TW201816912A - 用以處理晶圓狀物件之設備 - Google Patents

用以處理晶圓狀物件之設備 Download PDF

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TW201816912A
TW201816912A TW106125664A TW106125664A TW201816912A TW 201816912 A TW201816912 A TW 201816912A TW 106125664 A TW106125664 A TW 106125664A TW 106125664 A TW106125664 A TW 106125664A TW 201816912 A TW201816912 A TW 201816912A
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世中 龔
米蘭 普利斯卡
貝哈德 洛伊德爾
麥可 布魯格
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奧地利商蘭姆研究股份公司
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Abstract

一種用以處理晶圓狀物件的設備，其包含具有一系列的接觸元件之旋轉卡盤，當晶圓狀物件安裝於旋轉卡盤上時，該系列的接觸元件圍繞該晶圓狀物件。非旋轉板係定位於該系列的接觸元件內側。該板包括配置成供給氣體的氣體供給部，以根據白努利定律支撐晶圓狀物件而不需接觸非旋轉板。

Description

用以處理晶圓狀物件之設備
本發明大致關於用以處理例如半導體晶圓的晶圓狀物件之設備。
半導體晶圓經歷各種表面處理製程，例如蝕刻、清潔、拋光及材料沉積。為了容許如此製程，單一晶圓可相對於一或更多處理流體噴嘴藉由與可旋轉的承載件相關連的卡盤加以支撐，如在美國專利第4,903,717號和第5,513,668號中所述者。
上述專利案的卡盤根據白努利定律將晶圓支撐在氣墊上。然而，在習知的白努力卡盤中，將液體配送至晶圓下側的周邊區域上是困難或不便的。
在一實施態樣中，本發明關於用以處理晶圓狀物件的設備，其包含具有一系列的接觸元件之旋轉卡盤，當晶圓狀物件安裝於旋轉卡盤上時，該系列的接觸元件圍繞該晶圓狀物件。非旋轉板係定位於該系列的接觸元件內側。該板包括配置成供給氣體的氣體供給部，以根據白努利定律支撐晶圓狀物件而不需接觸非旋轉板。
在根據本發明之設備的較佳實施例中，氣體供給部為相對於旋轉卡盤的旋轉軸以徑向向外導向的環形氣體供給部。
在根據本發明之設備的較佳實施例中，非旋轉板係緊固至固定式中央柱上。
在根據本發明之設備的較佳實施例中，非旋轉板大致為圓形，且與旋轉卡盤的旋轉軸同軸安裝，旋轉卡盤具有大於預定直徑的直徑。
在根據本發明之設備的較佳實施例中，接觸表面在接觸位置徑向朝內，且平行於旋轉卡盤的旋轉軸。
在根據本發明之設備的較佳實施例中，旋轉卡盤包含用以繞中央柱旋轉的卡盤基體，旋轉基體圍繞包含非旋轉板的流體分配歧管。
在根據本發明之設備的較佳實施例中，該系列的接觸元件之各者包含從卡盤基體突出的桿部，且接觸表面從桿部的末端徑向朝內突出以覆蓋在接觸位置的非旋轉板。
