JP2018082006A - パワーモジュール - Google Patents
パワーモジュール Download PDFInfo
- Publication number
- JP2018082006A JP2018082006A JP2016222527A JP2016222527A JP2018082006A JP 2018082006 A JP2018082006 A JP 2018082006A JP 2016222527 A JP2016222527 A JP 2016222527A JP 2016222527 A JP2016222527 A JP 2016222527A JP 2018082006 A JP2018082006 A JP 2018082006A
- Authority
- JP
- Japan
- Prior art keywords
- power
- power card
- cooler
- outermost
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003825 pressing Methods 0.000 claims abstract description 45
- 238000003475 lamination Methods 0.000 abstract description 3
- 239000000470 constituent Substances 0.000 abstract description 2
- 239000011347 resin Substances 0.000 description 17
- 229920005989 resin Polymers 0.000 description 17
- 239000004065 semiconductor Substances 0.000 description 7
- 125000006850 spacer group Chemical group 0.000 description 6
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
10:積層体
12:パワーカード
12a:積層体10の一端に位置する最外のパワーカード
14:冷却器
14a:最外のパワーカード12aに隣接するパワーカード
16:管路
18:絶縁板
20:押圧機構
22:弾性部材
24:押圧プレート
30:最外の冷却器14aに設けられた凹部
42、44、46、48:パワー半導体素子(スイッチング素子又はダイオード)
50:樹脂モールド
52、54、56、58:放熱板
60、62:信号端子群
64、66、68:電力端子
70:スペーサ
72:スペーサ70に設けられた凹部
74、76:ペーサ70に設けられた突出部
80:絶縁板18に設けられた凹部
Claims (1)
- パワーカードと冷却器とが交互に積層された積層体と、
前記積層体の一端に位置する最外の冷却器を、前記積層体の積層方向に沿って押圧する押圧機構と、を備え、
前記最外の冷却器に隣接するパワーカードと前記押圧機構との間に位置する少なくとも一つの部材には、前記隣接するパワーカードの中心部に対応する箇所に凹部が設けられている、
パワーモジュール。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016222527A JP6686848B2 (ja) | 2016-11-15 | 2016-11-15 | パワーモジュール |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016222527A JP6686848B2 (ja) | 2016-11-15 | 2016-11-15 | パワーモジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018082006A true JP2018082006A (ja) | 2018-05-24 |
JP6686848B2 JP6686848B2 (ja) | 2020-04-22 |
Family
ID=62197845
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016222527A Expired - Fee Related JP6686848B2 (ja) | 2016-11-15 | 2016-11-15 | パワーモジュール |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6686848B2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111384158A (zh) * | 2018-12-26 | 2020-07-07 | 株式会社Flosfia | 结晶性氧化物半导体、半导体装置及半导体系统 |
CN111383911A (zh) * | 2018-12-26 | 2020-07-07 | 株式会社Flosfia | 结晶性氧化物膜、半导体装置及半导体系统 |
JP2020167750A (ja) * | 2019-03-28 | 2020-10-08 | 株式会社デンソー | 加圧部材 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11215804A (ja) * | 1998-01-23 | 1999-08-06 | Toshiba Corp | 平型半導体素子用スタック |
JP2005143244A (ja) * | 2003-11-07 | 2005-06-02 | Denso Corp | 電力変換装置 |
JP2007166820A (ja) * | 2005-12-15 | 2007-06-28 | Denso Corp | 電力変換装置 |
JP2011210966A (ja) * | 2010-03-30 | 2011-10-20 | Denso Corp | 電力変換装置 |
JP2012028703A (ja) * | 2010-07-27 | 2012-02-09 | Denso Corp | 電力変換装置 |
-
2016
- 2016-11-15 JP JP2016222527A patent/JP6686848B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11215804A (ja) * | 1998-01-23 | 1999-08-06 | Toshiba Corp | 平型半導体素子用スタック |
JP2005143244A (ja) * | 2003-11-07 | 2005-06-02 | Denso Corp | 電力変換装置 |
JP2007166820A (ja) * | 2005-12-15 | 2007-06-28 | Denso Corp | 電力変換装置 |
JP2011210966A (ja) * | 2010-03-30 | 2011-10-20 | Denso Corp | 電力変換装置 |
JP2012028703A (ja) * | 2010-07-27 | 2012-02-09 | Denso Corp | 電力変換装置 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111384158A (zh) * | 2018-12-26 | 2020-07-07 | 株式会社Flosfia | 结晶性氧化物半导体、半导体装置及半导体系统 |
CN111383911A (zh) * | 2018-12-26 | 2020-07-07 | 株式会社Flosfia | 结晶性氧化物膜、半导体装置及半导体系统 |
JP2020107636A (ja) * | 2018-12-26 | 2020-07-09 | 株式会社Flosfia | 結晶性酸化物膜 |
JP2020107635A (ja) * | 2018-12-26 | 2020-07-09 | 株式会社Flosfia | 結晶性酸化物半導体 |
JP7315137B2 (ja) | 2018-12-26 | 2023-07-26 | 株式会社Flosfia | 結晶性酸化物膜 |
JP7315136B2 (ja) | 2018-12-26 | 2023-07-26 | 株式会社Flosfia | 結晶性酸化物半導体 |
CN111383911B (zh) * | 2018-12-26 | 2023-11-24 | 株式会社Flosfia | 结晶性氧化物膜、半导体装置及半导体系统 |
TWI827752B (zh) * | 2018-12-26 | 2024-01-01 | 日商Flosfia股份有限公司 | 結晶性氧化物半導體 |
CN111384158B (zh) * | 2018-12-26 | 2024-01-09 | 株式会社Flosfia | 结晶性氧化物半导体、半导体装置及半导体系统 |
JP2020167750A (ja) * | 2019-03-28 | 2020-10-08 | 株式会社デンソー | 加圧部材 |
Also Published As
Publication number | Publication date |
---|---|
JP6686848B2 (ja) | 2020-04-22 |
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