JP2017508303A5 - - Google Patents

Download PDF

Info

Publication number
JP2017508303A5
JP2017508303A5 JP2016561588A JP2016561588A JP2017508303A5 JP 2017508303 A5 JP2017508303 A5 JP 2017508303A5 JP 2016561588 A JP2016561588 A JP 2016561588A JP 2016561588 A JP2016561588 A JP 2016561588A JP 2017508303 A5 JP2017508303 A5 JP 2017508303A5
Authority
JP
Japan
Prior art keywords
coating
region
thickness
tapered
support ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016561588A
Other languages
English (en)
Japanese (ja)
Other versions
JP6408606B2 (ja
JP2017508303A (ja
Filing date
Publication date
Priority claimed from US14/218,597 external-priority patent/US9330955B2/en
Application filed filed Critical
Publication of JP2017508303A publication Critical patent/JP2017508303A/ja
Publication of JP2017508303A5 publication Critical patent/JP2017508303A5/ja
Application granted granted Critical
Publication of JP6408606B2 publication Critical patent/JP6408606B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016561588A 2013-12-31 2014-11-25 マスキングされたエッジを有する支持リング Active JP6408606B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361922451P 2013-12-31 2013-12-31
US61/922,451 2013-12-31
US14/218,597 US9330955B2 (en) 2013-12-31 2014-03-18 Support ring with masked edge
US14/218,597 2014-03-18
PCT/US2014/067367 WO2015102781A1 (en) 2013-12-31 2014-11-25 Support ring with masked edge

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018176528A Division JP6758353B2 (ja) 2013-12-31 2018-09-20 マスキングされたエッジを有する支持リング

Publications (3)

Publication Number Publication Date
JP2017508303A JP2017508303A (ja) 2017-03-23
JP2017508303A5 true JP2017508303A5 (https=) 2018-01-18
JP6408606B2 JP6408606B2 (ja) 2018-10-17

Family

ID=53482656

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016561588A Active JP6408606B2 (ja) 2013-12-31 2014-11-25 マスキングされたエッジを有する支持リング
JP2018176528A Active JP6758353B2 (ja) 2013-12-31 2018-09-20 マスキングされたエッジを有する支持リング

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2018176528A Active JP6758353B2 (ja) 2013-12-31 2018-09-20 マスキングされたエッジを有する支持リング

Country Status (6)

Country Link
US (4) US9330955B2 (https=)
JP (2) JP6408606B2 (https=)
KR (3) KR102279150B1 (https=)
CN (2) CN110223949B (https=)
TW (3) TWI594361B (https=)
WO (1) WO2015102781A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012158291A1 (en) * 2011-05-13 2012-11-22 Dow Global Technologies Llc Insulation formulations
US9330955B2 (en) * 2013-12-31 2016-05-03 Applied Materials, Inc. Support ring with masked edge
JP2020516770A (ja) 2017-04-07 2020-06-11 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 基板端部上のプラズマ密度制御
CN107121892B (zh) * 2017-04-26 2018-12-28 武汉华星光电技术有限公司 一种基板曝边设备
CN111819679A (zh) * 2018-03-13 2020-10-23 应用材料公司 具有等离子体喷涂涂层的支撑环
CN110920254B (zh) 2018-09-19 2021-03-16 精工爱普生株式会社 打印头控制电路及液体喷出装置
US12134835B2 (en) * 2021-09-01 2024-11-05 Applied Materials, Inc. Quartz susceptor for accurate non-contact temperature measurement
US20250305141A1 (en) * 2024-03-27 2025-10-02 Applied Materials, Inc. Multi-section substrate supports and related methods, process kits, and processing chambers for semiconductor manufacturing
KR102944097B1 (ko) * 2024-09-23 2026-03-27 주식회사 비아트론 웨이퍼 지지용 에지링