在根據本發明之設備的較佳實施例中，氣體供給部為氣體供給噴嘴的環形陣列，其包含開口在非旋轉板的表面之圓形系列的鑽孔，當晶圓狀物件安裝至旋轉卡盤上時，非旋轉板之該表面面對晶圓狀物件，圓形系列的鑽孔之各者從非旋轉板內側之表面以相對於旋轉卡盤的旋轉軸之斜向角度延伸。
在根據本發明之設備的較佳實施例中，非旋轉板更包含複數氣體噴嘴，其對於氣體供給部徑向朝外而定位，且當晶圓狀物件定位在旋轉卡盤上時朝晶圓狀物件的邊緣區域導向。
在根據本發明之設備的較佳實施例中，複數液體配送噴嘴係由模組化噴嘴區塊所包含，該模組化噴嘴區塊可附接至非旋轉板，且可從非旋轉板拆卸。
在根據本發明之設備的較佳實施例中，該系列的接觸元件為一系列的銷，該系列的銷之各者可繞個別的銷軸旋轉，以使相應夾持銷的接觸表面從徑向外部裝載位置移動至徑向內部接觸位置。
在根據本發明之設備的較佳實施例中，液體配送器係定位成當晶圓狀物件定位在旋轉卡盤上時，配送液體至晶圓狀物件背向非旋轉板的一側上。
在根據本發明之設備的較佳實施例中，氣體供給部包含氣體供給噴嘴的環形陣列或環形氣體供給噴嘴。
在根據本發明之設備的較佳實施例中，惰性氣體供給部係與氣體供給部連通。
在根據本發明之設備的較佳實施例中，製程液體的供給部係與複數液體配送噴嘴連通。
在根據本發明之設備的較佳實施例中，製程液體的供給部係與液體配送器連通。
在根據本發明之設備的較佳實施例中，輻射加熱組件係定位成使得當晶圓狀物件安裝在旋轉卡盤上時，該晶圓狀物件定位於輻射加熱組件與非旋轉板之間。
在根據本發明之設備的較佳實施例中，輻射加熱組件包含複數LED燈，且其中非旋轉板包含由石英或藍寶石形成的部分。
在根據本發明之設備的較佳實施例中，接觸表面係配置成僅在晶圓狀物件的側表面接觸晶圓狀物件的邊緣。
在根據本發明之設備的較佳實施例中，接觸表面朝內且平行於旋轉卡盤的旋轉軸。
現參照圖1，旋轉卡盤10包含圓形系列的接觸元件12，其在本實施例之數量為八，但可為三或更多之任何所需的數量。較佳為一系列六個接觸元件12。接觸元件12各在其遠端包含接觸表面14，該接觸表面14在旋轉卡盤10使用中時接觸晶圓W。接觸元件12可為夾持銷，但接觸表面14更佳地為平滑且平行於旋轉卡盤10的旋轉軸，因為它們僅需要提供晶圓W橫向而非下方的支撐。
如所示，接觸元件12的接觸表面14與接觸元件12的旋轉軸偏心，使得接觸表面14可在用於裝載與卸除晶圓W之徑向外部非接觸位置與工作位置之間移動。接觸元件12的定位係使得旋轉卡盤10配置成固持具有預定直徑的晶圓，例如直徑300mm或直徑450mm的半導體晶圓。
固定式流體分配歧管20定位在由接觸元件12所描述之圓內，且當晶圓W定位在旋轉卡盤10上時該歧管20係定位在該晶圓W下。歧管20包含同為固定式的上板25，且在其內形成內側系列的排放噴嘴22與外側系列的排放噴嘴24。該等系列的排放噴嘴22、24之其一或兩者可形成單一連續環形噴嘴或圓形系列的弓形噴嘴作為替代。
三模組化液體噴嘴組件26、30可拆卸地附接至歧管20與上板25，且各包括一系列的液體排放流孔28、31，液體排放流孔28、31係定位成朝上、與徑向朝外(如果需要的話)排放製程液體至晶圓W的面朝下表面上、晶圓W的周邊區域中。
現轉至圖2，可見到旋轉卡盤10包含由剛性互連的下部件11與上部件13組成之卡盤基體。卡盤基體係安裝成繞固定式中央柱50旋轉，因而係安裝在設備的支撐架36上。定子32也安裝在支撐架36上，其與緊固至卡盤基體的轉子34配合以驅動旋轉卡盤10轉動。
