CA2942044C - Heavily phosphor loaded led package - Google Patents

Heavily phosphor loaded led package Download PDF

Info

Publication number
CA2942044C
CA2942044C CA2942044A CA2942044A CA2942044C CA 2942044 C CA2942044 C CA 2942044C CA 2942044 A CA2942044 A CA 2942044A CA 2942044 A CA2942044 A CA 2942044A CA 2942044 C CA2942044 C CA 2942044C
Authority
CA
Canada
Prior art keywords
phosphor
silicone
led
overlayer
blend
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CA2942044A
Other languages
English (en)
French (fr)
Other versions
CA2942044A1 (en
Inventor
Ashfaqul Islam Chowdhury
Gary Robert Allen
Dengke Cai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Current Lighting Solutions LLC
Original Assignee
Current Lighting Solutions LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=52596638&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CA2942044(C) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Current Lighting Solutions LLC filed Critical Current Lighting Solutions LLC
Publication of CA2942044A1 publication Critical patent/CA2942044A1/en
Application granted granted Critical
Publication of CA2942044C publication Critical patent/CA2942044C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/61—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing fluorine, chlorine, bromine, iodine or unspecified halogen elements
    • C09K11/617—Silicates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8516—Wavelength conversion means having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
  • Optical Filters (AREA)
  • Led Devices (AREA)
CA2942044A 2014-03-18 2015-02-23 Heavily phosphor loaded led package Active CA2942044C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/217,831 2014-03-18
US14/217,831 US9680067B2 (en) 2014-03-18 2014-03-18 Heavily phosphor loaded LED packages having higher stability
PCT/US2015/017010 WO2015142478A1 (en) 2014-03-18 2015-02-23 Heavily phosphor loaded led package

Publications (2)

Publication Number Publication Date
CA2942044A1 CA2942044A1 (en) 2015-09-24
CA2942044C true CA2942044C (en) 2023-01-03

Family

ID=52596638

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2942044A Active CA2942044C (en) 2014-03-18 2015-02-23 Heavily phosphor loaded led package

Country Status (10)

Country Link
US (1) US9680067B2 (enExample)
EP (2) EP4332196A3 (enExample)
JP (1) JP6855245B2 (enExample)
KR (3) KR102923991B1 (enExample)
CN (2) CN113675322A (enExample)
CA (1) CA2942044C (enExample)
MX (1) MX2016012013A (enExample)
MY (1) MY178038A (enExample)
TW (1) TWI657600B (enExample)
WO (1) WO2015142478A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9590148B2 (en) * 2014-03-18 2017-03-07 GE Lighting Solutions, LLC Encapsulant modification in heavily phosphor loaded LED packages for improved stability
US9680067B2 (en) 2014-03-18 2017-06-13 GE Lighting Solutions, LLC Heavily phosphor loaded LED packages having higher stability
EP3590307B1 (en) 2017-02-28 2023-09-27 Quarkstar LLC Lifetime color stabilization of color-shifting artificial light sources
RU2666578C1 (ru) * 2017-08-08 2018-09-11 Акционерное общество "Центральный научно-исследовательский институт "Электрон" Светоизлучающий диод
CN111712555B (zh) 2018-02-12 2023-06-09 昕诺飞控股有限公司 照明装置、灯具和提供聚合物主体基质元件的方法
US11056625B2 (en) * 2018-02-19 2021-07-06 Creeled, Inc. Clear coating for light emitting device exterior having chemical resistance and related methods
CN109668062A (zh) * 2018-12-11 2019-04-23 业成科技(成都)有限公司 发光二极体面光源结构
WO2021021984A1 (en) * 2019-07-30 2021-02-04 Current Lighting Solutions, Llc Stable phosphor converted led and systems using the same
GB2590450B (en) * 2019-12-18 2022-01-05 Plessey Semiconductors Ltd Light emitting diode precursor

