JP2017507484A5 - - Google Patents
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- Publication number
- JP2017507484A5 JP2017507484A5 JP2016548231A JP2016548231A JP2017507484A5 JP 2017507484 A5 JP2017507484 A5 JP 2017507484A5 JP 2016548231 A JP2016548231 A JP 2016548231A JP 2016548231 A JP2016548231 A JP 2016548231A JP 2017507484 A5 JP2017507484 A5 JP 2017507484A5
- Authority
- JP
- Japan
- Prior art keywords
- dielectric layer
- electrostatic chuck
- oxynitride
- dielectric
- silicon oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 6
- 229910052814 silicon oxide Inorganic materials 0.000 claims 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 4
- 229910052782 aluminium Inorganic materials 0.000 claims 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 4
- 229910052710 silicon Inorganic materials 0.000 claims 4
- 239000010703 silicon Substances 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 239000012212 insulator Substances 0.000 claims 3
- 239000010409 thin film Substances 0.000 claims 3
- 239000000919 ceramic Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 229910052761 rare earth metal Inorganic materials 0.000 claims 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 claims 1
- 150000002910 rare earth metals Chemical class 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- 229910052723 transition metal Inorganic materials 0.000 claims 1
- 229910000314 transition metal oxide Inorganic materials 0.000 claims 1
- 150000003624 transition metals Chemical class 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461937135P | 2014-02-07 | 2014-02-07 | |
| US61/937,135 | 2014-02-07 | ||
| PCT/US2015/014810 WO2015120265A1 (en) | 2014-02-07 | 2015-02-06 | Electrostatic chuck and method of making same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017507484A JP2017507484A (ja) | 2017-03-16 |
| JP2017507484A5 true JP2017507484A5 (cg-RX-API-DMAC7.html) | 2018-03-15 |
| JP6527524B2 JP6527524B2 (ja) | 2019-06-05 |
Family
ID=52544589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016548231A Active JP6527524B2 (ja) | 2014-02-07 | 2015-02-06 | 静電チャックおよびその作製方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10497598B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP3103136B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP6527524B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR102369706B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN107078086B (cg-RX-API-DMAC7.html) |
| SG (1) | SG10201806706VA (cg-RX-API-DMAC7.html) |
| TW (1) | TWI663681B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2015120265A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (46)
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| US10236202B2 (en) * | 2013-11-11 | 2019-03-19 | Diablo Capital, Inc. | System and method for adhering a semiconductive wafer to a mobile electrostatic carrier through a vacuum |
| EP3103136B1 (en) | 2014-02-07 | 2021-06-23 | Entegris, Inc. | Electrostatic chuck and method of making same |
| US20160379806A1 (en) * | 2015-06-25 | 2016-12-29 | Lam Research Corporation | Use of plasma-resistant atomic layer deposition coatings to extend the lifetime of polymer components in etch chambers |
| US20170211185A1 (en) * | 2016-01-22 | 2017-07-27 | Applied Materials, Inc. | Ceramic showerhead with embedded conductive layers |
| US11326253B2 (en) | 2016-04-27 | 2022-05-10 | Applied Materials, Inc. | Atomic layer deposition of protective coatings for semiconductor process chamber components |
| US9850573B1 (en) | 2016-06-23 | 2017-12-26 | Applied Materials, Inc. | Non-line of sight deposition of erbium based plasma resistant ceramic coating |
