MY178038A - Heavily phosphor loaded led packages having higher stability - Google Patents
Heavily phosphor loaded led packages having higher stabilityInfo
- Publication number
- MY178038A MY178038A MYPI2016702904A MYPI2016702904A MY178038A MY 178038 A MY178038 A MY 178038A MY PI2016702904 A MYPI2016702904 A MY PI2016702904A MY PI2016702904 A MYPI2016702904 A MY PI2016702904A MY 178038 A MY178038 A MY 178038A
- Authority
- MY
- Malaysia
- Prior art keywords
- led packages
- higher stability
- loaded led
- phosphor loaded
- heavily
- Prior art date
Links
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title abstract 4
- 229920001296 polysiloxane Polymers 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
- H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/61—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing fluorine, chlorine, bromine, iodine or unspecified halogen elements
- C09K11/617—Silicates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8515—Wavelength conversion means not being in contact with the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0362—Manufacture or treatment of packages of encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8516—Wavelength conversion means having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
- Optical Filters (AREA)
- Led Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/217,831 US9680067B2 (en) | 2014-03-18 | 2014-03-18 | Heavily phosphor loaded LED packages having higher stability |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY178038A true MY178038A (en) | 2020-09-30 |
Family
ID=52596638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2016702904A MY178038A (en) | 2014-03-18 | 2015-02-23 | Heavily phosphor loaded led packages having higher stability |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US9680067B2 (enExample) |
| EP (2) | EP4332196A3 (enExample) |
| JP (1) | JP6855245B2 (enExample) |
| KR (3) | KR20160133528A (enExample) |
| CN (2) | CN113675322A (enExample) |
| CA (1) | CA2942044C (enExample) |
| MX (1) | MX2016012013A (enExample) |
| MY (1) | MY178038A (enExample) |
| TW (1) | TWI657600B (enExample) |
| WO (1) | WO2015142478A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9590148B2 (en) * | 2014-03-18 | 2017-03-07 | GE Lighting Solutions, LLC | Encapsulant modification in heavily phosphor loaded LED packages for improved stability |
| US9680067B2 (en) | 2014-03-18 | 2017-06-13 | GE Lighting Solutions, LLC | Heavily phosphor loaded LED packages having higher stability |
| US11337282B2 (en) * | 2017-02-28 | 2022-05-17 | Quarkstar Llc | Lifetime color stabilization of color-shifting artificial light sources |
| RU2666578C1 (ru) * | 2017-08-08 | 2018-09-11 | Акционерное общество "Центральный научно-исследовательский институт "Электрон" | Светоизлучающий диод |
| JP7002665B2 (ja) * | 2018-02-12 | 2022-02-04 | シグニファイ ホールディング ビー ヴィ | フッ化物蛍光体を有するled光源 |
| US11056625B2 (en) * | 2018-02-19 | 2021-07-06 | Creeled, Inc. | Clear coating for light emitting device exterior having chemical resistance and related methods |
| CN109668062A (zh) * | 2018-12-11 | 2019-04-23 | 业成科技(成都)有限公司 | 发光二极体面光源结构 |
| US20220275275A1 (en) * | 2019-07-30 | 2022-09-01 | Current Lighting Solution, Llc | Stable phosphor converted led and system using the same |
| GB2590450B (en) * | 2019-12-18 | 2022-01-05 | Plessey Semiconductors Ltd | Light emitting diode precursor |
Family Cites Families (45)
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| TW383508B (en) * | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
| JP4271747B2 (ja) | 1997-07-07 | 2009-06-03 | 株式会社朝日ラバー | 発光ダイオード用透光性被覆材及び蛍光カラー光源 |