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61217561A (ja) * 1985-03-25 1986-09-27 Sumitomo Metal Ind Ltd Ni基合金の製造方法
US5690795A (en) * 1995-06-05 1997-11-25 Applied Materials, Inc. Screwless shield assembly for vacuum processing chambers
US5884412A (en) * 1996-07-24 1999-03-23 Applied Materials, Inc. Method and apparatus for purging the back side of a substrate during chemical vapor processing
US5848889A (en) * 1996-07-24 1998-12-15 Applied Materials Inc. Semiconductor wafer support with graded thermal mass
US6395363B1 (en) * 1996-11-05 2002-05-28 Applied Materials, Inc. Sloped substrate support
US6530994B1 (en) 1997-08-15 2003-03-11 Micro C Technologies, Inc. Platform for supporting a semiconductor substrate and method of supporting a substrate during rapid high temperature processing
DE69813014T2 (de) 1997-11-03 2004-02-12 Asm America Inc., Phoenix Verbesserte kleinmassige waferhaleeinrichtung
US6200388B1 (en) * 1998-02-11 2001-03-13 Applied Materials, Inc. Substrate support for a thermal processing chamber
US6280183B1 (en) * 1998-04-01 2001-08-28 Applied Materials, Inc. Substrate support for a thermal processing chamber
US6048403A (en) * 1998-04-01 2000-04-11 Applied Materials, Inc. Multi-ledge substrate support for a thermal processing chamber
US6264467B1 (en) * 1999-04-14 2001-07-24 Applied Materials, Inc. Micro grooved support surface for reducing substrate wear and slip formation
US6383931B1 (en) * 2000-02-11 2002-05-07 Lam Research Corporation Convertible hot edge ring to improve low-K dielectric etch
KR20010087542A (ko) 2000-03-07 2001-09-21 윤종용 반도체 확산 공정용 석영 보트의 웨이퍼 지지장치
KR20020073814A (ko) * 2001-03-16 2002-09-28 삼성전자 주식회사 웨이퍼 열처리 장치
JP4323764B2 (ja) * 2002-07-16 2009-09-02 大日本スクリーン製造株式会社 熱処理装置
JP4067858B2 (ja) * 2002-04-16 2008-03-26 東京エレクトロン株式会社 Ald成膜装置およびald成膜方法
US7734439B2 (en) 2002-06-24 2010-06-08 Mattson Technology, Inc. System and process for calibrating pyrometers in thermal processing chambers
US7704327B2 (en) 2002-09-30 2010-04-27 Applied Materials, Inc. High temperature anneal with improved substrate support
US7241345B2 (en) 2003-06-16 2007-07-10 Applied Materials, Inc. Cylinder for thermal processing chamber
WO2005013334A2 (en) * 2003-08-01 2005-02-10 Sgl Carbon Ag Holder for supporting wafers during semiconductor manufacture
JPWO2005017988A1 (ja) * 2003-08-15 2006-10-12 株式会社日立国際電気 基板処理装置および半導体デバイスの製造方法
US6888104B1 (en) * 2004-02-05 2005-05-03 Applied Materials, Inc. Thermally matched support ring for substrate processing chamber
US7648579B2 (en) * 2004-02-13 2010-01-19 Asm America, Inc. Substrate support system for reduced autodoping and backside deposition
KR100733269B1 (ko) * 2005-08-18 2007-06-28 피에스케이 주식회사 반도체 식각 장비의 척 조립체
KR101122347B1 (ko) * 2006-05-31 2012-03-23 도쿄엘렉트론가부시키가이샤 절연막의 형성 방법 및 반도체 장치의 제조 방법
TW200834730A (en) * 2006-09-29 2008-08-16 Tokyo Electron Ltd Method for forming silicon oxide film, plasma processing apparatus and storage medium
JP5238688B2 (ja) * 2007-03-28 2013-07-17 東京エレクトロン株式会社 Cvd成膜装置
KR100856019B1 (ko) * 2008-02-22 2008-09-02 (주)타이닉스 플라즈마 처리장치의 기판 홀더
JP2010114190A (ja) 2008-11-05 2010-05-20 Mitsubishi Heavy Ind Ltd 光電変換装置の製造方法および光電変換装置
KR100940544B1 (ko) 2009-07-01 2010-02-10 (주)앤피에스 기판 지지 유닛
DE202010015933U1 (de) * 2009-12-01 2011-03-31 Lam Research Corp.(N.D.Ges.D.Staates Delaware), Fremont Eine Randringanordnung für Plasmaätzkammern
US8744250B2 (en) * 2011-02-23 2014-06-03 Applied Materials, Inc. Edge ring for a thermal processing chamber
US8979087B2 (en) * 2011-07-29 2015-03-17 Applied Materials, Inc. Substrate supporting edge ring with coating for improved soak performance
CN104718607B (zh) * 2012-08-31 2017-10-03 联达科技设备私人有限公司 用于自动校正膜片架上的晶圆的旋转错位的系统和方法
TWI675721B (zh) * 2013-07-11 2019-11-01 日商荏原製作所股份有限公司 研磨裝置及研磨狀態監視方法
US9385004B2 (en) * 2013-08-15 2016-07-05 Applied Materials, Inc. Support cylinder for thermal processing chamber
US9330955B2 (en) * 2013-12-31 2016-05-03 Applied Materials, Inc. Support ring with masked edge

Similar Documents

Publication Publication Date Title
JP2017508303A5 (https=)
JP2016530705A5 (https=)
JP1704964S (ja) プラズマ処理装置用サセプタリング
SG10201810390TA (en) Thermal processing susceptor
JP2016207806A5 (https=)
SG10201808035YA (en) Moveable edge coupling ring for edge process control during semiconductor wafer processing
TW201612974A (en) Proximity contact cover ring for plasma dicing
SG11202006623YA (en) Replaceable and/or collapsible edge ring assemblies for plasma sheath tuning incorporating edge ring positioning and centering features
JP2016530730A5 (https=)
JP6408606B2 (ja) マスキングされたエッジを有する支持リング
WO2016156510A3 (en) Apparatus for heating smokable material, article for use therewith and method of manufacture of article
MY177495A (en) Wafer thinning method
TW201614728A (en) Substrate processing method
JP2016534558A5 (https=)
PH12020551137A1 (en) Deposition ring for processing reduced size substrates
EP3666937C0 (en) HIGH FLATNESS, LOW DAMAGE, LARGE DIAMETER MONOCRYSTALLINE SILICON CARBIDE SUBSTRATE AND METHOD FOR MAKING THEREOF
JP2014175535A5 (https=)
MY179205A (en) Wafer and method of processing wafer
WO2017007297A3 (es) Tapa-casquillo con junta adaptada para obturar una botella metálica
JP2016109176A5 (https=)
TWD186396S (zh) 電漿處理裝置用環
HUE046837T2 (hu) Értékelési eljárás oxid félvezetõ vékony réteghez és rétegszerkezetû testhez, védõ réteggel az oxid félvezetõ vékony rétegen, és eljárás oxid félvezetõ vékony réteg minõségének biztosítására
EP4424871A3 (en) Mounting and cathodic protection
EP3521264A4 (en) SILICON CARBIDE ELEMENT FOR PLASMA TREATMENT APPARATUS, AND MANUFACTURING METHOD THEREOF
EP3078762A3 (en) Susceptor, vapor deposition apparatus, vapor deposition method and epitaxial silicon wafer