JP2017515301A5 - - Google Patents

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Publication number
JP2017515301A5
JP2017515301A5 JP2016558294A JP2016558294A JP2017515301A5 JP 2017515301 A5 JP2017515301 A5 JP 2017515301A5 JP 2016558294 A JP2016558294 A JP 2016558294A JP 2016558294 A JP2016558294 A JP 2016558294A JP 2017515301 A5 JP2017515301 A5 JP 2017515301A5
Authority
JP
Japan
Prior art keywords
substrate carrier
carrier system
protective layer
layer stack
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016558294A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017515301A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2015/024147 external-priority patent/WO2015171226A1/en
Publication of JP2017515301A publication Critical patent/JP2017515301A/ja
Publication of JP2017515301A5 publication Critical patent/JP2017515301A5/ja
Pending legal-status Critical Current

Links

JP2016558294A 2014-05-09 2015-04-02 保護カバーを有する基板キャリアシステム Pending JP2017515301A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461991350P 2014-05-09 2014-05-09
US61/991,350 2014-05-09
PCT/US2015/024147 WO2015171226A1 (en) 2014-05-09 2015-04-02 Substrate carrier system with protective covering

Publications (2)

Publication Number Publication Date
JP2017515301A JP2017515301A (ja) 2017-06-08
JP2017515301A5 true JP2017515301A5 (OSRAM) 2018-05-17

Family

ID=54392836

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016558294A Pending JP2017515301A (ja) 2014-05-09 2015-04-02 保護カバーを有する基板キャリアシステム

Country Status (6)

Country Link
US (1) US10096509B2 (OSRAM)
JP (1) JP2017515301A (OSRAM)
KR (1) KR20170002603A (OSRAM)
CN (1) CN106575720B (OSRAM)
TW (1) TW201606902A (OSRAM)
WO (1) WO2015171226A1 (OSRAM)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6533835B2 (ja) * 2017-01-31 2019-06-19 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 基板を処理する方法、及び基板を保持するための基板キャリア
JP6591657B2 (ja) * 2017-02-24 2019-10-16 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 真空システムで使用するためのキャリア、真空処理のためのシステム、及び基板の真空処理のための方法
CN109792004A (zh) * 2017-09-05 2019-05-21 应用材料公司 搬运掩模器件的方法、用于更换掩模器件的设备、掩模更换腔室以及真空系统
KR20190062380A (ko) * 2017-11-23 2019-06-05 어플라이드 머티어리얼스, 인코포레이티드 기판을 지지하기 위한 기판 캐리어, 마스크 척킹 장치, 진공 프로세싱 시스템, 및 기판 캐리어를 동작시키는 방법
KR20190114216A (ko) * 2018-03-29 2019-10-10 어플라이드 머티어리얼스, 인코포레이티드 정전척 및 기판처리장치
US11588209B2 (en) 2018-08-21 2023-02-21 Applied Materials, Inc. Ultra-thin ceramic coating on separator for batteries
US11586160B2 (en) * 2021-06-28 2023-02-21 Applied Materials, Inc. Reducing substrate surface scratching using machine learning

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JP2003060020A (ja) * 2001-06-07 2003-02-28 Komatsu Ltd 静電チャック装置
JP2002357838A (ja) 2001-05-31 2002-12-13 Hitachi Industries Co Ltd 基板貼り合わせ方法及びその装置
JP4166449B2 (ja) * 2001-07-30 2008-10-15 株式会社アルバック 真空処理装置
JP2003179128A (ja) 2001-12-11 2003-06-27 Ngk Spark Plug Co Ltd 静電チャック
JP2003243493A (ja) 2002-02-15 2003-08-29 Taiheiyo Cement Corp 双極型静電チャック
US7916447B2 (en) 2003-07-08 2011-03-29 Future Vision Inc. Electrostatic chuck for substrate stage, electrode used for the chuck, and treating system having the chuck and electrode
JP4684222B2 (ja) 2004-03-19 2011-05-18 株式会社クリエイティブ テクノロジー 双極型静電チャック
TWI267940B (en) 2004-06-28 2006-12-01 Kyocera Corp Electrostatic chuck
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EP2306505A4 (en) 2008-07-08 2011-09-14 Creative Tech Corp BIPOLAR ELECTROSTATIC CHUCK
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US20120227886A1 (en) * 2011-03-10 2012-09-13 Taipei Semiconductor Manufacturing Company, Ltd. Substrate Assembly Carrier Using Electrostatic Force
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JP2013163837A (ja) * 2012-02-09 2013-08-22 Canon Tokki Corp 蒸着装置並びに蒸着装置を用いた成膜方法
JP2013197465A (ja) * 2012-03-22 2013-09-30 Toshiba Corp 静電チャック装置および露光装置
KR102047001B1 (ko) 2012-10-16 2019-12-03 삼성디스플레이 주식회사 정전 척
US9740111B2 (en) 2014-05-16 2017-08-22 Applied Materials, Inc. Electrostatic carrier for handling substrates for processing
US10978334B2 (en) 2014-09-02 2021-04-13 Applied Materials, Inc. Sealing structure for workpiece to substrate bonding in a processing chamber

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