JP2018026557A5 - - Google Patents

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Publication number
JP2018026557A5
JP2018026557A5 JP2017149283A JP2017149283A JP2018026557A5 JP 2018026557 A5 JP2018026557 A5 JP 2018026557A5 JP 2017149283 A JP2017149283 A JP 2017149283A JP 2017149283 A JP2017149283 A JP 2017149283A JP 2018026557 A5 JP2018026557 A5 JP 2018026557A5
Authority
JP
Japan
Prior art keywords
chuck
rotating plate
rotating
gas supply
series
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017149283A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018026557A (ja
Filing date
Publication date
Priority claimed from US15/230,254 external-priority patent/US20180040502A1/en
Application filed filed Critical
Publication of JP2018026557A publication Critical patent/JP2018026557A/ja
Publication of JP2018026557A5 publication Critical patent/JP2018026557A5/ja
Pending legal-status Critical Current

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JP2017149283A 2016-08-05 2017-08-01 ウエハ形状の物品を処理するための装置 Pending JP2018026557A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/230,254 US20180040502A1 (en) 2016-08-05 2016-08-05 Apparatus for processing wafer-shaped articles
US15/230,254 2016-08-05

Publications (2)

Publication Number Publication Date
JP2018026557A JP2018026557A (ja) 2018-02-15
JP2018026557A5 true JP2018026557A5 (enExample) 2018-03-29

Family

ID=61069548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017149283A Pending JP2018026557A (ja) 2016-08-05 2017-08-01 ウエハ形状の物品を処理するための装置

Country Status (5)

Country Link
US (1) US20180040502A1 (enExample)
JP (1) JP2018026557A (enExample)
KR (1) KR20180016280A (enExample)
CN (1) CN107689338A (enExample)
TW (1) TW201816912A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019058601A1 (ja) * 2017-09-25 2019-03-28 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、基板処理装置及びプログラム
US10872789B2 (en) * 2017-09-28 2020-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer cooling system
WO2019213564A1 (en) 2018-05-03 2019-11-07 Nypro Inc. Apparatus, system, and method of providing a solids level monitor
JP6979935B2 (ja) 2018-10-24 2021-12-15 三菱電機株式会社 半導体製造装置および半導体製造方法
JP7455844B2 (ja) * 2018-12-21 2024-03-26 エーエスエムエル ホールディング エヌ．ブイ． ダイレクトドライブのレチクル安全ラッチ
GB201900912D0 (en) * 2019-01-23 2019-03-13 Lam Res Ag Apparatus for processing a wafer, and method of controlling such an apparatus
WO2021167585A1 (en) * 2020-02-17 2021-08-26 Jabil Inc. Apparatus, system and method for providing a manufacturing gripping nozzle
GB202012725D0 (en) * 2020-08-14 2020-09-30 Lam Res Ag Apparatus for processing a wafer-shaped article
GB202109051D0 (en) * 2021-06-24 2021-08-11 Lam Res Ag Device for holding a wafer-shaped article
GB202203589D0 (en) 2022-03-15 2022-04-27 Lam Res Ag Apparatus for processing a wafer-shaped article

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004319720A (ja) * 2003-04-16 2004-11-11 Sony Corp 基板洗浄装置および基板洗浄方法
JP2006013107A (ja) * 2004-06-25 2006-01-12 Dainippon Screen Mfg Co Ltd 基板処理装置
TWI373804B (en) * 2007-07-13 2012-10-01 Lam Res Ag Apparatus and method for wet treatment of disc-like articles
US8596623B2 (en) * 2009-12-18 2013-12-03 Lam Research Ag Device and process for liquid treatment of a wafer shaped article
US8613288B2 (en) * 2009-12-18 2013-12-24 Lam Research Ag High temperature chuck and method of using same
JP5254308B2 (ja) * 2010-12-27 2013-08-07 東京エレクトロン株式会社 液処理装置、液処理方法及びその液処理方法を実行させるためのプログラムを記録した記録媒体
US8997764B2 (en) * 2011-05-27 2015-04-07 Lam Research Ag Method and apparatus for liquid treatment of wafer shaped articles
US8945341B2 (en) * 2011-08-22 2015-02-03 Lam Research Ag Method and device for wet treatment of plate-like articles
US9355883B2 (en) * 2011-09-09 2016-05-31 Lam Research Ag Method and apparatus for liquid treatment of wafer shaped articles
US9136155B2 (en) * 2011-11-17 2015-09-15 Lam Research Ag Method and device for processing wafer shaped articles
US20140041803A1 (en) * 2012-08-08 2014-02-13 Lam Research Ag Method and apparatus for liquid treatment of wafer shaped articles
JP5894897B2 (ja) * 2012-09-28 2016-03-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
US9147593B2 (en) * 2012-10-10 2015-09-29 Lam Research Ag Apparatus for liquid treatment of wafer shaped articles
US9093482B2 (en) * 2012-10-12 2015-07-28 Lam Research Ag Method and apparatus for liquid treatment of wafer shaped articles
US9245777B2 (en) * 2013-05-15 2016-01-26 Lam Research Ag Apparatus for liquid treatment of wafer shaped articles and heating system for use in such apparatus
US10490426B2 (en) * 2014-08-26 2019-11-26 Lam Research Ag Method and apparatus for processing wafer-shaped articles

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