|
TW383508B
(en)
*
|
1996-07-29 |
2000-03-01 |
Nichia Kagaku Kogyo Kk |
Light emitting device and display
|
|
JP4271747B2
(ja)
|
1997-07-07 |
2009-06-03 |
株式会社朝日ラバー |
発光ダイオード用透光性被覆材及び蛍光カラー光源
|
|
US6204523B1
(en)
|
1998-11-06 |
2001-03-20 |
Lumileds Lighting, U.S., Llc |
High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range
|
|
US7023019B2
(en)
|
2001-09-03 |
2006-04-04 |
Matsushita Electric Industrial Co., Ltd. |
Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device
|
|
TWI245436B
(en)
|
2003-10-30 |
2005-12-11 |
Kyocera Corp |
Package for housing light-emitting element, light-emitting apparatus and illumination apparatus
|
|
US7497973B2
(en)
*
|
2005-02-02 |
2009-03-03 |
Lumination Llc |
Red line emitting phosphor materials for use in LED applications
|
|
EP1865564B1
(en)
*
|
2005-03-18 |
2014-11-19 |
Mitsubishi Chemical Corporation |
Light-emitting device, white light-emitting device, illuminator, and image display
|
|
JP2007123390A
(ja)
*
|
2005-10-26 |
2007-05-17 |
Kyocera Corp |
発光装置
|
|
US7521728B2
(en)
|
2006-01-20 |
2009-04-21 |
Cree, Inc. |
Packages for semiconductor light emitting devices utilizing dispensed reflectors and methods of forming the same
|
|
KR100785492B1
(ko)
|
2006-04-17 |
2007-12-13 |
한국과학기술원 |
새로운 조성의 황색 발광 Ce3+부활 실리케이트황색형광체, 그 제조방법 및 상기 형광체를 포함하는 백색발광 다이오드
|
|
JP5205724B2
(ja)
*
|
2006-08-04 |
2013-06-05 |
日亜化学工業株式会社 |
発光装置
|
|
JP5578597B2
(ja)
*
|
2007-09-03 |
2014-08-27 |
独立行政法人物質・材料研究機構 |
蛍光体及びその製造方法、並びにそれを用いた発光装置
|
|
EP2242119A4
(en)
*
|
2008-02-07 |
2012-03-07 |
Mitsubishi Chem Corp |
SEMICONDUCTOR LIGHT ARRANGEMENT, BACKLIGHT ARRANGEMENT, PAINT DISPLAY ARRANGEMENT, AND FLUORATE USED FOR THESE ARRANGEMENTS
|
|
US9287469B2
(en)
*
|
2008-05-02 |
2016-03-15 |
Cree, Inc. |
Encapsulation for phosphor-converted white light emitting diode
|
|
JP2010093132A
(ja)
|
2008-10-09 |
2010-04-22 |
Sharp Corp |
半導体発光装置およびそれを用いた画像表示装置、液晶表示装置
|
|
JP5308773B2
(ja)
|
2008-10-30 |
2013-10-09 |
スタンレー電気株式会社 |
半導体発光装置
|
|
US8058667B2
(en)
|
2009-03-10 |
2011-11-15 |
Nepes Led Corporation |
Leadframe package for light emitting diode device
|
|
US8039862B2
(en)
|
2009-03-10 |
2011-10-18 |
Nepes Led Corporation |
White light emitting diode package having enhanced white lighting efficiency and method of making the same
|
|
JP5423120B2
(ja)
|
2009-04-17 |
2014-02-19 |
三菱化学株式会社 |
半導体発光装置
|
|
JP2011054958A
(ja)
*
|
2009-08-06 |
2011-03-17 |
Mitsubishi Chemicals Corp |
半導体発光装置、並びに画像表示装置及び照明装置
|
|
US20110031516A1
(en)
|
2009-08-07 |
2011-02-10 |
Koninklijke Philips Electronics N.V. |
Led with silicone layer and laminated remote phosphor layer
|
|
US20100276712A1
(en)
*
|
2009-11-03 |
2010-11-04 |
Alexander Shaikevitch |
Light emitting diode with thin multilayer phosphor film
|
|
JP5076017B2
(ja)
*
|
2010-08-23 |
2012-11-21 |
株式会社東芝 |
発光装置
|
|
RU2570356C2
(ru)
*
|
2010-08-31 |
2015-12-10 |
Нития Корпорейшн |
Светоизлучающее устройство и способ его изготовления
