JP2018026557A - ウエハ形状の物品を処理するための装置 - Google Patents

ウエハ形状の物品を処理するための装置 Download PDF

Info

Publication number
JP2018026557A
JP2018026557A JP2017149283A JP2017149283A JP2018026557A JP 2018026557 A JP2018026557 A JP 2018026557A JP 2017149283 A JP2017149283 A JP 2017149283A JP 2017149283 A JP2017149283 A JP 2017149283A JP 2018026557 A JP2018026557 A JP 2018026557A
Authority
JP
Japan
Prior art keywords
chuck
wafer
rotating plate
rotating
gas supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017149283A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018026557A5 (enExample
Inventor
シン−チュン・コン
Shih Chung Kon
ミラン・プリシャ
Pliska Milan
ベルンハルト・ロイドル
Loidl Bernhard
ミヒャエル・ブルガー
Brugger Michael
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research AG
Original Assignee
Lam Research AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research AG filed Critical Lam Research AG
Publication of JP2018026557A publication Critical patent/JP2018026557A/ja
Publication of JP2018026557A5 publication Critical patent/JP2018026557A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
JP2017149283A 2016-08-05 2017-08-01 ウエハ形状の物品を処理するための装置 Pending JP2018026557A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/230,254 2016-08-05
US15/230,254 US20180040502A1 (en) 2016-08-05 2016-08-05 Apparatus for processing wafer-shaped articles

Publications (2)

Publication Number Publication Date
JP2018026557A true JP2018026557A (ja) 2018-02-15
JP2018026557A5 JP2018026557A5 (enExample) 2018-03-29

Family

ID=61069548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017149283A Pending JP2018026557A (ja) 2016-08-05 2017-08-01 ウエハ形状の物品を処理するための装置

Country Status (5)

Country Link
US (1) US20180040502A1 (enExample)
JP (1) JP2018026557A (enExample)
KR (1) KR20180016280A (enExample)
CN (1) CN107689338A (enExample)
TW (1) TW201816912A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020068276A (ja) * 2018-10-24 2020-04-30 三菱電機株式会社 半導体製造装置および半導体製造方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019058601A1 (ja) * 2017-09-25 2019-03-28 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、基板処理装置及びプログラム
US10872789B2 (en) * 2017-09-28 2020-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer cooling system
WO2019213564A1 (en) 2018-05-03 2019-11-07 Nypro Inc. Apparatus, system, and method of providing a solids level monitor
NL2024436A (en) * 2018-12-21 2020-07-07 Asml Holding Nv Direct drive reticle safety latch
GB201900912D0 (en) * 2019-01-23 2019-03-13 Lam Res Ag Apparatus for processing a wafer, and method of controlling such an apparatus
EP4107102A4 (en) * 2020-02-17 2023-11-08 Jabil Inc. APPARATUS, SYSTEM AND METHOD FOR PROVIDING A MANUFACTURING AND GRIPPER NOZZLE
GB202012725D0 (en) * 2020-08-14 2020-09-30 Lam Res Ag Apparatus for processing a wafer-shaped article
GB202109051D0 (en) * 2021-06-24 2021-08-11 Lam Res Ag Device for holding a wafer-shaped article
JP7780335B2 (ja) * 2021-12-28 2025-12-04 ルネサスエレクトロニクス株式会社 ウエハ保持装置および半導体装置の製造方法
GB202203589D0 (en) 2022-03-15 2022-04-27 Lam Res Ag Apparatus for processing a wafer-shaped article

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004319720A (ja) * 2003-04-16 2004-11-11 Sony Corp 基板洗浄装置および基板洗浄方法
JP2006013107A (ja) * 2004-06-25 2006-01-12 Dainippon Screen Mfg Co Ltd 基板処理装置
TWI373804B (en) * 2007-07-13 2012-10-01 Lam Res Ag Apparatus and method for wet treatment of disc-like articles
US8596623B2 (en) * 2009-12-18 2013-12-03 Lam Research Ag Device and process for liquid treatment of a wafer shaped article
US8613288B2 (en) * 2009-12-18 2013-12-24 Lam Research Ag High temperature chuck and method of using same
JP5254308B2 (ja) * 2010-12-27 2013-08-07 東京エレクトロン株式会社 液処理装置、液処理方法及びその液処理方法を実行させるためのプログラムを記録した記録媒体
US8997764B2 (en) * 2011-05-27 2015-04-07 Lam Research Ag Method and apparatus for liquid treatment of wafer shaped articles
US8945341B2 (en) * 2011-08-22 2015-02-03 Lam Research Ag Method and device for wet treatment of plate-like articles
US9355883B2 (en) * 2011-09-09 2016-05-31 Lam Research Ag Method and apparatus for liquid treatment of wafer shaped articles
US9136155B2 (en) * 2011-11-17 2015-09-15 Lam Research Ag Method and device for processing wafer shaped articles
US20140041803A1 (en) * 2012-08-08 2014-02-13 Lam Research Ag Method and apparatus for liquid treatment of wafer shaped articles
JP5894897B2 (ja) * 2012-09-28 2016-03-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
US9147593B2 (en) * 2012-10-10 2015-09-29 Lam Research Ag Apparatus for liquid treatment of wafer shaped articles
US9093482B2 (en) * 2012-10-12 2015-07-28 Lam Research Ag Method and apparatus for liquid treatment of wafer shaped articles
US9245777B2 (en) * 2013-05-15 2016-01-26 Lam Research Ag Apparatus for liquid treatment of wafer shaped articles and heating system for use in such apparatus
US10490426B2 (en) * 2014-08-26 2019-11-26 Lam Research Ag Method and apparatus for processing wafer-shaped articles

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020068276A (ja) * 2018-10-24 2020-04-30 三菱電機株式会社 半導体製造装置および半導体製造方法
US11152229B2 (en) 2018-10-24 2021-10-19 Mitsubishi Electric Corporation Semiconductor manufacturing apparatus and semiconductor manufacturing method
US11791174B2 (en) 2018-10-24 2023-10-17 Mitsubishi Electric Corporation Semiconductor manufacturing apparatus and semiconductor manufacturing method

Also Published As

Publication number Publication date
TW201816912A (zh) 2018-05-01
CN107689338A (zh) 2018-02-13
US20180040502A1 (en) 2018-02-08
KR20180016280A (ko) 2018-02-14

Similar Documents

Publication Publication Date Title
US20180040502A1 (en) Apparatus for processing wafer-shaped articles
KR102126590B1 (ko) 웨이퍼 형상 물체의 액체 처리를 위한 장치 및 이러한 장치에서 사용되는 가열 시스템
JP2018026557A5 (enExample)
TWI731940B (zh) 晶圓狀物件之液體處理用設備
JP6198840B2 (ja) 基板支持装置
KR102018397B1 (ko) 판상 물체들의 습식 처리를 위한 방법 및 디바이스
US9968970B2 (en) Spin chuck with in situ cleaning capability
KR102392259B1 (ko) 에지 링을 포함한 스핀 척
KR102194148B1 (ko) 웨이퍼 형상 물품들의 액체 처리를 위한 장치 및 그에서의 사용을 위한 액체 제어링
TWI460807B (zh) 晶圓狀物件之液體處理方法與設備
JP6285125B2 (ja) ウエハ状物品の液体処理のための方法及び装置
TWI687540B (zh) 具有旋轉式氣體噴淋頭之旋轉夾頭
KR20240163106A (ko) 웨이퍼-형상 물품 (wafer-shaped article) 을 프로세싱하기 위한 장치

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180214