CN106463584A - 重磷光体装填的led封装 - Google Patents

重磷光体装填的led封装 Download PDF

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CN106463584A
CN106463584A CN201580014432.0A CN201580014432A CN106463584A CN 106463584 A CN106463584 A CN 106463584A CN 201580014432 A CN201580014432 A CN 201580014432A CN 106463584 A CN106463584 A CN 106463584A
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phosphor
led
silicones
cover layer
led encapsulation
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A·I·乔扈里
G·R·艾伦
蔡登科
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Current Lighting Solutions LLC
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Abstract

具有较高稳定性的重磷光体装填的LED封装以及用于提高重磷光体装填的LED封装稳定性的方法。在磷光体硅树脂混合层上提供硅树脂覆盖层。

Description

重磷光体装填的LED封装
技术领域
本公开通常涉及装填磷光体的发光二极管(LED)。更特别地，本公开涉及具有较高稳定性的重磷光体装填的LED封装以及用于提高重磷光体装填LED封装稳定性的方法。
背景技术
LED是通常用作对于其他光源诸如白炽灯的替代物的半导体光发射器。在希望离散地或高度集中的光的应用中它们作为照明源是特别有用的。由LED封装产生的光的颜色取决于在其制造中所使用的半导电材料的类型，以及其中使用磷光体系统时所使用的磷光体混合物。
已经从III-V族合金诸如氮化镓(GaN)制造了有色半导体LED，包括发光二极管和激光器(均通常在此称作LED)。参照GaN基LED，通常在电磁频谱的UV至绿光范围中发射光。直至最近，由于LED所产生光的固有颜色，LED尚未适用于其中需要明亮白色光的照明用途。
磷光体将辐射(能量)转换为可见光。磷光体的不同组合提供了不同颜色的光发射。所产生可见光的颜色取决于磷光体材料的特定组分。磷光体材料可以仅包括单个磷光体组分或者基本颜色的两个或多个磷光体，例如具有黄色和红色磷光体的一个或多个的特定混合物以发射所希望的光颜色(色彩)。如在此所使用的，术语“磷光体”和“磷光体材料”可以用于表示单个磷光体合成物以及两个或多个磷光体合成物的混合物。
在希望“白色”光的典型应用中，磷光体与LED结合使用以提供所希望特性的可接受净发射光谱。“白色”光通常定义为在2500K至6000K的相关色温(CCT)的区域中在颜色上接近黑体轨迹。例如，在典型的照明应用中，由InGaN(氮化铟镓)制成的在电磁频谱的蓝光区域中发光的LED与黄色、绿色和红色磷光体结合使用以提供范围从约2500K CCT至6000KCCT之上的合成光谱输出。得到的CIE三色图中的色温和色点取决于二极管发光器的输出频谱功率和波长、混合比例、会话特性、以及所使用的磷光体的量。
美国专利号7,497,973公开了包括半导体光源以及包含采用Mn4+激活的复合磷光体的磷光体材料的LED。特定的磷光体材料是K2[SiF6]：Mn4+(氟硅酸钾或PFS)。
另一种LED使用PFS磷光体与磷光体BSY(蓝移钇铝石榴石(YAG))的组合。该组合称作BSY-PFS并且其产生白色光。使用BSY-PFS组合的LED封装的一个优选实施例是中间功率的LED封装(＜1W)，在此用作示例性实施例。在Nichia 757封装中已经使用Nichia Mint磷光体(BSY)和GE PFS磷光体制造封装。在美国专利号5,998,925和7,026,756中包括了在白光LED中石榴石磷光体的使用。对于本领域技术人员而言明显的是，创新性元素的实施方式不限于Nichia 757。本发明可以以许多不同的LED封装而实施，其中PFS与BSY磷光体或频谱类似的磷光体结合使用。
因此，在LED封装中使用磷光体提供了优点并且是普通的。然而，通常，包括PFS磷光体的LED封装呈现长期颜色和流明稳定性问题。例如，BSY-PFS系统在4000K Hi CRI(显色指数)的颜色需求使得硅树脂/磷光体盘/模具的非常高的磷光体装填成为必需。在湿度存在下的可靠性测试中，来自激励的LED封装的可见辐射偏移颜色。主要地，频谱功率分布的红色分量随着工作时间而逐渐地损失强度。高磷光体装填也导致侧墙“沟槽”形成以及导致净色点偏移的其他效果。
上述缺点大大限制了PSF LED诸如BSY-PFS LED的有用性。因此，具有减轻颜色不稳定性问题的LED封装级改进是有用的。
本发明涉及改进使用PFS磷光体的LED封装的稳定性。通常在这些封装中磷光体装填如上所述是高的。高装填在该上下文中涉及20％或更高的磷光体与硅树脂的重量比例。
发明内容
在至少一个方面中，本公开提供了一种具有较高稳定性的重磷光体装填的LED封装。优选地LED封装是低至中功率LED。一个示例性实施例是Nichia 757中功率LED封装，其采用BSY-PFS磷光体混合物高装填。采用硅树脂覆盖层覆盖磷光体混合物，其保护磷光体并且提供了色移的改进。
