TWI638067B - 自含有吡唑化合物及雙環氧化物的反應產物的銅電鍍浴液電鍍光致抗蝕劑限定的特徵之方法 - Google Patents

自含有吡唑化合物及雙環氧化物的反應產物的銅電鍍浴液電鍍光致抗蝕劑限定的特徵之方法 Download PDF

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Publication number
TWI638067B
TWI638067B TW106121152A TW106121152A TWI638067B TW I638067 B TWI638067 B TW I638067B TW 106121152 A TW106121152 A TW 106121152A TW 106121152 A TW106121152 A TW 106121152A TW I638067 B TWI638067 B TW I638067B
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TW
Taiwan
Prior art keywords
copper
height
photoresist
tir
features
Prior art date
Application number
TW106121152A
Other languages
English (en)
Chinese (zh)
Other versions
TW201800618A (zh
Inventor
拉維 博克雷爾
Ravi POKHREL
馬修 朵塞特
Matthew THORSETH
詹姆士 伯恩斯
James BYRNES
馬克 斯科里西
Mark Scalisi
齊拉 奈耶札貝托瓦
Zuhra Niazimbetova
喬安娜 魯維查克
Joanna Dziewiszek
Original Assignee
羅門哈斯電子材料有限公司
Rohm And Haas Electronic Materials Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 羅門哈斯電子材料有限公司, Rohm And Haas Electronic Materials Llc filed Critical 羅門哈斯電子材料有限公司
Publication of TW201800618A publication Critical patent/TW201800618A/zh
Application granted granted Critical
Publication of TWI638067B publication Critical patent/TWI638067B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Mechanical Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW106121152A 2016-06-27 2017-06-23 自含有吡唑化合物及雙環氧化物的反應產物的銅電鍍浴液電鍍光致抗蝕劑限定的特徵之方法 TWI638067B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662354972P 2016-06-27 2016-06-27
US62/354,972 2016-06-27

Publications (2)

Publication Number Publication Date
TW201800618A TW201800618A (zh) 2018-01-01
TWI638067B true TWI638067B (zh) 2018-10-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW106121152A TWI638067B (zh) 2016-06-27 2017-06-23 自含有吡唑化合物及雙環氧化物的反應產物的銅電鍍浴液電鍍光致抗蝕劑限定的特徵之方法

Country Status (6)

Country Link
US (1) US10508349B2 (https=)
EP (1) EP3263745B1 (https=)
JP (1) JP6538116B2 (https=)
KR (1) KR101994907B1 (https=)
CN (1) CN107541757B (https=)
TW (1) TWI638067B (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200131909A (ko) * 2018-04-09 2020-11-24 램 리써치 코포레이션 비-구리 라이너 층들 상의 구리 전기충진 (electrofill)
US11946153B2 (en) 2019-02-01 2024-04-02 Ishihara Chemical Co., Ltd. Copper or copper alloy electroplating bath
CN119287460B (zh) * 2024-12-10 2025-03-14 深圳市联合蓝海应用材料科技股份有限公司 一种电镀铜整平剂及制备方法、电镀液及电镀方法与产品
CN119528801B (zh) * 2024-12-10 2026-04-03 深圳市联合蓝海应用材料科技股份有限公司 一种以三吡啶基苯为骨架的季铵盐化合物及制备方法

Citations (1)

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TW201712159A (zh) * 2015-08-06 2017-04-01 羅門哈斯電子材料有限公司 自含有咪唑化合物、雙環氧化物及鹵基苄基化合物的反應產物的銅電鍍浴電鍍光致抗蝕劑限定的特徵之方法

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US6610192B1 (en) 2000-11-02 2003-08-26 Shipley Company, L.L.C. Copper electroplating
JP4392168B2 (ja) 2001-05-09 2009-12-24 荏原ユージライト株式会社 銅めっき浴およびこれを用いる基板のめっき方法
US7128822B2 (en) 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
TW200613586A (en) * 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
EP1741804B1 (en) 2005-07-08 2016-04-27 Rohm and Haas Electronic Materials, L.L.C. Electrolytic copper plating method
CN106245073B (zh) 2010-05-19 2019-12-20 诺发系统有限公司 用金属电化学填充高纵横比的大型凹入特征的方法、水溶液电镀槽溶液、电镀设备以及系统
US8546254B2 (en) 2010-08-19 2013-10-01 Taiwan Semiconductor Manufacturing Company, Ltd. Mechanisms for forming copper pillar bumps using patterned anodes
EP2729595B1 (en) * 2011-07-07 2017-02-01 ATOTECH Deutschland GmbH Method for providing organic resist adhesion to a copper or copper alloy surface
US8747643B2 (en) * 2011-08-22 2014-06-10 Rohm And Haas Electronic Materials Llc Plating bath and method
TWI637467B (zh) * 2012-05-24 2018-10-01 欣興電子股份有限公司 中介基材及其製作方法
US9932684B2 (en) 2015-08-06 2018-04-03 Rohm And Haas Electronic Materials Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides
TWI608132B (zh) * 2015-08-06 2017-12-11 羅門哈斯電子材料有限公司 自含有吡啶基烷基胺及雙環氧化物之反應產物的銅電鍍覆浴液電鍍覆光阻劑限定之特徵的方法
US10100421B2 (en) * 2015-08-06 2018-10-16 Dow Global Technologies Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201712159A (zh) * 2015-08-06 2017-04-01 羅門哈斯電子材料有限公司 自含有咪唑化合物、雙環氧化物及鹵基苄基化合物的反應產物的銅電鍍浴電鍍光致抗蝕劑限定的特徵之方法

Also Published As

Publication number Publication date
CN107541757A (zh) 2018-01-05
KR20180001512A (ko) 2018-01-04
JP6538116B2 (ja) 2019-07-03
US10508349B2 (en) 2019-12-17
CN107541757B (zh) 2019-07-19
KR101994907B1 (ko) 2019-07-01
TW201800618A (zh) 2018-01-01
JP2018012885A (ja) 2018-01-25
US20170370014A1 (en) 2017-12-28
EP3263745B1 (en) 2018-10-31
EP3263745A1 (en) 2018-01-03

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