JP6407305B2 - 転写基板を用いて乾燥金属焼結化合物を電子部品用キャリア上へ適用する方法および対応するキャリアおよび電子部品との焼結結合のためのその使用 - Google Patents

転写基板を用いて乾燥金属焼結化合物を電子部品用キャリア上へ適用する方法および対応するキャリアおよび電子部品との焼結結合のためのその使用 Download PDF

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JP6407305B2
JP6407305B2 JP2016565289A JP2016565289A JP6407305B2 JP 6407305 B2 JP6407305 B2 JP 6407305B2 JP 2016565289 A JP2016565289 A JP 2016565289A JP 2016565289 A JP2016565289 A JP 2016565289A JP 6407305 B2 JP6407305 B2 JP 6407305B2
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substrate
preparation
transfer substrate
electronic component
metal
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JP2017520907A (ja
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ミヒャエル シェーファー
ミヒャエル シェーファー
スザンヌ クラウディア ドゥッフ
スザンヌ クラウディア ドゥッフ
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ヘレウス ドイチェラント ゲーエムベーハー ウント カンパニー カーゲー
ヘレウス ドイチェラント ゲーエムベーハー ウント カンパニー カーゲー
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  • Engineering & Computer Science (AREA)
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  • Ceramic Engineering (AREA)
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  • Geometry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
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Description

本発明は、乾燥金属焼結調製物から作製された複数の分離層断片の、電子部品用基板の所定の導電性表面部分への適用方法に関する。
エレクトロニクス産業では、半導体チップなどの電子部品の取り付けおよび電気的接触および熱放散のために金属焼結調製物を使用することが知られている。前記金属焼結調製物は、例えば、特許文献１〜４に開示されている。通常、前記金属焼結調製物は、基板を支持するために、例えばスクリーン印刷またはステンシル印刷などの印刷によって適用され、必要であれば乾燥させ、電子部品とともに構成され、焼結プロセスを受ける。液体状態へ遷移することなく、金属粒子は拡散による焼結プロセスの間結合し、基板と電子部品との間で確実な電流伝導性および熱伝導性金属結合を形成する。
分注による適用は、印刷による金属焼結調製物の適用の代替法として知られている。
国際公開第２０１１／０２６６２３Ａ１号 欧州特許出願第２４２５９２０Ａ１号 欧州特許出願第２４２８２９３Ａ２号 欧州特許出願第２５７２８１４Ａ１号
本発明の目的は、完全に平面でない、また適用できる場合、部分的に電子部品とともに事前構成された基板に対して、金属焼結調製物の複数の層断片の同時適用（１つの処理工程で）を可能にする方法を考案し、基板および／または場合により基板上に位置する電子部品への温度応力をできる限り低くすることである。
本発明は、乾燥金属焼結調製物から作製された複数の分離層断片の、電子部品用基板の所定の導電性表面部分への適用方法に関する。乾燥金属焼結調製物が提供された平面転写基板が本発明による方法で使用される。この方法は、