在另一实施例中，本发明提供一种方法以改进采用PFS磷光体系统的LED封装的长期稳定性和可靠性。在方法中，在硅树脂/磷光体层的顶面上提供硅树脂覆盖层。
附图说明
图1示出了现有技术的LED的示意图。
图2示出了具有硅树脂覆盖层的LED封装。
本公开可以成形在各种部件以及部件的排列中，以及各种处理操作以及处理操作的排列。本公开示出在附图中，遍及附图相同的附图标记可以指示在各个附图中对应的或类似的部件。附图仅用于示意说明优选实施例的目的并且不应构造为限定本公开。假设以下使能了附图的描述说明，本公开的创新性特征方面应该对于本领域普通技术人员变得明显。
具体实施方式
以下详细说明书本质上仅是示例并且并非意在限制在此所公开内容的应用和用途。此外，无意受到在由前述背景技术或发明内容或者以下详细说明书中所展示的任何理论约束。尽管在此主要结合PFS LED封装并且尤其是Nichia 757 BSY-PFS LED封装描述本发明技术的实施例，概念也可适用于其他类型的磷光体装填的LED并且尤其是重磷光体装填LED的其他类型。具体地，概念在其中磷光体与硅树脂的重量比为高(20％或更高)的LED封装中是最适用的，并且至少一个磷光体展现对于环境大气组分诸如湿气的敏感性。
图1示出了示例性的现有技术LED封装10。封装10包括发光二极管(LED)芯片12。磷光体和硅树脂混合层22覆盖芯片12。LED芯片12和磷光体硅树脂混合层22采用透镜18密封。LED封装10包括外侧封壳30。
磷光体硅树脂混合层22沿由箭头24所示方向辐射地耦合至LED芯片12。辐射地耦合意味着元件相互关联以使得从一个发出的辐射的至少一部分发射至另一个。
在图2重示出了具有较大稳定性的重磷光体装填的LED封装50的一个实施例。封装50包括半导体UV或可见辐射源，诸如发光二极管(LED)芯片52。磷光体和硅树脂混合层54覆盖芯片52。
封装50可以包括当其发出的辐射被引导至磷光体上时能够产生白光的任何半导体可见光或UV光源。LED芯片52的优选的尖峰发射将取决于所使用的磷光体的等同性并且范围可以从例如250-550nm。然而，在一个优选实施例中，LED的发光将在紫色至蓝-绿色区域中并且具有在从约420至约500nm的范围中的峰值波长。随后通常，半导体光源包括采用各种杂质掺杂的LED。因此，LED可以包括基于任何合适的III-V、II-VI或IV-IV半导体层并且具有约250至550nm的峰值发射波长的半导体二极管。
尽管在此所述的本发明的示例性结构的通常讨论涉及基于无机LED的光源，应该理解的是可以由有机发光结构或其他辐射源替代LED芯片，除非另外指示，并且对于LED芯片或半导体的任何参照仅代表任何合适的辐射源。
磷光体硅树脂混合层54希望地是采用磷光体重装填，尤其是20％或更大重量的磷光体。磷光体硅树脂混合层54通常厚度约为0.2mm。在优选实施例中，磷光体是PFS磷光体与BSY磷光体或频谱类似磷光体的混合物。特别优选的是Nichia Mint磷光体(BSY)和GE PFS磷光体，在低至中功率LED封装中是希望的。示例是Nichia 757封装。
硅树脂覆盖层56提供在磷光体硅树脂混合层54的顶部上。覆盖层具有约0.1mm的厚度，希望地在约0.1和0.5mm之间。所使用的硅树脂希望与磷光体硅树脂混合层54中相同类型。
硅树脂覆盖层56希望在紧接硅树脂/磷光体浆料分配之后由混合物施加或者合成地产生并且随后同时固化以避免分离。在优选实施例中，在固化LED封装中硅树脂磷光体混合物之前，硅树脂保护性覆盖层56可以通过在硅树脂混合物中磷光体的重力沉淀而形成。可以通过经由离心分离机或类似装置人为产生额外重力而辅助沉淀过程。该重力作用将磷光体硅树脂混合物层54物理地向下沉淀在LED芯片52上并且允许硅树脂渗出至顶部以形成仅硅树脂的保护性覆盖层56。
LED芯片52和磷光体硅树脂混合层54可以采用透镜58密封。透镜58可以例如是环氧树脂、塑料、低温玻璃、聚合物、热塑性、热固性材料、树脂或本领域已知的其他类型LED密封材料。任选地，透镜58是旋涂玻璃或者具有高折射率的一些其他材料。在一个优选实施例中，透镜58是聚合物材料，诸如环氧树脂、硅树脂、或硅环氧树脂，尽管可以使用其他有机或无机密封剂。
透镜58优选地相对于由LED芯片52和磷光体硅树脂混合材料54所产生的光的波长是透明的或者基本上是光透射性的。在备选实施例中，封装50可以仅包括密封材料而不具有外部透镜。
LED封装的外侧封壳60通常由聚合物合成材料EMC(环氧可模压合成物)制成。LED芯片52可以例如由引线框架(未示出)、由自支撑电极、封壳60的底部、或者由安装至外壳或引线框架的底座(未示出)而支撑。LED芯片52电附接至在外侧封壳60的底表面处的电接触。对于本领域技术人员已知的是在LED封装中可以存在具有类似功能属性的多个芯片。
由于其磷光体的保护以及与诸如水的环境要素隔离，与不具有硅树脂覆盖层的相同LED封装相比，已经量化硅树脂覆盖层56以提供25％的封装色移改进。
示例
Nichia 757LED具有高BSY-PFS磷光体装填(49∶40∶11的硅树脂∶PFS∶BSY重量百分比)制成为具有或不具有硅树脂覆盖层并且在受控工作条件下比较。在两种情形中所使用的磷光体的量相同并且LED驱动和环境条件保持相同。LED工作条件是在47C恒定温度腔室中30mA。
以下表1示出了色移的相对改进。
表1
在500个工作小时之后色移的改进是34％，并且在4000个工作小时之后改进是29％。
本领域技术人员，特别是根据前述教导，可以做出仍然由本公开所包括的备选实施例、示例和修改。此外，应该理解的是用于描述本公开的术语意在本质上是描述性而不是限定性词语。
本领域技术人员也将知晓，可以配置如上所述的优选和备选实施例的各种改变和修改而并未脱离本公开的范围和精神。因此，应该理解的是，在所附权利要求的范围内，除了在此具体所述之外可以实施本公开。