| US6204523B1 (en) | 1998-11-06 | 2001-03-20 | Lumileds Lighting, U.S., Llc | High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range |
| KR100923804B1 (ko) | 2001-09-03 | 2009-10-27 | 파나소닉 주식회사 | 반도체발광소자, 발광장치 및 반도체발광소자의 제조방법 |
| TWI245436B (en) | 2003-10-30 | 2005-12-11 | Kyocera Corp | Package for housing light-emitting element, light-emitting apparatus and illumination apparatus |
| US7497973B2 (en) * | 2005-02-02 | 2009-03-03 | Lumination Llc | Red line emitting phosphor materials for use in LED applications |
| US8269410B2 (en) * | 2005-03-18 | 2012-09-18 | Mitsubishi Chemical Corporation | Light-emitting device, white light-emitting device, illuminator, and image display |
| JP2007123390A (ja) * | 2005-10-26 | 2007-05-17 | Kyocera Corp | 発光装置 |
| US7521728B2 (en) | 2006-01-20 | 2009-04-21 | Cree, Inc. | Packages for semiconductor light emitting devices utilizing dispensed reflectors and methods of forming the same |
| KR100785492B1 (ko) | 2006-04-17 | 2007-12-13 | 한국과학기술원 | 새로운 조성의 황색 발광 Ce3+부활 실리케이트황색형광체, 그 제조방법 및 상기 형광체를 포함하는 백색발광 다이오드 |
| JP5205724B2 (ja) * | 2006-08-04 | 2013-06-05 | 日亜化学工業株式会社 | 発光装置 |
| JP5578597B2 (ja) * | 2007-09-03 | 2014-08-27 | 独立行政法人物質・材料研究機構 | 蛍光体及びその製造方法、並びにそれを用いた発光装置 |
| US8491816B2 (en) * | 2008-02-07 | 2013-07-23 | Mitsubishi Chemical Corporation | Semiconductor light emitting device, backlight, color image display device and phosphor to be used for them |
| US9287469B2 (en) * | 2008-05-02 | 2016-03-15 | Cree, Inc. | Encapsulation for phosphor-converted white light emitting diode |
| JP2010093132A (ja) | 2008-10-09 | 2010-04-22 | Sharp Corp | 半導体発光装置およびそれを用いた画像表示装置、液晶表示装置 |
| JP5308773B2 (ja) | 2008-10-30 | 2013-10-09 | スタンレー電気株式会社 | 半導体発光装置 |
| US8058667B2 (en) | 2009-03-10 | 2011-11-15 | Nepes Led Corporation | Leadframe package for light emitting diode device |
| US8039862B2 (en) | 2009-03-10 | 2011-10-18 | Nepes Led Corporation | White light emitting diode package having enhanced white lighting efficiency and method of making the same |
| JP5423120B2 (ja) | 2009-04-17 | 2014-02-19 | 三菱化学株式会社 | 半導体発光装置 |
| JP2011054958A (ja) * | 2009-08-06 | 2011-03-17 | Mitsubishi Chemicals Corp | 半導体発光装置、並びに画像表示装置及び照明装置 |
| US20110031516A1 (en) | 2009-08-07 | 2011-02-10 | Koninklijke Philips Electronics N.V. | Led with silicone layer and laminated remote phosphor layer |
| US20100276712A1 (en) * | 2009-11-03 | 2010-11-04 | Alexander Shaikevitch | Light emitting diode with thin multilayer phosphor film |
| JP5076017B2 (ja) * | 2010-08-23 | 2012-11-21 | 株式会社東芝 | 発光装置 |
| EP2613371B1 (en) * | 2010-08-31 | 2019-04-24 | Nichia Corporation | Light emitting device and method for manufacturing same |
| JP5622494B2 (ja) | 2010-09-09 | 2014-11-12 | スタンレー電気株式会社 | 発光装置およびその製造方法 |
| JP4974310B2 (ja) | 2010-10-15 | 2012-07-11 | 三菱化学株式会社 | 白色発光装置及び照明器具 |
| DE102010063760B4 (de) * | 2010-12-21 | 2022-12-29 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement |
| CN103328605B (zh) * | 2011-01-28 | 2015-04-08 | 昭和电工株式会社 | 包含量子点荧光体的组合物、量子点荧光体分散树脂成型体、包含量子点荧光体的结构物、发光装置、电子设备、机械装置及量子点荧光体分散树脂成型体的制造方法 |
| DE102011003969B4 (de) | 2011-02-11 | 2023-03-09 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines optoelektronischen Bauelements |
| JP5762044B2 (ja) * | 2011-02-23 | 2015-08-12 | 三菱電機株式会社 | 発光装置及び発光装置群及び製造方法 |
| US8252613B1 (en) | 2011-03-23 | 2012-08-28 | General Electric Company | Color stable manganese-doped phosphors |
| EP2503606B1 (en) | 2011-03-25 | 2020-02-26 | Samsung Electronics Co., Ltd. | Light Emitting Diode, Manufacturing Method Thereof, Light Emitting Diode Module, and Manufacturing Method Thereof |