| US20180016678A1 (en) | 2016-07-15 | 2018-01-18 | Applied Materials, Inc. | Multi-layer coating with diffusion barrier layer and erosion resistant layer |
| US10186400B2 (en) * | 2017-01-20 | 2019-01-22 | Applied Materials, Inc. | Multi-layer plasma resistant coating by atomic layer deposition |
| US20180213608A1 (en) * | 2017-01-20 | 2018-07-26 | Applied Materials, Inc. | Electrostatic chuck with radio frequency isolated heaters |
| JP7111727B2 (ja) * | 2017-01-27 | 2022-08-02 | ビーコ インストゥルメント インク | 基板バイアスａｌｄ用電気絶縁改善チャックシステムおよび方法 |
| US10975469B2 (en) | 2017-03-17 | 2021-04-13 | Applied Materials, Inc. | Plasma resistant coating of porous body by atomic layer deposition |
| US11289355B2 (en) | 2017-06-02 | 2022-03-29 | Lam Research Corporation | Electrostatic chuck for use in semiconductor processing |
| US11469084B2 (en) | 2017-09-05 | 2022-10-11 | Lam Research Corporation | High temperature RF connection with integral thermal choke |
| US11279656B2 (en) | 2017-10-27 | 2022-03-22 | Applied Materials, Inc. | Nanopowders, nanoceramic materials and methods of making and use thereof |
| KR20200089765A (ko) * | 2017-12-18 | 2020-07-27 | 엔테그리스, 아이엔씨. | 원자 층 증착에 의해 도포되는 내화학약품성 다층 코팅 |
| US11990360B2 (en) | 2018-01-31 | 2024-05-21 | Lam Research Corporation | Electrostatic chuck (ESC) pedestal voltage isolation |
| US11848177B2 (en) | 2018-02-23 | 2023-12-19 | Lam Research Corporation | Multi-plate electrostatic chucks with ceramic baseplates |
| US11086233B2 (en) * | 2018-03-20 | 2021-08-10 | Lam Research Corporation | Protective coating for electrostatic chucks |
| US10443126B1 (en) | 2018-04-06 | 2019-10-15 | Applied Materials, Inc. | Zone-controlled rare-earth oxide ALD and CVD coatings |
| KR102862930B1 (ko) * | 2018-06-22 | 2025-09-19 | 어플라이드 머티어리얼스, 인코포레이티드 | 반도체 웨이퍼 프로세싱에서 웨이퍼 후면 손상을 최소화하는 방법들 |
| US11667575B2 (en) | 2018-07-18 | 2023-06-06 | Applied Materials, Inc. | Erosion resistant metal oxide coatings |
| US11183368B2 (en) | 2018-08-02 | 2021-11-23 | Lam Research Corporation | RF tuning systems including tuning circuits having impedances for setting and adjusting parameters of electrodes in electrostatic chucks |
| US11031272B2 (en) * | 2018-11-06 | 2021-06-08 | Mikro Mesa Technology Co., Ltd. | Micro device electrostatic chuck with diffusion blocking layer |
| CN113056816B (zh) * | 2018-11-19 | 2024-11-12 | 恩特格里斯公司 | 具有电荷耗散涂层的静电卡盘 |
| US11180847B2 (en) | 2018-12-06 | 2021-11-23 | Applied Materials, Inc. | Atomic layer deposition coatings for high temperature ceramic components |
| US11673161B2 (en) * | 2019-03-11 | 2023-06-13 | Technetics Group Llc | Methods of manufacturing electrostatic chucks |
| US10858741B2 (en) | 2019-03-11 | 2020-12-08 | Applied Materials, Inc. | Plasma resistant multi-layer architecture for high aspect ratio parts |
| US11335581B2 (en) * | 2019-07-31 | 2022-05-17 | Eryn Smith | System and method for adhering a semiconductive wafer to an electrostatic carrier by adjusting relative permittivity |
| KR102790475B1 (ko) * | 2019-09-16 | 2025-04-08 | 삼성디스플레이 주식회사 | 금속 마스크, 이의 제조 방법, 및 표시 패널 제조 방법 |
| CN112553592B (zh) * | 2019-09-25 | 2023-03-31 | 中微半导体设备(上海)股份有限公司 | 一种利用ald工艺对静电吸盘进行处理的方法 |
| CN113053774A (zh) * | 2019-12-27 | 2021-06-29 | 迪科特测试科技(苏州)有限公司 | 探测装置 |
| KR102701133B1 (ko) * | 2020-03-06 | 2024-09-03 | 세메스 주식회사 | 지지 유닛 및 그를 포함하는 기판 처리 장치 |
| JP2023551725A (ja) * | 2020-12-02 | 2023-12-12 | エリコン・サーフェス・ソリューションズ・アクチェンゲゼルシャフト，プフェフィコーン | 静電チャック用の改善されたプラズマ耐性コーティング |
| CN112652677B (zh) * | 2020-12-09 | 2023-10-27 | 晋能光伏技术有限责任公司 | 一种perc电池背面钝化工艺 |