Claims (22)

1.一种磷光体装填的LED封装，包括：
LED；
第一层，其包括覆盖所述LED的磷光体和硅树脂的混合物，其中所述混合物包括至少20％的磷光体与硅树脂的重量比；以及
覆盖层，包括硅树脂。
2.根据权利要求1所述的LED封装，其中，所述覆盖层并不包括磷光体。
3.根据前述权利要求任一项所述的LED封装，其中，所述混合物中的磷光体呈现湿气敏感性。
4.根据前述权利要求任一项所述的LED封装，其中，所述混合物包括红色磷光体和黄色磷光体。
5.根据前述权利要求任一项所述的LED封装，其中，所述混合物包括PFS磷光体。
6.根据前述权利要求任一项所述的LED封装，其中，所述混合物包括YAG磷光体。
7.根据前述权利要求任一项所述的LED封装，其中，所述LED封装使用BSY-PFS磷光体。
8.根据前述权利要求任一项所述的LED封装，其中，所述LED封装是＜1W的低至中功率LED封装。
9.根据前述权利要求任一项所述的LED封装，其中，所述覆盖层具有约0.1mm或更大的厚度。
10.根据前述权利要求任一项所述的LED封装，其中，所述覆盖层由与所述第一层的混合物中相同的硅树脂制成。
11.根据前述权利要求任一项所述的LED封装，其中，与不具有覆盖层的相同封装相比，所述封装具有至少25％的色移改进。
12.一种方法，包括：
将包括硅树脂的覆盖层施加至覆盖了LED的第一层上；
其中所述第一层包括覆盖了所述LED的磷光体和硅树脂的混合物，其中所述混合物包括至少20％的磷光体与硅树脂重量比。
13.根据权利要求12所述的方法，其中，所述方法提高了重磷光体装填的LED封装的稳定性。
14.根据权利要求12所述的方法，其中，所述混合物包括PFS磷光体和BSY磷光体，或者频谱类似于PFS和BSY磷光体的磷光体。
15.根据权利要求12所述的方法，其中，所述LED封装是使用BSY-PFS磷光体的低至中功率LED封装。
16.根据权利要求12所述的方法，其中，所述硅树脂覆盖层具有约0.1mm或更大的厚度。
17.根据权利要求12所述的方法，其中，所述硅树脂覆盖层由与混合物中相同的硅树脂制成。
18.根据权利要求12所述的方法，其中，与不具有硅树脂覆盖层的相同封装相比，所述封装具有至少25％的色移改进。
19.根据权利要求12所述的方法，其中，所述硅树脂覆盖层施加至所形成的第一层。
20.根据权利要求12所述的方法，其中，在所述磷光体硅树脂混合物的固化之前，通过磷光体硅树脂混合物中磷光体的沉淀形成所述硅树脂覆盖层，提供所述第一层和所述硅树脂覆盖层。
21.根据权利要求12所述的方法，其中，由增强重力辅助所述磷光体在所述磷光体硅树脂混合物上的沉淀。
22.根据权利要求12所述的方法，其中，所述覆盖层不包括磷光体。
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