| JP5105132B1 (ja) | 2011-06-02 | 2012-12-19 | 三菱化学株式会社 | 半導体発光装置、半導体発光システムおよび照明器具 |
| EP3346512B1 (en) | 2011-06-03 | 2023-06-07 | Citizen Electronics Co., Ltd. | Semiconductor light-emitting device, exhibit-irradiating illumination device, meat-irradiating illumination device, vegetable-irradiating illumination device, fresh fish-irradiating illumination device, general-purpose illumination device, and semiconductor light-emitting system |
| CN103650183B (zh) * | 2011-06-30 | 2017-02-22 | 松下知识产权经营株式会社 | 发光装置 |
| DE102011081083A1 (de) | 2011-08-17 | 2013-02-21 | Osram Ag | Presswerkzeug und verfahren zum pressen eines silikonelements |
| US8841689B2 (en) * | 2012-02-03 | 2014-09-23 | Shin-Etsu Chemical Co., Ltd. | Heat-curable silicone resin sheet having phosphor-containing layer and phosphor-free layer, method of producing light emitting device utilizing same and light emitting semiconductor device obtained by the method |
| US9343441B2 (en) * | 2012-02-13 | 2016-05-17 | Cree, Inc. | Light emitter devices having improved light output and related methods |
| JP5840540B2 (ja) * | 2012-03-15 | 2016-01-06 | 株式会社東芝 | 白色照明装置 |
| DE102012208900A1 (de) | 2012-05-25 | 2013-11-28 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen optoelektronischer Bauelemente und Vorrichtung zum Herstellen optoelektronischer Bauelemente |
| US10424702B2 (en) | 2012-06-11 | 2019-09-24 | Cree, Inc. | Compact LED package with reflectivity layer |
| JP2014041993A (ja) * | 2012-07-24 | 2014-03-06 | Toyoda Gosei Co Ltd | 発光装置及びその製造方法 |
| DE102012213195A1 (de) | 2012-07-26 | 2014-01-30 | Osram Gmbh | Verfahren zum Belegen einer Oberfläche mit Leuchtstoff |
| US9761763B2 (en) * | 2012-12-21 | 2017-09-12 | Soraa, Inc. | Dense-luminescent-materials-coated violet LEDs |
| US9680067B2 (en) | 2014-03-18 | 2017-06-13 | GE Lighting Solutions, LLC | Heavily phosphor loaded LED packages having higher stability |
-
2014
- 2014-03-18 US US14/217,831 patent/US9680067B2/en active Active
-
2015
- 2015-02-23 KR KR1020167028521A patent/KR20160133528A/ko not_active Ceased
- 2015-02-23 EP EP23216627.2A patent/EP4332196A3/en active Pending
- 2015-02-23 EP EP15707243.0A patent/EP3120394B1/en active Active
- 2015-02-23 CA CA2942044A patent/CA2942044C/en active Active
- 2015-02-23 JP JP2016556865A patent/JP6855245B2/ja active Active
- 2015-02-23 MY MYPI2016702904A patent/MY178038A/en unknown
- 2015-02-23 CN CN202110725667.8A patent/CN113675322A/zh active Pending
- 2015-02-23 KR KR1020227009789A patent/KR20220045236A/ko not_active Ceased
- 2015-02-23 KR KR1020247004203A patent/KR20240023202A/ko active Pending
- 2015-02-23 MX MX2016012013A patent/MX2016012013A/es unknown
- 2015-02-23 WO PCT/US2015/017010 patent/WO2015142478A1/en not_active Ceased
- 2015-02-23 CN CN201580014432.0A patent/CN106463584A/zh active Pending
- 2015-03-05 TW TW104107021A patent/TWI657600B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| EP3120394A1 (en) | 2017-01-25 |
| CA2942044C (en) | 2023-01-03 |
| EP3120394B1 (en) | 2023-12-20 |
| KR20220045236A (ko) | 2022-04-12 |
| MX2016012013A (es) | 2016-12-05 |
| CN113675322A (zh) | 2021-11-19 |
| EP4332196A2 (en) | 2024-03-06 |
| JP6855245B2 (ja) | 2021-04-07 |
| WO2015142478A1 (en) | 2015-09-24 |
| KR20160133528A (ko) | 2016-11-22 |
| CN106463584A (zh) | 2017-02-22 |
| JP2017511599A (ja) | 2017-04-20 |
| KR20240023202A (ko) | 2024-02-20 |
| EP4332196A3 (en) | 2024-06-05 |
| US9680067B2 (en) | 2017-06-13 |
| TWI657600B (zh) | 2019-04-21 |
| CA2942044A1 (en) | 2015-09-24 |
| US20150270451A1 (en) | 2015-09-24 |
| TW201547060A (zh) | 2015-12-16 |
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