CN107689338A - 用于处理晶片状物品的装置 - Google Patents

用于处理晶片状物品的装置 Download PDF

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CN107689338A
CN107689338A CN201710659207.3A CN201710659207A CN107689338A CN 107689338 A CN107689338 A CN 107689338A CN 201710659207 A CN201710659207 A CN 201710659207A CN 107689338 A CN107689338 A CN 107689338A
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wafer
rotating plate
rotary chuck
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孔施钟
米兰·普丽莎
伯恩哈德·洛伊德尔
迈克尔·布鲁格
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Lam Research Corp
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Abstract

本发明涉及一种用于处理晶片状物品的装置，其包括：旋转卡盘，当晶片状物品被安装在旋转卡盘上时，该旋转卡盘具有围绕晶片状物品的一系列接触元件。非旋转板位于一系列接触元件的内部。该板包括气体供应装置，所述气体供应装置构造成供应气体，以便根据伯努利原理，在不接触非旋转板的情况下支撑所述晶片状物品。

Description

用于处理晶片状物品的装置
技术领域
本发明一般涉及用于处理诸如半导体晶片之类的晶片状物品的装置。
背景技术
半导体晶片会经受诸如蚀刻、清洗、抛光和材料沉积等各种表面处理处理工艺。为了适应这样的处理，可以通过与可旋转载体相关联的卡盘相对于一个或多个处理流体喷嘴来支撑单个晶片，例如在美国专利号4,903,717和5,513,668中所描述的。
根据伯努利的原则，上述专利的卡盘将晶片支撑在气垫上。然而，在常规的伯努利卡盘中，将液体分配到晶片的下侧的周边区域是困难或不方便的。
发明内容
一方面，本发明涉及一种用于处理晶片状物品的装置，所述装置包括旋转卡盘，当晶片被安装在所述旋转卡盘上时，所述旋转卡盘具有围绕晶片状物品的一系列接触元件。非旋转板位于一系列接触元件的内部。该板包括气体供应装置，所述气体供应装置构造成供应气体，以便根据伯努利原理，在不接触非旋转板的情况下支撑所述晶片状物品。
在根据本发明的装置的优选实施方式中，气体供应装置是相对于旋转卡盘的旋转轴线径向向外指向的环形气体供应装置。
在根据本发明的装置的优选实施方式中，非旋转板固定在固定的中心柱上。
在根据本发明的装置的优选实施方式中，非旋转板通常为圆形并与旋转卡盘的旋转轴线同轴安装，旋转卡盘具有大于预定直径的直径。
在根据本发明的装置的优选实施方式中，接触表面在接触位置处径向向内并且平行于旋转卡盘的旋转轴线。
在根据本发明的装置的优选实施方式中，旋转卡盘包括安装成围绕中心柱旋转的卡盘基体，所述卡盘基体围绕包括非旋转板的流体分配歧管。
在根据本发明的装置的优选实施方式中，一系列接触元件中的每一个包括从卡盘基体突出的杆，并且接触表面从所述杆的远端径向向内突出，以在接触位置覆在所述非旋转板上。
在根据本发明的装置的优选实施方式中，气体供应装置是气体供应喷嘴的环形阵列，其包括圆形的一系列孔，当晶片状物品安装在旋转卡盘上时，所述圆形的一系列孔开在非旋转板的面向晶片状物品的表面上，所述圆形的一系列孔中的每一个从非旋转板的内部的表面以相对于旋转卡盘的旋转轴线一倾斜角度延伸。
