JP2018012885A5 - - Google Patents

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JP2018012885A5
JP2018012885A5 JP2017123821A JP2017123821A JP2018012885A5 JP 2018012885 A5 JP2018012885 A5 JP 2018012885A5 JP 2017123821 A JP2017123821 A JP 2017123821A JP 2017123821 A JP2017123821 A JP 2017123821A JP 2018012885 A5 JP2018012885 A5 JP 2018012885A5
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Japan
Prior art keywords
photoresist
substrate
feature
features
copper
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JP2017123821A
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English (en)
Japanese (ja)
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JP6538116B2 (ja
JP2018012885A (ja
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Publication of JP2018012885A5 publication Critical patent/JP2018012885A5/ja
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JP2017123821A 2016-06-27 2017-06-26 ピラゾール化合物とビスエポキシドとの反応生成物を含有する電気銅めっき浴からフォトレジスト画定フィーチャを電気めっきする方法 Active JP6538116B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662354972P 2016-06-27 2016-06-27
US62/354,972 2016-06-27

Publications (3)

Publication Number Publication Date
JP2018012885A JP2018012885A (ja) 2018-01-25
JP2018012885A5 true JP2018012885A5 (https=) 2018-11-08
JP6538116B2 JP6538116B2 (ja) 2019-07-03

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ID=59091406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017123821A Active JP6538116B2 (ja) 2016-06-27 2017-06-26 ピラゾール化合物とビスエポキシドとの反応生成物を含有する電気銅めっき浴からフォトレジスト画定フィーチャを電気めっきする方法

Country Status (6)

Country Link
US (1) US10508349B2 (https=)
EP (1) EP3263745B1 (https=)
JP (1) JP6538116B2 (https=)
KR (1) KR101994907B1 (https=)
CN (1) CN107541757B (https=)
TW (1) TWI638067B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200131909A (ko) * 2018-04-09 2020-11-24 램 리써치 코포레이션 비-구리 라이너 층들 상의 구리 전기충진 (electrofill)
US11946153B2 (en) 2019-02-01 2024-04-02 Ishihara Chemical Co., Ltd. Copper or copper alloy electroplating bath
CN119287460B (zh) * 2024-12-10 2025-03-14 深圳市联合蓝海应用材料科技股份有限公司 一种电镀铜整平剂及制备方法、电镀液及电镀方法与产品
CN119528801B (zh) * 2024-12-10 2026-04-03 深圳市联合蓝海应用材料科技股份有限公司 一种以三吡啶基苯为骨架的季铵盐化合物及制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6610192B1 (en) 2000-11-02 2003-08-26 Shipley Company, L.L.C. Copper electroplating
JP4392168B2 (ja) 2001-05-09 2009-12-24 荏原ユージライト株式会社 銅めっき浴およびこれを用いる基板のめっき方法
US7128822B2 (en) 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
TW200613586A (en) * 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
EP1741804B1 (en) 2005-07-08 2016-04-27 Rohm and Haas Electronic Materials, L.L.C. Electrolytic copper plating method
CN106245073B (zh) 2010-05-19 2019-12-20 诺发系统有限公司 用金属电化学填充高纵横比的大型凹入特征的方法、水溶液电镀槽溶液、电镀设备以及系统
US8546254B2 (en) 2010-08-19 2013-10-01 Taiwan Semiconductor Manufacturing Company, Ltd. Mechanisms for forming copper pillar bumps using patterned anodes
EP2729595B1 (en) * 2011-07-07 2017-02-01 ATOTECH Deutschland GmbH Method for providing organic resist adhesion to a copper or copper alloy surface
US8747643B2 (en) * 2011-08-22 2014-06-10 Rohm And Haas Electronic Materials Llc Plating bath and method
TWI637467B (zh) * 2012-05-24 2018-10-01 欣興電子股份有限公司 中介基材及其製作方法
US10006136B2 (en) * 2015-08-06 2018-06-26 Dow Global Technologies Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds
US9932684B2 (en) 2015-08-06 2018-04-03 Rohm And Haas Electronic Materials Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides
TWI608132B (zh) * 2015-08-06 2017-12-11 羅門哈斯電子材料有限公司 自含有吡啶基烷基胺及雙環氧化物之反應產物的銅電鍍覆浴液電鍍覆光阻劑限定之特徵的方法
US10100421B2 (en) * 2015-08-06 2018-10-16 Dow Global Technologies Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds

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