条件の熱拡散によって行われる、請求項1に記載の受光素子の製造方法。
- 前記第1半導体層、前記光吸収層、前記増倍層、および前記第2半導体層を除去して前記メサ構造体を形成する工程は、前記マスク層をマスクとして利用したエッチング工程によって実施される、請求項1又は2に記載の受光素子の製造方法。
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JP2017038793A JP6879617B2 (ja) | 2017-03-01 | 2017-03-01 | 受光素子の製造方法 |
US15/907,590 US10580927B2 (en) | 2017-03-01 | 2018-02-28 | Process of forming light-receiving device |
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Families Citing this family (5)
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WO2016190346A1 (ja) * | 2015-05-28 | 2016-12-01 | 日本電信電話株式会社 | 受光素子および光集積回路 |
CN109473496B (zh) * | 2018-10-30 | 2020-06-26 | 中国科学院上海技术物理研究所 | 一种雪崩探测器过渡层结构及制备方法 |
JP7361490B2 (ja) * | 2019-05-07 | 2023-10-16 | 日本ルメンタム株式会社 | 半導体受光素子及び半導体受光素子の製造方法 |
US11289532B1 (en) * | 2020-09-08 | 2022-03-29 | Argo Al, LLC | Systems, methods, and devices for reducing optical and electrical crosstalk in photodiodes |
CN113138207B (zh) * | 2021-04-22 | 2022-04-19 | 安徽理工大学 | 一种正交各向异性固体材料热扩散系数测试系统及方法 |
Citations (3)
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US6495380B2 (en) * | 2000-12-11 | 2002-12-17 | Nortel Networks Limited | Epitaxially grown avalanche photodiode |
JP2005327810A (ja) * | 2004-05-12 | 2005-11-24 | Anritsu Corp | 順メサ型受光素子 |
JP2006339413A (ja) * | 2005-06-02 | 2006-12-14 | Fujitsu Ltd | 半導体受光装置及びその製造方法 |
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JPH08274366A (ja) * | 1995-03-31 | 1996-10-18 | Nec Corp | 半導体受光素子 |
JPH11354827A (ja) | 1998-06-05 | 1999-12-24 | Hitachi Ltd | 受光素子およびその製造方法 |
JP2008252145A (ja) | 2002-10-30 | 2008-10-16 | Fujitsu Ltd | アバランシェフォトダイオード |
JP2005086028A (ja) | 2003-09-09 | 2005-03-31 | Fujitsu Ltd | 半導体受光装置 |
JP5195816B2 (ja) * | 2010-05-17 | 2013-05-15 | 富士電機株式会社 | 半導体装置の製造方法 |
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Publication number | Priority date | Publication date | Assignee | Title |
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US6495380B2 (en) * | 2000-12-11 | 2002-12-17 | Nortel Networks Limited | Epitaxially grown avalanche photodiode |
JP2005327810A (ja) * | 2004-05-12 | 2005-11-24 | Anritsu Corp | 順メサ型受光素子 |
JP2006339413A (ja) * | 2005-06-02 | 2006-12-14 | Fujitsu Ltd | 半導体受光装置及びその製造方法 |
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