| US11417557B2 (en) * | 2020-12-15 | 2022-08-16 | Entegris, Inc. | Spiraling polyphase electrodes for electrostatic chuck |
| US11955361B2 (en) * | 2021-04-15 | 2024-04-09 | Applied Materials, Inc. | Electrostatic chuck with mesas |
| KR102520805B1 (ko) * | 2021-05-10 | 2023-04-13 | 주식회사 템네스트 | 이종 복합재료로 이루어진 전극층을 포함하는 정전척의 제조방법 및 이에 의해 제조된 정전척 |
| KR102548445B1 (ko) * | 2021-05-10 | 2023-06-28 | 부경대학교 산학협력단 | 클래드재 전극층을 포함하는 정전척의 제조방법 및 이에 의해 제조된 정전척 |
| TWI829316B (zh) * | 2021-08-31 | 2024-01-11 | 日商京瓷股份有限公司 | 耐電漿積層體、其製造方法及電漿處理裝置 |
| KR102875533B1 (ko) * | 2021-10-28 | 2025-10-27 | 엔테그리스, 아이엔씨. | 유전체 층을 포함하는 상부 세라믹 층을 포함하는 정전 척, 및 관련 방법 및 구조 |
| KR102697860B1 (ko) * | 2022-02-08 | 2024-08-22 | (주)아이씨디 | 정전 장치 및 그 동작 방법 |
| US20230294208A1 (en) * | 2022-03-21 | 2023-09-21 | Applied Materials, Inc. | Electrostatic chuck with laser-machined mesas |
| WO2023191999A1 (en) * | 2022-04-01 | 2023-10-05 | Applied Materials, Inc. | Ceramic engineering by grading materials |
| JP2023170413A (ja) * | 2022-05-19 | 2023-12-01 | 新光電気工業株式会社 | セラミックス基板及びその製造方法、静電チャック、基板固定装置、半導体装置用パッケージ |
| JP2024020855A (ja) * | 2022-08-02 | 2024-02-15 | 新光電気工業株式会社 | 静電チャック、基板固定装置、ペースト |
| WO2025004883A1 (ja) * | 2023-06-29 | 2025-01-02 | 東京エレクトロン株式会社 | プラズマ処理装置 |
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| JP4004086B2 (ja) * | 1996-07-22 | 2007-11-07 | 日本発条株式会社 | 静電チャック装置 |
| JP3949763B2 (ja) | 1996-11-21 | 2007-07-25 | トーカロ株式会社 | 静電チャック部材 |
| US5909355A (en) | 1997-12-02 | 1999-06-01 | Applied Materials, Inc. | Ceramic electrostatic chuck and method of fabricating same |
| JPH11168134A (ja) * | 1997-12-03 | 1999-06-22 | Shin Etsu Chem Co Ltd | 静電吸着装置およびその製造方法 |
| JPH11260534A (ja) * | 1998-01-09 | 1999-09-24 | Ngk Insulators Ltd | 加熱装置およびその製造方法 |
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| WO2008082978A2 (en) | 2006-12-26 | 2008-07-10 | Saint-Gobain Ceramics & Plastics, Inc. | Electrostatic chuck and method of forming |
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| JP4712836B2 (ja) * | 2008-07-07 | 2011-06-29 | 信越化学工業株式会社 | 耐腐食性積層セラミックス部材 |
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| SG10201402319QA (en) | 2009-05-15 | 2014-07-30 | Entegris Inc | Electrostatic chuck with polymer protrusions |
| KR100997374B1 (ko) | 2009-08-21 | 2010-11-30 | 주식회사 코미코 | 정전척 및 이의 제조 방법 |
| US8637794B2 (en) * | 2009-10-21 | 2014-01-28 | Lam Research Corporation | Heating plate with planar heating zones for semiconductor processing |
| TW201209957A (en) | 2010-05-28 | 2012-03-01 | Praxair Technology Inc | Substrate supports for semiconductor applications |
| JP6014587B2 (ja) | 2010-05-28 | 2016-10-25 | インテグリス・インコーポレーテッド | 高表面抵抗率の静電チャック |
| US9728429B2 (en) * | 2010-07-27 | 2017-08-08 | Lam Research Corporation | Parasitic plasma prevention in plasma processing chambers |
| CN103222043B (zh) | 2010-09-08 | 2016-10-12 | 恩特格林斯公司 | 一种高传导静电夹盘 |
| KR101974386B1 (ko) * | 2012-03-21 | 2019-05-03 | 주식회사 미코 | 정전척 |
| EP3103136B1 (en) | 2014-02-07 | 2021-06-23 | Entegris, Inc. | Electrostatic chuck and method of making same |
-
2015
- 2015-02-06 EP EP15705762.1A patent/EP3103136B1/en active Active
- 2015-02-06 WO PCT/US2015/014810 patent/WO2015120265A1/en not_active Ceased
- 2015-02-06 SG SG10201806706VA patent/SG10201806706VA/en unknown
- 2015-02-06 US US15/111,591 patent/US10497598B2/en active Active
- 2015-02-06 KR KR1020167021232A patent/KR102369706B1/ko active Active
- 2015-02-06 JP JP2016548231A patent/JP6527524B2/ja active Active
- 2015-02-06 TW TW104104028A patent/TWI663681B/zh active
- 2015-02-06 CN CN201580007196.XA patent/CN107078086B/zh active Active