JP2018110149A5 - - Google Patents
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- JP2018110149A5 JP2018110149A5 JP2016256337A JP2016256337A JP2018110149A5 JP 2018110149 A5 JP2018110149 A5 JP 2018110149A5 JP 2016256337 A JP2016256337 A JP 2016256337A JP 2016256337 A JP2016256337 A JP 2016256337A JP 2018110149 A5 JP2018110149 A5 JP 2018110149A5
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- semiconductor device
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- 239000004065 semiconductor Substances 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000002923 metal particle Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 238000005245 sintering Methods 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 5
- 229920000620 organic polymer Polymers 0.000 claims 5
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016256337A JP6643975B2 (ja) | 2016-12-28 | 2016-12-28 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016256337A JP6643975B2 (ja) | 2016-12-28 | 2016-12-28 | 半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018110149A JP2018110149A (ja) | 2018-07-12 |
| JP2018110149A5 true JP2018110149A5 (OSRAM) | 2018-12-27 |
| JP6643975B2 JP6643975B2 (ja) | 2020-02-12 |
Family
ID=62844633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016256337A Active JP6643975B2 (ja) | 2016-12-28 | 2016-12-28 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6643975B2 (OSRAM) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113169083B (zh) * | 2019-06-20 | 2024-12-31 | 富士电机株式会社 | 半导体装置以及半导体装置的制造方法 |
| JP7484097B2 (ja) * | 2019-07-18 | 2024-05-16 | 株式会社レゾナック | 半導体装置 |
| JP7247053B2 (ja) * | 2019-08-02 | 2023-03-28 | 株式会社東芝 | 半導体装置 |
| JP7404208B2 (ja) * | 2020-09-24 | 2023-12-25 | 株式会社東芝 | 半導体装置 |
| WO2022113617A1 (ja) * | 2020-11-27 | 2022-06-02 | ローム株式会社 | 半導体装置 |
| US20250201764A1 (en) | 2022-03-30 | 2025-06-19 | Mitsui Mining & Smelting Co., Ltd. | Method for manufacturing bonded body and method for bonding bodies to be bonded |
| JP2025077454A (ja) * | 2023-11-06 | 2025-05-19 | ミネベアパワーデバイス株式会社 | 半導体装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5542567B2 (ja) * | 2010-07-27 | 2014-07-09 | 三菱電機株式会社 | 半導体装置 |
| JP2014029897A (ja) * | 2012-07-31 | 2014-02-13 | Hitachi Ltd | 導電性接合体およびそれを用いた半導体装置 |
| JP6147176B2 (ja) * | 2013-12-02 | 2017-06-14 | 三菱電機株式会社 | 半導体素子の基板への接合方法 |
-
2016
- 2016-12-28 JP JP2016256337A patent/JP6643975B2/ja active Active
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