（１）金属焼結調製物から作製された複数の分離層断片を、所定の導電性表面部分に対して鏡面対称である配置において平面転写基板の一面に適用する工程と、
（２）焼結を防ぎながら、このようにして適用された金属焼結調製物を乾燥させる工程と、
（３）電子部品用基板の表面に面するように乾燥金属焼結調製物から作製された層断片を有する転写基板を配置し、接触させ、乾燥金属焼結調製物が提供された転写基板の表面部分と電子部品用基板の所定の導電性表面部分との一致した配置を確実にする工程と、
（４）工程（３）で生成された接触構成に圧縮力を適用する工程と、
（５）接触構成から転写基板を除去する工程と、
を含み、工程（４）の完了後に、電子部品用基板の所定の導電性表面部分に対する乾燥金属焼結調製物の接着力は、転写基板の表面に対する接着力より大きく、
平面転写基板は非焼結性であり、適用できる場合、被覆金属箔または熱可塑性フィルムであり、
電子部品用基板は１０〜５００μｍの１つ以上のくぼみを含む平面状表面を有する基板であり、さらにリードフレーム、セラミック基板、ＤＣＢ基板、および金属複合材からなる群から選択され、少なくとも１つの所定の導電性表面部分はくぼみの中に位置する。
また本発明は、本発明による方法にしたがって製造され、乾燥金属焼結調製物が提供された電子部品用基板に関する。
電子部品の例としては、能動部品（例：ＬＥＤ、ダイオード、ＩＧＢＴ、サイリスタ、ＭＯＳＦＥＴ、トランジスタなどの半導体チップ）および／または受動部品（例：レジスタ、コンデンサ、インダクタ、およびメモリスタ）および／または圧電セラミック、および／またはペルチェ素子を含む。
「乾燥金属焼結調製物」とは、揮発性成分を完全に、または基本的に含まない、もはや湿性でない、未焼結の金属焼結調製物を意味することが理解されるものとする。例えば「乾燥金属焼結調製物」とは、金属焼結調製物中に最初に存在する９８〜１００重量％の揮発性成分が除去されたことを意味し、乾燥金属焼結調製物は、工程（２）で適用される乾燥条件を繰り返し適用した後でさえ、重量計測式測定で質量が一定または基本的に一定であることが分かった。乾燥金属焼結調製物は、７０℃未満の温度で形が安定する、固化した、依然として焼結性の金属焼結調製物である。本発明による方法の工程（１）で使用される金属焼結調製物は下記でより詳細に説明する。
本発明による方法で乾燥金属焼結調製物が適用される電子部品用基板は、エレクトロニクス産業で一般的な支持基板であり、リードフレーム、セラミック基板、ＤＣＢ基板、および金属複合材からなる群から選択され、電子部品用基板は、キャビティと呼ばれる１０〜５００μｍの１つ以上のくぼみを含むような平面状表面を有する基板である。基板は平坦な基板であってもよい。電子部品用基板は電子部品に電圧／電流を提供するための導電性表面部分を含む。この文脈では、「導電性表面部分」とは、基板の電気絶縁性表面の、および／または電気絶縁性表面上の導電性表面部分のレイアウトのことを言う。すなわち、それは例えば、印刷導体のパターンのことを言う。それに対して、「所定の導電性表面部分」とは、乾燥金属焼結調製物が適用される、および／または乾燥金属焼結調製物を用いて電子部品が取り付けられ、電気接触される導電性表面部分のそれらの部分のことを言う。この文脈では、少なくとも１つの所定の導電性表面部分は、１０〜５００μｍのくぼみの中に位置する。これを言い換えると、複数の状況が実施可能である。
基板は１０〜５００μｍの１つのくぼみを有し、１つの所定の導電性表面部分は前記くぼみの中に位置し、１つ以上のさらなる所定の導電性表面部分はくぼみの外側に位置する。
基板は１０〜５００μｍの１つのくぼみを有し、複数の所定の導電性表面部分は前記くぼみの中に位置し、１つ以上のさらなる所定の導電性表面部分はくぼみの外側に位置する。
基板は１０〜５００μｍの１つのくぼみを有し、全ての所定の導電性表面部分は前記くぼみの中に位置する。
基板は１０〜５００μｍの複数のくぼみを有し、所定の導電性表面部分の１つはくぼみの１つの中に位置し、１つ以上のさらなる所定の導電性表面部分はくぼみの外側に位置する。
基板は１０〜５００μｍの複数のくぼみを有し、複数の所定の導電性表面部分はくぼみの１つの中に位置し、１つ以上のさらなる所定の導電性表面部分はくぼみの外側に位置する。
基板は１０〜５００μｍの複数のくぼみを有し、全ての所定の導電性表面部分はくぼみの１つの中に位置する。