在根据本发明的装置的优选实施方式中，非旋转板还包括多个液体分配喷嘴，所述多个液体分配喷嘴位于气体供应装置的径向外侧，并且当晶片状物品定位在所述旋转卡盘上时指向晶片状物品的边缘区域。
在根据本发明的装置的优选实施方式中，多个液体分配喷嘴由可附接到非旋转板上并可从其拆卸的模块化喷嘴块组成。
在根据本发明的装置的优选实施方式中，一系列接触元件是一系列销，所述一系列销中的每一个可以围绕相应的销轴线旋转，以使相应销的接触表面从径向外部装载位置移动到径向内部接触位置。
在根据本发明的装置的优选实施方式中，液体分配器被定位成当晶片状物品定位在旋转卡盘上时，将液体分配到晶片状物品的远离非旋转板的一侧上。
在根据本发明的装置的优选实施方式中，气体供应装置包括气体供应喷嘴的环形阵列或环形气体供应喷嘴。
在根据本发明的装置的优选实施方式中，惰性气体的供应装置与气体供应装置连通。
在根据本发明的装置的优选实施方式中，处理液体的供应装置与多个液体分配喷嘴连通。
在根据本发明的装置的优选实施方式中，处理液体的供应装置与液体分配器连通。
在根据本发明的装置的优选实施方式中，辐射加热组件被定位成使得当晶片状物品安装在旋转卡盘上时，晶片状物品位于辐射加热组件和非旋转板之间。
在根据本发明的装置的优选实施方式中，辐射加热组件包括多个LED灯，并且其中非旋转板包括由石英或蓝宝石形成的部分。
在根据本发明的装置的优选实施方式中，接触表面被配置为仅在晶片状物品的侧表面接触其边缘。
在根据本发明的装置的优选实施方式中，接触表面面向内并且平行于旋转卡盘的旋转轴线。
具体而言，本发明的一些方面可以阐述如下：
1.一种用于处理晶片状物品的装置，其包括旋转卡盘，所述旋转卡盘适于在其上接收具有预定直径的晶片状物品，所述旋转卡盘包括当晶片状物品安装在所述旋转卡盘上时围绕所述晶片状物品的一系列接触元件，所述一系列接触元件随着旋转卡盘旋转而围成圈旋转，并且所述一系列接触元件中的每一个能移动以使相应接触元件的接触表面从径向外部装载位置移动到径向内部接触位置；
所述装置还包括非旋转板，所述非旋转板位于所述一系列接触元件的内部，覆盖由所述一系列接触元件包围的区域的至少90％，并且包括气体供应装置，所述气体供应装置构造成供应气体，以便根据伯努利原理在不接触所述非旋转板的情况下支撑所述晶片状物品。
2.根据条款1所述的装置，其中所述气体供应装置是相对于所述旋转卡盘的旋转轴线径向向外指向的环形气体供应装置。
3.根据条款1所述的装置，其中所述非旋转板固定在固定的中心柱上。
4.根据条款1所述的装置，其中所述非旋转板通常为圆形并与所述旋转卡盘的旋转轴线同轴地安装，所述旋转卡盘具有大于所述预定直径的直径。
5.根据条款1所述的装置，其中所述接触表面在所述接触位置处径向向内并且平行于所述旋转卡盘的旋转轴线。
6.根据条款1所述的装置，其中所述旋转卡盘包括安装成围绕所述中心柱旋转的卡盘基体，所述卡盘基体围绕包括所述非旋转板的液体分配歧管。
7.根据条款6所述的装置，其中所述一系列接触元件中的每一个包括从所述卡盘基体突出的杆，并且其中所述接触表面从所述杆的远端径向向内突出，以在所述接触位置覆在所述非旋转板上。
8.根据条款1所述的装置，其中所述气体供应装置是气体供应喷嘴的环形阵列，所述气体供应喷嘴的环形阵列包括圆形的一系列孔，当晶片状物品安装在所述旋转卡盘上时，所述圆形的一系列孔开在所述非旋转板的面向所述晶片状物品的表面上，所述圆形的一系列孔中的每一个从所述非旋转板的内部的所述表面以相对于所述旋转卡盘的旋转轴线一倾斜角度延伸。
9.根据条款1所述的装置，其中所述非旋转板还包括多个液体分配喷嘴，所述多个液体分配喷嘴位于所述气体供应装置径向外侧，并且当晶片状物品定位在所述旋转卡盘上时指向所述晶片状物品的边缘区域。
10.根据条款9所述的装置，其中所述多个液体分配喷嘴由能附接到所述非旋转板上并能从所述非旋转板拆卸的模块化喷嘴块组成。