流體分配歧管20包括剛性安裝至固定式中央柱50的上板25。旋轉卡盤10圍繞歧管20。旋轉卡盤10也包括夾在下部件11與上部件13之間的環形齒輪15，其包含具有朝外突出齒的環，該環與旋轉卡盤10同軸、並同時與形成在各接觸元件12底部的互補齒接合。卡盤基體與環形齒輪15的轉動從而一起使該系列的接觸元件12旋轉。
如在圖2處可見，此實施例的接觸元件12為曲柄狀，使得從上觀視時它們的上端與下端與歧管20重疊，但該接觸元件12也包括徑向朝外突出的中介部，其提供接觸元件12相對於歧管20之間隙。
中央柱50包含液體導管56與57，其係受供給來自製程液體之供給部的製程液體。液體導管56、57分別與在液體分配歧管20中形成的液體導管27與29連通，因而分別與示於圖1之液體噴嘴組件26、30連通。組件26的模組化本質允許其容易被移除與更換以供清潔、並根據所考慮的製程設置不同尺寸與形狀的排放流孔。
中央柱50亦包括連接至氣體(較佳為氮)源的氣體導管54。氣體導管54在其下游末端開放至形成在歧管20中之腔室23內。腔室23與如圖2所示的圓形系列的排放噴嘴24連通，該排放噴嘴24為形成在上板25中且從徑向內入口斜向延伸至徑向外出口的鑽孔。
中央柱50更進一步包括同樣連接至氣體(再次，較佳為氮)源的氣體導管52。導管52在其下游末端開放至形成在歧管20中之腔室21內。腔室21與如圖2所示的圓形系列的排放噴嘴22連通，該排放噴嘴22為形成在上板25中且軸向延伸通過上板25的鑽孔。
也示於圖2之液體配送器45用以配送液體至晶圓W之面朝上的表面上。配送器45可採用例如擺動吊桿臂的形態，其沿著待處理晶圓的上表面上的弧移動朝下懸掛的排放噴嘴，以及移動至靜止位置。
圖2也顯示加熱器40，其較佳為輻射加熱組件。更佳地，加熱器40包含多數藍光LED加熱元件42，其藉由板44從製程環境隔離，該板44由對於LED加熱元件42放射的輻射為通透性的材料(例如石英或藍寶石)製成。
在圖2將觀察到，觸及晶圓W的接觸元件12的接觸表面14僅在晶圓的外周邊邊緣處觸及晶圓W。在此實施例中，那些表面平行於旋轉卡盤10的旋轉軸。如此，接觸元件12針對橫向位移閉鎖晶圓W但不提供晶圓下方的支撐。此設置允許在與上板25不同的軸向距離處的不同位置夾持晶圓W。
在使用中，氣體係供給通過導管54至腔室23內並透過噴嘴24排放。晶圓W係較佳地以在0.3至3.0mm的範圍內之距離定位於上板25上且平行於上板25。通過噴嘴的氣體流速受調整，使得晶圓W根據白努利定律受支撐。
晶圓W的裝載與卸除可藉由供給氣體通過導管52之加以協助，該氣體通至腔室21內且排放通過軸向噴嘴22。通過噴嘴22的氣體供給可獨立於通過噴嘴24的氣體供給加以控制。該供給可為交替的或同時的。
接觸表面14的上述配置有助於以此方式達成晶圓W的穩定支撐，因為到非旋轉板的距離為取決於氣流和晶圓狀物件重量(進一步取決於重力與質量)的平衡狀態。平行接觸表面14可例如為垂直平面或圓柱體，其具有平行於旋轉卡盤之旋轉軸的母線。因此，晶圓狀物件的徑向支持係由夾持元件提供，而軸向支持係由氣墊提供。接觸表面的水平凹口將傾向限制晶圓W的軸向位移，且較佳地避免。然而，如果在接觸元件中使用凹口，它應該在相應於針對所考慮的氣體流和晶圓重量預測之平衡狀態的位置。
然後，接觸元件12係藉由使環形齒輪15與卡盤基體11、13以本身已知的方式相對旋轉而關閉，之後晶圓W可藉由一致地旋轉卡盤基體11、13與接觸元件12而旋轉。
