JP2018041958A5 - - Google Patents

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Publication number
JP2018041958A5
JP2018041958A5 JP2017164943A JP2017164943A JP2018041958A5 JP 2018041958 A5 JP2018041958 A5 JP 2018041958A5 JP 2017164943 A JP2017164943 A JP 2017164943A JP 2017164943 A JP2017164943 A JP 2017164943A JP 2018041958 A5 JP2018041958 A5 JP 2018041958A5
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JP
Japan
Prior art keywords
insulating film
gate insulating
gate
transistor
oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017164943A
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English (en)
Japanese (ja)
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JP7019346B2 (ja
JP2018041958A (ja
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Publication date
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Publication of JP2018041958A publication Critical patent/JP2018041958A/ja
Publication of JP2018041958A5 publication Critical patent/JP2018041958A5/ja
Application granted granted Critical
Publication of JP7019346B2 publication Critical patent/JP7019346B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017164943A 2016-08-31 2017-08-30 半導体装置 Expired - Fee Related JP7019346B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016169448 2016-08-31
JP2016169448 2016-08-31

Publications (3)

Publication Number Publication Date
JP2018041958A JP2018041958A (ja) 2018-03-15
JP2018041958A5 true JP2018041958A5 (https=) 2020-10-08
JP7019346B2 JP7019346B2 (ja) 2022-02-15

Family

ID=61243565

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017164943A Expired - Fee Related JP7019346B2 (ja) 2016-08-31 2017-08-30 半導体装置

Country Status (4)

Country Link
US (2) US9978879B2 (https=)
JP (1) JP7019346B2 (https=)
CN (1) CN107863352A (https=)
TW (1) TW201826531A (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019220259A1 (ja) * 2018-05-17 2019-11-21 株式会社半導体エネルギー研究所 記憶装置、半導体装置、および電子機器
WO2020084415A1 (ja) * 2018-10-26 2020-04-30 株式会社半導体エネルギー研究所 半導体装置、および半導体装置の作製方法
KR102914910B1 (ko) * 2018-10-26 2026-01-21 가부시키가이샤 한도오따이 에네루기 켄큐쇼 금속 산화물의 제작 방법, 반도체 장치의 제작 방법
CN113491006B (zh) * 2019-02-28 2025-09-23 株式会社半导体能源研究所 半导体装置及半导体装置的制造方法
CN109873037A (zh) * 2019-03-20 2019-06-11 京东方科技集团股份有限公司 薄膜晶体管及其制备方法、显示装置
JP7510431B2 (ja) * 2019-10-11 2024-07-03 株式会社半導体エネルギー研究所 記憶装置
JP7679305B2 (ja) * 2019-11-08 2025-05-19 株式会社半導体エネルギー研究所 半導体装置
WO2024074969A1 (ja) * 2022-10-07 2024-04-11 株式会社半導体エネルギー研究所 記憶装置
KR102793003B1 (ko) * 2022-11-30 2025-04-09 한국생산기술연구원 강유전체 전계 효과 트랜지스터 및 이를 제조하는 방법

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JP5078246B2 (ja) 2005-09-29 2012-11-21 株式会社半導体エネルギー研究所 半導体装置、及び半導体装置の作製方法
EP3614442A3 (en) 2005-09-29 2020-03-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having oxide semiconductor layer and manufactoring method thereof
JP5064747B2 (ja) 2005-09-29 2012-10-31 株式会社半導体エネルギー研究所 半導体装置、電気泳動表示装置、表示モジュール、電子機器、及び半導体装置の作製方法
TWI495108B (zh) * 2008-07-31 2015-08-01 半導體能源研究所股份有限公司 半導體裝置的製造方法
EP2494597A4 (en) 2009-10-30 2015-03-18 Semiconductor Energy Lab SEMICONDUCTOR COMPONENT
JP5497417B2 (ja) 2009-12-10 2014-05-21 富士フイルム株式会社 薄膜トランジスタおよびその製造方法、並びにその薄膜トランジスタを備えた装置
JP2011138934A (ja) 2009-12-28 2011-07-14 Sony Corp 薄膜トランジスタ、表示装置および電子機器
KR102436902B1 (ko) * 2010-04-02 2022-08-25 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
WO2012002292A1 (en) * 2010-07-02 2012-01-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR102115344B1 (ko) 2010-08-27 2020-05-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 기억 장치, 반도체 장치
US9024317B2 (en) 2010-12-24 2015-05-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor circuit, method for driving the same, storage device, register circuit, display device, and electronic device
US9082860B2 (en) * 2011-03-31 2015-07-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR102100425B1 (ko) * 2011-12-27 2020-04-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작 방법
US9029863B2 (en) * 2012-04-20 2015-05-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
DE102013207324A1 (de) 2012-05-11 2013-11-14 Semiconductor Energy Laboratory Co., Ltd. Halbleitervorrichtung und elektronisches Gerät
US8947158B2 (en) 2012-09-03 2015-02-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
TWI761605B (zh) * 2012-09-14 2022-04-21 日商半導體能源研究所股份有限公司 半導體裝置及其製造方法
US9425217B2 (en) * 2013-09-23 2016-08-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
CN113793872A (zh) * 2014-12-10 2021-12-14 株式会社半导体能源研究所 半导体装置及其制造方法
JP6711642B2 (ja) * 2015-02-25 2020-06-17 株式会社半導体エネルギー研究所 半導体装置
US10014325B2 (en) 2016-03-10 2018-07-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
US10741587B2 (en) 2016-03-11 2020-08-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, semiconductor wafer, module, electronic device, and manufacturing method the same
US10333004B2 (en) 2016-03-18 2019-06-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, semiconductor wafer, module and electronic device
KR102320483B1 (ko) 2016-04-08 2021-11-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
JP6968567B2 (ja) 2016-04-22 2021-11-17 株式会社半導体エネルギー研究所 半導体装置の作製方法
US10032918B2 (en) 2016-04-22 2018-07-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same

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