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW383508B (en) * 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
JP4271747B2 (ja) 1997-07-07 2009-06-03 株式会社朝日ラバー 発光ダイオード用透光性被覆材及び蛍光カラー光源
US6204523B1 (en) 1998-11-06 2001-03-20 Lumileds Lighting, U.S., Llc High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range
EP2017901A1 (en) 2001-09-03 2009-01-21 Panasonic Corporation Semiconductor light emitting device, light emitting apparatus and production method for semiconductor light emitting DEV
TWI245436B (en) 2003-10-30 2005-12-11 Kyocera Corp Package for housing light-emitting element, light-emitting apparatus and illumination apparatus
US7497973B2 (en) * 2005-02-02 2009-03-03 Lumination Llc Red line emitting phosphor materials for use in LED applications
EP1865564B1 (en) * 2005-03-18 2014-11-19 Mitsubishi Chemical Corporation Light-emitting device, white light-emitting device, illuminator, and image display
JP2007123390A (ja) * 2005-10-26 2007-05-17 Kyocera Corp 発光装置
US7521728B2 (en) 2006-01-20 2009-04-21 Cree, Inc. Packages for semiconductor light emitting devices utilizing dispensed reflectors and methods of forming the same
KR100785492B1 (ko) 2006-04-17 2007-12-13 한국과학기술원 새로운 조성의 황색 발광 Ce3+부활 실리케이트황색형광체, 그 제조방법 및 상기 형광체를 포함하는 백색발광 다이오드
JP5205724B2 (ja) * 2006-08-04 2013-06-05 日亜化学工業株式会社 発光装置
JP5578597B2 (ja) * 2007-09-03 2014-08-27 独立行政法人物質・材料研究機構 蛍光体及びその製造方法、並びにそれを用いた発光装置
KR101559603B1 (ko) 2008-02-07 2015-10-12 미쓰비시 가가꾸 가부시키가이샤 반도체 발광 장치, 백라이트, 컬러 화상 표시 장치, 및 그들에 사용하는 형광체
KR101226777B1 (ko) * 2008-03-25 2013-01-25 가부시끼가이샤 도시바 발광 장치와, 그 제조 방법 및 장치
US9287469B2 (en) * 2008-05-02 2016-03-15 Cree, Inc. Encapsulation for phosphor-converted white light emitting diode
KR101503499B1 (ko) * 2008-09-11 2015-03-18 서울반도체 주식회사 멀티칩 발광 다이오드 패키지
JP2010093132A (ja) 2008-10-09 2010-04-22 Sharp Corp 半導体発光装置およびそれを用いた画像表示装置、液晶表示装置
JP5308773B2 (ja) 2008-10-30 2013-10-09 スタンレー電気株式会社 半導体発光装置
US8039862B2 (en) 2009-03-10 2011-10-18 Nepes Led Corporation White light emitting diode package having enhanced white lighting efficiency and method of making the same
US8058667B2 (en) 2009-03-10 2011-11-15 Nepes Led Corporation Leadframe package for light emitting diode device
JP5423120B2 (ja) 2009-04-17 2014-02-19 三菱化学株式会社 半導体発光装置
JP2011054958A (ja) * 2009-08-06 2011-03-17 Mitsubishi Chemicals Corp 半導体発光装置、並びに画像表示装置及び照明装置
US20110031516A1 (en) 2009-08-07 2011-02-10 Koninklijke Philips Electronics N.V. Led with silicone layer and laminated remote phosphor layer
US20100276712A1 (en) * 2009-11-03 2010-11-04 Alexander Shaikevitch Light emitting diode with thin multilayer phosphor film
JP5076017B2 (ja) * 2010-08-23 2012-11-21 株式会社東芝 発光装置
WO2012029695A1 (ja) * 2010-08-31 2012-03-08 日亜化学工業株式会社 発光装置とその製造方法
JP5622494B2 (ja) 2010-09-09 2014-11-12 スタンレー電気株式会社 発光装置およびその製造方法
JP4974310B2 (ja) 2010-10-15 2012-07-11 三菱化学株式会社 白色発光装置及び照明器具
DE102010063760B4 (de) 2010-12-21 2022-12-29 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement
US9085728B2 (en) * 2011-01-28 2015-07-21 Showa Denko K.K. Composition containing quantum dot fluorescent body, molded body of quantum dot fluorescent body dispersion resin, structure containing quantum dot fluorescent body, light-emitting device, electronic apparatus, mechanical device, and method for producing molded body of quantum dot fluorescent body dispersion resin
DE102011003969B4 (de) 2011-02-11 2023-03-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines optoelektronischen Bauelements
JP5762044B2 (ja) * 2011-02-23 2015-08-12 三菱電機株式会社 発光装置及び発光装置群及び製造方法
US8252613B1 (en) 2011-03-23 2012-08-28 General Electric Company Color stable manganese-doped phosphors
TWI489656B (zh) 2011-03-25 2015-06-21 三星電子股份有限公司 發光二極體、發光二極體之製造方法、發光二極體模組及發光二極體模組之製造方法
JP5105132B1 (ja) * 2011-06-02 2012-12-19 三菱化学株式会社 半導体発光装置、半導体発光システムおよび照明器具
EP3346512B1 (en) 2011-06-03 2023-06-07 Citizen Electronics Co., Ltd. Semiconductor light-emitting device, exhibit-irradiating illumination device, meat-irradiating illumination device, vegetable-irradiating illumination device, fresh fish-irradiating illumination device, general-purpose illumination device, and semiconductor light-emitting system
WO2013001687A1 (ja) * 2011-06-30 2013-01-03 パナソニック株式会社 発光装置
DE102011081083A1 (de) 2011-08-17 2013-02-21 Osram Ag Presswerkzeug und verfahren zum pressen eines silikonelements
US8841689B2 (en) * 2012-02-03 2014-09-23 Shin-Etsu Chemical Co., Ltd. Heat-curable silicone resin sheet having phosphor-containing layer and phosphor-free layer, method of producing light emitting device utilizing same and light emitting semiconductor device obtained by the method
US9343441B2 (en) * 2012-02-13 2016-05-17 Cree, Inc. Light emitter devices having improved light output and related methods
JP5840540B2 (ja) * 2012-03-15 2016-01-06 株式会社東芝 白色照明装置
DE102012208900A1 (de) 2012-05-25 2013-11-28 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen optoelektronischer Bauelemente und Vorrichtung zum Herstellen optoelektronischer Bauelemente
US10424702B2 (en) 2012-06-11 2019-09-24 Cree, Inc. Compact LED package with reflectivity layer
JP2014041993A (ja) * 2012-07-24 2014-03-06 Toyoda Gosei Co Ltd 発光装置及びその製造方法
DE102012213195A1 (de) 2012-07-26 2014-01-30 Osram Gmbh Verfahren zum Belegen einer Oberfläche mit Leuchtstoff
US9761763B2 (en) * 2012-12-21 2017-09-12 Soraa, Inc. Dense-luminescent-materials-coated violet LEDs
US9680067B2 (en) 2014-03-18 2017-06-13 GE Lighting Solutions, LLC Heavily phosphor loaded LED packages having higher stability

