JP2018088525A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2018088525A5 JP2018088525A5 JP2017228355A JP2017228355A JP2018088525A5 JP 2018088525 A5 JP2018088525 A5 JP 2018088525A5 JP 2017228355 A JP2017228355 A JP 2017228355A JP 2017228355 A JP2017228355 A JP 2017228355A JP 2018088525 A5 JP2018088525 A5 JP 2018088525A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- copper
- carrier
- ultra
- migration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 47
- 229910052802 copper Inorganic materials 0.000 claims 47
- 239000010949 copper Substances 0.000 claims 47
- 239000011888 foil Substances 0.000 claims 16
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 13
- 229910052804 chromium Inorganic materials 0.000 claims 13
- 239000011651 chromium Substances 0.000 claims 13
- 239000000758 substrate Substances 0.000 claims 12
- 238000013508 migration Methods 0.000 claims 11
- 238000000034 method Methods 0.000 claims 8
- 238000000059 patterning Methods 0.000 claims 4
- 239000004020 conductor Substances 0.000 claims 3
- 230000005012 migration Effects 0.000 claims 3
- 230000002265 prevention Effects 0.000 claims 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims 2
- 229920000106 Liquid crystal polymer Polymers 0.000 claims 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 239000004642 Polyimide Substances 0.000 claims 2
- 239000004721 Polyphenylene oxide Substances 0.000 claims 2
- 239000004643 cyanate ester Substances 0.000 claims 2
- 239000003822 epoxy resin Substances 0.000 claims 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 239000005011 phenolic resin Substances 0.000 claims 2
- 229920002120 photoresistant polymer Polymers 0.000 claims 2
- 229920003192 poly(bis maleimide) Polymers 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- 229920001721 polyimide Polymers 0.000 claims 2
- 229920001955 polyphenylene ether Polymers 0.000 claims 2
- 229920006380 polyphenylene oxide Polymers 0.000 claims 2
- -1 polytetrafluoroethylene, cyanate Polymers 0.000 claims 2
- 230000003449 preventive effect Effects 0.000 claims 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 1
- 239000012050 conventional carrier Substances 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229920001568 phenolic resin Polymers 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/361,983 US9955588B1 (en) | 2016-11-28 | 2016-11-28 | Multilayer carrier foil |
| US15/361,983 | 2016-11-28 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018088525A JP2018088525A (ja) | 2018-06-07 |
| JP2018088525A5 true JP2018088525A5 (enExample) | 2018-07-26 |
| JP6546252B2 JP6546252B2 (ja) | 2019-07-17 |
Family
ID=61951829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017228355A Active JP6546252B2 (ja) | 2016-11-28 | 2017-11-28 | 多層キャリア箔 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9955588B1 (enExample) |
| JP (1) | JP6546252B2 (enExample) |
| KR (1) | KR101958573B1 (enExample) |
| CN (1) | CN108124392B (enExample) |
| TW (1) | TWI655083B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10581081B1 (en) * | 2019-02-01 | 2020-03-03 | Chang Chun Petrochemical Co., Ltd. | Copper foil for negative electrode current collector of lithium ion secondary battery |
| CN118057914A (zh) * | 2022-11-18 | 2024-05-21 | 鹏鼎控股(深圳)股份有限公司 | 具有极细线路的电路板及其制造方法 |
| CN119947005A (zh) * | 2023-10-26 | 2025-05-06 | 鹏鼎控股(深圳)股份有限公司 | 多层电路板及其制造方法 |
| WO2025094611A1 (ja) * | 2023-11-01 | 2025-05-08 | 三井金属鉱業株式会社 | プリント配線板の製造方法 |