在所示設備上待執行的典型製程將為晶圓的斜角蝕刻，其係單獨執行或與背側蝕刻共同執行。在此製程中，晶圓W定位在卡盤上，其元件側朝下且其背側朝上。供給通過導管56、27且藉由噴嘴組件26之排放噴嘴28排放的蝕刻液體將衝擊元件側之定義的周邊區域，從而提供斜角蝕刻。其後清洗液體係供給通過導管57、29且藉由噴嘴組件30之排放噴嘴31排放。
如果也需要蝕刻晶圓W面朝上的背側，則製程液體可從配送器45配送。藉由使用加熱器40執行晶圓的加熱來促進蝕刻。
不同晶圓可能需要例如2、3或4mm之不同程度的斜角蝕刻。模組化液體噴嘴組件26的提供也允許組件的快速更換，液體噴嘴組件26的噴嘴係取決於所需斜面蝕刻的徑向範圍而不同地定位。
儘管本發明係結合其數個較佳實施例來加以描述，然而應瞭解，該等實施例僅供說明本發明，且本發明不受限於該等實施例，而是包括由隨附申請專利範圍的真實範疇及精神所涵蓋之範圍。
10‧‧‧旋轉卡盤
11‧‧‧下部件
12‧‧‧接觸元件
13‧‧‧上部件
14‧‧‧接觸表面
15‧‧‧環形齒輪
20‧‧‧歧管
21‧‧‧腔室
22‧‧‧排放噴嘴
23‧‧‧腔室
24‧‧‧排放噴嘴
25‧‧‧上板
26‧‧‧液體噴嘴組件
27‧‧‧液體導管
28‧‧‧流孔
29‧‧‧液體導管
30‧‧‧液體噴嘴組件
31‧‧‧流孔
32‧‧‧定子
34‧‧‧轉子
36‧‧‧支撐架
40‧‧‧加熱器
42‧‧‧加熱元件
44‧‧‧板
45‧‧‧配送器
50‧‧‧中央柱
52‧‧‧氣體導管
54‧‧‧氣體導管
56‧‧‧液體導管
57‧‧‧液體導管
W‧‧‧晶圓
在閱讀下列本發明之「實施方式」並參照隨附圖式之後，本發明之其他目的、特徵、及優點將更顯而易見。其中：
圖1為根據本發明之第一實施例用於設備中的旋轉卡盤的俯視圖；及
圖2為根據本發明之第一實施例的設備的橫剖面圖，其中旋轉卡盤係沿著圖1之線II-II剖切。

Claims (20)

  1. 一種用於處理晶圓狀物件的設備，包含： 一旋轉卡盤，用以在其上容納具有一預定直徑的一晶圓狀物件，該旋轉卡盤包含當一晶圓狀物件安裝在該旋轉卡盤上時圍繞該晶圓狀物件之一系列的接觸元件，該系列的接觸元件在該旋轉卡盤旋轉時在一圓上旋轉，且該系列的接觸元件的各者為可移動的，以便使一相應接觸元件的一接觸表面從一徑向外部裝載位置移動至一徑向內部接觸位置； 該設備更包含一非旋轉板，該非旋轉板係定位於該系列的接觸元件內側，其覆蓋由該系列的接觸元件所圍繞的面積之至少90%並包含一氣體供給部，該氣體供應部係配置成供給氣體以根據白努利定律支撐該晶圓狀物件而不接觸該非旋轉板。
  2. 如申請專利範圍第1項之用於處理晶圓狀物件的設備，其中該氣體供給部為相對於該旋轉卡盤的一旋轉軸以徑向向外導向的一環形氣體供給部。
  3. 如申請專利範圍第1項之用於處理晶圓狀物件的設備，其中該非旋轉板係緊固至一固定式中央柱上。
  4. 如申請專利範圍第1項之用於處理晶圓狀物件的設備，其中該非旋轉板大致為圓形且與該旋轉卡盤的一旋轉軸同軸安裝，該旋轉卡盤具有大於該預定直徑的一直徑。
  5. 如申請專利範圍第1項之用於處理晶圓狀物件的設備，其中該接觸表面在該接觸位置徑向朝內，且平行於該旋轉卡盤的該旋轉軸。
  6. 如申請專利範圍第1項之用於處理晶圓狀物件的設備，其中該旋轉卡盤包含用以繞一固定式中央柱旋轉的一卡盤基體，該旋轉基體圍繞包含該非旋轉板的一流體分配歧管。