基板は１０〜５００μｍの複数のくぼみを有し、所定の導電性表面部分が１つずつそれぞれのくぼみの中に位置し、さらなる所定の導電性表面部分は、くぼみの外側に全く位置しないか、または１つ以上のさらなる所定の導電性表面部分がくぼみの外側に位置する。
基板は１０〜５００μｍの複数のくぼみを有し、所定の導電性表面部分が１つずつくぼみのいくつかの中に位置し、さらなる所定の導電性表面部分は、くぼみの外側に全く位置しないか、または１つ以上のさらなる所定の導電性表面部分がくぼみの外側に位置する。
基板は１０〜５００μｍの複数のくぼみを有し、所定の導電性表面部分が複数ずつくぼみのそれぞれの中に位置し、さらなる所定の導電性表面部分は、くぼみの外側に全く位置しないか、または１つ以上のさらなる所定の導電性表面部分がくぼみの外側に位置する。
基板は１０〜５００μｍの複数のくぼみを有し、所定の導電性表面部分が複数ずつくぼみのいくつかの中に位置し、さらなる所定の導電性表面部分は、くぼみの外側に全く位置しないか、または１つ以上のさらなる所定の導電性表面部分がくぼみの外側に位置する。
基板は１０〜５００μｍの複数のくぼみを有し、いくつかのくぼみの中には１つ、いくつかのくぼみの中には複数の、所定の導電性表面部分がくぼみの２つ以上の中に位置し、さらなる所定の導電性表面部分は、くぼみの外側に全く位置しないか、または１つ以上のさらなる所定の導電性表面部分がくぼみの外側に位置する。
基板は１０〜５００μｍの複数のくぼみを有し、いくつかのくぼみの中には１つ、いくつかのくぼみの中には複数の、所定の導電性表面部分がくぼみの中に位置し、所定の導電性表面部分を含まないくぼみはなく、さらなる所定の導電性表面部分は、くぼみの外側に全く位置しないか、または１つ以上のさらなる所定の導電性表面部分がくぼみの外側に位置する。
さらに電子部品用基板は、本発明による方法で乾燥金属焼結調製物から作製された層断片が提供される前に、１つ以上の電子部品とともに構成されていてもよい。部品の高さによって、深さまたは全深さは例えば１０〜２００μｍであり、または相対的に高い部品の高さを有する部品の場合、例えばそのような隣接する部品間は２００〜１０００μｍである。全深さは、例えば、１０〜５００μｍの前記くぼみのうちの１つの深さと部品の高さおよび／または前記くぼみに隣接または隣に位置する電子部品のうち最も高い部品の高さとの合計であり得る。
電子部品用基板の導電性表面部分は特に金属製である。後者の場合は、これは電気的接触用に一般的な薄い金属層またはメタライゼーションに関し、例えば、銅、銀、金、パラジウム、ニッケル、アルミニウム、およびこれらの金属の適切な合金から作製される。これは他の金属層でコーティングされた金属、例えば金の層でコーティングされたニッケル、外部が金とパラジウムの層でコーティングされたニッケル、金の層でコーティングされた銀／パラジウム合金を考慮してもよい。
本発明による方法の工程（１）では、複数の分離層断片の形態の金属焼結調製物は、電子部品用基板の所定の導電性表面部分に対して鏡面対称の配置、すなわち電子部品用基板の所定の導電性表面部分に対応するが鏡面対称の配置において平面転写基板の一面に適用される。実際的見地から見れば、この文脈では、分離層断片は一度にまたは同時に適用される。「分離層断片」とは、これは連続層ではなく、互いから分離していて金属焼結調製物から適用される個別の層状の要素に関することを意味することが理解されるものとする。上記の説明から明らかなように、所定の導電性表面部分は互いから分離した個別の表面部分でもある。
この金属焼結調製物は、電子部品の取り付けおよび電気的接触および熱放散のためにエレクトロニクス産業で使用される基本的に公知の金属焼結調製物である。１つ以上の金属または金属合金および／または焼結プロセスの間に金属を形成する金属化合物から作製された粒子の他に、金属焼結調製物は、特に、可能な添加物に加えて揮発性有機溶媒も含む。金属粒子は、例えば銅、ニッケル、アルミニウム、または特に銀から作製された金属粒子であり、それぞれは例えば１〜１０μｍの範囲の平均粒径（レーザー回析によって測定されたｄ５０）を有する。添加物の例としては、金属粒子用のコーティング、例えばＣ８−Ｃ２８脂肪酸、Ｃ８−Ｃ２８脂肪酸塩、Ｃ８−Ｃ２８脂肪酸エステル、一般的な焼結助剤、およびポリマー結合剤などを含む。特許文献１〜４は、使用することができる金属焼結調製物、特に金属焼結ペーストを開示している文献の例である。
