JP6538116B2 - ピラゾール化合物とビスエポキシドとの反応生成物を含有する電気銅めっき浴からフォトレジスト画定フィーチャを電気めっきする方法 - Google Patents

ピラゾール化合物とビスエポキシドとの反応生成物を含有する電気銅めっき浴からフォトレジスト画定フィーチャを電気めっきする方法 Download PDF

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Publication number
JP6538116B2
JP6538116B2 JP2017123821A JP2017123821A JP6538116B2 JP 6538116 B2 JP6538116 B2 JP 6538116B2 JP 2017123821 A JP2017123821 A JP 2017123821A JP 2017123821 A JP2017123821 A JP 2017123821A JP 6538116 B2 JP6538116 B2 JP 6538116B2
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Japan
Prior art keywords
copper
height
photoresist
features
substrate
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JP2017123821A
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English (en)
Japanese (ja)
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JP2018012885A5 (https=
JP2018012885A (ja
Inventor
ラヴィ・ポークレル
マシュー・ソアセス
ジェームス・バイネス
マーク・スカリシ
スーラ・ニアジンヴェトワ
ジョアンナ・ディウィジック
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DuPont Electronic Materials International LLC
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Rohm and Haas Electronic Materials LLC
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Mechanical Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2017123821A 2016-06-27 2017-06-26 ピラゾール化合物とビスエポキシドとの反応生成物を含有する電気銅めっき浴からフォトレジスト画定フィーチャを電気めっきする方法 Active JP6538116B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662354972P 2016-06-27 2016-06-27
US62/354,972 2016-06-27

Publications (3)

Publication Number Publication Date
JP2018012885A JP2018012885A (ja) 2018-01-25
JP2018012885A5 JP2018012885A5 (https=) 2018-11-08
JP6538116B2 true JP6538116B2 (ja) 2019-07-03

Family

ID=59091406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017123821A Active JP6538116B2 (ja) 2016-06-27 2017-06-26 ピラゾール化合物とビスエポキシドとの反応生成物を含有する電気銅めっき浴からフォトレジスト画定フィーチャを電気めっきする方法

Country Status (6)

Country Link
US (1) US10508349B2 (https=)
EP (1) EP3263745B1 (https=)
JP (1) JP6538116B2 (https=)
KR (1) KR101994907B1 (https=)
CN (1) CN107541757B (https=)
TW (1) TWI638067B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200131909A (ko) * 2018-04-09 2020-11-24 램 리써치 코포레이션 비-구리 라이너 층들 상의 구리 전기충진 (electrofill)
US11946153B2 (en) 2019-02-01 2024-04-02 Ishihara Chemical Co., Ltd. Copper or copper alloy electroplating bath
CN119287460B (zh) * 2024-12-10 2025-03-14 深圳市联合蓝海应用材料科技股份有限公司 一种电镀铜整平剂及制备方法、电镀液及电镀方法与产品
CN119528801B (zh) * 2024-12-10 2026-04-03 深圳市联合蓝海应用材料科技股份有限公司 一种以三吡啶基苯为骨架的季铵盐化合物及制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6610192B1 (en) 2000-11-02 2003-08-26 Shipley Company, L.L.C. Copper electroplating
JP4392168B2 (ja) 2001-05-09 2009-12-24 荏原ユージライト株式会社 銅めっき浴およびこれを用いる基板のめっき方法
US7128822B2 (en) 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
TW200613586A (en) * 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
EP1741804B1 (en) 2005-07-08 2016-04-27 Rohm and Haas Electronic Materials, L.L.C. Electrolytic copper plating method
CN106245073B (zh) 2010-05-19 2019-12-20 诺发系统有限公司 用金属电化学填充高纵横比的大型凹入特征的方法、水溶液电镀槽溶液、电镀设备以及系统
US8546254B2 (en) 2010-08-19 2013-10-01 Taiwan Semiconductor Manufacturing Company, Ltd. Mechanisms for forming copper pillar bumps using patterned anodes
EP2729595B1 (en) * 2011-07-07 2017-02-01 ATOTECH Deutschland GmbH Method for providing organic resist adhesion to a copper or copper alloy surface
US8747643B2 (en) * 2011-08-22 2014-06-10 Rohm And Haas Electronic Materials Llc Plating bath and method
TWI637467B (zh) * 2012-05-24 2018-10-01 欣興電子股份有限公司 中介基材及其製作方法
US10006136B2 (en) * 2015-08-06 2018-06-26 Dow Global Technologies Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds
US9932684B2 (en) 2015-08-06 2018-04-03 Rohm And Haas Electronic Materials Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides
TWI608132B (zh) * 2015-08-06 2017-12-11 羅門哈斯電子材料有限公司 自含有吡啶基烷基胺及雙環氧化物之反應產物的銅電鍍覆浴液電鍍覆光阻劑限定之特徵的方法
US10100421B2 (en) * 2015-08-06 2018-10-16 Dow Global Technologies Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds

Also Published As

Publication number Publication date
CN107541757A (zh) 2018-01-05
KR20180001512A (ko) 2018-01-04
US10508349B2 (en) 2019-12-17
CN107541757B (zh) 2019-07-19
KR101994907B1 (ko) 2019-07-01
TW201800618A (zh) 2018-01-01
JP2018012885A (ja) 2018-01-25
US20170370014A1 (en) 2017-12-28
EP3263745B1 (en) 2018-10-31
TWI638067B (zh) 2018-10-11
EP3263745A1 (en) 2018-01-03

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