11.根据条款1所述的装置，其中所述一系列接触元件是一系列销，所述一系列销中的每一个能围绕相应的销轴线旋转，以便使相应销的接触表面从径向外部装载位置移动到径向内部接触位置。
12.根据条款1所述的装置，其还包括液体分配器，所述液体分配器定位成当晶片状物品定位在所述旋转卡盘上时将液体分配到所述晶片状物品的远离所述非旋转板的一侧上。
13.根据条款1所述的装置，其中所述气体供应装置包括气体供应喷嘴的环形阵列或环形气体供应喷嘴。
14.根据条款1所述的装置，其还包括与所述气体供应装置连通的惰性气体的供应装置。
15.根据条款9所述的装置，其还包括与所述多个液体分配喷嘴连通的处理液体的供应装置。
16.根据条款12所述的装置，其还包括与所述液体分配器连通的处理液体的供应装置。
17.根据条款1所述的装置，其还包括辐射加热组件，所述辐射加热组件被定位成使得当晶片状物品安装在所述旋转卡盘上时，所述晶片状物品位于所述辐射加热组件和所述非旋转板之间。
18.根据条款17所述的装置，其中所述辐射加热组件包括多个LED灯，并且其中所述非旋转板包括由石英或蓝宝石形成的部分。
19.根据条款1所述的装置，其中所述接触表面构造成仅在晶片状物品的侧表面接触所述晶片状物品的边缘。
20.根据条款19所述的装置，其中所述接触表面面向内并平行于所述旋转卡盘的旋转轴线。
附图说明
在阅读了参照附图给出的本发明的优选实施方式的以下详细描述之后，本发明的其它目的、特征和优点将变得更加明显，其中：
图1是用于根据本发明的第一实施方式的装置中的旋转卡盘的平面图；和
图2是根据本发明的第一实施方式的装置的横截面图，其中旋转卡盘沿着图1中的II-II线被截面。
具体实施方式
现在参考图1，旋转卡盘10包括圆形的一系列接触元件12，其在该实施方式中的数量为8个，但可以是三个或三个以上的任意所需数量。一系列的六个接触元件12是优选的。每一个接触元件12包括在其远端处的接触表面14，当卡盘10在使用时接触表面14与晶片W接触。接触元件12可以是夹紧销，但是更优选地，接触表面14平滑并且平行于旋转卡盘10的旋转轴线，因为它们仅需要为晶片W提供侧向而不是下方的支撑。
接触元件12的接触表面14与接触元件12的旋转轴线偏心，使得表面14可在用于装载和卸载晶片W的径向外部非接触位置和工作位置之间移动，如图所示。接触元件12的定位使得卡盘10构造成保持预定直径的晶片，例如直径为300mm或直径为450mm的半导体晶片。
固定流体分配歧管20定位在由接触元件12描述的圆内，并且当晶片W定位在卡盘10上时，位于晶片W的下方。歧管20包括同样固定的上板25，并且其中形成有内部的一系列排出喷嘴22和外部的一系列排出喷嘴24。可以将一系列喷嘴22、24中的一者或两者全部替代地形成为单个连续的环形喷嘴或圆形的一系列弧形喷嘴。
三个模块化液体喷嘴组件26、30可移除地附接到歧管20和上板25，并且每一个包括一系列液体排出孔28、31，所述一系列液体排出孔28、31定位成，在其周边区域中，向上排放处理液体，以及，如果需要，将处理液体径向向外排放到晶片W的面向下的表面上。
现在转到图2，可以看出，旋转卡盘10包括由刚性互连的下部11和上部13构成的卡盘基体。卡盘基体安装成围绕固定的中心柱50旋转，中心柱50又安装在装置的支撑框架36上。定子32也安装在支撑框架36上，所述定子32与固定到卡盘基体的转子34配合，以驱动卡盘10旋转。
包括上板25的流体分配歧管20刚性地安装到固定的中心柱50。卡盘10围绕歧管20。卡盘10还包括夹在元件11和13之间的环形齿轮15，该环形齿轮15包括与卡盘10同轴的向外突出的齿和形成在每个接触元件12的基部处的同时啮合的互补齿。卡盘基体和环形齿轮15的旋转从而使一系列接触元件12一致地旋转。
从图2中可以看出，本实施方式的接触元件12是曲柄形的，使得它们的上端和下端从上方观察时与歧管20重叠，并且还包括径向向外突出的中间部分，其向接触元件12提供相对于歧管20的空隙。