平面転写基板は非焼結性であり、適用できる場合、被覆金属箔または熱可塑性フィルムであり、例えば、ポリエステル、フルオロポリマー、例えばポリテトラフルオロエチレン、ポリイミド、シリコーンまたはポリオレフィンなどから作製されている。金属焼結調製物が提供される可塑性フィルムの全質量または面は、例えば接着低減材が提供、例えばコーティングされていてもよい。接着低減材の例としては、シリコーンまたはフルオロポリマーをベースにした物質を含む。平面転写基板は、透明な可塑性フィルムであることが好ましい。
工程（４）の完了後に、乾燥金属焼結調製物の接着力は、電子部品用基板の所定の導電性表面部分に対しての方が、転写基板の表面に対してより大きいことは必須である。例えば、２２０ｇ／ｃｍの接着力の接着テープを用いたＤＩＮ ＥＮ １４０９９（２００２年１０月）にしたがって測定された接着力が０．４Ｎ／ｃｍ以上大きい場合、十分である。
一実施形態では、転写基板は、熱応力にさらされた後でさえ、大部分が寸法的に安定している軟質熱可塑性フィルムである。この軟質熱可塑性フィルムは、１２０℃の対象温度で３０分間熱応力にさらされた後、その長さと幅の寸法の変化は１．５％以下を示すことが好ましく（ＡＳＴＭ Ｄ １２０４）、すなわち前記条件にさらされた後、長さと幅の寸法の変化は全くないか、または最大１．５％未満であることが好ましい（ＡＳＴＭ Ｄ １２０４）。
本発明による方法において転写基板として用いることができる熱可塑性フィルムの例としては、市販の可塑性フィルム、三菱製のＨｏｓｔａｐｈａｎ（登録商標）ＲＮ７５、ＤｕＰｏｎｔ製のＭｙｌａｒ（登録商標）Ａ ５０μｍおよび／または７５μｍ、および東レ製のＬｕｍｉｒｒｏｒ（登録商標）４０．０１を含む。
金属焼結調製物は通常、例えばスクリーン印刷またはステンシル印刷などの印刷によって、例えば最高２００μｍの乾燥層の厚さで転写基板に適用される。十分に非粘性の金属焼結調製物の場合、適用は噴霧によって行うこともでき、金属焼結調製物にさらされるべきでない領域を保護する手段として適切であり得る。前記手段の例としては、テープを適用すること、またはステンシルで覆うことを含む。
本発明による方法の工程（２）では、工程（１）で適用される湿性金属焼結調製物は、焼結を防ぎながら乾燥させる。すなわち、例えば有機溶媒などの揮発性成分が除去される。好ましくは、金属焼結調製物の乾燥プロセスは、特に、乾燥プロセスの後、金属焼結調製物中で完了へ進む焼結プロセスが起こることなく、金属焼結調製物から揮発性成分を除去するのに適切な温度条件の条件で行われる。この目的で、金属焼結調製物が提供された転写基板は、例えば対流式オーブンなどのオーブンで、例えば１０〜３０分間、８０〜１５０℃で加熱することができる。この文脈では、オーブンを不活性にしてもよく、適用できる場合、例えば窒素雰囲気を用いて不活性にしてもよい。
上述のように、乾燥金属焼結調製物は、溶媒などの揮発性成分が少なくとも基本的に除去され、例えば後の焼結プロセスで金属粒子および／または金属を形成する金属化合物に加えて非揮発性添加物を依然として含む。乾燥金属焼結調製物は固化するが、焼結しないか、または部分的にのみ焼結する。すなわち固化した金属焼結調製物は依然として焼結することができる。
したがって、転写基板上にある乾燥金属焼結調製物とともに転写基板はプリフォームを形成し、中間生成物として工程（３）〜（５）を含むさらなる製造プロセスに導くことができる。工程（３）〜（５）を含むさらなる製造プロセスは、工程（１）および（２）を実施する製造者の施設で、または他の製造者の施設で行うことができる。概して、中間生成物は、さらなる処理のために搬送できるほど安定していて扱いやすいものである。これは乾燥金属焼結調製物が固化して寸法的に安定したことによる。
本発明による方法の工程（３）は、乾燥金属焼結調製物から作製された層断片を有する転写基板を電子部品用基板の表面の方へ配向し、配置し、接触させ、乾燥金属焼結調製物が提供された転写基板の表面部分と電子部品用基板の所定の導電性表面部分との一致した配置を確実にする。これは転写基板上の乾燥金属焼結調製物が位置する場所が、乾燥金属焼結調製物が適用される、および／または乾燥金属焼結調製物を用いて電子部品が取り付けられ、後で電気的に接触させられる電子部品用基板の前記所定の導電性表面部分によって覆われることを確実にする。工程（３）の配置はどの位置で行われてもよく、例えば垂直または水平位置で行われてもよい。例えば水平位置では、転写基板は電子部品用基板の下、またはその逆に配置されてもよい。