Also Published As

Publication number Publication date
KR20240023202A (ko) 2024-02-20
CA2942044A1 (en) 2015-09-24
US9680067B2 (en) 2017-06-13
KR20220045236A (ko) 2022-04-12
EP3120394A1 (en) 2017-01-25
KR102923991B1 (ko) 2026-02-05
KR20160133528A (ko) 2016-11-22
MX2016012013A (es) 2016-12-05
JP2017511599A (ja) 2017-04-20
US20150270451A1 (en) 2015-09-24
EP3120394B1 (en) 2023-12-20
WO2015142478A1 (en) 2015-09-24
CN113675322A (zh) 2021-11-19
EP4332196A2 (en) 2024-03-06
CN106463584A (zh) 2017-02-22
TWI657600B (zh) 2019-04-21
TW201547060A (zh) 2015-12-16
MY178038A (en) 2020-09-30
EP4332196A3 (en) 2024-06-05
JP6855245B2 (ja) 2021-04-07

Similar Documents

Publication Publication Date Title
US9680067B2 (en) Heavily phosphor loaded LED packages having higher stability
US10862009B2 (en) Encapsulant modification in heavily phosphor loaded LED packages for improved stability
CN104756251B (zh) 发光二极管模块
JP2000031531A (ja) 発光装置
CN107406766B (zh) 具有蓝色颜料的蓝色发射磷光体转换led
EP3035395A1 (en) White light emitting diode device for illumination using near UV light and phosphor
US8519611B2 (en) Hybrid illumination system with improved color quality
KR102503519B1 (ko) 옥시플루오라이드 인광체 조성물 및 이의 조명 장치
CN106784190B (zh) 一种具有变色功能的GaN基LED的结构及其调节方法
KR20150025663A (ko) 근자외선과 형광체를 이용한 백색 발광 조명용 소자
CN101308837A (zh) 暖色系光源
CN104716248A (zh) 全新高性能的led高显yag成份绿粉
KR102401589B1 (ko) 인체에 유익한 스펙트럼을 가지는 고연색성 백색 광원
KR20170081931A (ko) 발광 소자 및 이를 구비한 조명 장치

Legal Events

Date Code Title Description
EEER Examination request

Effective date: 20200219

MPN Maintenance fee for patent paid

Free format text: FEE DESCRIPTION TEXT: MF (PATENT, 10TH ANNIV.) - STANDARD

Year of fee payment: 10

U00 Fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U00-U101 (AS PROVIDED BY THE NATIONAL OFFICE); EVENT TEXT: MAINTENANCE REQUEST RECEIVED

Effective date: 20250123

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-U102 (AS PROVIDED BY THE NATIONAL OFFICE); EVENT TEXT: MAINTENANCE FEE PAYMENT DETERMINED COMPLIANT

Effective date: 20250123