中心柱50包括液体管道56和57，所述液体管道56和57从其供应源供应处理液体。液体管道56、57分别与形成在流体分配歧管20中的液体管道27和29连通，流体分配歧管20又分别与的液体喷嘴组件26和30连通，如图1所示。组件26的模块化性质允许它们容易地移除和更换以进行清洁，并且根据所讨论的处理提供不同尺寸和形状的排出孔。
中心柱50还包括气体管道54，其连接到优选为氮气的气体源。管道54在其下游端开口进入形成在歧管20中的室23。室23与圆形的一系列排出喷嘴24连通，如图2所示，一系列排出喷嘴24是在板25上形成的孔，它们从径向内部入口向径向外部出口倾斜延伸。
中心柱50还进一步包括气体管道52，气体管道52同样与再次优选为氮气的气体源连接。管道52在其下游端开口进入形成在歧管20中的室21。室21与圆形的一系列排出喷嘴22连通，如图2所示，一系列排出喷嘴22是在板25上形成的孔，它们轴向延伸穿过板25。
同样也在图2中示出的是液体分配器45，其用于将液体分配到晶片W的面向上的表面上。分配器45可以例如采取吊杆摇臂的形式，其使得向下悬挂的排出喷嘴沿着待处理晶片的上表面上方的弧形移动，并移动到停止位置。
图2还示出了加热器40，其优选地是辐射加热组件。更优选地，加热器40包括多个蓝色LED加热元件42，其通过板44被从工艺环境屏蔽，板44由对LED 42发射的辐射透明的材料(诸如石英或蓝宝石)制成。
将在图2中观察到，接触晶片W的接触元件12的表面14仅在晶片的外周边缘处这样做。在该实施方式中，这些表面平行于卡盘10的旋转轴线。因此，接触元件12检查晶片W以防止横向位移，但不向晶片提供下面的支撑。这种布置允许晶片W被夹持在距上板25不同轴向距离处的不同位置。
在使用中，气体通过管道54供应到室23中并通过喷嘴24排出。晶片W位于上板25上方并平行于上板25，优选地在0.3至3.0mm的范围内的距离处。根据伯努利原理，调整通过喷嘴的气体的流速，使得晶片W被支撑。
可以通过通过管道52供应气体来辅助晶片W的装载和卸载，气体进入室21并通过轴向喷嘴22排出。通过喷嘴22的气体供应可以独立于通过喷嘴24供应的气体进行控制。供应可以是交替的或同时的。
接触表面14的上述构造有助于以这种方式实现晶片W的稳定支撑，因为到非旋转板的距离是取决于气流和晶片状物品的重量(进一步取决于重力和质量)的平衡。平行接触表面14可以例如是具有平行于旋转卡盘的旋转轴线的母线的竖直平面或圆柱面。因此，晶片状物品的径向轴承由夹紧元件提供，而轴向轴承由气垫提供。接触表面中的水平切口将倾向于限制晶片W的轴向位移，并且优选地避免这种位移。然而，如果在接触元件中使用切口，则其应该处于与所讨论的气体流和晶片重量预测的平衡相对应的位置。
然后通过以本身已知的方式引起齿轮环15和卡盘基体11、13的相对旋转来关闭接触元件20，之后可以通过使卡盘基体11、13和接触元件12一致地旋转来旋转晶片W。
要在所示装置上执行的典型处理将是晶片的斜面蚀刻，该斜面蚀刻单独地或与背面蚀刻一起进行。在这种处理中，晶片W位于卡盘上，其装置侧朝下，其背面朝上。通过管道56、27供应并由喷嘴组件26的排出喷嘴28排出的蚀刻液将撞击装置侧的限定的周边区域，从而提供斜面蚀刻。此后，通过管道57、29供应冲洗液体，并通过喷嘴组件30的排出喷嘴31排出冲洗液体。
如果还需要蚀刻晶片W的面向上的背面，则可以从分配器45分配处理液体。通过由加热器40执行的晶片加热来促进蚀刻。
不同的晶片可能需要不同程度的斜面蚀刻，例如2mm、3mm或4mm。提供模块化液体喷嘴组件26还允许快速更换其组件，该组件的喷嘴根据期望的斜面蚀刻的径向长度而不同地定位。
虽然已经结合本发明的各种优选实施方式描述了本发明，但是应当理解，这些实施方式仅用于说明本发明，并且本发明不限于这些实施方式，而是包括所附权利要求的真实范围和精神所包含的。