| WO2025094612A1 (ja) * | 2023-11-01 | 2025-05-08 | 三井金属鉱業株式会社 | プリント配線板の製造方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5720347A (en) * | 1980-07-14 | 1982-02-02 | Nippon Denkai Kk | Synthetic foil for printed wiring and its manufacture |
| US7026059B2 (en) * | 2000-09-22 | 2006-04-11 | Circuit Foil Japan Co., Ltd. | Copper foil for high-density ultrafine printed wiring boad |
| JP2005260058A (ja) * | 2004-03-12 | 2005-09-22 | Furukawa Circuit Foil Kk | キャリア付き極薄銅箔、キャリア付き極薄銅箔の製造方法および配線板 |
| JP4927503B2 (ja) * | 2005-12-15 | 2012-05-09 | 古河電気工業株式会社 | キャリア付き極薄銅箔及びプリント配線基板 |
| JP2007214427A (ja) * | 2006-02-10 | 2007-08-23 | Shinko Electric Ind Co Ltd | 配線基板の製造方法 |
| JP5959149B2 (ja) * | 2008-09-05 | 2016-08-02 | 古河電気工業株式会社 | キャリア付き極薄銅箔、並びに銅貼積層板またはプリント配線基板 |
| JP4824828B1 (ja) * | 2010-11-04 | 2011-11-30 | 福田金属箔粉工業株式会社 | 複合金属箔及びその製造方法並びにプリント配線板 |
| KR101510366B1 (ko) * | 2011-03-30 | 2015-04-07 | 미쓰이금속광업주식회사 | 다층 프린트 배선판의 제조 방법 |
| JP5814168B2 (ja) | 2012-03-27 | 2015-11-17 | Jx日鉱日石金属株式会社 | キャリア付銅箔 |
| WO2013161334A1 (ja) * | 2012-04-24 | 2013-10-31 | Jx日鉱日石金属株式会社 | キャリア付銅箔、キャリア付銅箔の製造方法及びプリント配線板 |
| JP2014193606A (ja) | 2013-03-01 | 2014-10-09 | Jx Nippon Mining & Metals Corp | キャリア付銅箔、それを用いた銅張積層板、プリント配線板、それを用いた電子機器及びプリント配線板の製造方法 |
| CN104120471B (zh) * | 2013-04-26 | 2018-06-08 | Jx日矿日石金属株式会社 | 高频电路用铜箔、覆铜板、印刷配线板、带载体的铜箔、电子设备及印刷配线板的制造方法 |
| JP6310191B2 (ja) * | 2013-07-02 | 2018-04-11 | Ｊｘ金属株式会社 | キャリア付銅箔及びその製造方法、銅張積層板の製造方法及びプリント配線板の製造方法 |
| US9210816B1 (en) | 2013-12-18 | 2015-12-08 | Stats Chippac Ltd. | Method of manufacture of support system with fine pitch |
| KR101803390B1 (ko) | 2014-02-14 | 2017-11-30 | 후루카와 덴키 고교 가부시키가이샤 | 캐리어 부착 극박 동박, 그리고 이것을 이용하여 제작된 구리 클래드 적층판, 프린트 배선 기판 및 코어리스 기판 |
| TWI621381B (zh) * | 2014-04-02 | 2018-04-11 | Jx Nippon Mining & Metals Corp | Laminated body with metal foil with carrier |
| CN107003257B (zh) | 2014-12-08 | 2020-07-03 | 三井金属矿业株式会社 | 印刷板线路板的制造方法 |
| KR101852671B1 (ko) * | 2015-01-21 | 2018-06-04 | 제이엑스금속주식회사 | 캐리어 부착 동박, 적층체, 프린트 배선판, 및, 프린트 배선판의 제조 방법 |
-
2016
- 2016-11-28 US US15/361,983 patent/US9955588B1/en active Active
-
2017
- 2017-10-31 TW TW106137578A patent/TWI655083B/zh active
- 2017-11-20 KR KR1020170155109A patent/KR101958573B1/ko active Active
- 2017-11-28 JP JP2017228355A patent/JP6546252B2/ja active Active
- 2017-11-28 CN CN201711215234.8A patent/CN108124392B/zh active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2018088525A5 (enExample) | ||
| CN107170689B (zh) | 芯片封装基板 | |
| KR20080044174A (ko) | 반도체 패키지 및 그 제조방법 | |
| JP2011199077A (ja) | 多層配線基板の製造方法 | |
| TW201513761A (zh) | 電路基板、電路基板的製造方法及電子機器 | |
| CN105409334B (zh) | 使用可去除覆盖层形成具有电镀透孔的层叠结构的方法 | |
| JP5302920B2 (ja) | 多層配線基板の製造方法 | |
| KR101205464B1 (ko) | 인쇄회로기판 제조방법 | |
| US9661759B2 (en) | Printed circuit board and method of manufacturing the same | |
| KR20100002664A (ko) | 금속적층판 및 그 제조방법 | |
| KR101580472B1 (ko) | 회로기판 제조방법 | |
| US8637775B2 (en) | Printed circuit board and method of manufacturing the same | |
| KR101138542B1 (ko) | 다층 인쇄회로기판의 제조방법 | |
| KR100722599B1 (ko) | 필 도금을 이용한 전층 이너비아홀 인쇄회로기판 및 그제조방법 | |
| JPH11251703A (ja) | 回路基板、両面回路基板、多層回路基板及び回路基板の製造方法 | |
| KR100704920B1 (ko) | 범프기판을 이용한 인쇄회로기판 및 제조방법 | |
| JP5439165B2 (ja) | 多層配線板及びその製造方法 | |
| JP5836019B2 (ja) | 部品内蔵基板およびその製造方法 | |
| KR101109277B1 (ko) | 인쇄회로기판의 제조방법 | |
| KR101272664B1 (ko) | 시드층 및 도금층을 포함하는 금속 패턴을 포함하는 다층 인쇄 회로 기판 및 이의 제조 방법 | |
| JP4899409B2 (ja) | 多層プリント配線基板及びその製造方法 | |
| KR100733814B1 (ko) | 인쇄회로기판 제조방법 | |
| KR20080113501A (ko) | 범프 비아를 이용한 인쇄 회로 기판 및 제작 방법 | |
| JP4892924B2 (ja) | 多層プリント配線基板及びその製造方法 | |
| JP5920716B2 (ja) | 部品内蔵基板の製造方法 |