実際の転写工程である本発明による方法の工程（４）では、工程（３）で生成された接触構成上に、乾燥金属焼結調製物が位置する全表面またはそれらの位置で少なくとも十分に圧縮力が加えられる。例えば、０．５〜１０ＭＰａの接触圧力は、例えば１〜３０秒間、適用されてもよい。この文脈では、最高１５０℃の対象温度の上昇を使用することが適切であり得、加熱は例えば加圧ツールの下側および／または上側を加熱することによって行うことができる。一般的な装置は、例えば積層プレス工程、特に加熱可能な積層プレス工程などの処理工程（４）を実施するのに使用することができる。さらに、例えば５０〜７０のショアＡ硬度の適合した硬さの程度の例えばシリコーンプレートが、パンチと乾燥金属焼結調製物が提供された転写基板との間に使用することができる。具体的には、圧縮力が全表面に適用されない場合、乾燥金属焼結調製物が位置する位置のパンチを妨げるように作動する補助器具を使用することができる。特に基板が電子部品とともに、特に相対的に高く組み立てられた高さの電子部品とともにすでに構成されているとき、記載した手順は適切である。さらに、転写基板は、電子部品用基板の表面に完全に接触できるように、すでに存在する前記電子部品用の適切な凹部を含むことが適切であり得る。
工程（４）の完了後に、転写基板は本発明による方法の工程（５）で除去され、乾燥金属焼結調製物は電子部品用基板の所定の導電性表面部分上にとどまる。最初に転写基板に接着し、その後、転写によって除去される乾燥金属焼結調製物の表面は、今度はさらなる製造プロセスの対象となる電子部品に取り付け、および／または結合することが意図される。
工程（３）〜（５）は、例えばローラー積層プロセスに合うようにバッチプロセスまたは連続して行うことができる。実際的見地から見ると、一度にまたは同時に工程（３）〜（５）の順序で、分離層断片は転写基板から電子部品用基板に転写される。
一実施形態では、本発明による方法は、電子部品用基板の両面に乾燥金属焼結調製物が提供されるように適切に行うことができる。この文脈では基本的に同じ工程（１）〜（５）が行われるが、ただし工程（３）〜（４）では電子部品用基板が乾燥金属焼結調製物が適切に提供された２つの転写基板の間に配置され、工程（５）で転写基板が電子部品用基板の両面から除去される。
（２）からさらなる製造プロセスにおける電子部品の取り付けおよび結合のために行われる工程は、例えば別の製造者の施設で行うこともできる。前記さらなる製造プロセスは実際の焼結工程を含む。この文脈では、まず、一般的なサンドイッチ配置が、本発明の方法によってそれに転写される乾燥金属焼結調製物を有する電子部品用基板と電子部品とから生成される。次にサンドイッチ配置は焼結プロセスを受け、その間に焼結された金属焼結調製物が乾燥金属焼結調製物から生成され、基板と電子部品との間に機械的、電気的、および熱伝導性結合が形成される。
乾燥金属焼結調製物が提供された電子部品用基板の形態の工程（１）〜（５）を含む本発明による方法の生成物は、中間生成物として、前節で説明されたさらなる製造プロセスへ回すことのできるプリフォームである。
概して、中間生成物はさらなる処理のために搬送できるほど安定していて扱いやすいものである。これは転写された乾燥金属焼結調製物が固化して寸法的に安定したことによる。
本発明による方法は、金属焼結調製物の乾燥プロセスの間に広がる温度応力に基板または電子部品をさらすことなく、層断片状の乾燥金属焼結調製物を一度に電子部品用基板に適用できるようにする。この文脈では、本発明による方法は、従来のスクリーン印刷またはステンシル印刷では実施不可能であった、基板の表面上のくぼみの中で、また適用できる場合、基板上にすでに存在する電子部品間で、乾燥金属焼結調製物の適用を可能にする。
本発明を以下の一つの例示的な実施形態を通して説明するが、いかなる方法または形態においても本発明を限定するようには解釈されない。
例示的な実施形態（電子部品用基板として厚さ５００μｍの銀箔（ＧｏｏｄＦｅｌｌｏｗ製、Ｔｙｐ ＡＧ０００４６５）中の１５０μｍの深さのキャビティ内の２つのダイオード（ＩＦＸ ＩＤＣ７３Ｄ１２０Ｔ６Ｈ）を焼結）