Claims (10)

1.一种用于处理晶片状物品的装置，其包括旋转卡盘，所述旋转卡盘适于在其上接收具有预定直径的晶片状物品，所述旋转卡盘包括当晶片状物品安装在所述旋转卡盘上时围绕所述晶片状物品的一系列接触元件，所述一系列接触元件随着旋转卡盘旋转而围成圈旋转，并且所述一系列接触元件中的每一个能移动以使相应接触元件的接触表面从径向外部装载位置移动到径向内部接触位置；
所述装置还包括非旋转板，所述非旋转板位于所述一系列接触元件的内部，覆盖由所述一系列接触元件包围的区域的至少90％，并且包括气体供应装置，所述气体供应装置构造成供应气体，以便根据伯努利原理在不接触所述非旋转板的情况下支撑所述晶片状物品。
2.根据权利要求1所述的装置，其中所述气体供应装置是相对于所述旋转卡盘的旋转轴线径向向外指向的环形气体供应装置。
3.根据权利要求1所述的装置，其中所述非旋转板固定在固定的中心柱上。
4.根据权利要求1所述的装置，其中所述非旋转板通常为圆形并与所述旋转卡盘的旋转轴线同轴地安装，所述旋转卡盘具有大于所述预定直径的直径。
5.根据权利要求1所述的装置，其中所述接触表面在所述接触位置处径向向内并且平行于所述旋转卡盘的旋转轴线。
6.根据权利要求1所述的装置，其中所述旋转卡盘包括安装成围绕所述中心柱旋转的卡盘基体，所述卡盘基体围绕包括所述非旋转板的液体分配歧管。
7.根据权利要求6所述的装置，其中所述一系列接触元件中的每一个包括从所述卡盘基体突出的杆，并且其中所述接触表面从所述杆的远端径向向内突出，以在所述接触位置覆在所述非旋转板上。
8.根据权利要求1所述的装置，其中所述气体供应装置是气体供应喷嘴的环形阵列，所述气体供应喷嘴的环形阵列包括圆形的一系列孔，当晶片状物品安装在所述旋转卡盘上时，所述圆形的一系列孔开在所述非旋转板的面向所述晶片状物品的表面上，所述圆形的一系列孔中的每一个从所述非旋转板的内部的所述表面以相对于所述旋转卡盘的旋转轴线一倾斜角度延伸。
9.根据权利要求1所述的装置，其中所述非旋转板还包括多个液体分配喷嘴，所述多个液体分配喷嘴位于所述气体供应装置径向外侧，并且当晶片状物品定位在所述旋转卡盘上时指向所述晶片状物品的边缘区域。
10.根据权利要求9所述的装置，其中所述多个液体分配喷嘴由能附接到所述非旋转板上并能从所述非旋转板拆卸的模块化喷嘴块组成。
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111092028A (zh) * 2018-10-24 2020-05-01 三菱电机株式会社 半导体制造装置及半导体制造方法
CN113227903A (zh) * 2018-12-21 2021-08-06 Asml控股股份有限公司 直接驱动式掩模版安全闩锁