|
|
JP5622494B2
(ja)
|
2010-09-09 |
2014-11-12 |
スタンレー電気株式会社 |
発光装置およびその製造方法
|
|
EP2629341B8
(en)
|
2010-10-15 |
2020-04-08 |
Mitsubishi Chemical Corporation |
White light emitting device and lighting device
|
|
DE102010063760B4
(de)
|
2010-12-21 |
2022-12-29 |
OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung |
Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement
|
|
JP5937521B2
(ja)
*
|
2011-01-28 |
2016-06-22 |
昭和電工株式会社 |
量子ドット蛍光体を含む組成物、量子ドット蛍光体分散樹脂成形体、量子ドット蛍光体を含む構造物、発光装置、電子機器、機械装置及び量子ドット蛍光体分散樹脂成形体の製造方法
|
|
DE102011003969B4
(de)
|
2011-02-11 |
2023-03-09 |
OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung |
Verfahren zur Herstellung eines optoelektronischen Bauelements
|
|
JP5762044B2
(ja)
*
|
2011-02-23 |
2015-08-12 |
三菱電機株式会社 |
発光装置及び発光装置群及び製造方法
|
|
US8252613B1
(en)
|
2011-03-23 |
2012-08-28 |
General Electric Company |
Color stable manganese-doped phosphors
|
|
TWI489656B
(zh)
|
2011-03-25 |
2015-06-21 |
三星電子股份有限公司 |
發光二極體、發光二極體之製造方法、發光二極體模組及發光二極體模組之製造方法
|
|
JP5105132B1
(ja)
|
2011-06-02 |
2012-12-19 |
三菱化学株式会社 |
半導体発光装置、半導体発光システムおよび照明器具
|
|
EP3346512B1
(en)
|
2011-06-03 |
2023-06-07 |
Citizen Electronics Co., Ltd. |
Semiconductor light-emitting device, exhibit-irradiating illumination device, meat-irradiating illumination device, vegetable-irradiating illumination device, fresh fish-irradiating illumination device, general-purpose illumination device, and semiconductor light-emitting system
|
|
CN103650183B
(zh)
*
|
2011-06-30 |
2017-02-22 |
松下知识产权经营株式会社 |
发光装置
|
|
DE102011081083A1
(de)
|
2011-08-17 |
2013-02-21 |
Osram Ag |
Presswerkzeug und verfahren zum pressen eines silikonelements
|
|
US8841689B2
(en)
*
|
2012-02-03 |
2014-09-23 |
Shin-Etsu Chemical Co., Ltd. |
Heat-curable silicone resin sheet having phosphor-containing layer and phosphor-free layer, method of producing light emitting device utilizing same and light emitting semiconductor device obtained by the method
|
|
US9343441B2
(en)
*
|
2012-02-13 |
2016-05-17 |
Cree, Inc. |
Light emitter devices having improved light output and related methods
|
|
JP5840540B2
(ja)
*
|
2012-03-15 |
2016-01-06 |
株式会社東芝 |
白色照明装置
|
|
DE102012208900A1
(de)
|
2012-05-25 |
2013-11-28 |
Osram Opto Semiconductors Gmbh |
Verfahren zum Herstellen optoelektronischer Bauelemente und Vorrichtung zum Herstellen optoelektronischer Bauelemente
|
|
US10424702B2
(en)
|
2012-06-11 |
2019-09-24 |
Cree, Inc. |
Compact LED package with reflectivity layer
|
|
JP2014041993A
(ja)
*
|
2012-07-24 |
2014-03-06 |
Toyoda Gosei Co Ltd |
発光装置及びその製造方法
|
|
DE102012213195A1
(de)
|
2012-07-26 |
2014-01-30 |
Osram Gmbh |
Verfahren zum Belegen einer Oberfläche mit Leuchtstoff
|
|
US9761763B2
(en)
*
|
2012-12-21 |
2017-09-12 |
Soraa, Inc. |
Dense-luminescent-materials-coated violet LEDs
|
|
US9680067B2
(en)
|
2014-03-18 |
2017-06-13 |
GE Lighting Solutions, LLC |
Heavily phosphor loaded LED packages having higher stability
|