ヘレウス（ドイツ、ハナウ）製の焼結ペーストＡＳＰ ０４３−０４を、Ｋｏｅｎｅｎ製の７５μｍの厚さのスチールステンシルを用いたＤＥＫ Ｈｏｒｉｚｏｎ ０３ｉＸステンシルプリンタを用いて、転写基板としての三菱製のＰＥＴフィルム、タイプＨｏｓｔａｐｈａｎ（登録商標）ＲＮ７５２５ＪＫ上に印刷した（印刷速度２０ｍｍ／秒、ドクターブレード圧力２ｋｇ）。印刷された焼結ペーストのレイアウトは、銀ペースト中のキャビティのレイアウトに鏡面対称になるように配置した。
印刷された転写フィルムを１００℃で１５分間、対流式オーブン（Ｂｉｎｄｅｒ）で乾燥させた。
焼結ペーストを銀箔のキャビティに転写するために、印刷されて乾燥焼結ペーストが提供された転写フィルムを、印刷面側で焼結ペーストとキャビティの一致した配置において銀箔上にセットした。
圧力の分配のために、シリコーンフィルム（Ａｌｐｈａ Ｔｅｃｔｒａｄｅ、タイプ「Ｓｉｌｉｋｏｎ ６０ ｒｏｔ Ｂａｓｉｃ」）を、印刷を有さない転写フィルムの面の上方に配置した。
積層プレス（Ｌａｕｆｅｒ）（銀箔側で１００℃の温度で５ＭＰａの接触圧力で１０秒間、転写フィルム側は加熱しない）で、焼結ペーストを銀箔中のキャビティに転写した。転写完了後、転写フィルムを除去し、銀箔を乾燥焼結ペーストが提供されたキャビティ内のダイオードとともに構成し、加圧焼結プロセスを行った。

Claims (12)

  1. 乾燥金属焼結調製物から作製された複数の分離層断片の、電子部品用基板の複数の所定の導電性表面部分への適用方法であって、
    （１）金属焼結調製物から作製された複数の分離層断片を、前記複数の所定の導電性表面部分に対して鏡面対称である配置において平面転写基板の一面に適用する工程と、
    （２）焼結を防ぎながら、このようにして適用された前記金属焼結調製物を乾燥させる工程と、
    （３）前記電子部品用基板の表面に面するように乾燥金属焼結調製物から作製された前記複数の分離層断片を有する前記平面転写基板を配置し、前記乾燥金属焼結調製物の表面部分と前記電子部品用基板の複数の所定の導電性表面部分とを接触させる工程と、
    （４）工程（３）で生成された接触構成に圧縮力を適用する工程と、
    （５）前記接触構成から前記平面転写基板を除去する工程と、
    を含み、
    工程（４）の完了後に、前記電子部品用基板の複数の所定の導電性表面部分に対する前記乾燥金属焼結調製物の接着力が前記平面転写基板の表面に対する接着力より大きく、
    前記平面転写基板が非焼結性であり、
    前記電子部品用基板は１０μｍ以上５００μｍ以下の１つ以上のくぼみを含む平面状表面を有する基板であり、さらにリードフレーム、セラミック基板、ＤＣＢ基板、および金属複合材からなる群から選択され、少なくとも１つの所定の導電性表面部分はくぼみの中に位置する、適用方法。
  2. 前記平面転写基板が、１２０℃の対象温度で３０分間熱応力にさらされた後、前記平面転写基板の長さと幅の寸法の変化が、ＡＳＴＭ Ｄ １２０４に準拠した方法によって測定された値で、１．５％以下を示す軟質熱可塑性フィルムである、請求項１に記載の方法。
  3. 前記工程（３）の前に、前記電子部品用基板が１つ以上の電子部品とともに構成されている、請求項１または２に記載の方法。
  4. 前記平面転写基板が、前記電子部品用基板上に既に存在する電子部品用の凹部を含む、請求項３に記載の方法。
  5. 前記平面転写基板は、透明な熱可塑性フィルムである、請求項１〜４のいずれか一項に記載の方法。
  6. 前記金属焼結調製物が工程（１）で印刷または噴霧によって適用される請求項１〜５のいずれか一項に記載の方法。
  7. 工程（２）での乾燥プロセスが８０℃以上１５０℃以下の対象温度に加熱することにより１０分以上３０分以下行われる、請求項１〜６のいずれか一項に記載の方法。
  8. ０．５ＭＰａ以上１０ＭＰａ以下の接触圧力が工程（４）で１秒以上３０秒以下適用される、請求項１〜７のいずれか一項に記載の方法。
  9. 最高１５０℃の対象温度の上昇が工程（４）で使用される、請求項１〜８のいずれか一項に記載の方法。
  10. 前記工程（１）では、前記複数の分離層断片を一度に適用する請求項１〜９のいずれか一項に記載の方法。
  11. 前記複数の分離層断片は、前記工程（３）〜（５）の順序で、前記平面転写基板から前記電子部品用基板に一度に転写される請求項１〜１０のいずれか一項に記載の方法。
  12. 請求項１〜１１のいずれか一項に記載の方法によって乾燥金属焼結調製物が提供された電子部品用基板の製造方法。
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