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10872789B2 (en) * 2017-09-28 2020-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer cooling system
GB202109051D0 (en) * 2021-06-24 2021-08-11 Lam Res Ag Device for holding a wafer-shaped article
GB202203589D0 (en) 2022-03-15 2022-04-27 Lam Res Ag Apparatus for processing a wafer-shaped article

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004319720A (ja) * 2003-04-16 2004-11-11 Sony Corp 基板洗浄装置および基板洗浄方法
CN102656681A (zh) * 2009-12-18 2012-09-05 朗姆研究公司 高温卡盘及其使用方法
CN102714153A (zh) * 2009-12-18 2012-10-03 朗姆研究公司 用于对晶片形物体进行液体处理的装置及工艺
US20120298149A1 (en) * 2011-05-27 2012-11-29 Lam Research Ag Method and apparatus for liquid treatment of wafer shaped articles
US20130048607A1 (en) * 2011-08-22 2013-02-28 Lam Research Ag Method and device for wet treatment of plate-like articles
US20140090669A1 (en) * 2012-09-28 2014-04-03 Dainippon Screen Mfg. Co., Ltd. Substrate treatment method and substrate treatment apparatus
CN105390416A (zh) * 2014-08-26 2016-03-09 朗姆研究公司 用于处理晶片状物件的方法和装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006013107A (ja) * 2004-06-25 2006-01-12 Dainippon Screen Mfg Co Ltd 基板処理装置
TWI373804B (en) * 2007-07-13 2012-10-01 Lam Res Ag Apparatus and method for wet treatment of disc-like articles
JP5254308B2 (ja) * 2010-12-27 2013-08-07 東京エレクトロン株式会社 液処理装置、液処理方法及びその液処理方法を実行させるためのプログラムを記録した記録媒体
US9355883B2 (en) * 2011-09-09 2016-05-31 Lam Research Ag Method and apparatus for liquid treatment of wafer shaped articles
US9136155B2 (en) * 2011-11-17 2015-09-15 Lam Research Ag Method and device for processing wafer shaped articles
US20140041803A1 (en) * 2012-08-08 2014-02-13 Lam Research Ag Method and apparatus for liquid treatment of wafer shaped articles
US9147593B2 (en) * 2012-10-10 2015-09-29 Lam Research Ag Apparatus for liquid treatment of wafer shaped articles
US9093482B2 (en) * 2012-10-12 2015-07-28 Lam Research Ag Method and apparatus for liquid treatment of wafer shaped articles
US9245777B2 (en) * 2013-05-15 2016-01-26 Lam Research Ag Apparatus for liquid treatment of wafer shaped articles and heating system for use in such apparatus

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004319720A (ja) * 2003-04-16 2004-11-11 Sony Corp 基板洗浄装置および基板洗浄方法
CN102656681A (zh) * 2009-12-18 2012-09-05 朗姆研究公司 高温卡盘及其使用方法
CN102714153A (zh) * 2009-12-18 2012-10-03 朗姆研究公司 用于对晶片形物体进行液体处理的装置及工艺
US20120298149A1 (en) * 2011-05-27 2012-11-29 Lam Research Ag Method and apparatus for liquid treatment of wafer shaped articles
US20130048607A1 (en) * 2011-08-22 2013-02-28 Lam Research Ag Method and device for wet treatment of plate-like articles
WO2013027153A1 (en) * 2011-08-22 2013-02-28 Lam Research Ag Method and device for wet treatment of plate-like articles
US20140090669A1 (en) * 2012-09-28 2014-04-03 Dainippon Screen Mfg. Co., Ltd. Substrate treatment method and substrate treatment apparatus
CN105390416A (zh) * 2014-08-26 2016-03-09 朗姆研究公司 用于处理晶片状物件的方法和装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111092028A (zh) * 2018-10-24 2020-05-01 三菱电机株式会社 半导体制造装置及半导体制造方法
CN111092028B (zh) * 2018-10-24 2023-10-20 三菱电机株式会社 半导体制造装置及半导体制造方法
CN113227903A (zh) * 2018-12-21 2021-08-06 Asml控股股份有限公司 直接驱动式掩模版安全闩锁

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