  7. 如申請專利範圍第6項之用於處理晶圓狀物件的設備，其中該系列的接觸元件之各者包含從該卡盤基體突出的一桿部，且其中該接觸表面從該桿部的一遠端徑向朝內突出以便覆蓋在該接觸位置的該非旋轉板。
  8. 如申請專利範圍第1項之用於處理晶圓狀物件的設備，其中該氣體供給部為一氣體供給噴嘴的環形陣列，其包含開口在該非旋轉板的一表面之一圓形系列的鑽孔，當該晶圓狀物件安裝至該旋轉卡盤上時，該非旋轉板之該表面面對該晶圓狀物件，該圓形系列的鑽孔之各者從該非旋轉板內側之一表面以相對於該旋轉卡盤的一旋轉軸之一斜向角度延伸。
  9. 如申請專利範圍第1項之用於處理晶圓狀物件的設備，其中該非旋轉板更包含複數液體配送噴嘴，該複數液體配送噴嘴對於該氣體供給部徑向朝外而定位，且當該晶圓狀物件定位在該旋轉卡盤上時朝該晶圓狀物件的一邊緣區域導向。
  10. 如申請專利範圍第9項之用於處理晶圓狀物件的設備，其中該複數液體配送噴嘴係由一模組化噴嘴區塊所包含，該模組化噴嘴區塊係可附接至該非旋轉板，且可自該非旋轉板拆卸。
  11. 如申請專利範圍第1項之用於處理晶圓狀物件的設備，其中該系列的接觸元件為一系列的銷，該系列的銷之各者可繞個別的一夾軸旋轉，以使一相應銷的一接觸表面從一徑向外部裝載位置移動至一徑向內部接觸位置。
  12. 如申請專利範圍第1項之用於處理晶圓狀物件的設備，更包含一液體配送器，其係定位成在該晶圓狀物件定位在該旋轉卡盤上時，配送液體至該晶圓狀物件背向該非旋轉板的一側上。
  13. 如申請專利範圍第1項之用於處理晶圓狀物件的設備，其中該氣體供給部包含一氣體供給噴嘴的環形陣列或一環形氣體供給噴嘴。
  14. 如申請專利範圍第1項之用於處理晶圓狀物件的設備，更包含一惰性氣體供給部，其係與該氣體供給部連通。
  15. 如申請專利範圍第9項之用於處理晶圓狀物件的設備，更包含一製程液體的供給部，其係與該複數液體配送噴嘴連通。
  16. 如申請專利範圍第12項之用於處理晶圓狀物件的設備，更包含一製程液體的供給部，其係與該液體配送器連通。
  17. 如申請專利範圍第1項之用於處理晶圓狀物件的設備，更包含一輻射加熱組件，其係定位成使得當該晶圓狀物件安裝在該旋轉卡盤上時，該晶圓狀物件係定位於該輻射加熱組件與該非旋轉板之間。
  18. 如申請專利範圍第17項之用於處理晶圓狀物件的設備，其中該輻射加熱組件包含複數LED燈，且其中該非旋轉板包含由石英或藍寶石形成的部分。
  19. 如申請專利範圍第1項之用於處理晶圓狀物件的設備，其中該接觸表面係配置成僅在該晶圓狀物件的一側表面接觸該晶圓狀物件的一邊緣。
  20. 如申請專利範圍第19項之用於處理晶圓狀物件的設備，其中該接觸表面朝內且平行於該旋轉卡盤的一旋轉軸。
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JP5894897B2 (ja) * 2012-09-28 2016-03-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
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US20180040502A1 (en) 2018-02-08
KR20180016280A (ko) 2018-02-14
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